CN1821338A - Resin adhesive for diamond grinding wheel - Google Patents
Resin adhesive for diamond grinding wheel Download PDFInfo
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- CN1821338A CN1821338A CN 200610043299 CN200610043299A CN1821338A CN 1821338 A CN1821338 A CN 1821338A CN 200610043299 CN200610043299 CN 200610043299 CN 200610043299 A CN200610043299 A CN 200610043299A CN 1821338 A CN1821338 A CN 1821338A
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- resin
- grinding wheel
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- resin adhesive
- diamond grinding
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Abstract
The resin adhesive for grinding diamond wheel consists of polyimide 15-55 wt%, modified organic silicon resin 10-60 wt%, modified organic silicon rubber 15-50 wt%, inorganic stuffing 10-50 wt%, and microcapsule 1-10 wt%; and the inorganic stuffing consists of boron carbide 20-50 wt%, graphite 5-25 wt%, chromium oxide 0-15 wt%, silicon carbide 5-30 wt% and copper powder 0-30 wt%. The polyimide, the modified organic silicon resin and the modified organic silicon rubber are compounded to obtain one kind of composite superfine powder in micron level average size; the microcapsule, surface activated diamond and the inorganic stuffing are then added to produce the grinding wheel. The grinding diamond wheel has less diamond falling-off, high toughness, high strength, and high wear resistance. The resin adhesive is suitable for grinding diamond wheel and other grinding resin wheel with other grinding material.
Description
Technical field: the present invention relates to the preparation method of resin diamond grinding wheel, specifically about a kind of preparation method of resin adhesive for diamond grinding wheel.
Background technology: Chinese patent notification number 1187166C, the method that improves the resin diamond grinding wheel wear resistance is disclosed, be characterized in that used diamond and powder filler granule have carried out surface activation process, obtaining effect preferably aspect the wear resistance of emery wheel.Yet for utilizing polyimide resin as emery grinding wheel binder, because polyimide (PI) end has active function groups, can add silicone resin, solidifying agent, toughner and carry out modification, polyimide resin, silicone resin and organo-silicone rubber be high temperature generation copolymerization in the presence of curing catalyst, form fine and close inierpeneirating network structure, this resin glue can at high temperature not decompose for a long time, and high-temperature machinery intensity is good.Strong to diamond particles and matrix bonding force, diamond particles is difficult drop-off in the course of the work, and good toughness, emery wheel be easy fracture, decylization not, and the emery wheel pore-free, the compactness that make are good.
Summary of the invention: the objective of the invention is to carry out modification, thereby reach the purpose of the wear resistance that improves diamond wheel for polyimide resin interpolation silicone resin, solidifying agent, toughner as emery grinding wheel binder.Technical scheme of the present invention is achieved in that proportioning (weight %): polyimide 15-55 modified organic silicone resin 10-60 modified organic silicon rubber 15-50 mineral filler 10-50 microcapsule 1～10.
Wherein, mineral filler (weight %): norbide 20-50 graphite 5-25 chromic oxide 0-15 silicon carbide 5-30 copper powder 0-30.
Modified organic silicone resin is: a kind of, two or three element modified vinyl organosilicon resin, vinyl organosilicon azane resin.
Toughner is modified organic silicon rubber, select for use by group modified organo-silicone rubbers such as group trifluoro propyl, vinyl, penylene, Bian decaboranes, wherein a kind of, two or three.500～600 ℃ of the silicon rubber energy withstand long term exposure of this type of modification have good force of cohesion, adhesivity and increasing tougheness.
The curing catalyst that microcapsule coat: because the silicone resin solidification value is too high, abrasive wheel forming technology is brought difficulty, we add curing catalyst for this reason, and the one, reduce the silicone resin solidification value, the 2nd, allow silicone resin and silicone rubber crosslinking.For fear of deposit curing catalyst and grinding wheel bond reaction in the process at resin, so we adopt the form of micro-capsule to coat curing catalyst, curing catalyst is in the emery wheel preparation process, and high temperature discharges curing catalyst and participates in reaction.Curing catalyst comprises: the organic salt of metals such as lead, zinc, cobalt, nickel, as: butoxy Acetyl Acetone cobalt (lead, zinc, nickel), four cobalt chloride (lead, zinc, nickel).
Microcapsule wall thing: the superpolymer of trimeric cyanamide-formaldehyde, urea-formaldehyde, trimeric cyanamide-urea-formaldehyde.
Microcapsule preparation: trimeric cyanamide-formaldehyde is added in the flask, regulate pH to alkalescence, at 30～80 ℃ of stirring reaction 1～3h.Add curing catalyst in trimeric cyanamide-formaldehyde prepolymer, emulsification, adjusting pH are acid, stir polyreaction 1～6h, promptly get the nano level microcapsule that coat curing catalyst.These microcapsule cyst wall under high-temperature condition breaks and discharges curing catalyst.For above-mentioned other microcapsule wall thing, the preparation method is identical.
