CN1735316A - Circuit base board - Google Patents
Circuit base board Download PDFInfo
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- CN1735316A CN1735316A CN 200410056728 CN200410056728A CN1735316A CN 1735316 A CN1735316 A CN 1735316A CN 200410056728 CN200410056728 CN 200410056728 CN 200410056728 A CN200410056728 A CN 200410056728A CN 1735316 A CN1735316 A CN 1735316A
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- cylindrical conductor
- circuit substrate
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- micropore
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Abstract
The circuit base board comprises inductance structure and reference surface. Wherein, the inductance structure comprises a first cylinder conductor with separated left and conduction poles, a second cylinder conductor on near side to the first one, a first routing electric connected to the first bottom of left conduction pole of first cylinder conductor and the second bottom of second cylinder conductor, and a second routing electric connected to the first top of right conduction pole of first cylinder conductor and the second top of second cylinder conductor; the reference surface is on the second surface to make magnetic contour from inductance parallel with the reference surface; wherein, the first and second cylinder conductor are arranged separately on circuit base board and cut through the opposite first and second surfaces of the board.
Description
Technical field
The relevant a kind of circuit substrate of the present invention, and particularly relevant a kind of laser cutting drilling technique that utilizes is to form the circuit substrate of built-in inductor structure.
Background technology
Please refer to Figure 1A and Figure 1B, Figure 1A is the vertical view of conventional helical shape inductance, and Figure 1B is the side cutaway view of conventional helical shape inductance.Conventional helical shape inductance 10 be planar configuration on substrate 14 surfaces, and by micropore (micro-via) 12, helical form inductance 10 electrically connects ground planes 16.The magnetic line of force 18 is perpendicular to ground plane 16, and reflected by ground plane 16.This is because ground plane 16 can change the distribution situation of electric field/magnetic field, the effect of performance shielding.But helical form inductance 10 belows to 16 spaces that covered of ground plane can't be used.In addition, the wire circle of inductance value and inductance square is directly proportional, and the helical form inductance 10 of planar configuration is because of being limited by limited layout (layout) space, and (quality factor Q) all can't effective raising for inductance value and factor of merit.
Conventional helical shape inductance 10 generally can design the helical form inductance with the maximum factor of merit under the required operating frequency, so that required inductance value is provided on the Free Region of substrate when design.But in order to reduce the eddy current loss of substrate layer, and reduce the electric capacity that is coupled to substrate, conventional helical shape inductance must be from semiconductor substrate more better.Therefore, must keep certain height H between conventional helical shape inductance 10 and the ground plane 16 (plane of reference), can not unconfinedly compress, this is against the trend of integrated element microminiaturization.On the other hand, ground plane but is obligato, otherwise electromagnetism can be coupled and interfere with adjacent element.In addition, the excessive and helical form inductance 10 in the aperture of micropore 12 all can take the arrangement space of substrate surface.
What deserves to be mentioned is that inductance value generally commonly used and factor of merit (Q) are weighed the quality of an inductance.The Q value is a key property of inductance.Q is in order to weigh an inductance " purity ".For an inductance, the Q value is higher, and the energy of loss is lower.
Illustrating further, is example with a simple and easy LRC circuit 20, and as shown in Figure 2, inductance 22, resistance 24 are to contact mutually with electric capacity 26.In this circuit,, so produce reforming phenomena because energy stored is back and forth between inductance 22 and electric capacity 26.At this moment, factor of merit Q promptly is used to weigh the decay of this reforming phenomena, and the Q value is higher, and the amplitude of decay is littler.Shown in the following row mathematical expression of Q value and inductance value relation:
Q=ω L/R, in other words, inductance value L is higher, and the Q value is also bigger.
Summary of the invention
In view of this, the purpose of this invention is to provide a kind of circuit substrate, this kind circuit substrate has built-in induction structure, not only can increase arrangement space, also can produce bigger inductance value and Q value.
