CN1759284A - 混合类型的冷却装置 - Google Patents
混合类型的冷却装置 Download PDFInfo
- Publication number
- CN1759284A CN1759284A CNA2003801101921A CN200380110192A CN1759284A CN 1759284 A CN1759284 A CN 1759284A CN A2003801101921 A CNA2003801101921 A CN A2003801101921A CN 200380110192 A CN200380110192 A CN 200380110192A CN 1759284 A CN1759284 A CN 1759284A
- Authority
- CN
- China
- Prior art keywords
- phase transformation
- hop
- evaporation section
- cooling device
- liquid refrigerant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2210/00—Heat exchange conduits
- F28F2210/02—Heat exchange conduits with particular branching, e.g. fractal conduit arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/02—Coatings; Surface treatments hydrophilic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (28)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0004932A KR100505554B1 (ko) | 2003-01-24 | 2003-01-24 | 하이브리드형 냉각 장치 |
KR1020030004932 | 2003-01-24 | ||
KR10-2003-0004932 | 2003-01-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1759284A true CN1759284A (zh) | 2006-04-12 |
CN100419355C CN100419355C (zh) | 2008-09-17 |
Family
ID=36383779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003801101921A Expired - Fee Related CN100419355C (zh) | 2003-01-24 | 2003-10-28 | 混合类型的冷却装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7249627B2 (zh) |
EP (1) | EP1595099A4 (zh) |
JP (1) | JP2006513577A (zh) |
KR (1) | KR100505554B1 (zh) |
CN (1) | CN100419355C (zh) |
AU (1) | AU2003273116A1 (zh) |
RU (1) | RU2005126722A (zh) |
WO (1) | WO2004065866A1 (zh) |
Cited By (13)
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CN102052783A (zh) * | 2009-11-11 | 2011-05-11 | 施国庆 | 内凹放热界面真空循环集热元件 |
CN102052778A (zh) * | 2009-11-11 | 2011-05-11 | 林根弟 | 可伐封接真空循环集热元件太阳集热装置 |
CN102052785A (zh) * | 2009-11-11 | 2011-05-11 | 徐利明 | 罩玻璃管放热的真空循环集热元件 |
CN102052786A (zh) * | 2009-11-11 | 2011-05-11 | 徐利明 | 可伐封接的真空循环集热元件 |
CN103313574A (zh) * | 2012-03-06 | 2013-09-18 | 宏碁股份有限公司 | 散热装置 |
CN102052784B (zh) * | 2009-11-11 | 2014-11-12 | 赵钦舫 | 玻璃管熔封的真空循环集热元件 |
CN102052779B (zh) * | 2009-11-11 | 2014-12-10 | 邱丽琴 | 真空循环集热元件太阳集热装置 |
CN104266518A (zh) * | 2014-10-13 | 2015-01-07 | 芜湖长启炉业有限公司 | 三环超导散热座 |
CN104296575A (zh) * | 2014-11-04 | 2015-01-21 | 芜湖长启炉业有限公司 | 管套式超导散热器 |
CN104780738A (zh) * | 2014-01-15 | 2015-07-15 | 奇鋐科技股份有限公司 | 热管结构及散热模块 |
CN105258382A (zh) * | 2015-09-29 | 2016-01-20 | 青岛海尔特种电冰箱有限公司 | 换热装置及具有该换热装置的半导体制冷冰箱 |
CN105300145A (zh) * | 2014-07-02 | 2016-02-03 | 程长青 | 热管加热式散热器 |
CN109244051A (zh) * | 2018-10-30 | 2019-01-18 | 中国航天空气动力技术研究院 | 一种用于服务器芯片散热的并联式环路热管散热装置 |
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JP2005191452A (ja) * | 2003-12-26 | 2005-07-14 | Toshiba Corp | 放熱器、冷却装置および冷却装置を有する電子機器 |
KR100512116B1 (ko) * | 2004-12-17 | 2005-09-02 | 박윤종 | 냉각기 |
WO2006109929A1 (en) | 2005-04-11 | 2006-10-19 | Zalman Tech Co., Ltd. | Apparatus for cooling computer parts and method of manufacturing the same |
JP2006322630A (ja) * | 2005-05-17 | 2006-11-30 | Dainippon Screen Mfg Co Ltd | 熱処理装置 |
US7824075B2 (en) | 2006-06-08 | 2010-11-02 | Lighting Science Group Corporation | Method and apparatus for cooling a lightbulb |
US20100132924A1 (en) * | 2007-04-27 | 2010-06-03 | National University Of Singapore | Cooling device for electronic components |
