CN1739186B - 芯片传送方法与设备 - Google Patents
芯片传送方法与设备 Download PDFInfo
- Publication number
- CN1739186B CN1739186B CN2003801089046A CN200380108904A CN1739186B CN 1739186 B CN1739186 B CN 1739186B CN 2003801089046 A CN2003801089046 A CN 2003801089046A CN 200380108904 A CN200380108904 A CN 200380108904A CN 1739186 B CN1739186 B CN 1739186B
- Authority
- CN
- China
- Prior art keywords
- chip
- plane
- head
- chuck
- transfer assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012546 transfer Methods 0.000 title claims abstract description 117
- 238000000034 method Methods 0.000 title claims description 35
- 230000005540 biological transmission Effects 0.000 claims description 56
- 230000033001 locomotion Effects 0.000 claims description 19
- 230000008093 supporting effect Effects 0.000 claims description 8
- 230000013011 mating Effects 0.000 claims description 7
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 abstract description 5
- 238000010168 coupling process Methods 0.000 abstract description 5
- 238000005859 coupling reaction Methods 0.000 abstract description 5
- 230000007246 mechanism Effects 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 17
- 238000013459 approach Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 210000004907 gland Anatomy 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (28)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03100077 | 2003-01-16 | ||
EP03100077.1 | 2003-01-16 | ||
PCT/IB2003/006050 WO2004064124A1 (en) | 2003-01-16 | 2003-12-11 | Chip transfer method and apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1739186A CN1739186A (zh) | 2006-02-22 |
CN1739186B true CN1739186B (zh) | 2010-10-13 |
Family
ID=32695655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2003801089046A Expired - Lifetime CN1739186B (zh) | 2003-01-16 | 2003-12-11 | 芯片传送方法与设备 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7726011B2 (zh) |
EP (1) | EP1588402B1 (zh) |
JP (1) | JP2006513565A (zh) |
KR (1) | KR20050092765A (zh) |
CN (1) | CN1739186B (zh) |
AT (1) | ATE522925T1 (zh) |
AU (1) | AU2003303704A1 (zh) |
TW (1) | TW200501200A (zh) |
WO (1) | WO2004064124A1 (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7303111B2 (en) * | 2005-10-14 | 2007-12-04 | Asm Technology Singapore Pte. Ltd. | Lightweight bondhead assembly |
US7569932B2 (en) | 2005-11-18 | 2009-08-04 | Checkpoint Systems, Inc. | Rotary chip attach |
JP2009526394A (ja) * | 2006-02-10 | 2009-07-16 | エヌエックスピー ビー ヴィ | 光学装置を対象物と合わせるための器具を備える光学機器を持つ半導体処理システム |
JP2008098320A (ja) * | 2006-10-11 | 2008-04-24 | Nidec Tosok Corp | ボンディング装置 |
KR100787627B1 (ko) * | 2007-02-01 | 2007-12-26 | (주)큐엠씨 | 반도체 칩 분류장치 |
JP5074788B2 (ja) * | 2007-03-06 | 2012-11-14 | 株式会社日立ハイテクインスツルメンツ | チップ部品装着装置 |
JP2009105357A (ja) * | 2007-10-23 | 2009-05-14 | M Tec Kk | チップの搬送方法及び装置 |
SG173943A1 (en) * | 2010-03-04 | 2011-09-29 | Ah Yoong Sim | Rotary die bonding apparatus and methodology thereof |
WO2013171863A1 (ja) * | 2012-05-16 | 2013-11-21 | 上野精機株式会社 | ダイボンダー装置 |
WO2014087489A1 (ja) * | 2012-12-04 | 2014-06-12 | 上野精機株式会社 | ダイボンダー装置 |
KR102231293B1 (ko) | 2014-02-10 | 2021-03-23 | 삼성전자주식회사 | 다이 본딩 장치 |
US10199254B2 (en) * | 2015-05-12 | 2019-02-05 | Nexperia B.V. | Method and system for transferring semiconductor devices from a wafer to a carrier structure |
US10104784B2 (en) | 2015-11-06 | 2018-10-16 | Nxp B.V. | Method for making an electronic product with flexible substrate |
US9994407B2 (en) | 2015-11-06 | 2018-06-12 | Nxp B.V. | System and method for processing a flexible substrate |
CN109314069B (zh) * | 2016-05-13 | 2022-08-12 | Asml荷兰有限公司 | 用于部件堆叠和/或拾放过程的微型多拾取元件 |
US10192773B2 (en) | 2016-06-20 | 2019-01-29 | Nexperia B.V. | Semiconductor device positioning system and method for semiconductor device positioning |
KR101785388B1 (ko) | 2016-07-11 | 2017-10-16 | (주)쏠라딘 | 칩 이송 장치 및 이를 이용한 칩 이송 시스템 |
JP6889614B2 (ja) * | 2017-05-31 | 2021-06-18 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
DE102017124582A1 (de) * | 2017-10-20 | 2019-04-25 | Asm Assembly Systems Gmbh & Co. Kg | Ergänzungswerkzeug für Chip-Transfervorrichtung mit Entnahmewerkzeug und Wendewerkzeug |
EP3503172B1 (en) * | 2017-12-20 | 2024-04-03 | Nexperia B.V. | Apparatus and system |
EP3672040A1 (en) * | 2018-12-17 | 2020-06-24 | Nexperia B.V. | Device for enabling a rotating and translating movement by means of a single motor; apparatus and system comprising such a device |