According to a kind of high efficiency circuit substrate of the present invention, it has the magnetic line of force induction structure parallel with the plane of reference.This kind circuit substrate has first micropore and second micropore, runs through opposite first and second surface on the circuit substrate respectively.Circuit substrate includes the induction structure and the plane of reference.Induction structure then includes first cylindrical conductor, second cylindrical conductor, first cabling and second cabling.First cylindrical conductor has left conductive pole spaced apart from each other and right conductive pole, be disposed in first micropore, and second cylindrical conductor is disposed among second micropore, and contiguous first cylindrical conductor.First cylindrical conductor and second cylindrical conductor electrically connect first surface and second surface respectively.First cylindrical conductor cuts out a laser cutting district by laser cutting technique, and this laser cutting district can make the cylindrical conductor of winning be separated into left conductive pole and right conductive pole.First cylindrical conductor forms first top in first surface, and forms first bottom in second surface.Second cylindrical conductor forms second top in first surface, and forms second bottom in second surface.First cabling is positioned on the second surface, in order to first bottom that electrically connects left conductive pole and second bottom of second cylindrical conductor.Second cabling is positioned on the first surface, in order to first top that electrically connects right conductive pole and second top of second cylindrical conductor.
Aforesaid circuit substrate of the present invention also includes a plurality of first cylindrical conductors, a plurality of second cylindrical conductor and a plurality of the 3rd cylindrical conductor, arranges in line and form the three colonnade shape conductor groups that are parallel to each other respectively.Wherein this first cylindrical conductor, second cylindrical conductor and the 3rd cylindrical conductor are disposed at respectively in first micropore, second micropore and the 3rd micropore of circuit substrate.Moreover this first cylindrical conductor is respectively being laser-cut into left conductive pole and right conductive pole, and should right side conductive pole be spaced from each other with corresponding left conductive pole respectively.Wherein the left conductive pole bottom of this first cylindrical conductor electrically connects corresponding second cylindrical conductor bottom respectively with many first cablings, and the left conductive pole top of this first cylindrical conductor electrically connects the 3rd corresponding cylindrical conductor top with many articles the 4th cablings respectively.On the other hand, this conductive pole top, right side of this first cylindrical conductor electrically connects the second corresponding cylindrical conductor top with many second cablings respectively, and this conductive pole bottom, right side of this first cylindrical conductor electrically connects corresponding the 3rd cylindrical conductor bottom respectively with many articles the 3rd cablings.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. is elaborated.
Description of drawings
Figure 1A is the vertical view of conventional helical inductance.
Figure 1B is the side cutaway view of conventional helical inductance.
Fig. 2 is the schematic diagram of simple and easy LRC circuit.
Fig. 3 A is the part microporous side pseudosection of the circuit substrate of first embodiment of the invention.
Fig. 3 B is the part side cutaway view of the circuit substrate of first embodiment of the invention.
Fig. 3 C is another part side cutaway view of the circuit substrate of first embodiment of the invention.
Fig. 3 D is the partial inductance stereogram in the circuit substrate of first embodiment of the invention.
Fig. 4 A is the vertical view of microwell array of the circuit substrate of second embodiment of the invention.
Fig. 4 B is the vertical view of first surface of the circuit substrate of second embodiment of the invention.
Fig. 4 C is the vertical view of second surface of the circuit substrate of second embodiment of the invention.
Fig. 4 D is the partial inductance stereogram in the circuit substrate of second embodiment of the invention.
Embodiment
Embodiment one
Please refer to Fig. 3 A, it is the part microporous side pseudosection of the circuit substrate of first embodiment of the invention.Circuit substrate 300 has a relative first surface 314 and a second surface 316.By formed first micropore 303 of laser cutting drilling technique and second micropore 305 respectively thus the first surface 314 of circuit substrate 300 be through to second surface 316.
Please be simultaneously with reference to Fig. 3 B, Fig. 3 C and Fig. 3 D, Fig. 3 B is the part end view of the circuit substrate of first embodiment of the invention, Fig. 3 C is another part end view of the circuit substrate of first embodiment of the invention, and Fig. 3 D is the partial inductance stereogram in the circuit substrate of first embodiment of the invention.
Circuit substrate 300 comprises an induction structure 302 and a plane of reference.Induction structure 302 includes one first cylindrical conductor 304, one second cylindrical conductor 306, one first cabling 308 and one second cabling 310.First cylindrical conductor 304 is disposed in first micropore 303, and second cylindrical conductor 306 is disposed among second micropore 305, and contiguous first cylindrical conductor 304.First cylindrical conductor 304 and second cylindrical conductor 306 run through circuit substrate 300 respectively.Wherein,, form a laser cutting district 312, and make the therefore laser cutting district 312 and be separated into left conductive pole 3042 and right conductive pole 3041 of cylindrical conductor 304 that wins in first cylindrical conductor, 304 central parts by laser cutting technique.In addition, a side of second cylindrical conductor, 306 contiguous first cylindrical conductors 304.
