CN1730724A - Chemical bronze plating liquid of mixing type non-formaldehyde reducer - Google Patents
Chemical bronze plating liquid of mixing type non-formaldehyde reducer Download PDFInfo
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Abstract
The invention relates to a chemical bronze plating liquid of mixing type non-formaldehyde reducer for electronic printing circuit board, wherein the constituents include copper sulfate, EDTA, reducing agent and stabilizing agent, the reducing agent is prepared by mixing two non-formaldehyde reducing agents, which can be hypophosphites, glyoxylic acid and methyl aldehyde addition compound, any two of them can be combined. The advantages of the non-formaldehyde reducing agent include reduced environmental pollution, fast rate of deposition, high copper sedimentary deposit, and good copper deposition compactness.
Description
Technical field
The present invention relates to chemical copper plating solution, specifically be used for the chemical copper plating solution of electronic industry wiring board.
Background technology
The electronic industry develop rapidly in modern age, the Application Areas of wiring board does not have can't be obtained, does not occur nowhere until the space flight and aviation cause from some little daily necessities.Along with the development of electronic industry, the technology of making wiring board is also being maked rapid progress, and numerous manufacturing wiring board merchants have dropped into great amount of manpower and material resources research, has only obtained many achievements at chemical bronze plating liquid on this, many product innovations occurred.Traditional chemical-copper-plating process is a reductive agent with formaldehyde (HCHO), and EDTA and Seignette salt are independent or mixed twine mixture.This chemical-copper-plating process still exist a lot of problems as:
(1) formaldehyde odor is unpleasant and carcinogenesis is arranged, and environmental pollution is serious;
(2) performance of coating is being mingled with H because of it
2, Cu
2Impurity such as O, C, N and relatively poor;
(3) be that the chemical copper plating solution of reductive agent must effectively reaction could take place in high alkalinity with formaldehyde, thereby cause the corrosion of plating piece body easily;
(4) bath stability is good inadequately, and copper electroless plating speed is lower.
Owing to exist above defective, researchist to begin to do some and test the novel reductive agent of seeking instead of formaldehyde.
Once proof non-formaldehyde reducer has hypophosphite, dimethylamino borine (DMAB), oxoethanoic acid, formaldehyde-amino acid, formaldehyde affixture and Co (II)-quadrol etc.The chemical copper plating solution that is used for micropore copper film as report in the United States Patent (USP) 6329072 adopts hypophosphite to make reductive agent, and this solution is made up of cupric ion, complexing agent, hypophosphite, metal catalyst (be used to begin reduction reaction) and the compound that contains acetylene union.The deficiency of its existence is to use the inorganic salt of metal catalyst such as nickel, cobalt or palladium etc. in the plating bath; Though copper layer purity height, sedimentation rate are also very fast, the temperature requirement of heavy copper is higher, operation inconvenience.And for example having introduced the employing oxoethanoic acid among United States Patent (USP) 6660071 and the Japanese Patent P2002-241953A is reductive agent, high, the bath stability of this method plating speed, alleviate environmental pollution, but raw material ratio is expensive, the SILVER REAGENT 50% aqueous glyoxylic acid price of producing as Merck company is 1018 yuan/liter, so this method is difficult to realize industrialization.The electroless copper plating method that mainly to have introduced a kind of formaldehyde affixture in the United States Patent (USP) 4539044 for another example again be reductive agent selects for use a kind of metal-salt and formaldehyde in sulphite, thiosulphate, nitrite, the phosphite etc. to form affixture; In plating bath, the total content of formaldehyde comprises formaldehyde free and the formation affixture, and wherein the content of free formaldehyde is very micro-, in reaction process, formaldehyde is discharged slowly, and its advantage is the coating performance height, environmental pollution reduces, but sedimentation velocity is slower, needs to add formaldehyde as promotor.Application number is z102151397x.Name is called " solution that uses in formaldehydeless electroless copper plating method and this method ".The reductive agent that they use is sodium borohydride, dimethylamino borine and hydrazine.And sodium borohydride, dimethylamino borine cost an arm and a leg, and hydrazine is a violent in toxicity.
