CN1802084B - Methods and apparatus for reducing an electronic device manufacturing tool footprint - Google Patents
Methods and apparatus for reducing an electronic device manufacturing tool footprint Download PDFInfo
- Publication number
- CN1802084B CN1802084B CN2005101132259A CN200510113225A CN1802084B CN 1802084 B CN1802084 B CN 1802084B CN 2005101132259 A CN2005101132259 A CN 2005101132259A CN 200510113225 A CN200510113225 A CN 200510113225A CN 1802084 B CN1802084 B CN 1802084B
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- China
- Prior art keywords
- body frame
- floor space
- electronic device
- loadlock
- overlay area
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
In at least one aspect, a method includes positioning a load lock of an electronic device manufacturing tool such that the load lock occupies a first floor area; and positioning a mainframe power supply in a second floor area, wherein a substantial portion of the second floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint. Additionally, or alternatively, a mainframe controller may be placed so that the footprint thereof substantially overlaps the footprint of the load lock. Numerous other aspects are also provided.
Description
The sequence number that the present patent application requires on July 12nd, 2004 to submit to is the U.S. Provisional Application No. of No.60/587110 (attorney docket is No.9081/L), and this application is all quoted as a reference at this.
Technical field
Present invention relates in general to the manufacturing of electronic equipment, especially relate to and be used to reduce the method and apparatus that electronic device is made the overlay area of apparatus.
Background technology
Fig. 1 shows a kind of traditional electronic device and makes apparatus (perhaps system) 101.With reference to Fig. 1, electronic device is made apparatus 101 and is comprised a plurality of assemblies, for example is connected the 103 and body frame controllers 105 of body frame power source (for example, body frame headstock) on the body frame 107.Body frame 107 comprises one or more process chamber 109, and described each process chamber is connected on a process chamber headstock 110 and the process chamber controller 111, and a transfer chamber 112 that is connected on the loadlock 113.The overlay area that electronic device is made apparatus 101 is that electronic device is made the floor space 115 (for example, in a clean room) that apparatus 101 occupies.Body frame headstock 103 and body frame controller 105 are connected on the shelf 117 that separates with body frame 107 (for example, the support of a sealing).Therefore, body frame headstock 103 and controller 105 occupy one and make the floor space 118 that the body frame of apparatus 101 separates with electronic device, therefore, have increased the overlay area that electronic device is made apparatus.
In addition, body frame headstock 103 and controller 105 are connected on the body frame 107 by distribution 119, and described line extends to body frame 107 from separating shelf 117.Therefore, it is far away more that separation shelf 117 leaves body frame 107, and electronic device is made apparatus 101 needs many more distributions 119, reduces the integrated level of system.As described below, reduce electronic device and make the integrated level that instrument (perhaps system) can be improved in the overlay area of apparatus.
Therefore, need be used to reduce the method and apparatus that electronic device is made the overlay area of apparatus.
Summary of the invention
In a first aspect of the present invention, be provided for reducing the first method that electronic device is made the overlay area of apparatus.First method comprises the steps: the loadlock of (1) localized electron device manufacturing apparatus, thereby makes loadlock occupy first floor space; And (2) be positioned at the body frame power source in second floor space, and wherein the overlay area that electronic device is made apparatus has been reduced in most of zone of second floor space therefore in described first floor space.
In a second aspect of the present invention, be provided for reducing the second method that electronic device is made the overlay area of apparatus.Second method comprises the steps: the loadlock of (1) localized electron device manufacturing apparatus, thereby makes loadlock occupy first floor space; And (2) be positioned at the body frame controller in second floor space, and wherein the overlay area that electronic device is made apparatus has been reduced in most of zone of second floor space therefore in described first floor space.
In a third aspect of the present invention, be provided for reducing the third method that electronic device is made the shipping cost of apparatus.The third method comprises the steps: that loadlock and body frame power source that (1) makes apparatus to electronic device put into a container; And (2) shipping container.
In a fourth aspect of the present invention, be provided for reducing the 4th kind of method that electronic device is made the shipping cost of apparatus.The 4th kind of method comprises the steps: that loadlock and body frame controller that (1) makes apparatus to electronic device put into a container; And (2) shipping container.