US8142702B2 (en) * | 2007-06-18 | 2012-03-27 | Molecular Imprints, Inc. | Solvent-assisted layer formation for imprint lithography |
WO2009007905A2 (en) * | 2007-07-11 | 2009-01-15 | Koninklijke Philips Electronics N.V. | Heat pipe |
KR102165778B1 (ko) * | 2007-11-16 | 2020-10-14 | 매뉴팩처링 리소시스 인터내셔널 인코포레이티드 | 듀얼-모드 냉각 시스템 및 듀얼-모드로 냉각되는 전자 디스플레이 어셈블리 |
US8854595B2 (en) | 2008-03-03 | 2014-10-07 | Manufacturing Resources International, Inc. | Constricted convection cooling system for an electronic display |
US8497972B2 (en) | 2009-11-13 | 2013-07-30 | Manufacturing Resources International, Inc. | Thermal plate with optional cooling loop in electronic display |
US8773633B2 (en) | 2008-03-03 | 2014-07-08 | Manufacturing Resources International, Inc. | Expanded heat sink for electronic displays |
US8654302B2 (en) | 2008-03-03 | 2014-02-18 | Manufacturing Resources International, Inc. | Heat exchanger for an electronic display |
US9173325B2 (en) | 2008-03-26 | 2015-10-27 | Manufacturing Resources International, Inc. | Heat exchanger for back to back electronic displays |
US8693185B2 (en) | 2008-03-26 | 2014-04-08 | Manufacturing Resources International, Inc. | System and method for maintaining a consistent temperature gradient across an electronic display |
KR101007174B1 (ko) * | 2008-11-05 | 2011-01-12 | 한국전자통신연구원 | 박형 냉각소자 |
US10827656B2 (en) | 2008-12-18 | 2020-11-03 | Manufacturing Resources International, Inc. | System for cooling an electronic image assembly with circulating gas and ambient gas |
US8749749B2 (en) | 2008-12-18 | 2014-06-10 | Manufacturing Resources International, Inc. | System for cooling an electronic image assembly with manifolds and ambient gas |
US20100212862A1 (en) * | 2009-02-26 | 2010-08-26 | Chun-Ju Lin | Cooling structure for a housing |
US8147994B2 (en) * | 2009-02-26 | 2012-04-03 | Tdk Corporation | Layered structure having FePt system magnetic layer and magnetoresistive effect element using the same |
BRPI1013063B1 (pt) * | 2009-05-18 | 2020-11-17 | Huawei Technologies Co., Ltd. | dispositivo de propagação de calor de termossifão e método para fabricar um dispositivo de propagação de calor de termossifão |
CN102052776B (zh) * | 2009-11-11 | 2014-08-06 | 邱丽琴 | 罩玻璃管放热真空循环集热元件太阳集热装置 |
TWI423015B (zh) * | 2010-07-21 | 2014-01-11 | Asia Vital Components Co Ltd | Pressure gradient driven thin plate type low pressure heat siphon plate |
DE102011015097B4 (de) * | 2011-03-15 | 2013-10-24 | Asia Vital Components Co., Ltd. | Kühleinheit mit hydrophiler Verbindungsschicht |
US9506699B2 (en) * | 2012-02-22 | 2016-11-29 | Asia Vital Components Co., Ltd. | Heat pipe structure |
TWI449875B (zh) * | 2012-02-29 | 2014-08-21 | Acer Inc | 散熱裝置 |
US11454454B2 (en) * | 2012-03-12 | 2022-09-27 | Cooler Master Co., Ltd. | Flat heat pipe structure |
WO2013159040A1 (en) * | 2012-04-19 | 2013-10-24 | Packet Photonics, Inc. | Heat removal system for devices and subassemblies |
US20130291555A1 (en) | 2012-05-07 | 2013-11-07 | Phononic Devices, Inc. | Thermoelectric refrigeration system control scheme for high efficiency performance |
CA2888494C (en) | 2012-10-16 | 2019-09-24 | Manufacturing Resources International, Inc. | Back pan cooling assembly for electronic display |