A community that from above numerous patents, reflects them, be exactly in their the technical scheme about the heavy copper of non-formaldehyde, all be only to adopt single reductive agent, because single reductive agent tends to occur defective, so present numerous researchist is in the research of being engaged in the non-formaldehyde reducer chemical bronze plating liquid, but also remain the research of being engaged in these single reductive agents, though make moderate progress, still existing above-described shortcoming can't solve at all.
Summary of the invention
The chemistry that the purpose of this invention is to provide a kind of mixing type non-formaldehyde reducer crosses copper liquid, and it adopts at least two kinds of non-formaldehyde reducers to mix this non-formaldehyde reducer non-environmental-pollution, settling rate is fast, copper settled layer purity high-copper deposition compact is good, simple to operate, with low cost.
Technical solution of the present invention is that the chemical bronze plating liquid of said mixing type non-formaldehyde reducer comprises compounds such as copper sulfate, EDTA, reductive agent, stablizer.
The reductive agent that the chemical bronze plating liquid of above-described mixing type non-formaldehyde reducer comprises is mixed by two kinds of non-formaldehyde reducers and forms.Available non-formaldehyde reducer comprises hypophosphite, oxoethanoic acid and formaldehyde affixture, they any two kinds can intermingling use.
The chemical bronze plating liquid of mixing type non-formaldehyde reducer of the present invention is made up of the aqueous solution of following composition and concentration, and each constituent concentration is CuSO
45H
2O is 10～30 grams per liters, EDTA4Na2H
2O is 20～60 grams per liters, and the stablizer α，α′-Lian Biding is 5～15 mg/litre, and reductive agent is as follows by the consumption of different compounds: sodium hypophosphite is 20～40 grams per liters, and oxoethanoic acid is 1～10 grams per liter, and the formaldehyde affixture is 1～20 grams per liter.
1, if reductive agent is mixed by hypophosphite and two kinds of compositions of oxoethanoic acid, their consumption is respectively that sodium hypophosphite is 20～40 grams per liters, and oxoethanoic acid is 1～10 grams per liter.
2, if reductive agent is mixed by hypophosphite and two kinds of compositions of formaldehyde affixture, their consumption is respectively that sodium hypophosphite is 20～40 grams per liters, and the formaldehyde affixture is 1～20 grams per liter.
3, if reductive agent is mixed by oxoethanoic acid and two kinds of compositions of formaldehyde affixture, their consumption is respectively that oxoethanoic acid is 1～10 grams per liter, and the formaldehyde affixture is 1～20 grams per liter.
The existing deficiency of soluble single reductive agent is used in mixing by reductive agent.Mix by hypophosphite and two kinds of compositions of oxoethanoic acid as reductive agent, can not have also higher sedimentation rate can be arranged under the condition of metal catalyst.And for example reductive agent is mixed by oxoethanoic acid and two kinds of compositions of formaldehyde affixture, not only can reduce the cost of single use oxoethanoic acid as reductive agent, and has accelerated the sedimentation rate of single use formaldehyde affixture as reductive agent.Free from environmental pollution in addition, overcome the insurmountable disadvantage of traditional reductive agent.
The present invention is applied on the industrial production, and its industrial technical process is the same with the copper-plated technical process of traditional chemical, and its concrete technical process is as follows:
Oil removing--〉washing--〉microetch--〉washing--〉pre-preg--〉activation treatment--〉washing--〉quicken
Handle--〉washing--〉electroless copper--〉washing--〉drying
The invention has the beneficial effects as follows that at least two kinds of non-formaldehyde reducers of its employing mix, non-environmental-pollution, settling rate is fast, and copper settled layer purity is high and copper deposition compact (rank backlight is good) property is good, simple to operate, with low cost.