In a fifth aspect of the present invention, be provided for reducing first kind of equipment that electronic device is made the overlay area of apparatus.First kind of equipment comprises (1) loadlock support; (2) electronic device that is connected on the loadlock support is made the loadlock of apparatus, thereby makes loadlock occupy first floor space; And (3) be connected the body frame power source on the loadlock support, thereby make the body frame power source occupy second floor space.The major part of second floor space is arranged in first floor space, has therefore reduced the overlay area that electronic device is made apparatus.
In a sixth aspect of the present invention, be provided for reducing second kind of equipment that electronic device is made the overlay area of apparatus.Second kind of equipment comprises (1) loadlock support; (2) electronic device that is connected on the loadlock support is made the loadlock of apparatus, thereby makes loadlock occupy first floor space; And (3) be connected the body frame controller on the loadlock support, thereby make the body frame controller occupy second floor space.The major part of second floor space is arranged in first floor space, has therefore reduced the overlay area that electronic device is made apparatus.
In a seventh aspect of the present invention, be provided for reducing the third equipment that electronic device is made the overlay area of apparatus.The third equipment comprises that (1) has the electronic device manufacturing apparatus of body frame, and this body frame occupies first overlay area; And (2) occupy the body frame power source of second overlay area, described second overlay area basically with first covering area overlapping.
In a eighth aspect of the present invention, be provided for reducing the 4th kind of equipment that electronic device is made the overlay area of apparatus.The 4th kind of equipment comprises that (1) has the electronic device manufacturing apparatus of body frame, and this body frame occupies first overlay area; And (2) occupy the body frame controller of second overlay area, described second overlay area basically with first covering area overlapping.As system and equipment, a plurality of others of the present invention are provided according to these and other aspect of the present invention.
By the following detailed description, appended claims and accompanying drawing, it is clearer that further feature of the present invention and aspect will become.
The simple description of accompanying drawing
Fig. 1 shows a kind of traditional electronic device and makes apparatus.
Fig. 2 shows an exemplary electronic device according to an embodiment of the invention and makes apparatus.
The detailed description of invention
The present invention relates to improve integrated level and reduce the overlay area that electronic device is made apparatus (perhaps system).Fig. 2 shows exemplary electronic device manufacturing apparatus (perhaps system) 201 according to an embodiment of the invention.Electronic device is made apparatus 201 and can be used for producing and/or treatment substrate, for example is used to make the glass of flat-panel monitor or polymer matrix film, semiconductor wafer etc.With reference to Fig. 2, the structure of exemplary electronic device manufacturing apparatus 201 is similar to conditional electronic device manufacturing apparatus 101 shown in Figure 1.Especially, exemplary electronic device manufacturing apparatus 201 comprises a body frame 203.Body frame 203 comprises one or more process chamber 205, and described each process chamber 205 is connected on a process chamber headstock 206 and the process chamber controller 202, and a transfer chamber 208 and a loadlock 209.Loadlock 209 is supported by a loadlock shelf (rack) 211.
It is different with the position of the body frame headstock 103 of conditional electronic device manufacturing apparatus 101 that the exemplary electronic device is made body frame headstock (for example, power source) 213 of apparatus 201, and described body frame headstock provides power for body frame 203 and each process chamber headstock 206.Especially, loadlock 209 is located (for example, being positioned on the loadlock shelf 211) like this, thereby makes loadlock 209 occupy first floor space 215, body frame headstock 213 is positioned to occupy second floor space 217, and the major part of described second floor space is included in first floor space 215.For example, first floor space 215 can comprise whole second floor space 217.Body frame headstock 213 is suitable for being connected on the loadlock shelf 211.For example, body frame headstock 213 can connect and be supported on the loadlock shelf 211, and/or with loadlock 209 be an integral body.For example, body frame headstock 213 is positioned at the bottom of loadlock 209.Yet body frame headstock 213 can be positioned on other the position, for example above loadlock 209.Therefore, according to the structure of exemplary electronic device manufacturing apparatus 201, loadlock 209 and body frame headstock 213 occupy most of overlapping floor space at least.In this way, reduced the overlay area that electronic device is made apparatus 201.Reduce electronic device and make the size that required clean room can be reduced in the overlay area of apparatus, thereby reduce the running cost of instrument.
