CN1802724B - 高频等离子体射束源及喷射表面的方法 - Google Patents
高频等离子体射束源及喷射表面的方法 Download PDFInfo
- Publication number
- CN1802724B CN1802724B CN2004800159205A CN200480015920A CN1802724B CN 1802724 B CN1802724 B CN 1802724B CN 2004800159205 A CN2004800159205 A CN 2004800159205A CN 200480015920 A CN200480015920 A CN 200480015920A CN 1802724 B CN1802724 B CN 1802724B
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- CN
- China
- Prior art keywords
- plasma
- plasma beam
- grid
- beam source
- frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 230000001678 irradiating effect Effects 0.000 title abstract 2
- 239000011248 coating agent Substances 0.000 claims description 35
- 238000000576 coating method Methods 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 31
- 230000007935 neutral effect Effects 0.000 claims description 16
- 239000007921 spray Substances 0.000 claims description 15
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 10
- 238000005507 spraying Methods 0.000 claims description 10
- 230000008020 evaporation Effects 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 6
- 238000005315 distribution function Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 239000012634 fragment Substances 0.000 claims description 2
- 230000003993 interaction Effects 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 238000000605 extraction Methods 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract description 2
- 238000009826 distribution Methods 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32357—Generation remote from the workpiece, e.g. down-stream
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J27/00—Ion beam tubes
- H01J27/02—Ion sources; Ion guns
- H01J27/16—Ion sources; Ion guns using high-frequency excitation, e.g. microwave excitation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/54—Plasma accelerators
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Combustion & Propulsion (AREA)
- Plasma Technology (AREA)
- Physical Vapour Deposition (AREA)
- Chemically Coating (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- ing And Chemical Polishing (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10317027.8 | 2003-04-11 | ||
DE10317027A DE10317027A1 (de) | 2003-04-11 | 2003-04-11 | Hochfrequenz-Plasmastrahlquelle und Verfahren zum Bestrahlen einer Oberfläche |
PCT/EP2004/003796 WO2004091264A2 (de) | 2003-04-11 | 2004-04-08 | Hochfrequenz-plasmastrahlquelle und verfahren zum bestrahlen einer oberfläche |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1802724A CN1802724A (zh) | 2006-07-12 |
CN1802724B true CN1802724B (zh) | 2011-05-25 |
Family
ID=33154197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004800159205A Expired - Lifetime CN1802724B (zh) | 2003-04-11 | 2004-04-08 | 高频等离子体射束源及喷射表面的方法 |
Country Status (11)
Country | Link |
---|---|
US (1) | US20060099341A1 (de) |
EP (1) | EP1614138B1 (de) |
JP (1) | JP4669472B2 (de) |
KR (1) | KR101112529B1 (de) |
CN (1) | CN1802724B (de) |
AT (1) | ATE463041T1 (de) |
CA (1) | CA2522058C (de) |
DE (2) | DE10317027A1 (de) |
ES (1) | ES2343960T3 (de) |
TW (1) | TW200423826A (de) |
WO (1) | WO2004091264A2 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100126337A (ko) * | 2008-01-30 | 2010-12-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 표면파 런칭 플라즈마 방전 소스들의 사전-이온화를 위한 시스템 및 방법 |
US8698400B2 (en) | 2009-04-28 | 2014-04-15 | Leybold Optics Gmbh | Method for producing a plasma beam and plasma source |
DE102009018912A1 (de) * | 2009-04-28 | 2010-11-18 | Leybold Optics Gmbh | Verfahren zur Erzeugung eines Plasmastrahls sowie Plasmaquelle |
EP2447393A1 (de) * | 2010-10-27 | 2012-05-02 | Applied Materials, Inc. | Verdampfungssystem und Verfahren |
RU2521823C1 (ru) * | 2013-04-17 | 2014-07-10 | Государственный научный центр Российской Федерации-федеральное государственное унитарное предприятие "Исследовательский Центр имени М.В. Келдыша" | Способ ускоренных испытаний катодов плазменных двигателей и устройство для его осуществления |
EP4006948A1 (de) * | 2020-11-26 | 2022-06-01 | Bühler AG | Extraktionsgitter |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4401054A (en) * | 1980-05-02 | 1983-08-30 | Nippon Telegraph & Telephone Public Corporation | Plasma deposition apparatus |