Embodiment
Embodiment one
Chemical bronze plating liquid is formed
| CuSO 4·5H 2O | 20g/L |
| EDTA·4Na·2H 2O | 45g/L |
| NaOH | 20g/L |
| NaH 2PO 2·H 2O | 30g/L |
| OHC-COOH | 2.5g/L |
| α α '-dipyridyl | 5ppm |
| Water | Add to 1 liter |
Treatment condition are as follows:
Employing is waved and is soaked and pump-up device
40 ℃ of treatment temps
20 minutes electroless copper time
PH value=13
Experimental result sees Table one
Embodiment two
Chemical bronze plating liquid is formed
| CuSO 4·5H 2O | 20g/L |
| EDTA·4Na·2H 2O | 45g/L |
| NaOH | 20g/L |
| NaH 2PO 2·H 2O | 30g/L |
| OHC-COOH | 2.5g/L |
| α α '-dipyridyl | 10ppm |
| Water | Add to 1 liter |
Treatment condition are as follows:
Employing is waved and is soaked and pump-up device
40 ℃ of treatment temps
20 minutes electroless copper time
PH value=13
Experimental result sees Table one
Embodiment three
Chemical bronze plating liquid is formed
| CuSO 4·5H 2O | 30g/L |
| EDTA·4Na·2H 2O | 60g/L |
| NaOH | 20g/L |
| NaH 2PO 2·H 2O | 40g/L |
| (HCHO) n | 1g/L |
| NaHSO 3 | 2.5g/L |
| α α '-dipyridyl | 5ppm |
| Water | Add to 1 liter |
Treatment condition are as follows:
Employing is waved and is soaked and pump-up device
40 ℃ of treatment temps
20 minutes electroless copper time
PH value=13
Experimental result sees Table one
Annotate: the formaldehyde affixture here is meant Paraformaldehyde 96 (HCHO)
nWith acid S-WAT NaHSO
3Affixture.
Embodiment four
Chemical bronze plating liquid is formed
| CuSO 4·5H 2O | 20g/L |
| EDTA·4Na·2H 2O | 45g/L |
| NaOH | 20g/L |
| NaH 2PO 2·H 2O | 20g/L |
| (HCHO) n | 2g/L |
| NaHSO 3 | 5g/L |
| α α '-dipyridyl | 10ppm |
| Water | Add to 1 liter |
Treatment condition are as follows:
Employing is waved and is soaked and pump-up device
40 ℃ of treatment temps
20 minutes electroless copper time
PH value=13
Experimental result sees Table one
Annotate: the formaldehyde affixture here is meant Paraformaldehyde 96 (HCHO)
nWith acid S-WAT NaHSO
3Affixture.
Embodiment five
Chemical bronze plating liquid is formed
| CuSO 4·5H 2O | 20g/L |
| EDTA·4Na·2H 2O | 45g/L |
| NaOH | 20g/L |
| OHC-COOH | 10g/L |
| (HCHO) n | 1g/L |
| NaHSO 3 | 2.5g/L |
| α α '-dipyridyl | 10ppm |
| Water | Add to 1 liter |
Treatment condition are as follows:
Employing is waved and is soaked and pump-up device
40 ℃ of treatment temps
20 minutes electroless copper time
PH value=13
Experimental result sees Table one
Annotate: the formaldehyde affixture here is meant Paraformaldehyde 96 (HCHO)
nWith acid S-WAT NaHSO
3Affixture.
Embodiment six
Chemical bronze plating liquid is formed
| CuSO 4·5H 2O | 20g/L |
| EDTA·4Na·2H 2O | 45g/L |
| NaOH | 20g/L |
| OHC-COOH | 1g/L |
| (HCHO) n | 5g/L |
| NaHSO 3 | 15g/L |
| α α '-dipyridyl | 10ppm |
| Water | Add to 1 liter |
Treatment condition are as follows:
Employing is waved and is soaked and pump-up device
40 ℃ of treatment temps
20 minutes electroless copper time
PH value=13
Experimental result sees Table one
Annotate: the formaldehyde affixture here is meant Paraformaldehyde 96 (HCHO)
nWith acid S-WAT NaHSO
3Affixture.