KR102172744B1 (ko) * | 2019-01-28 | 2020-11-02 | 세메스 주식회사 | 다이 본딩 장치 |
EP3734649A1 (en) * | 2019-05-03 | 2020-11-04 | Nexperia B.V. | Electronic component transfer apparatus |
DE102019125134A1 (de) | 2019-09-18 | 2021-03-18 | Mühlbauer Gmbh & Co. Kg | Bauteilhandhabung, Bauteilinspektion |
DE102019125127A1 (de) * | 2019-09-18 | 2021-03-18 | Mühlbauer Gmbh & Co. Kg | Bauteilhandhabung, Bauteilinspektion |
JP6842732B1 (ja) * | 2020-09-24 | 2021-03-17 | 上野精機株式会社 | 電子部品の処理装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN85107808A (zh) * | 1985-05-20 | 1987-01-28 | Tdk株式会社 | 在印刷电路板上安装芯片型电路元件的方法及其所用装置 |
US4653664A (en) * | 1983-07-01 | 1987-03-31 | Sanyo Electric Co | Automatic component mounting apparatus |
EP0312116A2 (en) * | 1987-10-16 | 1989-04-19 | Sanyo Electric Co., Ltd | Automatic electronic parts mounting apparatus |
CN1038740A (zh) * | 1988-06-16 | 1990-01-10 | Tdk株式会社 | 电子元件安装设备 |
US4913335A (en) * | 1988-09-01 | 1990-04-03 | Mitsubishi Denki Kabushiki Kaisha | Method and apparatus for die bonding |
US6171049B1 (en) * | 1996-02-29 | 2001-01-09 | Alphasem Ag | Method and device for receiving, orientating and assembling of components |
EP1194029A1 (en) * | 1999-05-06 | 2002-04-03 | Matsushita Electric Industrial Co., Ltd. | Component mounting apparatus and method therefor |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4461610A (en) * | 1980-06-02 | 1984-07-24 | Tdk Corporation | Apparatus for mounting chip type circuit elements on printed circuit boards |
KR100779771B1 (ko) * | 2000-09-13 | 2007-11-27 | 언액시스 인터내셔널 트레이딩 엘티디 | 반도체 칩을 장착하는 장치 |
-
2003
- 2003-12-11 WO PCT/IB2003/006050 patent/WO2004064124A1/en active Application Filing
- 2003-12-11 JP JP2004566187A patent/JP2006513565A/ja active Pending
- 2003-12-11 US US10/561,397 patent/US7726011B2/en active Active
- 2003-12-11 AT AT03815128T patent/ATE522925T1/de not_active IP Right Cessation
- 2003-12-11 EP EP03815128A patent/EP1588402B1/en not_active Expired - Lifetime
- 2003-12-11 AU AU2003303704A patent/AU2003303704A1/en not_active Abandoned
- 2003-12-11 CN CN2003801089046A patent/CN1739186B/zh not_active Expired - Lifetime
- 2003-12-11 KR KR1020057013196A patent/KR20050092765A/ko not_active Application Discontinuation
-
2004
- 2004-01-13 TW TW093100807A patent/TW200501200A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4653664A (en) * | 1983-07-01 | 1987-03-31 | Sanyo Electric Co | Automatic component mounting apparatus |
CN85107808A (zh) * | 1985-05-20 | 1987-01-28 | Tdk株式会社 | 在印刷电路板上安装芯片型电路元件的方法及其所用装置 |
EP0312116A2 (en) * | 1987-10-16 | 1989-04-19 | Sanyo Electric Co., Ltd | Automatic electronic parts mounting apparatus |
CN1038740A (zh) * | 1988-06-16 | 1990-01-10 | Tdk株式会社 | 电子元件安装设备 |
US4913335A (en) * | 1988-09-01 | 1990-04-03 | Mitsubishi Denki Kabushiki Kaisha | Method and apparatus for die bonding |
US6171049B1 (en) * | 1996-02-29 | 2001-01-09 | Alphasem Ag | Method and device for receiving, orientating and assembling of components |
EP1194029A1 (en) * | 1999-05-06 | 2002-04-03 | Matsushita Electric Industrial Co., Ltd. | Component mounting apparatus and method therefor |
Non-Patent Citations (1)
Title |
---|
US 6171049 B1,全文. |
Also Published As
Publication number | Publication date |
---|---|
CN1739186A (zh) | 2006-02-22 |
EP1588402A1 (en) | 2005-10-26 |
WO2004064124A1 (en) | 2004-07-29 |
US20070137031A1 (en) | 2007-06-21 |
EP1588402B1 (en) | 2011-08-31 |
ATE522925T1 (de) | 2011-09-15 |
AU2003303704A1 (en) | 2004-08-10 |
US7726011B2 (en) | 2010-06-01 |
KR20050092765A (ko) | 2005-09-22 |
TW200501200A (en) | 2005-01-01 |
JP2006513565A (ja) | 2006-04-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: NXP CO., LTD. Free format text: FORMER OWNER: KONINKLIJKE PHILIPS ELECTRONICS N.V. Effective date: 20071109 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20071109 Address after: Holland Ian Deho Finn Applicant after: NXP B.V. Address before: Holland Ian Deho Finn Applicant before: Koninklijke Philips Electronics N.V. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160912 Address after: Holland Ian Deho Finn Patentee after: Nexperia B.V. Address before: Holland Ian Deho Finn Patentee before: NXP B.V. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Nijmegen Patentee after: NEXPERIA B.V. Address before: Holland Ian Deho Finn Patentee before: Nexperia B.V. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20101013 |