CN1722456A - Image sensor package and manufacture method thereof - Google Patents
Image sensor package and manufacture method thereof Download PDFInfo
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- CN1722456A CN1722456A CNA200510076348XA CN200510076348A CN1722456A CN 1722456 A CN1722456 A CN 1722456A CN A200510076348X A CNA200510076348X A CN A200510076348XA CN 200510076348 A CN200510076348 A CN 200510076348A CN 1722456 A CN1722456 A CN 1722456A
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- 238000000034 method Methods 0.000 title claims abstract description 100
- 238000004519 manufacturing process Methods 0.000 title abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 137
- 238000005520 cutting process Methods 0.000 claims description 63
- 238000005516 engineering process Methods 0.000 claims description 37
- 239000000853 adhesive Substances 0.000 claims description 32
- 230000001070 adhesive effect Effects 0.000 claims description 32
- 125000006850 spacer group Chemical group 0.000 claims description 29
- 238000001746 injection moulding Methods 0.000 claims description 12
- 238000007731 hot pressing Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims 6
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000008569 process Effects 0.000 description 25
- 239000003822 epoxy resin Substances 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 230000009471 action Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 210000003811 finger Anatomy 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 210000003813 thumb Anatomy 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000009924 canning Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
- H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- Transforming Light Signals Into Electric Signals (AREA)
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Abstract
A kind of assemble method of image sensor package comprises: a substrate is provided, a plurality of imageing sensors are installed on it; One housing strip is provided, described housing strip has a plurality of shells, described shell is arranged corresponding to the arrangement of a plurality of imageing sensors on the described substrate, and each in described a plurality of shells has corresponding to the hole of the active surface of respective image sensor with around the chamber at the edge of respective image sensor; After attaching to housing strip on the substrate, attach the hole of transparent cover plate with a plurality of shells on the can bar; And cut described transparent cover plate, described housing strip and described substrate continuously, described image sensor package is separated from each other.Can realize the rate of finished products and the production efficiency that improve.
Description
Technical field
The present invention relates to a kind of encapsulation that is used for electronic component, relate in particular to a kind of image sensor package (image sensor package) and manufacture method thereof.
Background technology
Imageing sensor is a kind of semiconductor device that optical information is converted to the signal of telecommunication.Imageing sensor is divided into charge-coupled device (CCD) imageing sensor or complementary metal oxide semiconductors (CMOS) (CMOS) imageing sensor usually.To imageing sensor encapsulate with the protection imageing sensor electro-optical system and allow light action on the optical receiving surface or active surface (active surface) of imageing sensor.
Therefore typical image sensor package comprises shell and window, by this window light is sent to the light-receiving active surface.Image sensor package can also comprise the lens that supported by lens carrier, suitably aligns with the active surface of imageing sensor.In this example, lens carrier is installed on the hole that is formed on the shell.
In the U.S. Patent No. 6492774B1 of the Webster of on November 19th, 2002 issue " MOLDED IMAGE SENSORPACKAGE HAVING LENS HOLDER (molded image sensor package) " by name with lens carrier, a kind of such image sensor package example has been discussed, and it has lens and lens carrier.In the disclosed therein image sensor package, at the last screw thread that forms of the periphery (outer circumference) of round lens support, canning has circular hole, wherein inserts lens carrier.On the interior week in hole, also form screw thread, make lens carrier can in the hole, carry out screw thread couple.This installation process must be carried out repetition to each image sensor package.May need not explanation, this type of installation is an effort, time-consuming and with high costs.
Unsafty is when screwing in lens carrier in the shell aperture, can rub between the screw thread that cooperates.Because this screw thread friction, the screw thread of cooperation is easy to wearing and tearing.This wearing and tearing have caused free particle (free particle) within shell aperture.The error that this type free particle has blocked light path and can't compensate in image sensing operating period generation.In addition, be difficult to accurately to control lens carrier and screw in process in the hole.As a result, need to regulate the focus of lens later on, so that realize best optical correction and imaging performance.
Therefore, need a kind of image sensor package, it can prevent to generate bad free particulate in manufacture process.Also need a kind of like this manufacture method, wherein can simultaneously a plurality of imageing sensors be assembled in the corresponding encapsulation.
Summary of the invention
The invention provides a kind of method of making a plurality of image sensor package in other respects, this method has prevented the generation that may pollute light path and influence the free particle of picture quality simultaneously effectively.The present invention also provides a kind of image sensor package of making by this method.