WO2014149773A1 (en) | 2013-03-15 | 2014-09-25 | Manufacturing Resources International, Inc. | Heat exchange assembly for an electronic display |
US10524384B2 (en) | 2013-03-15 | 2019-12-31 | Manufacturing Resources International, Inc. | Cooling assembly for an electronic display |
WO2015006335A2 (en) | 2013-07-08 | 2015-01-15 | Manufacturing Resources International, Inc. | Figure eight closed loop cooling system for electronic display |
US20150226492A1 (en) * | 2014-02-12 | 2015-08-13 | Asia Vital Components Co., Ltd. | Heat Pipe Structure and Thermal Module Using Same |
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US20150308750A1 (en) * | 2014-04-28 | 2015-10-29 | J R Thermal LLC | Slug Pump Heat Pipe |
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US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
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US9723765B2 (en) | 2015-02-17 | 2017-08-01 | Manufacturing Resources International, Inc. | Perimeter ventilation system for electronic display |
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US10353445B2 (en) * | 2016-04-11 | 2019-07-16 | Qualcomm Incorporated | Multi-phase heat dissipating device for an electronic device |
US10746474B2 (en) | 2016-04-11 | 2020-08-18 | Qualcomm Incorporated | Multi-phase heat dissipating device comprising piezo structures |
TWM532046U (zh) * | 2016-06-02 | 2016-11-11 | Tai Sol Electronics Co Ltd | 具有液汽分離結構的均溫板 |
US10485113B2 (en) | 2017-04-27 | 2019-11-19 | Manufacturing Resources International, Inc. | Field serviceable and replaceable display |
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US11181323B2 (en) | 2019-02-21 | 2021-11-23 | Qualcomm Incorporated | Heat-dissipating device with interfacial enhancements |
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US11611192B2 (en) * | 2019-10-04 | 2023-03-21 | Accelsius, Llc | Embedded microfluidic distribution apparatus for passively cooling optoelectronic devices |
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US11477923B2 (en) | 2020-10-02 | 2022-10-18 | Manufacturing Resources International, Inc. | Field customizable airflow system for a communications box |
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US11470749B2 (en) | 2020-10-23 | 2022-10-11 | Manufacturing Resources International, Inc. | Forced air cooling for display assemblies using centrifugal fans |
CN113453510B (zh) * | 2021-06-28 | 2022-10-11 | 航天科技控股集团股份有限公司 | 一种逆变器的散热结构 |
US11966263B2 (en) | 2021-07-28 | 2024-04-23 | Manufacturing Resources International, Inc. | Display assemblies for providing compressive forces at electronic display layers |
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US11744054B2 (en) | 2021-08-23 | 2023-08-29 | Manufacturing Resources International, Inc. | Fan unit for providing improved airflow within display assemblies |
US11762231B2 (en) | 2021-08-23 | 2023-09-19 | Manufacturing Resources International, Inc. | Display assemblies inducing turbulent flow |
US11968813B2 (en) | 2021-11-23 | 2024-04-23 | Manufacturing Resources International, Inc. | Display assembly with divided interior space |