By two adjacent cylindrical conductors of above-mentioned cabling electrically connect, can form the built-in type coil of an open circulus, make the direction of the magnetic line of force be horizontal direction along circuit substrate 300 and ground plane 317.Thus, but circuit substrate 300 thin typeization not only after forming laminated substrates with other substrates, also can provide bigger arrangement space.The direction indication sense of current of arrow oppositely also can in graphic.
This circuit substrate 300 also can comprise one the 3rd cylindrical conductor 322, and this 3rd cylindrical conductor 322 runs through first surface 314 and second surface 316.Wherein, this first cylindrical conductor 304 is arranged between second cylindrical conductor 306 and the 3rd cylindrical conductor 322.This 3rd cylindrical conductor 322 forms one the 3rd top 3221 in first surface 314, and forms one the 3rd bottom 3222 in second surface 316.The 3rd cabling 324 is positioned on the second surface 316, in order to first bottom 3044 that electrically connects right conductive pole and second bottom 3222 of second cylindrical conductor 306.Make second cylindrical conductor 306, second cabling 310, right conductive pole 3041, the 3rd cabling 324 and the 3rd cylindrical conductor 322 electrically connect and form a S shape structure mutually.
First cylindrical conductor 304, second cylindrical conductor 306 and the 3rd cylindrical conductor 322 of circuit substrate 300 of the present invention have first through hole 318, second through hole 320 and the 3rd through hole 328 respectively, and this perforation aperture can be as small as 10 μ m to 15 μ m.
On the other hand, the laser cutting district 312 of first cylindrical conductor 304 can utilize same laser cutting drilling technique cutting to form.Laser cutting drilling technique of the present invention uses carbon dioxide laser or ultraviolet laser, and wherein, ultraviolet laser more can not produce the diffraction phenomenon because wavelength is shorter, therefore can produce the less micropore in aperture.
The inner wall surface electroless plating of first cylindrical conductor 304, second cylindrical conductor 306 and the 3rd cylindrical conductor 322 of circuit substrate 300 has the layer of copper conductive layer.The another kind of practice is earlier this micropore to be filled the conductive paste of a bronze medal, again row cutting first cylindrical conductor.In other words, no matter this micropore is solid or hollow, all can bring into play identical function.
Embodiment two
Please refer to Fig. 4 A, it is the vertical view of microwell array of the circuit substrate of second embodiment of the invention.By the laser cutting drilling technique, a plurality of first micropores 403, a plurality of second micropore 405 and a plurality of the 3rd micropore 407 that formation is arranged in rows respectively are in substrate 402.
Please be simultaneously with reference to Fig. 4 B and Fig. 4 C, Fig. 4 B is the vertical view of first surface of the circuit substrate of second embodiment of the invention, Fig. 4 C is the vertical view of second surface of the circuit substrate of second embodiment of the invention.
Aforesaid a plurality of cylindrical conductor is disposed in the circuit substrate 400 and vertically runs through circuit substrate 400 respectively.Wherein, several first cylindrical conductors 404 are disposed in this first micropore 403 and are arranged in a straight line, in order to run through first surface 4021 and second surface 4022.This first cylindrical conductor 404 also comprises several left conductive poles 4042 and several right conductive poles 4041, and this right side conductive pole 4041 is spaced from each other with corresponding left conductive pole 4042 respectively.Can be by the laser cutting drilling technique, respectively at forming laser cutting district 410 on this first cylindrical conductor 404, in order at interval should right side conductive pole 4041 and this left side conductive pole 4042.
A plurality of second cylindrical conductors 406, be disposed at corresponding second micropore 405 and be parallel to the front side of this first cylindrical conductor 404, wherein left conductive pole 4042 bottoms of this first cylindrical conductor 404 electrically connect corresponding second cylindrical conductor, 406 bottoms respectively with many first cablings 412, and right conductive pole 4041 tops of this first cylindrical conductor 404 electrically connect corresponding second cylindrical conductor, 406 tops with many second cablings 414 respectively.