Selectively or additionally, in a kind of and above-mentioned similar mode, the exemplary electronic device make apparatus 201 body frame controller 218 can to make the position of body frame controller 105 of apparatus 101 different with the conditional electronic device.For example, body frame headstock 213 and body frame controller 218 all are oriented to reduce among the embodiment of overlay area of fabrication tool 101 therein, body frame controller 218 (for example is positioned to occupy a floor space, the 3rd floor space) 219, the major part of described floor space is included in first floor space 215.For example, first floor space 215 can comprise at least 50% of the 3rd floor space 219, perhaps preferably includes whole the 3rd floor space 219.Body frame controller 218 is suitable for connecting or being supported on the loadlock shelf 211.For example, body frame controller 218 is connected a side of loadlock 211, and this side is mutually opposed with the side that body frame headstock 213 is connected on the loadlock shelf 211.Selectively, body frame controller 218 can be connected on the other parts or other side of loadlock shelf 211.In addition, body frame controller 218 can be positioned at the top or the bottom of loadlock 209.Therefore, according to structure shown in Figure 2, loadlock 209 and body frame controller 218 occupy overlapping floor space.In this way, reduced the overlay area that electronic device is made apparatus 201.
Electronic device of the present invention is made the body frame headstock 213 of apparatus 201 and/or the location of body frame controller 218, allows to reduce electronic device and makes the body frame headstock 213 of apparatus 201 and/or the distribution 220 between body frame controller 218 and other parts.Especially, because the location of body frame headstock 213 and/or body frame controller 218, electronic device make apparatus 201 do not need distribution from one independently housing be connected to body frame 203, thereby body frame headstock 213 and/or body frame controller 218 are connected on the body frame 203.Distribution 220 between body frame 203 and body frame headstock 213 and/or body frame controller 218 can be assemblied in the overlay area of body frame compactly.Therefore, help reducing the overlay area that electronic device is made apparatus, method and apparatus of the present invention can improve level of integrated system and reduce the complexity of system.
According to one embodiment of present invention, exemplary electronic device is made apparatus 201 can more effectively carry (for example, shipping) than traditional electronic device manufacturing apparatus 101.Especially, usually, body frame headstock 103 and body frame controller 105 that the conditional electronic device is made apparatus 101 separate shipping with loadlock 113.On the contrary, the body frame headstock 213 of electronic device manufacturing apparatus 201 of the present invention can be with loadlock 209 shippings.As mentioned above, body frame headstock 213 is suitable for being connected on the loadlock shelf 211 and with loadlock 209 and occupies an overlapping overlay area.Therefore, the loadlock 209 and the body frame headstock 213 (for example, they can be assembled on the loadlock shelf 209) of electronic device manufacturing apparatus 201 of the present invention can shippings in same container.By shipping loadlock 209 in same container and body frame headstock 213, can reduce the required container sum that is used to load and transport exemplary electronic device manufacturing apparatus 201.Therefore, electronic device is made the shipping cost reduction of apparatus.Selectively or additionally, by similar mode, body frame controller 218 can with loadlock 209 shipping in same container.
Aforesaid description only discloses one exemplary embodiment of the present invention.The modification that above-mentioned disclosed equipment and method are carried out is conspicuous for a person skilled in the art within the scope of the invention.In one or more embodiment, the floor space that body frame headstock 213 and/or body frame controller 218 occupy (for example, be respectively the second and/or the 3rd floor space) major part (for example, at least 50%, be preferably 100%) fall into the floor space (for example, first floor space 215) that loadlock 209 occupies.Yet in other embodiments, the floor space that body frame headstock 213 and/or body frame controller 218 occupy can major part fall into the occupied floor space of other assembly that electronic device is made apparatus 201.For example, body frame headstock 213 and/or body frame controller 218 can be connected electronic device and make on other assembly of apparatus 201 or be connected on the support shelf of described assembly.
Therefore, although the present invention is disclosed, it should be understood that other embodiment will fall in the spirit and scope of the present invention that limit as appended claims in conjunction with its exemplary embodiment.
Claims (17)
1. one kind is used to reduce the method that electronic device is made the overlay area of apparatus, comprising:
The localized electron device is made the loadlock of apparatus, thereby makes loadlock occupy first floor space;
The body frame power source is positioned at second floor space, wherein at least 50% of second floor space is arranged in first floor space, thereby reduced the overlay area that electronic device is made apparatus, wherein said body frame power source is used for providing power to each process chamber headstock; And
The body frame controller is positioned at the below of described loadlock.
2. method according to claim 1, wherein the body frame power source is positioned in second floor space, wherein at least 50% of second floor space is arranged in first floor space, comprise the body frame power source is positioned in second floor space that wherein whole second floor space is arranged in first floor space.
3. method according to claim 1 comprises that also reducing electronic device makes the required distribution of apparatus.