Adhesive complex: with polyimide resin, modified organic silicone resin, modified organic silicon rubber, comminution by gas stream in fluidized bed jet mill and to obtain a kind of median size be the micron level composite ultrafine powder.
Diamond wheel is manufactured: will contain the binding agent composite ultrafine powder of microcapsule and make the emery wheel model through surface-treated diamond and mineral filler mixing, again high temperature compacting curing molding.230 ℃ of press temperatures, the time is 50 minutes, the temperature and time of regelate is respectively 180 ℃ and 15 hours.
Embodiment:
Embodiment 1:(weight %) polyimide 14 vinyl organosilicon azane resins 14 penylenes 3 third fluorine-based organo-silicone rubber 6.5 mineral fillers 65 microcapsule 0.5 mineral filler: norbide 45 graphite 8 chromic oxide 22 silicon carbide 25
Performance: wear resistance or work-ing life improve 24%.
Embodiment 2:(weight %) polyimide 15 aluminium element vinyl organosilicon resins 10 vinyl penylene Bian decaborane organo-silicone rubbers 8.5 mineral fillers 66 microcapsule 0.5 mineral filler: norbide 35 graphite 10 chromic oxide 10 silicon carbide 15 copper powders 30
Performance: wear resistance or work-ing life improve 30%.
Embodiment 3:(weight %) polyimide 10 boron vinyl organosilicon resins 19 penylenes 3 third fluorine-based Bian decaborane organo-silicone rubber 7.3 mineral fillers 63 microcapsule 0.7
Mineral filler: norbide 30 graphite 10 chromic oxide 20 silicon carbide 10 copper powders 25
Performance: wear resistance or work-ing life improve 28%.
Wear resistance in this embodiment or operating life data be with reference among the Chinese patent notification number 1187166C wear resistance of resin diamond grinding wheel or the test in work-ing life identify that rules identify, and compare with it.Used diamond and mineral filler have all been carried out activation treatment with reference to the method described in the 1187166C, and wedding agent is a kind of to be to compare resulting data with the resin binder modified and simple polyimide resin wedding agent that uses of the present invention.
Silicone resin and as the modified organic silicon rubber of toughner all from market purchasing, select the silicone resin of heteroatoms modification for use.On the silica chain, introduce the macromolecular chain that heteroatoms Al, Pb, Ge, B, N form (Si-O-M) n or stable silazane tetra-atomic ring.Heteroatoms can effectively improve organosilyl temperature tolerance, and the silicone resin of modification is heat-resisting, media-resistant, performance such as water-fast, weather-proof are improved, and can use down at 400～500 ℃ long-term down, and instantaneous temperature can be up to 1000～1200 ℃.
As the modified organic silicon rubber of toughner, select for use by group modified organo-silicone rubbers such as group trifluoro propyl, vinyl, penylene, Bian decaboranes.500～600 ℃ of the silicon rubber energy withstand long term exposure of this type of modification have good force of cohesion, adhesivity and increasing tougheness.
Resin adhesive for diamond grinding wheel of the present invention can at high temperature not decompose for a long time, and high-temperature machinery intensity is good, and is strong to diamond particles and matrix bonding force, and diamond particles is not easy fracture, decylization not of difficult drop-off, good toughness, emery wheel in the course of the work.The emery wheel pore-free that makes, compactness is good.This wedding agent is applicable to that also various corundum, norbide, silicon carbide are the resin wheel of abrasive material except that being applicable to man-made diamond.
Claims (6)
1, a kind of resin adhesive for diamond grinding wheel is characterized in that: the proportioning of resin adhesive for diamond grinding wheel (weight %): polyimide 15-55 modified organic silicone resin 10-60 modified organic silicon rubber 15-50 mineral filler 10-50 microcapsule 1-10; Wherein mineral filler (weight %): norbide 20-50 graphite 5-25 chromic oxide 0-15 silicon carbide 5-30 copper powder 0-30.
2, a kind of resin adhesive for diamond grinding wheel according to claim 1, it is characterized in that: described modified organic silicone resin is: a kind of, two or three element modified vinyl organosilicon resin, vinyl organosilicon azane resin.
3, a kind of resin adhesive for diamond grinding wheel according to claim 1, it is characterized in that: described toughner is modified organic silicon rubber, select for use by group modified organo-silicone rubber such as group trifluoro propyl, vinyl, penylene, Bian decaborane wherein a kind of, two or three.
4, according to the described a kind of resin adhesive for diamond grinding wheel of claim 1-3, it is characterized in that: the mixture of described polyimide resin, modified organic silicone resin, modified organic silicon rubber need be in fluidized bed jet mill comminution by gas stream, obtaining a kind of median size is the micron level composite ultrafine powder.