A plurality of the 3rd cylindrical conductors 408, be disposed at corresponding the 3rd micropore 407 and be parallel to the rear side of first cylindrical conductor 404, wherein right conductive pole 4041 bottoms of this first cylindrical conductor 404 electrically connect corresponding the 3rd cylindrical conductor 408 bottoms respectively with many articles the 3rd cablings 416, and left conductive pole 4042 tops of this first cylindrical conductor 404 electrically connect corresponding the 3rd cylindrical conductor 408 tops with many articles the 4th cablings 418 respectively.
On the other hand, the plane of reference for example is a ground plane 4024, is disposed on the second surface 4022, in order to the field shape of the limitation magnetic line of force, reaches the effect of shielding.Moreover after feeding electric current, the magnetic line of force that induction structure 402 is produced can be parallel with ground plane 4024.
Please refer to Fig. 4 C, Fig. 4 C is the partial inductance stereogram in the circuit substrate of second embodiment of the invention.Have first through hole 420, second through hole 422 and the 3rd through hole 424 in the cylindrical conductor of this circuit substrate respectively.In the second embodiment of the present invention, the computing formula of inductance value can be derived as follows by Faraday's law under certain frequency:
L1＝μN2A/l＝μN(2wh)/(1/N)＝2μNwh/d
Wherein
L1: inductance value
μ: the magnetic permeability (magnetic permeability) of core material (core material)
N: by the number of turns of cylindrical conductor and coil that cabling surrounds
A: area coil, l: the length of inductance
W: a cylindrical conductor is to the cable run distance between another corresponding cylindrical conductor
H: the height of cylindrical conductor, d: a coil is to the spacing of adjacent windings
Because electronic component is all towards microminiaturization development now,, must dwindle the cable run distance w between adjacent cylindrical conductor and the height h of cylindrical conductor therefore for inductance of the present invention as far as possible.On the other hand, bigger in order to make inductance value, the number of turns of coil is the more the better, and is better little apart from then healing between the adjacent windings.By laser drill and cutting technique now, micropore size can smallly have only tens of microns, just can solve the bottleneck that machine drilling runs into.The direction indication sense of current of arrow oppositely also can in graphic.
Identical with first embodiment is that the through hole aperture of circuit substrate 400 can be as small as and is about 10 μ m to 15 μ m.On the other hand, the laser cutting district 410 of this first cylindrical conductor 404 utilizes same laser cutting drilling technique cutting to form.Laser cutting drilling technique of the present invention uses carbon dioxide laser or ultraviolet laser, and wherein, ultraviolet laser more can not produce the diffraction phenomenon because wavelength is shorter, therefore can produce the less micropore in aperture.
The inner wall surface of a plurality of first cylindrical conductors 404 of circuit substrate 400, a plurality of second cylindrical conductors 406 and a plurality of the 3rd cylindrical conductors 408 electroless plating respectively has the layer of copper conductive layer.The another kind of practice is will fill the conductive paste of a bronze medal in this micropore earlier, again row cutting first cylindrical conductor.Therefore, no matter this micropore is solid or hollow, all brings into play identical function.
The circuit substrate that the above embodiment of the present invention disclosed, its characteristic are by the laser cutting drilling technique, get out three groups of micropores that are parallel to each other in substrate, the more a plurality of cylindrical conductors of configuration in this micropore.Electrically connect each corresponding cylindrical conductor to form the staggered inductance element of a similar coil by cabling.Circuit substrate of the present invention since the direction of the magnetic line of force for being parallel to the substrate and the plane of reference.Thus, no matter substrate on its surface or vertical space, all can increase many arrangement spaces, also thin typeization more.Another characteristic is by the laser cutting drilling technique, a plurality of first cylindrical conductors of circuit substrate of the present invention respectively its go up form about two conductive poles, this conductive pole utilizes cabling and corresponding micropore electric connection more respectively.This mode not only can effectively reduce the quantity of micropore, also can make between the adjacent windings apart from the number of turns of littler, coil the more.According to aforesaid under certain frequency inductance value computing formula as can be known, circuit substrate of the present invention can obtain bigger inductance value and bigger Q value in littler arrangement space.
In sum; though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; any ripe be present technique personnel without departing from the spirit and scope of the present invention; when the change that can make various equivalences or replacement, so protection scope of the present invention is when looking accompanying being as the criterion that the application's claim scope defined.