In image sensor package assemble method according to an embodiment of the invention, a plurality of shells and/or a plurality of sleeve pipe (barrel) are assembled on the corresponding imageing sensor regularly arranged on the substrate simultaneously.
At first, the array with rule is installed in a plurality of imageing sensors on the substrate.Then the identical a plurality of shells of arrangement mode are installed on the substrate.Each shell all comprises opening, and for example the hole of aiming at the active surface of corresponding imageing sensor also comprises peripheral lid (peripheral cap), is used for the peripheral edge of interlock imageing sensor.
Then, go up the transparent cover plate that stickup is used for closed hole in the housing strip that substrate has been installed (housing strip).Then, cut transparent cover plate, housing strip and substrate continuously, the image sensor package of gained is separated from each other.
Sleeve-assembled is on each image sensor package of separating, and set of lenses is inserted each sleeve pipe.Each set of lenses all comprises one or more lens and one or morely is arranged between lens and the cover plate and/or the spacer between the lens.Perhaps, before separating image sensor package, the sleeve pipe bar (barrel strip) that will have a plurality of sleeve pipes connected to one another attaches on housing strip and/or the cover plate.The sleeve pipe bar is formed by injection molding (injection molding), and the major axis of sleeve pipe is vertically set on the transparent cover plate.
In one embodiment of the invention, smooth, rounded internal surface that sleeve pipe comprises, it smoothly and simply holds the set of lenses that slips into wherein.
In another embodiment, the assemble method of image sensor package comprises: a substrate is provided, a plurality of imageing sensors are installed on it; One housing strip is provided, it comprises a plurality of shells, described shell is arranged corresponding to the arrangement of a plurality of imageing sensors on the described substrate, each of described a plurality of shells includes hole and chamber, described hole is corresponding to corresponding one active surface of described a plurality of imageing sensors, and described chamber is used for receiving at least in part therein corresponding of described a plurality of imageing sensors; Described housing strip is pasted on the described substrate; Attach transparent cover plate to seal the hole of a plurality of shells on the described housing strip; And cut described transparent cover plate, described housing strip and described substrate, described a plurality of image sensor package are separated from each other.
Preferably, described a plurality of image sensor package comprises that separately the described cover plate of cutting is with a part that exposes described housing strip and the expose portion that cuts described substrate and described housing strip.
More preferably, carry out cutting and the expose portion of housing strip and the cutting of substrate of cover plate like this, make the cutting surface of cover plate more to lean on the lining than the expose portion of housing strip and the cutting surface of substrate.In addition, carry out cutting and the expose portion of housing strip and the cutting of substrate of cover plate like this, make that the cutting surface of the expose portion of cutting surface and housing strip of cover plate and substrate is in the same plane.In addition, can so carry out the cutting of cover plate, make that the size of the cover plate that separates can coverage hole when cover plate separately is set on the housing strip.
In another embodiment, the assemble method of image sensor package comprises: a plurality of imageing sensors are installed on substrate; Paste a housing strip to described substrate, it has a plurality of shells, described shell is arranged corresponding to the arrangement of described a plurality of imageing sensors, each of described a plurality of shells all has hole and chamber, described hole is corresponding to corresponding one active surface of described a plurality of imageing sensors, and described chamber is used for receiving at least in part therein corresponding of described a plurality of imageing sensors; Attach transparent cover plate to seal the hole of a plurality of shells on the described housing strip; Utilize the first of the described transparent cover plate of first blade cuts, described transparent cover plate is divided into the window in the hole of the corresponding shell of a plurality of sealings, so that expose the first of described housing strip; First to the exposure of described housing strip attaches a sleeve pipe bar, and described sleeve pipe bar comprises a plurality of sleeve pipes, and each in described a plurality of sleeve pipes is connected to another one at least; And utilize effective cutting width to be narrower than of the first cutting of second blade of first blade by described sleeve pipe bar and substrate, by this described a plurality of image sensor package are separated from each other.
Preferably, carry out the cutting of described sleeve pipe bar like this, make the housing strip and the substrate that are arranged on described sleeve pipe bar below in the single operation, to cut, thereby the cutting surface of described sleeve pipe bar, housing strip and substrate can be in the same plane.