Embodiment seven
Chemical bronze plating liquid is formed
| CuSO 4·5H 2O | 10g/L |
| EDTA·4Na·2H 2O | 20g/L |
| NaOH | 20g/L |
| OHC-COOH | 8g/L |
| (HCHO) n | 3g/L |
| NaHSO 3 | 7.5g/L |
| α α '-dipyridyl | 15ppm |
| Water | Add to 1 liter |
Treatment condition are as follows:
Employing is waved and is soaked and pump-up device
40 ℃ of treatment temps
20 minutes electroless copper time
PH value=13
Experimental result sees Table one
Annotate: the formaldehyde affixture here is meant Paraformaldehyde 96 (HCHO)
nWith acid S-WAT NaHSO
3Affixture.
Embodiment eight
Chemical bronze plating liquid is formed
| CuSO 4·5H 2O | 20g/L |
| EDTA·4Na·2H 2O | 45g/L |
| NaOH | 20g/L |
| OHC-COOH | 5g/L |
| (HCHO) n | 4g/L |
| NaHSO 3 | 10g/L |
| α α '-dipyridyl | 10ppm |
| Water | Add to 1 liter |
Treatment condition are as follows:
Employing is waved and is soaked and pump-up device
40 ℃ of treatment temps
20 minutes electroless copper time
PH value=13
Experimental result sees Table one
Annotate: the formaldehyde affixture here is meant Paraformaldehyde 96 (HCHO)
nWith acid S-WAT NaHSO
3Affixture.
Below be the comparative example of the chemical bronze plating liquid of the traditional single reductive agent of use:
Comparative example one
Chemical bronze plating liquid is formed
| CuSO 4·5H 2O | 20g/L |
| EDTA·4Na·2H 2O | 45g/L |
| NaOH | 20g/L |
| (HCHO) n | 7g/L |
| α α '-dipyridyl | 5ppm |
| Water | Add to 1 liter |
Treatment condition are as follows:
Employing is waved and is soaked and pump-up device
40 ℃ of treatment temps
20 minutes electroless copper time
PH value=13
Experimental result sees Table one
Annotate: use Paraformaldehyde 96 (HCHO) separately
nShi Fanying is violent, has formaldehyde odor to emit, and illustrating has a large amount of free formaldehydes in the tank liquor.
Comparative example two
Chemical bronze plating liquid is formed
| CuSO 4·5H 2O | 30g/L |
| EDTA·4Na·2H 2O | 60g/L |
| NaH 2PO 2·H 2O | 40g/L |
| α α '-dipyridyl | 15ppm |
| Water | Add to 1 liter |
Treatment condition are as follows:
Employing is waved and is soaked and pump-up device
70 ℃ of treatment temps
20 minutes electroless copper time
PH value=8.5 (adjusting) with 50%NaOH solution
Comparative example three
Chemical bronze plating liquid is formed
| CuSO 4·5H 2O | 20g/L |
| EDTA·4Na·2H 2O | 45g/L |
| NaOH | 20g/L |
| OHC-COOH | 12g/L |
| α α '-dipyridyl | 10ppm |
| Water | Add to 1 liter |
Treatment condition are as follows:
Employing is waved and is soaked and pump-up device
40 ℃ of treatment temps
20 minutes electroless copper time
PH value=12.4
Experimental result sees Table one
Table one
| Example | Reductive agent | Outward appearance | Sedimentation rate μ " (20min) | Backlight level |
| Comparative example one | Paraformaldehyde 96 | Pink | 108 | 7 grades |
| Comparative example two | Sodium hypophosphite | Pink | 11.8 | 6 grades |
| Comparative example three | Oxoethanoic acid | Pink | 26.7 | 8 grades |
| Embodiment one | Sodium hypophosphite and oxoethanoic acid | Garnet | 39.1 | 8 grades |
| Embodiment two | Sodium hypophosphite and oxoethanoic acid | Pink | 27.4 | 9 grades |
| Embodiment three | Sodium hypophosphite and formaldehyde affixture | Garnet | 54.0 | 7 grades |
| Embodiment four | Sodium hypophosphite and formaldehyde affixture | Pink | 33.0 | 7 grades |
| Embodiment five | Oxoethanoic acid and formaldehyde affixture | Pink | 29.3 | 9 grades |
| Embodiment six | Oxoethanoic acid and formaldehyde affixture | Pink | 42.6 | 8 grades |
| Embodiment seven | Oxoethanoic acid and formaldehyde affixture | Pink | 26.8 | 8 grades |
| Embodiment eight | Oxoethanoic acid and yuban | Pink | 42.7 | 9 grades |
μ in the table one "---microinch
Sedimentation rate in the table one---the deposit thickness of copper layer in 20 minutes
Backlight level in the table one---by traditional test method(s) backlight
Oxoethanoic acid in the table one---by our company's preparation, greatly reduce use cost.