Claims (21)
1. a circuit substrate has opposite first and second surface, and has one first micropore and one second micropore, runs through this first surface and second surface, and this circuit substrate comprises:
One induction structure comprises:
One first cylindrical conductor has spaced apart from each other one a left conductive pole and a right conductive pole, is disposed in this first micropore, and this first cylindrical conductor forms one first top in this first surface, and forms one first bottom in this second surface;
One second cylindrical conductor, be disposed at this second micropore in, and contiguous this. a cylindrical conductor, this second cylindrical conductor form one second top in this first surface, and form one second bottom in this second surface;
One first cabling is positioned on this second surface, in order to this first bottom of this left side conductive pole of electrically connecting first cylindrical conductor and this second bottom of this second cylindrical conductor; And
One second cabling is positioned on this first surface surface, in order to this first top of this right side conductive pole of electrically connecting this first cylindrical conductor and this second top of this second cylindrical conductor; And
One plane of reference is disposed on this second surface, uses so that the magnetic line of force that this induction structure produced is parallel with this plane of reference.
2. circuit substrate as claimed in claim 1 is characterized in that this left side conductive pole, this first cabling, this second cylindrical conductor, this second cabling and this right side conductive pole form an open circulus.
3. circuit substrate as claimed in claim 1 is characterized in that this plane of reference is a ground plane.
4. circuit substrate as claimed in claim 1 is characterized in that this circuit substrate also has one the 3rd micropore, run through this first surface and this second surface, and this circuit substrate comprises also:
One the 3rd cylindrical conductor is disposed among the 3rd micropore, and the 3rd cylindrical conductor forms one the 3rd top in this first surface, and forms one the 3rd bottom in this second surface; And
One the 3rd cabling is positioned on this second surface, in order to this first bottom of electrically connecting this right side conductive pole and this second bottom of this second cylindrical conductor.
5. circuit substrate as claimed in claim 4 is characterized in that this first cylindrical conductor is arranged between this second cylindrical conductor and the 3rd cylindrical conductor.
6. circuit substrate as claimed in claim 4 is characterized in that this second cylindrical conductor, this second cabling, this right side conductive pole, the 3rd cabling and the 3rd cylindrical conductor form a S shape structure.
7. circuit substrate as claimed in claim 4 is characterized in that this first cylindrical conductor has a laser cutting district, is arranged between this right side conductive pole and this left side conductive pole, should right side conductive pole and this left side conductive pole in order to the interval.
8. circuit substrate as claimed in claim 7, it is characterized in that this first cylindrical conductor, this second cylindrical conductor and the 3rd cylindrical conductor have one first through hole, one second through hole and one the 3rd through hole respectively, and this laser cutting district, this first through hole, this second through hole and the 3rd through hole are to utilize the boring of laser cutting drilling technique to form.
9. circuit substrate as claimed in claim 8 is characterized in that this laser cutting drilling technique is to use carbon dioxide laser.
10. circuit substrate as claimed in claim 8 is characterized in that this laser cutting drilling technique is to use ultraviolet laser.
11. circuit substrate as claimed in claim 8 is characterized in that between pore size 10 μ m to the 15 μ m of this first through hole, this second through hole and the 3rd through hole.
12. circuit substrate as claimed in claim 8 is characterized in that this first cylindrical conductor, this second cylindrical conductor and the 3rd cylindrical conductor are the copper conductive layers that forms with electroless plating.
13. a circuit substrate comprises:
One substrate, have the first surface and the second surface that are oppositely arranged, and have a plurality of first micropores, a plurality of second micropore and a plurality of the 3rd micropore and be disposed at this substrate, this first micropore, this second micropore and the 3rd micropore all run through this first surface and this second surface;
One induction structure comprises:
A plurality of first cylindrical conductors are disposed in this first micropore and are arranged in a straight line, and in order to electrically connect this first surface and this second surface, this first cylindrical conductor also comprises:
A plurality of left conductive poles; And
A plurality of right conductive poles, this right side conductive pole are spaced from each other with corresponding this left side conductive pole respectively;
A plurality of second cylindrical conductors, be disposed in this second micropore and be parallel to the front side of this first cylindrical conductor, wherein this conductive pole bottom, left side of this first cylindrical conductor electrically connects this corresponding second cylindrical conductor bottom respectively with many first cablings, and this conductive pole top, right side of this first cylindrical conductor electrically connects this corresponding second cylindrical conductor top respectively with many second cablings;
A plurality of the 3rd cylindrical conductors, be disposed in the 3rd micropore and be parallel to the rear side of this first cylindrical conductor, in order to electrically connect this first surface and this second surface, wherein this conductive pole bottom, right side of this first cylindrical conductor electrically connects corresponding the 3rd cylindrical conductor bottom respectively with many articles the 3rd cablings, and this conductive pole top, left side of this first cylindrical conductor electrically connects the 3rd corresponding cylindrical conductor top respectively with many articles the 4th cablings; And
One plane of reference is disposed on this second surface, uses so that the magnetic line of force that this induction structure produced is parallel with this plane of reference.