Preferably, cut the part of described cover plate, make that the transparent cover plate that separates can cover described hole when the transparent cover plate that separates is arranged on the described housing strip.
In another embodiment, the assemble method of image sensor package comprises: a substrate is provided, a plurality of imageing sensors are installed on it; Attach a housing strip to described substrate, it has a plurality of shells, described shell is arranged corresponding to the arrangement of described a plurality of imageing sensors, each of described a plurality of shells all has hole and chamber, described hole is corresponding to corresponding one active surface of described a plurality of imageing sensors, and described chamber is used for receiving at least in part therein corresponding of described a plurality of imageing sensors; Attach transparent cover plate to seal the hole of a plurality of shells on the described housing strip; Attach the sleeve pipe bar on described transparent cover plate, described sleeve pipe bar has a plurality of sleeve pipes connected to one another; And the broad area in the middle of described sleeve pipe bar carries out cutting technique, and described a plurality of image sensor package are separated from each other.
Preferably, the assemble method of described image sensor package may further include, and before described sleeve pipe bar attaches on the described transparent cover plate, cuts described cover plate.
In another embodiment, the assemble method of image sensor package comprises: a substrate is provided, a plurality of imageing sensors are installed on it; Attach a housing strip to described substrate, described housing strip has a plurality of shells, described shell is arranged corresponding to the arrangement of a plurality of imageing sensors on the described substrate, and at least one has and is used for around corresponding one hole of described a plurality of imageing sensors in described a plurality of shells; And the individuality that will separate (individual) transparent cover plate sticks at least one hole of described a plurality of shells.Described method may further include described housing strip of cutting and substrate, so that the image sensor package of a plurality of individualities to be provided.
In addition, described method further is included on each individual images sensor package and assembles sleeve pipe, and described sleeve pipe has the opening of aiming at corresponding one hole of described a plurality of shells.At last, described method may further include set of lenses is inserted in the opening of each sleeve pipe.
Description of drawings
By being described in detail with reference to the attached drawings one exemplary embodiment of the present invention, above-mentioned and other characteristics of the present invention and advantage will be more obvious.
Figure 1A and 1B are respectively the sectional view and the stereograms of substrate according to an embodiment of the invention, arrange a plurality of image sensor package on this substrate regularly.
Fig. 2 A and 2B are respectively sectional view and the stereograms that is used for the housing strip of image sensor package according to an embodiment of the invention.
Fig. 3 is the stereogram of image sensor package cover plate according to an embodiment of the invention.
Fig. 4 A and 4B be respectively according to an embodiment of the invention, at stereogram and sectional view that the technology of package shell bar and cover plate on the substrate of a plurality of imageing sensors is installed.
Fig. 5 A and 5B illustrate the sectional view that is used for two step process that image sensor package is separated from each other according to an embodiment of the invention.
Fig. 6 A and 6B are according to the sectional view of having assembled the optional embodiment of image sensor package of the present invention.
Fig. 7 A and 7B illustrate according to an embodiment of the invention, be used for set of lenses is assembled into the sectional view of two step process on the image sensor package independently.
Fig. 8 is the sectional view that the sleeve pipe bar that is used for image sensor package according to an embodiment of the invention is shown.
Fig. 9 is for illustrating technology sectional view according to an embodiment of the invention, and this technology is used to prepare an image sensor package assembly, with mounting sleeve bar thereon.
Figure 10 is for illustrating technology sectional view according to an embodiment of the invention, and this technology is used for mounting sleeve bar on the image sensor package assembly that has prepared.
Figure 11 is technology sectional view according to an embodiment of the invention, and this technology is used to separate the image sensor package that is equipped with sleeve pipe.
Figure 12 illustrates the sectional view that is equipped with the image sensor package of sleeve pipe according to one embodiment of the invention.
Figure 13 to 16 shows technology according to another embodiment of the present invention, and each transparent cover plate that this technology is used for separating is assembled into the housing strip assembly.
Embodiment
Now with reference to accompanying drawing the present invention is done introduction more fully, one exemplary embodiment of the present invention has been shown in the accompanying drawing.But, the present invention can many different forms realize, should not be construed as and be subject to embodiment described herein; On the contrary, it is in order to make the disclosure thoroughly complete that these embodiment are provided, and fully passes on thought of the present invention to those skilled in the art.