From the experimental result of table one, following conclusion is arranged through contrast:
1, uses Paraformaldehyde 96 (HCHO) in the comparative example one separately
nThough sedimentation rate reaches 108 μ "/20min, reaction is violent, has formaldehyde odor to emit, and illustrating has a large amount of free formaldehydes in the tank liquor, pollute very big to operating environment; And be that oxoethanoic acid and formaldehyde affixture mix and use among the embodiment eight, sedimentation rate is also than higher 42.7 μ, and "/20min backlightly reaches 9 grades, does not have formaldehyde odor to emit in the process, operation environment safety.
2, use separately sodium hypophosphite in the comparative example two, when the treatment temp of tank liquor is 40 ℃, can not sink copper, tank liquor temperature needs just to sink copper more than 70 ℃, and low 11.8 μ of sedimentation rate "/20min, backlight have only 6 grades; And embodiment one, embodiment two, embodiment three and embodiment four all to be sodium hypophosphite and oxoethanoic acid or formaldehyde affixture mix uses, when the treatment temp of tank liquor is 40 ℃, can both sink copper, and sedimentation rate is fast, backlight good, all more than 7 grades.
3, use oxoethanoic acid in the comparative example three separately, the consumption of oxoethanoic acid is 12g/L, though sedimentation rate is fast, and 8 grades backlight, because oxoethanoic acid is relatively more expensive, use oxoethanoic acid to make reductive agent fully, cost is very high; And among the embodiment two, oxoethanoic acid mixes use with sodium hypophosphite, and the consumption of oxoethanoic acid only needs 2.5g/L, just can reach identical sedimentation rate, and 9 grades backlight; See embodiment eight again, oxoethanoic acid mixes use with the formaldehyde affixture, and the consumption of oxoethanoic acid also only needs 5g/L, just can reach sedimentation rate faster, and 9 grades backlight, reductive agent mixes use like this can reduce the cost of independent use oxoethanoic acid as reductive agent greatly.
4, comprehensive all experimental results, the chemical bronze plating liquid of two kinds of mixing type non-formaldehyde reducers of the present invention can solve more existing self the shortcoming of the electroless copper of single non-formaldehyde reducer, and advantages such as sedimentation rate is big, the settled layer purity of copper is high and rank backlight is good that this system has, for replacing traditional is the electroless copper technology of reductive agent with formaldehyde, and carries out the industrialization of non-formaldehyde electroless copper and opened up more direction.
Claims (8)
1, the chemical bronze plating liquid of mixing type non-formaldehyde reducer, it is characterized in that it is made up of copper sulfate, EDTA, reductive agent, stablizer, its reductive agent is mixed by two kinds of non-formaldehyde reducers and forms, available non-formaldehyde reducer comprises hypophosphite, oxoethanoic acid and formaldehyde affixture, they any two kinds can make up mutually.
2, the chemical bronze plating liquid of mixing type non-formaldehyde reducer according to claim 1 is characterized in that each component and concentration degree are:
CuSO
45H
2O is 10～30 grams per liters,
EDTA4Na2H
2O is 20～60 grams per liters,
The stablizer α，α′-Lian Biding is 5～15 mg/litre,
Sodium hypophosphite is 20～40 grams per liters,
Oxoethanoic acid is 1～10 grams per liter,
The formaldehyde affixture is 1～20 grams per liter.
