CN1764339A - Lighting device and printed circuit board for the same - Google Patents
Lighting device and printed circuit board for the same Download PDFInfo
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- CN1764339A CN1764339A CN 200410085387 CN200410085387A CN1764339A CN 1764339 A CN1764339 A CN 1764339A CN 200410085387 CN200410085387 CN 200410085387 CN 200410085387 A CN200410085387 A CN 200410085387A CN 1764339 A CN1764339 A CN 1764339A
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- conduction region
- conductive layer
- lampshade
- lighting device
- circuit board
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Abstract
The invention provides a lighting device and PCB for the device. Wherein, the device comprises: a circuit with a load-bearing surface to receive power, a plurality of separated conductive layers on said load-bearing surface, a plurality of luminous semiconductor wafers arranged between said conductive layers every with a couple of terminals electric connected to conductive layer on near wafer sides to receive power, and a lamp shade to cover the wafer; wherein, at least one conductive layer comprises a first and second conductive zones connected to opposite wafer and circuit surface on lamp shade outside respectively.
Description
Technical field
The present invention relates to a kind of lighting device, particularly relate to a kind of printed circuit board (PCB) that is used for lighting device.
Background technology
Conventional illuminator as shown in Figure 1, this lighting device comprises a printed circuit board (PCB) 100, it is made up of the circuit board 110 that a surface is covered with Copper Foil 112, the power supply supplying electrode 120,130 of a pair of positively charged and negative electricity is arranged at the two-end-point of circuit board 110, a plurality of copper foil electrodes 142,144 are arranged at light-emitting diode (LEDs) 140 both sides respectively, wherein each light-emitting diode (LEDs) 140 has pair of terminal, be used for being electrically connected at adjacent copper foil electrode 142,144, and be series at this power supply supplying electrode 120,130 positively charged and negative electricity.At last, provide a lampshade 150 to cover above-mentioned light-emitting diode (LEDs) 140.
Wherein, receive power supply and when light source is provided at the light-emitting diode that is one another in series, the adjacent copper foil electrode 142,144 that is used to electrically connect light-emitting diode (LEDs) 140 terminals also produces a large amount of heat energy, yet, because lampshade generally is made up of heat insulator, for example transmissive mirror or transparent resin etc., therefore, above-mentioned heat energy will be intercepted and continue to accumulate on the circuit board and light-emitting diode in the lampshade, and then may quicken to produce the damaging influence to wafer, circuit board even lampshade.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of lighting device and be used for the printed circuit board (PCB) of lighting device, improve its thermal diffusivity.
To achieve these goals, the invention provides lighting device, comprise a circuit board that can receive power supply, wherein circuit board has a loading end; The conductive layer of a plurality of mutual isolation is positioned on the loading end; A plurality of emitting semiconductor wafer are arranged at respectively between the conductive layer of above-mentioned mutual isolation, and wherein said emitting semiconductor wafer has pair of terminal separately, and its conductive layer that is electrically connected at adjacent emitting semiconductor wafer both sides is to receive described power supply; And lampshade, cover described emitting semiconductor wafer, and in the described conductive layer at least one comprises one first conduction region and one second conduction region, wherein first conduction region electrically connects corresponding emitting semiconductor wafer, and second conduction region is positioned on the circuit board surface in the lampshade outside.
Lighting device of the present invention also comprises a thermal conductive wire, and its surface from the lampshade inboard extends to the surface in the lampshade outside.
To achieve these goals, the present invention also provides a kind of printed circuit board (PCB) that is used for lighting device, comprising: a circuit board, have a loading end, and use for a lampshade to cover; The conductive layer of a plurality of mutual isolation is positioned on the loading end; And a plurality of bearings that are used to carry emitting semiconductor wafer, be arranged at respectively between the conductive layer of described mutual isolation, wherein, in the described conductive layer at least one comprises one first conduction region and one second conduction region, so that when lampshade covers on the loading end, second conduction region is positioned on the surface in the lampshade outside, and first conduction region is positioned on the surface of lampshade inboard, to be used for electrically connecting emitting semiconductor wafer.
Wherein, first conduction region that is used for electrically connecting emitting semiconductor wafer is positioned on the surface of lampshade inboard, and second conduction region is positioned on the surface in the lampshade outside, therefore can form one from first heat dissipation path of first conduction region towards second conduction region.
Lighting device of the present invention also provides a thermal conductive wire, and it can extend to the surface in the lampshade outside from the surface of lampshade inboard, therefore can form one second heat dissipation path.
Described conductive layer with first conduction region and second conduction region can cooperate the shape of lampshade and required area of dissipation to design different shape, as one in trapezoidal, triangle, ellipse, rectangle, mososeries, circular arc, hexagon, the infundibulate, accumulate on the element in the lampshade to avoid heat energy.