In one embodiment of the invention, image sensor package comprises imageing sensor, the described imageing sensor of protection that is installed on the substrate and is equipped with porose shell, and is installed in the window on the described hole.Its assemble method is also disclosed.In another embodiment of the present invention, imageing sensor is equipped with the sleeve pipe that invests described window and/or described shell.Its assemble method is also disclosed.The set of lenses of described sleeve pipe of packing into comprises one or more lens and spacer, and this spacer is regulated and kept between lens and the imageing sensor active surface and the distance between the lens self.
Described shell, window and/or sleeve pipe can so be assembled, and make to install and aim at a plurality of regularly arranged imageing sensors on substrate.Can also carry out set of lenses and insert the technology of respective sleeve, make and on described substrate, install and the alignment image transducer.In other words, can carry out packaging technology or technology for assembling, make on substrate, to attach and the alignment image transducer.
In order to encapsulate a plurality of imageing sensors simultaneously, a kind of housing strip is provided, wherein a plurality of shells with each imageing sensor are connected to each other.In addition, needn't provide independently window for each imageing sensor.As an alternative, on described housing strip, attach single big infrared (IR) filter glass window, to cover all images transducer regularly arranged on the substrate.After finishing assembly technology, can each be cut into the imageing sensor that glass window covers.
In addition, attach a sleeve pipe bar on described window and/or shell, a plurality of sleeve pipes that are used for respective image sensor in this sleeve pipe bar are connected to each other, and after finishing assembly technology, described sleeve pipe are cut apart independent of one another.Assembled and/or sleeve pipe when separating each other when the sleeve pipe bar, the set of lenses that will have one or more lens and one or more spacers by sliding is inserted also and is attached in the window.
Hereinafter the preferred embodiments of the present invention will be described in conjunction with the accompanying drawings.
Figure 1A and 1B show substrate according to an embodiment of the invention, regularly arranged a plurality of image sensor package on it.
A plurality of imageing sensors 200 preferably are arranged in regular orthogonal array on substrate 100, make its active surface 201 up.Imageing sensor 200 can be formed by ccd image sensor or cmos image sensor, wherein in the cmos image sensor, uses a pyroelectric ceramic on cmos device.Substrate 100 can be formed by the chip bearing substrate, for example printed circuit board (PCB) (PCB), Al-base ceramic plate, resin glass laminated substrates, tape base substrate or flexible PCB (FPCB).Can provide splicing ear 105 on the back side of described substrate 100, FPCB or socket are electrically connected on it.
In order on substrate 100, to attach a plurality of imageing sensors 200, between substrate 100 and each imageing sensor 200, the adhesive phase (not shown) is set.Imageing sensor 200 is electrically connected to substrate 100 by the welding wire 103 that is welded on the interconnect pad 101.But, the present invention not only is confined to this embodiment, and within the spirit and scope of the present invention, by utilizing any suitable interconnection technique, for example flip chip technology (fct) may change to some extent.When on substrate 100, aiming at and attaching imageing sensor 200, but before substrate 100 cuts into a plurality of parts at corresponding imageing sensor 200, carry out follow-up encapsulation assembling procedure, for example shell assembly process, window assembly process, sleeve pipe assembly process, lens arrangement operation etc.
Fig. 2 A and 2B show the housing strip of image sensor package according to an embodiment of the invention.
In order to assemble the shell 310 of protection respective image sensor 200, used housing strip 300, the shell with corresponding imageing sensor 200 on housing strip 300 is connected to each other.By housing strip 300 (comprising shell 310 connected to one another) is installed on the substrate 100, around substrate 100 epigraph transducers 200, a plurality of shells 310 have been assembled simultaneously.Can form by injection molding technology and have this type of housing strip 300 of shell 310 connected to one another.Therefore, form housing strip 300, make it can be attached on the part of the substrate 100 that is defined between the imageing sensor 200, allow shell 310 to surround corresponding imageing sensor 200 simultaneously.From Fig. 2 A and 2B as can be seen, each shell 310 all has the hole 311 corresponding to the active surface 201 of corresponding imageing sensor 200.