3, the chemical bronze plating liquid of mixing type non-formaldehyde reducer according to claim 1 and 2, its reductive agent can be mixed by oxoethanoic acid and two kinds of compositions of hypophosphite.
4, the chemical bronze plating liquid of mixing type non-formaldehyde reducer according to claim 1 and 2, it is characterized in that the reductive agent that mixes by hypophosphite and two kinds of compositions of oxoethanoic acid, then its concentration of component is that sodium hypophosphite is 20～40 grams per liters, and oxoethanoic acid is 1～10 grams per liter.
5, the chemical bronze plating liquid of mixing type non-formaldehyde reducer according to claim 1 and 2, its reductive agent can be mixed by formaldehyde affixture and two kinds of compositions of hypophosphite.
6, the chemical bronze plating liquid of mixing type non-formaldehyde reducer according to claim 1 and 2, it is characterized in that the reductive agent that two kinds of compositions of formaldehyde affixture and hypophosphite mix, its concentration of component is 1～20 grams per liter for the formaldehyde affixture, and sodium hypophosphite is 20～40 grams per liters.
7, the chemical bronze plating liquid of mixing type non-formaldehyde reducer according to claim 1 and 2, its reductive agent can be mixed by oxoethanoic acid and two kinds of compositions of formaldehyde affixture.
8, the chemical bronze plating liquid of mixing type non-formaldehyde reducer according to claim 1 and 2, it is characterized in that the reductive agent that two kinds of compositions of oxoethanoic acid and formaldehyde affixture mix, its concentration of component is that oxoethanoic acid is 1～10 grams per liter, and the formaldehyde affixture is 1～20 grams per liter.
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| CN101698936B (en) * | 2009-11-11 | 2011-08-17 | 陕西师范大学 | Chemical copper plating solution of sodium hypophosphite disodium edetate system |
| CN102277567A (en) * | 2011-07-26 | 2011-12-14 | 陕西师范大学 | Chemical copper plating solution for micropore filling |
| CN102858087A (en) * | 2012-08-27 | 2013-01-02 | 吴祖 | Blind-hole-conduction double-sided circuit board and processing method thereof |
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| JP2014129598A (en) * | 2012-12-26 | 2014-07-10 | Rohm & Haas Electronic Materials Llc | Electroless copper plating composition not containing formaldehyde and method |
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| CN102277567A (en) * | 2011-07-26 | 2011-12-14 | 陕西师范大学 | Chemical copper plating solution for micropore filling |
| CN102277567B (en) * | 2011-07-26 | 2013-04-17 | 陕西师范大学 | Chemical copper plating solution for micropore filling |
| CN102858087A (en) * | 2012-08-27 | 2013-01-02 | 吴祖 | Blind-hole-conduction double-sided circuit board and processing method thereof |
| JP2014129598A (en) * | 2012-12-26 | 2014-07-10 | Rohm & Haas Electronic Materials Llc | Electroless copper plating composition not containing formaldehyde and method |
| CN105593403A (en) * | 2013-11-22 | 2016-05-18 | 韩国生产技术研究院 | Electroless copper plating solution composition and electroless copper plating method using same |
| CN105593403B (en) * | 2013-11-22 | 2018-04-13 | 韩国生产技术研究院 | Chemical bronze plating liquid composition and the electroless copper plating method using the chemical bronze plating liquid composition |
| CN103668136A (en) * | 2013-12-17 | 2014-03-26 | 庞晋山 | Method for preparing zinc alloy faucet with dialyzed copper on inner wall through chemical dialysis-aging treatment |
| CN103866303A (en) * | 2014-04-04 | 2014-06-18 | 丽水学院 | Chemical copper plating solution for micropore filling and preparation method thereof |
| CN115110072A (en) * | 2022-08-26 | 2022-09-27 | 深圳市板明科技股份有限公司 | Environment-friendly chemical copper deposition solution and copper deposition method for circuit board |
| CN115522188A (en) * | 2022-09-02 | 2022-12-27 | 南通赛可特电子有限公司 | High-speed chemical copper plating solution and copper plating process thereof |
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