4. one kind is used to reduce the method that electronic device is made the overlay area of apparatus, comprising:
The localized electron device is made the loadlock of apparatus, thereby makes loadlock occupy first floor space; And
The body frame controller is positioned in second floor space of described loadlock below, wherein at least 50% of second floor space is arranged in first floor space, thereby has reduced the overlay area that electronic device is made apparatus;
The body frame power source is positioned in the 3rd floor space, and wherein at least 50% of the 3rd floor space is arranged in first floor space, and described body frame power source is used for providing power to each process chamber headstock.
5. method according to claim 4, wherein the body frame controller is positioned in second floor space, wherein at least 50% of second floor space is arranged in first floor space, comprise the body frame controller is positioned in second floor space that wherein whole second floor space is arranged in first floor space.
6. method according to claim 4 comprises that also reducing electronic device makes the required distribution of apparatus.
7. method according to claim 4, wherein whole the 3rd floor space is arranged in first floor space.
8. one kind is reduced the method that electronic device is made the shipping cost of apparatus, comprising:
Electronic device make apparatus loadlock, be connected to and body frame controller and body frame power source that the electronic device that is arranged in described loadlock below is made apparatus are put into a container, wherein said body frame power source is used for providing power to each process chamber headstock, and wherein the body frame headstock is suitable for being connected on the loadlock shelf and with loadlock and occupies an overlapping overlay area; And
The described container of shipping.
9. method according to claim 8, wherein the loadlock and the body frame power source of electronic device manufacturing apparatus are put into a container, comprise reducing being used for the sum that the shipping electronic device is made the required container of apparatus, thereby reduce the shipping cost that electronic device is made apparatus.
10. one kind is used to reduce the equipment that electronic device is made the overlay area of apparatus, comprising:
The loadlock support;
The electronic device that is connected on the loadlock support is made the loadlock of apparatus, thereby makes loadlock occupy first floor space;
Be connected the body frame power source on the loadlock support, thereby make the body frame power source occupy second floor space, wherein at least 50% of second floor space is arranged in first floor space, thereby reduced the overlay area that electronic device is made apparatus, wherein said body frame power source is used for providing power to each process chamber headstock; And
Be positioned at the body frame controller of described loadlock below.
11. equipment according to claim 10, wherein whole second floor space is arranged in first floor space.
12. one kind is used to reduce the equipment that electronic device is made the overlay area of apparatus, comprises:
The loadlock support;
The electronic device that is connected on the loadlock support is made the loadlock of apparatus, thereby makes loadlock occupy first floor space;
Be positioned at described loadlock below, be connected the body frame controller on the loadlock support, thereby make the body frame controller occupy second floor space, wherein at least 50% of second floor space is arranged in first floor space, thereby has reduced the overlay area that electronic device is made apparatus; And
Be connected the body frame power source on the loadlock support, thereby make the body frame power source occupy the 3rd floor space, wherein at least 50% of the 3rd floor space is arranged in first floor space, thereby reduced the overlay area that electronic device is made apparatus, wherein said body frame power source is used for providing power to each process chamber headstock.
13. equipment according to claim 12, wherein whole second floor space is arranged in first floor space.
14. equipment according to claim 12, wherein whole the 3rd floor space is arranged in first floor space.
15. an equipment comprises:
Electronic device with the body frame that has occupied first overlay area is made apparatus,
Occupied the body frame power source of second overlay area, wherein second overlay area basically with first covering area overlapping, described body frame power source is used for providing power to each process chamber headstock; And
Be positioned at the body frame controller of loadlock below.
16. an equipment comprises:
Electronic device with the body frame that has occupied first overlay area is made apparatus;
Be positioned at loadlock below, occupied the body frame controller of second overlay area, wherein second overlay area basically with first covering area overlapping; And
Occupied the body frame power source of the 3rd floor space, wherein at least 50% of the 3rd floor space is arranged in first floor space, and described body frame power source is used for providing power to each process chamber headstock.