Lighting device of the present invention, described circuit board are circular.
Lighting device of the present invention, described circuit board comprise a pair of power electrode receiving described power supply, and this exports described power supply to described conductive layer to power electrode.
Lighting device provided by the invention and be used for the printed circuit board (PCB) of lighting device can be avoided when the semiconductor light emitting wafer sends light source by the conductive layer energising, the heat energy excessive accumulation that produces at conductive layer in lampshade, thereby cause the damage of inner member.
Description of drawings
Fig. 1 shows the schematic diagram of conventional illuminator.
Fig. 2 shows the schematic diagram of the embodiment of lighting device of the present invention.
Fig. 3 a to Fig. 3 h shows the schematic diagram of the conductive layer different shape embodiment on the circuit board of the present invention.
Embodiment
Present embodiment discloses a kind of lighting device, and the printed circuit board (PCB) that is used for lighting device.See also respectively and illustrate.
At first see also Fig. 2, present embodiment is an example with the printed circuit board (PCB) 200 of circle, but is not limited thereto kind of a shape, mainly can use according to the shape demand collocation design of lighting device, for example can be designed to ellipse or rectangle etc.
Wherein, as shown in Figure 2, lighting device comprises a circuit board 210 that can receive power supply, it has a loading end, generally is coated with a conducting film, and needs based on the layout of circuit, can etching remove partly conducting film, form the conductive layer 212 of a plurality of mutual isolation.Conducting film mainly has conduction property, so gold, silver, copper film or other conductors all can be used in the present embodiment.
Circuit board 210 can select to be provided with a pair of power electrode in addition to receive above-mentioned power supply on any two ends point, for example be arranged on the same loading end or on the two sides of circuit board, or arbitrary layer of multilayer circuit board, in addition, also can select a pair of power line to come electrical connecting circuit plate and outside power supply, the variety of way that promptly can electrically connect power supply and circuit board all can be applicable in the present embodiment.
A plurality of emitting semiconductor wafer, for example be the various light-emittingdiodes that can send white light or blue light etc., be arranged at respectively between the conductive layer 212 of above-mentioned mutual isolation, with emitting semiconductor wafer 240a, 240b is example, it has pair of terminal separately, for example be the plain conductor of using always (it is not shown in this diagram), it is electrically connected at the conductive layer 242,244,246,248 of adjacent emitting semiconductor wafer 240a, 240b both sides respectively, to receive power supply.Present embodiment selects to make these emitting semiconductor wafer 240a, 240b to be one another in series to receive power supply, is example with this figure, and it is electrically connected at power electrode 220,230, with by power supply supplying electrode 220,230 out-put supplies to these conductive layers.Do not electrically connect wafer but do not get rid of, or provide a plurality of independent current sources to supply required curtage with parallel way.
A lampshade 250, cover these emitting semiconductor wafer, and in the present embodiment, the conductive layer 242 of isolating comprises one first conduction region 242a and one second conduction region 242b mutually, and the conductive layer 244 of isolating comprises one first conduction region 244a and one second conduction region 244b mutually.As shown in this figure, in the conductive layer that some is isolated mutually, can be designed to arrange, so that second conduction region drops on the surface in the lampshade outside along the periphery of lampshade 250.
Wherein, embodiment as shown in Figure 2, the first conduction region 242a, 244a are positioned on the surface of lampshade 250 inboards, and the second conduction region 244a, 244b are positioned on the surface in lampshade 250 outsides.Because conductive layer also has good thermal conduction characteristic, and do not blocked between first conduction region and second conduction region or isolated, therefore can be formed one from the first conduction region 242a, 244a first heat dissipation path towards the second conduction region 242b, 244b.
Therefore, when the first conduction region 242a, 244a electrically connect corresponding emitting semiconductor wafer 240b, because of electric current flows through heat energy that conductive layer produces can be by this heat dissipation path heat conduction to outside, thereby can avoid long-term accumulated heat energy in lampshade, and then influence the quality of inner member.
In addition, also can increase a thermal conductive wire 260 in addition, its surface from lampshade 250 inboards extends to the surface in the lampshade outside, like this, can form one second heat dissipation path.
In addition, see also Fig. 3 a to Fig. 3 h, present embodiment is for cooperating the required shape of lampshade and the ad-hoc location at periphery place thereof, and for obtaining preferable radiating effect, some has the conductive layer 300 of first conduction region and second conduction region, that its shape can be designed to respectively be is trapezoidal, triangle, ellipse, rectangle, mososeries, circular arc, hexagon, infundibulate one of them.