5, a kind of resin adhesive for diamond grinding wheel according to claim 1 is characterized in that: the curing catalyst that described microcapsule coat is butoxy Acetyl Acetone cobalt (lead, zinc, nickel), four cobalt chloride (lead, zinc, nickel); Microcapsule wall thing: the superpolymer of carbamide, urea-formaldehyde, trimeric cyanamide-urea-formaldehyde, wherein a kind of.
6, a kind of resin adhesive for diamond grinding wheel according to claim 5, it is characterized in that: the preparation method of the curing catalyst that described microcapsule coat adds carbamide in the flask to, regulate pH to alkalescence, at 30～80 ℃ of stirring reaction 1～3h, in the carbamide performed polymer, add curing catalyst, emulsification, adjusting pH are acid, stirring polyreaction 1～6h, promptly get the nano level microcapsule that coat curing catalyst.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100432994A CN100372903C (en) | 2006-03-29 | 2006-03-29 | Resin adhesive for diamond grinding wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100432994A CN100372903C (en) | 2006-03-29 | 2006-03-29 | Resin adhesive for diamond grinding wheel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1821338A true CN1821338A (en) | 2006-08-23 |
| CN100372903C CN100372903C (en) | 2008-03-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100432994A Expired - Fee Related CN100372903C (en) | 2006-03-29 | 2006-03-29 | Resin adhesive for diamond grinding wheel |
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| CN (1) | CN100372903C (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101633197B (en) * | 2009-07-30 | 2011-04-27 | 华南理工大学 | Method for producing energy-saving scagliola containing microencapsulated phase change materials |
| CN102350667A (en) * | 2011-06-29 | 2012-02-15 | 苏州赛力精密工具有限公司 | Resin metal composite bonding agent and composite bonding agent diamond grinding wheel |
| CN102391814A (en) * | 2011-10-07 | 2012-03-28 | 北京天诚宇新材料技术有限公司 | Abrasion-resistant repair agent |
| CN102001057B (en) * | 2009-09-02 | 2012-05-23 | 汕头市华达橡胶薄片砂轮实业有限公司 | Rubber thin sheet grinding wheel and preparation method thereof |
| CN102581778A (en) * | 2012-03-14 | 2012-07-18 | 青岛四砂泰益研磨有限公司 | Medical needle pin grinding wheel and manufacturing method thereof |
| CN103056786A (en) * | 2012-12-20 | 2013-04-24 | 郑州新安华砂轮有限公司 | Resin cutting disc and production method thereof |
| CN103240682A (en) * | 2013-05-02 | 2013-08-14 | 广东奔朗新材料股份有限公司 | Abrasion-resistant composite diamond abrasive tool |
| CN103492126A (en) * | 2011-04-18 | 2014-01-01 | 3M创新有限公司 | Resin bonded grinding wheel |
| CN103619540A (en) * | 2011-06-27 | 2014-03-05 | 3M创新有限公司 | Structured abrasive articles and method of manufacturing the same |
| CN103921219A (en) * | 2014-03-13 | 2014-07-16 | 常熟鼎天赫机械有限公司 | High-precision diamond grinding wheel |
| CN104440594A (en) * | 2014-10-29 | 2015-03-25 | 杨祝华 | Resin binder diamond grinding wheel |
| CN105081988A (en) * | 2014-12-19 | 2015-11-25 | 李立群 | Rubber and resin compound binding agent for grinding wheel and preparation method of rubber and resin compound binding agent |
| CN105504630A (en) * | 2015-12-09 | 2016-04-20 | 无锡普瑞明思机械制造有限公司 | Mechanical seal friction pair material |
| CN106002662A (en) * | 2016-05-24 | 2016-10-12 | 付文 | Preparing method of elastic grinding wheel |
| CN106378714A (en) * | 2016-10-14 | 2017-02-08 | 苏州赛尔科技有限公司 | Ultra-thin resin dicing blade for QFN high-quality cutting and preparing method of ultra-thin resin dicing blade |
| CN107662165A (en) * | 2017-10-25 | 2018-02-06 | 台山市兰宝磨具有限公司 | A kind of emery wheel manufacturing process |
| CN110752052A (en) * | 2019-09-10 | 2020-02-04 | 东莞市瀛通电线有限公司 | Reflective braided cable |
| CN112223131A (en) * | 2020-11-02 | 2021-01-15 | 惠州市新科磨具有限公司 | Wear-resistant sheet resin cutting sheet and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS60186376A (en) * | 1984-03-06 | 1985-09-21 | Showa Denko Kk | Abrasive molded body |