17. an equipment comprises:
Electronic device with the body frame that has occupied first overlay area is made apparatus;
Occupied the body frame power source of second overlay area, wherein second overlay area basically with first covering area overlapping, described body frame power source is used for providing power to each process chamber headstock; And
Occupied the body frame controller of the 3rd overlay area, wherein the 3rd overlay area basically with first covering area overlapping;
Wherein second overlay area and the 3rd overlay area are not overlapping basically.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US58711004P | 2004-07-12 | 2004-07-12 | |
| US60/587,110 | 2004-07-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1802084A CN1802084A (en) | 2006-07-12 |
| CN1802084B true CN1802084B (en) | 2011-08-10 |
Family
ID=35906106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2005101132259A Expired - Fee Related CN1802084B (en) | 2004-07-12 | 2005-07-12 | Methods and apparatus for reducing an electronic device manufacturing tool footprint |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20060104799A1 (en) |
| JP (1) | JP4567541B2 (en) |
| KR (1) | KR100648321B1 (en) |
| CN (1) | CN1802084B (en) |
| TW (1) | TWI297906B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6463220B2 (en) * | 2015-05-21 | 2019-01-30 | 東京エレクトロン株式会社 | Processing system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5909994A (en) * | 1996-11-18 | 1999-06-08 | Applied Materials, Inc. | Vertical dual loadlock chamber |
| US6059507A (en) * | 1997-04-21 | 2000-05-09 | Brooks Automation, Inc. | Substrate processing apparatus with small batch load lock |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5838121A (en) * | 1996-11-18 | 1998-11-17 | Applied Materials, Inc. | Dual blade robot |
| US5855681A (en) * | 1996-11-18 | 1999-01-05 | Applied Materials, Inc. | Ultra high throughput wafer vacuum processing system |
| JP3582330B2 (en) * | 1997-11-14 | 2004-10-27 | 東京エレクトロン株式会社 | Processing apparatus and processing system using the same |
| JP4316752B2 (en) * | 1999-11-30 | 2009-08-19 | キヤノンアネルバ株式会社 | Vacuum transfer processing equipment |
| US6303906B1 (en) * | 1999-11-30 | 2001-10-16 | Wafermasters, Inc. | Resistively heated single wafer furnace |
| US6860965B1 (en) * | 2000-06-23 | 2005-03-01 | Novellus Systems, Inc. | High throughput architecture for semiconductor processing |
| EP1338028A1 (en) * | 2000-12-01 | 2003-08-27 | Wafermasters, Incorporated | Wafer processing system including a robot |
| JP2002343720A (en) * | 2001-05-11 | 2002-11-29 | Hitachi Kokusai Electric Inc | Heat treatment system |
| JP2003017543A (en) * | 2001-06-28 | 2003-01-17 | Hitachi Kokusai Electric Inc | Substrate processing apparatus, substrate processing method, semiconductor device manufacturing method, and conveying apparatus |
| JP2003092329A (en) * | 2001-09-18 | 2003-03-28 | Hitachi Kokusai Electric Inc | Substrate processing system |
| JP2003133388A (en) * | 2001-10-25 | 2003-05-09 | Ulvac Japan Ltd | Substrate-conveying apparatus |
| US20030213560A1 (en) * | 2002-05-16 | 2003-11-20 | Yaxin Wang | Tandem wafer processing system and process |
| JP2004119401A (en) * | 2002-09-20 | 2004-04-15 | Foi:Kk | Substrate processing system |
| US8798964B2 (en) * | 2002-11-06 | 2014-08-05 | Hewlett-Packard Development Company, L. P. | Methods and apparatus for designing the racking and wiring configurations for pieces of hardware |
-
2005
- 2005-07-11 US US11/179,037 patent/US20060104799A1/en not_active Abandoned
- 2005-07-11 JP JP2005202138A patent/JP4567541B2/en not_active Expired - Fee Related
- 2005-07-12 TW TW094123643A patent/TWI297906B/en not_active IP Right Cessation
- 2005-07-12 KR KR1020050062596A patent/KR100648321B1/en active IP Right Grant
- 2005-07-12 CN CN2005101132259A patent/CN1802084B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5909994A (en) * | 1996-11-18 | 1999-06-08 | Applied Materials, Inc. | Vertical dual loadlock chamber |
| US6059507A (en) * | 1997-04-21 | 2000-05-09 | Brooks Automation, Inc. | Substrate processing apparatus with small batch load lock |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060050063A (en) | 2006-05-19 |
| KR100648321B1 (en) | 2006-11-23 |
| US20060104799A1 (en) | 2006-05-18 |
| TW200614328A (en) | 2006-05-01 |
| TWI297906B (en) | 2008-06-11 |
| JP2006041509A (en) | 2006-02-09 |
| CN1802084A (en) | 2006-07-12 |
| JP4567541B2 (en) | 2010-10-20 |
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