The above-mentioned printed circuit board (PCB) that is used for lighting device as shown in Figure 2, can be made separately, and lampshade or wafer then can be assembled in addition.This printed circuit board (PCB) main element comprises a circuit board 210, has a loading end, uses for a lampshade 250 to cover; The conductive layer 212 of a plurality of mutual isolation is positioned on the loading end; And a plurality ofly be used to carry emitting semiconductor wafer 240a, the bearing of 240b, bearing is usually located in the depressed area that is formed by the etching conductive layer, as shown in this embodiment, be arranged at respectively between the conductive layer 212 of mutual isolation, wherein, some conductive layer is as 242,244 comprise one first conduction region 242a, 244a and one second conduction region 242b, 244b, so that when covering on the loading end with lampshade 250, the second conduction region 242b, 244b is positioned on the surface in lampshade 250 outsides, and the first conduction region 242a, 244a is positioned on the surface of lampshade inboard, to be used for electrically connecting corresponding emitting semiconductor wafer 240b.
By the foregoing description, can avoid when the semiconductor light emitting wafer sends light source by conductive layer energising, the heat energy excessive accumulation that produces at conductive layer in lampshade, thereby cause the damage of inner member.
Being simply described as follows of symbol in the accompanying drawing:
100: printed circuit board (PCB) 120,130: power electrode
112: Copper Foil 142,144: copper foil electrode
110: circuit board 140: light-emittingdiode
150: lampshade 220,230: power electrode
200: printed circuit board (PCB) 250: lampshade
210: circuit board 242a, 244a: first conduction region
212,300: mutual conductive layer 242b, the 244b that isolates: second conduction region
240a, 240b: emitting semiconductor wafer 260: thermal conductive wire
242,244,246,248: conductive layer
Claims (8)
1, a kind of lighting device is characterized in that comprising:
The circuit board that can receive power supply, it has a loading end;
The conductive layer of a plurality of mutual isolation is positioned on the described loading end;
A plurality of emitting semiconductor wafer are arranged at respectively between the conductive layer of described mutual isolation, and wherein said emitting semiconductor wafer has pair of terminal separately, and its conductive layer that is electrically connected at adjacent described emitting semiconductor wafer both sides is to receive described power supply; And
A lampshade, cover described emitting semiconductor wafer, wherein, at least one comprises one first conduction region and one second conduction region in the described conductive layer, wherein said first conduction region electrically connects corresponding emitting semiconductor wafer, described second conduction region is positioned on the surface in the described lampshade outside, to form one from first heat dissipation path of described first conduction region towards described second conduction region.
2, lighting device according to claim 1 is characterized in that described first conduction region is positioned on the surface of described lampshade inboard.
3, lighting device according to claim 1 it is characterized in that described circuit board comprises a pair of power electrode receiving described power supply, and this is exported described power supply to described conductive layer to power electrode.
4, lighting device according to claim 1 is characterized in that also comprising a thermal conductive wire, and its surface from described lampshade inboard extends to the surface in the described lampshade outside, to form one second heat dissipation path.
5, lighting device according to claim 1 is characterized in that described circuit board is for circular.
6, lighting device according to claim 1 is characterized in that the periphery arrangement of described conductive layer part along described lampshade, and described second conduction region is positioned on the surface in the described lampshade outside.
7, lighting device according to claim 4, it is characterized in that in the described conductive layer at least one has first conduction region and second conduction region, and its shape be trapezoidal, triangle, ellipse, rectangle, mososeries, circular arc, hexagon, infundibulate one of them.
8, a kind of printed circuit board (PCB) that is used for lighting device is characterized in that comprising:
A circuit board has a loading end, uses for a lampshade to cover;
The conductive layer of a plurality of mutual isolation is positioned on the described loading end; And
A plurality of bearings that are used to carry emitting semiconductor wafer, be arranged at respectively between the conductive layer of described mutual isolation, wherein, in the described conductive layer at least one comprises one first conduction region and one second conduction region, so that when described lampshade covers on the described loading end, described second conduction region is positioned on the surface in the described lampshade outside, and described first conduction region is positioned on the surface of described lampshade inboard, to be used for electrically connecting corresponding emitting semiconductor wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410085387 CN1764339A (en) | 2004-10-22 | 2004-10-22 | Lighting device and printed circuit board for the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410085387 CN1764339A (en) | 2004-10-22 | 2004-10-22 | Lighting device and printed circuit board for the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1764339A true CN1764339A (en) | 2006-04-26 |
Family
ID=36748216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410085387 Pending CN1764339A (en) | 2004-10-22 | 2004-10-22 | Lighting device and printed circuit board for the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1764339A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076165A (en) * | 2011-01-30 | 2011-05-25 | 乐健线路板（珠海）有限公司 | Double-layer high-heat dissipation sandwich metal base printed circuit board |
-
2004
- 2004-10-22 CN CN 200410085387 patent/CN1764339A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076165A (en) * | 2011-01-30 | 2011-05-25 | 乐健线路板（珠海）有限公司 | Double-layer high-heat dissipation sandwich metal base printed circuit board |
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