CN1730693A - Sn-Zn-Cr合金无铅焊料的制备方法 - Google Patents
Sn-Zn-Cr合金无铅焊料的制备方法 Download PDFInfo
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- CN1730693A CN1730693A CN 200510028446 CN200510028446A CN1730693A CN 1730693 A CN1730693 A CN 1730693A CN 200510028446 CN200510028446 CN 200510028446 CN 200510028446 A CN200510028446 A CN 200510028446A CN 1730693 A CN1730693 A CN 1730693A
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- Prior art keywords
- preparation
- alloy
- alloy lead
- free solder
- raw material
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- Powder Metallurgy (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
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Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2005100284466A CN100387741C (zh) | 2005-08-04 | 2005-08-04 | Sn-Zn-Cr合金无铅焊料的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2005100284466A CN100387741C (zh) | 2005-08-04 | 2005-08-04 | Sn-Zn-Cr合金无铅焊料的制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN1730693A true CN1730693A (zh) | 2006-02-08 |
CN100387741C CN100387741C (zh) | 2008-05-14 |
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ID=35963114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB2005100284466A Expired - Fee Related CN100387741C (zh) | 2005-08-04 | 2005-08-04 | Sn-Zn-Cr合金无铅焊料的制备方法 |
Country Status (1)
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CN (1) | CN100387741C (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100510181C (zh) * | 2007-05-17 | 2009-07-08 | 戴国水 | 一种锡锌铜铬无铅喷金料 |
CN101985959A (zh) * | 2010-10-27 | 2011-03-16 | 江苏迪邦三星轴承有限公司 | 一种新型轴承保持架以及其制造方法 |
CN106676321A (zh) * | 2016-12-07 | 2017-05-17 | 北京态金科技有限公司 | 低熔点金属及其制备方法和应用 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103789569B (zh) * | 2014-02-13 | 2016-02-10 | 江苏迪邦三星轴承有限公司 | 轴承保持架材料及其制造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW592872B (en) * | 2001-06-28 | 2004-06-21 | Senju Metal Industry Co | Lead-free solder alloy |
CN1175956C (zh) * | 2002-05-10 | 2004-11-17 | 大连理工大学 | 锡锌基含稀土元素的无铅钎料合金 |
CN1555960A (zh) * | 2004-01-10 | 2004-12-22 | 大连理工大学 | 锡锌铜无铅钎料合金 |
-
2005
- 2005-08-04 CN CNB2005100284466A patent/CN100387741C/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100510181C (zh) * | 2007-05-17 | 2009-07-08 | 戴国水 | 一种锡锌铜铬无铅喷金料 |
CN101985959A (zh) * | 2010-10-27 | 2011-03-16 | 江苏迪邦三星轴承有限公司 | 一种新型轴承保持架以及其制造方法 |
CN106676321A (zh) * | 2016-12-07 | 2017-05-17 | 北京态金科技有限公司 | 低熔点金属及其制备方法和应用 |
Also Published As
Publication number | Publication date |
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CN100387741C (zh) | 2008-05-14 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shanghai Xinyang Semiconductor Material Co., Ltd. Assignor: Shanghai Jiao Tong University Contract fulfillment period: 2008.6.28 to 2013.6.27 contract change Contract record no.: 2009310000170 Denomination of invention: Method for preparing Sn-Zn-Cr alloy leadless solder Granted publication date: 20080514 License type: Exclusive license Record date: 2009.8.19 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.6.28 TO 2013.6.27; CHANGE OF CONTRACT Name of requester: SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD Effective date: 20090819 |
|
EM01 | Change of recordation of patent licensing contract |
Change date: 20100915 Contract record no.: 2009310000170 Assignee after: Shanghai Xinyang Semiconductor Material Co., Ltd. Assignee before: Shanghai Xinyang Semiconductor Material Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080514 Termination date: 20130804 |