14. circuit substrate as claimed in claim 13 is characterized in that this inductance has a spiral gimmal structure.
15. circuit substrate as claimed in claim 13 is characterized in that this first cylindrical conductor has a plurality of laser cutting district, is arranged between this right side conductive pole and this left side conductive pole, should right side conductive pole and this left side conductive pole in order to the interval.
16. circuit substrate as claimed in claim 13, it is characterized in that this first cylindrical conductor, this second cylindrical conductor and the 3rd cylindrical conductor have a plurality of first through holes, a plurality of second through hole and a plurality of the 3rd through hole respectively, and this laser cutting district, this first through hole, this second through hole and the 3rd through hole are to utilize the boring of laser cutting drilling technique to form.
17. circuit substrate as claimed in claim 13 is characterized in that this plane of reference is a ground plane.
18. circuit substrate as claimed in claim 16 is characterized in that this laser cutting drilling technique is to use carbon dioxide laser.
19. circuit substrate as claimed in claim 16 is characterized in that this laser cutting drilling technique is to use ultraviolet laser.
20. circuit substrate as claimed in claim 16 is characterized in that between pore size 10 μ m to the 15 μ m of this first through hole, this second through hole and the 3rd through hole.
21. circuit substrate as claimed in claim 13 is characterized in that this first cylindrical conductor, this second cylindrical conductor and the 3rd cylindrical conductor are the copper conductive layers that forms respectively with electroless plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100567282A CN100399866C (en) | 2004-08-11 | 2004-08-11 | Circuit base board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100567282A CN100399866C (en) | 2004-08-11 | 2004-08-11 | Circuit base board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1735316A true CN1735316A (en) | 2006-02-15 |
| CN100399866C CN100399866C (en) | 2008-07-02 |
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ID=36077445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100567282A Active CN100399866C (en) | 2004-08-11 | 2004-08-11 | Circuit base board |
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| Country | Link |
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| CN (1) | CN100399866C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102624654A (en) * | 2011-01-28 | 2012-08-01 | 株式会社日立制作所 | Equalizer circuit and printed circuit board |
| CN104780719A (en) * | 2015-04-27 | 2015-07-15 | 博敏电子股份有限公司 | Method for embedding inductors in printed-circuit board and printed-circuit board adopted by method |
| CN106862873A (en) * | 2017-03-07 | 2017-06-20 | 刘健克 | A kind of processing technology of packing machine fuselage |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| YU37241B (en) * | 1977-03-14 | 1984-08-31 | Iskra | Programming matrix |
| JPH08195539A (en) * | 1995-01-18 | 1996-07-30 | Eastern:Kk | Printed circuit board and manufacture thereof |
| US6072375A (en) * | 1998-05-12 | 2000-06-06 | Harris Corporation | Waveguide with edge grounding |
| JP2000216513A (en) * | 1999-01-22 | 2000-08-04 | Hitachi Ltd | Wiring board and manufacturing method using the same |
| JP2002064255A (en) * | 2000-08-22 | 2002-02-28 | Pfu Ltd | Structure of interlayer connection hole, method of manufacturing the interlayer connection hole and printed wiring board |
-
2004
- 2004-08-11 CN CNB2004100567282A patent/CN100399866C/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102624654A (en) * | 2011-01-28 | 2012-08-01 | 株式会社日立制作所 | Equalizer circuit and printed circuit board |
| CN102624654B (en) * | 2011-01-28 | 2016-02-03 | 株式会社日立制作所 | Transmission circuit, tellite |
| CN104780719A (en) * | 2015-04-27 | 2015-07-15 | 博敏电子股份有限公司 | Method for embedding inductors in printed-circuit board and printed-circuit board adopted by method |
| CN106862873A (en) * | 2017-03-07 | 2017-06-20 | 刘健克 | A kind of processing technology of packing machine fuselage |
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| Publication number | Publication date |
|---|---|
| CN100399866C (en) | 2008-07-02 |
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