| JP3051899B2 (en) * | 1993-01-11 | 2000-06-12 | 住友デュレズ株式会社 | Heat-resistant resin-bonded grinding wheel |
| US20030041525A1 (en) * | 2001-08-31 | 2003-03-06 | Sherwood Walter J. | Ceramic bonded abrasive |
| CN1187166C (en) * | 2002-08-02 | 2005-02-02 | 武汉理工大学 | Method for raising wear resistance of resin diamond grinding wheel |
| JP2004074330A (en) * | 2002-08-13 | 2004-03-11 | Ebara Corp | Fixed abrasive polishing tool, and method for manufacturing the same |
-
2006
- 2006-03-29 CN CNB2006100432994A patent/CN100372903C/en not_active Expired - Fee Related
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101633197B (en) * | 2009-07-30 | 2011-04-27 | 华南理工大学 | Method for producing energy-saving scagliola containing microencapsulated phase change materials |
| CN102001057B (en) * | 2009-09-02 | 2012-05-23 | 汕头市华达橡胶薄片砂轮实业有限公司 | Rubber thin sheet grinding wheel and preparation method thereof |
| CN103492126A (en) * | 2011-04-18 | 2014-01-01 | 3M创新有限公司 | Resin bonded grinding wheel |
| CN103619540B (en) * | 2011-06-27 | 2016-11-16 | 3M创新有限公司 | Structured abrasive article and preparation method thereof |
| CN103619540A (en) * | 2011-06-27 | 2014-03-05 | 3M创新有限公司 | Structured abrasive articles and method of manufacturing the same |
| CN102350667A (en) * | 2011-06-29 | 2012-02-15 | 苏州赛力精密工具有限公司 | Resin metal composite bonding agent and composite bonding agent diamond grinding wheel |
| CN102391814A (en) * | 2011-10-07 | 2012-03-28 | 北京天诚宇新材料技术有限公司 | Abrasion-resistant repair agent |
| CN102581778A (en) * | 2012-03-14 | 2012-07-18 | 青岛四砂泰益研磨有限公司 | Medical needle pin grinding wheel and manufacturing method thereof |
| CN102581778B (en) * | 2012-03-14 | 2014-10-08 | 青岛四砂泰益研磨有限公司 | Medical needle pin grinding wheel and manufacturing method thereof |
| CN103056786A (en) * | 2012-12-20 | 2013-04-24 | 郑州新安华砂轮有限公司 | Resin cutting disc and production method thereof |
| CN103056786B (en) * | 2012-12-20 | 2015-12-02 | 郑州新安华砂轮有限公司 | Resin cutting slice and preparation method thereof |
| CN103240682A (en) * | 2013-05-02 | 2013-08-14 | 广东奔朗新材料股份有限公司 | Abrasion-resistant composite diamond abrasive tool |
| CN103921219A (en) * | 2014-03-13 | 2014-07-16 | 常熟鼎天赫机械有限公司 | High-precision diamond grinding wheel |
| CN103921219B (en) * | 2014-03-13 | 2016-08-24 | 常熟鼎天赫机械有限公司 | A kind of high-precision diamond emery wheel |
| CN104440594A (en) * | 2014-10-29 | 2015-03-25 | 杨祝华 | Resin binder diamond grinding wheel |
| CN105081988A (en) * | 2014-12-19 | 2015-11-25 | 李立群 | Rubber and resin compound binding agent for grinding wheel and preparation method of rubber and resin compound binding agent |
| CN105081988B (en) * | 2014-12-19 | 2017-06-13 | 安徽格太信控科技有限公司 | Rubber, resin compounded abrasive wheel bonding agent and preparation method thereof |
| CN105504630A (en) * | 2015-12-09 | 2016-04-20 | 无锡普瑞明思机械制造有限公司 | Mechanical seal friction pair material |
| CN106002662A (en) * | 2016-05-24 | 2016-10-12 | 付文 | Preparing method of elastic grinding wheel |
| CN106378714A (en) * | 2016-10-14 | 2017-02-08 | 苏州赛尔科技有限公司 | Ultra-thin resin dicing blade for QFN high-quality cutting and preparing method of ultra-thin resin dicing blade |
| CN106378714B (en) * | 2016-10-14 | 2019-10-22 | 苏州赛尔科技有限公司 | A kind of QFN high quality cutting ultra-thin resin saw blade and preparation method thereof |
| CN107662165A (en) * | 2017-10-25 | 2018-02-06 | 台山市兰宝磨具有限公司 | A kind of emery wheel manufacturing process |
| CN110752052A (en) * | 2019-09-10 | 2020-02-04 | 东莞市瀛通电线有限公司 | Reflective braided cable |
| CN112223131A (en) * | 2020-11-02 | 2021-01-15 | 惠州市新科磨具有限公司 | Wear-resistant sheet resin cutting sheet and preparation method thereof |
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|---|---|
| CN100372903C (en) | 2008-03-05 |
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Granted publication date: 20080305 Termination date: 20110329 |