US5156703A (en) * | 1987-03-18 | 1992-10-20 | Hans Oechsner | Mthod for the surface treatment of semiconductors by particle bombardment |
US5656141A (en) * | 1990-06-25 | 1997-08-12 | Leybold Aktiengesellschaft | Apparatus for coating substrates |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2218652B1 (de) * | 1973-02-20 | 1976-09-10 | Thomson Csf | |
US4447773A (en) * | 1981-06-22 | 1984-05-08 | California Institute Of Technology | Ion beam accelerator system |
US4511593A (en) * | 1983-01-17 | 1985-04-16 | Multi-Arc Vacuum Systems Inc. | Vapor deposition apparatus and method |
US4587430A (en) * | 1983-02-10 | 1986-05-06 | Mission Research Corporation | Ion implantation source and device |
FR2619247A1 (fr) * | 1987-08-05 | 1989-02-10 | Realisations Nucleaires Et | Implanteur d'ions metalliques |
US5036252A (en) * | 1988-04-26 | 1991-07-30 | Hauzer Holding Bv | Radio frequency ion beam source |
JPH0265230A (ja) * | 1988-08-31 | 1990-03-05 | Mitsubishi Electric Corp | プラズマ反応装置 |
GB8905073D0 (en) * | 1989-03-06 | 1989-04-19 | Nordiko Ltd | Ion gun |
DE4239511A1 (de) * | 1992-11-25 | 1994-05-26 | Leybold Ag | Verfahren und Vorrichtung zum Beschichten von Substraten |
GB2299137B (en) * | 1995-03-20 | 1999-04-28 | Matra Marconi Space Uk Ltd | Ion thruster |
US6646223B2 (en) * | 1999-12-28 | 2003-11-11 | Texas Instruments Incorporated | Method for improving ash rate uniformity in photoresist ashing process equipment |
JP2001210245A (ja) * | 2000-01-26 | 2001-08-03 | Shincron:Kk | イオン源およびイオン引き出し電極 |
AU2001247685A1 (en) * | 2000-03-30 | 2001-10-15 | Tokyo Electron Limited | Method of and apparatus for tunable gas injection in a plasma processing system |
US6250070B1 (en) * | 2000-05-09 | 2001-06-26 | Hughes Electronics Corporation | Ion thruster with ion-extraction grids having compound contour shapes |
JP3485896B2 (ja) * | 2000-07-11 | 2004-01-13 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JP4073204B2 (ja) * | 2001-11-19 | 2008-04-09 | 株式会社荏原製作所 | エッチング方法 |
-
2003
- 2003-04-11 DE DE10317027A patent/DE10317027A1/de not_active Withdrawn
-
2004
- 2004-04-08 AT AT04726483T patent/ATE463041T1/de not_active IP Right Cessation
- 2004-04-08 WO PCT/EP2004/003796 patent/WO2004091264A2/de active Search and Examination
- 2004-04-08 CA CA2522058A patent/CA2522058C/en not_active Expired - Fee Related
- 2004-04-08 KR KR1020057019326A patent/KR101112529B1/ko active IP Right Grant
- 2004-04-08 EP EP04726483A patent/EP1614138B1/de not_active Expired - Lifetime
- 2004-04-08 US US10/552,677 patent/US20060099341A1/en not_active Abandoned
- 2004-04-08 DE DE502004010974T patent/DE502004010974D1/de not_active Expired - Lifetime
- 2004-04-08 JP JP2006505081A patent/JP4669472B2/ja not_active Expired - Lifetime
- 2004-04-08 ES ES04726483T patent/ES2343960T3/es not_active Expired - Lifetime
- 2004-04-08 CN CN2004800159205A patent/CN1802724B/zh not_active Expired - Lifetime
- 2004-04-09 TW TW093109834A patent/TW200423826A/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4401054A (en) * | 1980-05-02 | 1983-08-30 | Nippon Telegraph & Telephone Public Corporation | Plasma deposition apparatus |
US5156703A (en) * | 1987-03-18 | 1992-10-20 | Hans Oechsner | Mthod for the surface treatment of semiconductors by particle bombardment |
US5656141A (en) * | 1990-06-25 | 1997-08-12 | Leybold Aktiengesellschaft | Apparatus for coating substrates |
Non-Patent Citations (1)
Title |
---|
JP特開2001-210245A 2001.08.03 |
Also Published As
Publication number | Publication date |
---|---|
DE10317027A1 (de) | 2004-11-11 |
JP4669472B2 (ja) | 2011-04-13 |
CA2522058A1 (en) | 2004-10-21 |
EP1614138B1 (de) | 2010-03-31 |
WO2004091264A2 (de) | 2004-10-21 |
KR101112529B1 (ko) | 2012-02-17 |
WO2004091264A3 (de) | 2005-03-10 |
CA2522058C (en) | 2013-01-22 |
US20060099341A1 (en) | 2006-05-11 |
JP2006522870A (ja) | 2006-10-05 |
KR20050118234A (ko) | 2005-12-15 |
TW200423826A (en) | 2004-11-01 |
ATE463041T1 (de) | 2010-04-15 |
EP1614138A2 (de) | 2006-01-11 |
DE502004010974D1 (de) | 2010-05-12 |
TWI379620B (de) | 2012-12-11 |
CN1802724A (zh) | 2006-07-12 |
ES2343960T3 (es) | 2010-08-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20110525 |