US12010813B2 (en) | 2022-07-22 | 2024-06-11 | Manufacturing Resources International, Inc. | Self-contained electronic display assembly, mounting structure and methods for the same |
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JPH07318269A (ja) | 1994-05-25 | 1995-12-08 | Mitsubishi Cable Ind Ltd | ヒートパイプ構造体 |
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JPH09113058A (ja) | 1995-10-23 | 1997-05-02 | Fuji Electric Co Ltd | 電子冷却式冷却ユニット |
JPH1163722A (ja) * | 1997-08-11 | 1999-03-05 | Daikin Ind Ltd | 流体冷却装置 |
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CN1077676C (zh) * | 1998-03-30 | 2002-01-09 | 河北节能投资有限责任公司 | 采用热管传导散热的温差电致冷器 |
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JP2001201233A (ja) * | 2000-01-20 | 2001-07-27 | Fujitsu General Ltd | 保温・保冷装置 |
JP2001227852A (ja) * | 2000-02-16 | 2001-08-24 | Komatsu Ltd | 断熱パネル |
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-
2003
- 2003-01-24 KR KR10-2003-0004932A patent/KR100505554B1/ko not_active IP Right Cessation
- 2003-10-28 JP JP2004567181A patent/JP2006513577A/ja active Pending
- 2003-10-28 EP EP03754300A patent/EP1595099A4/en not_active Withdrawn
- 2003-10-28 CN CNB2003801101921A patent/CN100419355C/zh not_active Expired - Fee Related
- 2003-10-28 US US10/543,417 patent/US7249627B2/en not_active Expired - Fee Related
- 2003-10-28 RU RU2005126722/12A patent/RU2005126722A/ru not_active Application Discontinuation
- 2003-10-28 WO PCT/KR2003/002282 patent/WO2004065866A1/en active Application Filing
- 2003-10-28 AU AU2003273116A patent/AU2003273116A1/en not_active Abandoned
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102052778A (zh) * | 2009-11-11 | 2011-05-11 | 林根弟 | 可伐封接真空循环集热元件太阳集热装置 |
CN102052785A (zh) * | 2009-11-11 | 2011-05-11 | 徐利明 | 罩玻璃管放热的真空循环集热元件 |
CN102052786A (zh) * | 2009-11-11 | 2011-05-11 | 徐利明 | 可伐封接的真空循环集热元件 |
CN102052785B (zh) * | 2009-11-11 | 2014-10-22 | 邱旭堂 | 罩玻璃管放热的真空循环集热元件 |
CN102052784B (zh) * | 2009-11-11 | 2014-11-12 | 赵钦舫 | 玻璃管熔封的真空循环集热元件 |
CN102052779B (zh) * | 2009-11-11 | 2014-12-10 | 邱丽琴 | 真空循环集热元件太阳集热装置 |
CN102052783A (zh) * | 2009-11-11 | 2011-05-11 | 施国庆 | 内凹放热界面真空循环集热元件 |
CN103313574A (zh) * | 2012-03-06 | 2013-09-18 | 宏碁股份有限公司 | 散热装置 |
CN103313574B (zh) * | 2012-03-06 | 2016-03-30 | 宏碁股份有限公司 | 散热装置 |
CN104780738A (zh) * | 2014-01-15 | 2015-07-15 | 奇鋐科技股份有限公司 | 热管结构及散热模块 |
CN105300145A (zh) * | 2014-07-02 | 2016-02-03 | 程长青 | 热管加热式散热器 |
CN105300145B (zh) * | 2014-07-02 | 2017-08-29 | 程长青 | 热管加热式散热器 |
CN104266518A (zh) * | 2014-10-13 | 2015-01-07 | 芜湖长启炉业有限公司 | 三环超导散热座 |
CN104296575A (zh) * | 2014-11-04 | 2015-01-21 | 芜湖长启炉业有限公司 | 管套式超导散热器 |
CN105258382A (zh) * | 2015-09-29 | 2016-01-20 | 青岛海尔特种电冰箱有限公司 | 换热装置及具有该换热装置的半导体制冷冰箱 |
CN109244051A (zh) * | 2018-10-30 | 2019-01-18 | 中国航天空气动力技术研究院 | 一种用于服务器芯片散热的并联式环路热管散热装置 |
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RU2005126722A (ru) | 2006-02-10 |
EP1595099A4 (en) | 2010-03-10 |
US7249627B2 (en) | 2007-07-31 |
JP2006513577A (ja) | 2006-04-20 |
WO2004065866A1 (en) | 2004-08-05 |
AU2003273116A1 (en) | 2004-08-13 |
EP1595099A1 (en) | 2005-11-16 |
KR100505554B1 (ko) | 2005-08-03 |
US20060266499A1 (en) | 2006-11-30 |
KR20040067701A (ko) | 2004-07-30 |
CN100419355C (zh) | 2008-09-17 |
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