Preferably, shell 310 is configured to frame shape (rim-shape), or is configured to periphery cover (circumferential cap), as will be seen, and the edge of shell 310 interlocks or pinning imageing sensor 200.Housing strip 300 is by formation that frame is connected to each other.Form the gap between shell 310 and imageing sensor 200, limit a recess or cavity 312 by this, it holds described imageing sensor 200.In other words, the image sensor package of embodiment basically forms in the encapsulation of air chamber type.The internal height of shell 310 designs greatlyyer than imageing sensor 200, if when make using wire-bonded technology electrical connection graph image-position sensor 200 to substrate 100, the coil height of welding wire 103 is slightly smaller than the height of shell 310.Housing strip 300 can be formed by plastics that are suitable for injection molding technology or ceramic material.
Shown in Fig. 2 B,, therefore form housing strip 300 by injection molding technology easily because housing strip 300 forms the simple structure that connection all has the shell in chamber 312 and hole 311.
Fig. 3 shows the cover plate that image sensor package window according to an embodiment of the invention is used.
Provide a window with closed hole 311, protection is arranged on the imageing sensor 200 in the shell 310 by this, allows light to incide on the active surface of imageing sensor 200 by hole 311 simultaneously.In this embodiment, provide cover plate 400 for window.Cover plate 400 is installed on the housing strip 300.In other words, for this embodiment, window is not to be assembled in separately on the corresponding imageing sensor, on the contrary, large-sized cover plate 400 is assembled on the housing strip 300, to seal the institute porose 311 of corresponding shell 310 simultaneously.
In the image sensor package technology, window is formed by glass substrate usually, and it plays the effect of infrared fileter.Therefore, cover plate 400 can be formed by IR filtering glass substrate, and its size covers the whole of the substrate 100 shown in Figure 1A substantially.
As mentioned above, housing strip 300 is aimed at and is installed on the described substrate 100, makes shell 310 to aim at the respective image sensor 200 on being arranged in substrate 100.Cover plate 400 is attached on the housing strip 300, to seal the institute porose 311 of corresponding shell 310.That is, the upper surface 303 of housing strip 300 (with reference to figure 2A) contact cover plate 400, and the lower surface 304 contact substrates 100 of housing strip 300.Can understand this point better with reference to figure 4A and 4B.
Fig. 4 A and 4B show technology according to an embodiment of the invention, and this technology is used for housing strip and cover plate are assembled into substrate, have wherein arranged a plurality of imageing sensors on the substrate.
By suitable method, for example adhesive is adhering to each other with substrate 100, housing strip 300 and cover plate 400.For example, shown in Fig. 4 B, first adhesive phase 510 is applied on the lower surface 304 (with reference to figure 2A) of housing strip 300, pastes then on the substrate 100.Because lower surface 304 correspondences the expose portion of the substrate 100 that defines in the middle of the imageing sensor 200, therefore first adhesive phase 510 that is formed on the lower surface 304 pastes on the expose portion of substrate 100, thereby sealing is provided.
First adhesive phase 510 can be made by epoxy resin.Preferably, epoxy resin is in B in the stage, rather than A is in the stage, and the B stage is a gel, and the A stage is a liquid.Usually, well-known, the solidification process epoxy resin by proper temperature from the A phase transition to the B stage.Similarly, the solidification process epoxy resin by proper temperature further from the B phase transition to the C stage, the C stage is a solid.
Form first adhesive phase 510 by the epoxy resin that utilizes the B stage, taking and placing housing strip 300 just becomes and is more prone to.This situation with the epoxy resin that uses the A stage is opposite.When attaching to housing strip 300 on the substrate 100 by first adhesive phase of making by semi-solid epoxy resin 510, be that first adhesive phase 510 is carried out the temperature-curable processes, solidify first adhesive phase 510 by this and housing strip 300 is firmly attached on the substrate 100.
Second adhesive phase 520 (with reference to figure 4B) is applied to the upper surface of housing strip 300 and cover plate 400 is pasted second adhesive phase 520.Second adhesive phase 520 is also made by the B stage epoxy resin.After pasting cover plate 400 on second adhesive phase 520, carry out the temperature-curable process and solidify second adhesive phase 520.It will be understood by those skilled in the art that, except two different temperature-curable processes, can also after substrate 100 and cover plate 400 are adhered to first and second adhesive phases 510 and 520 respectively, only carry out the temperature-curable process one time.
At this moment, the temperature-curable process can comprise vacuum and hot pressing.As having air or gas in the fruit caving 312, because air or gas expansion image sensor package may be broken in hot pressing.In order to prevent this situation, before carrying out hot pressing, carry out pumping process with air or gas in the chamber of the shell 310 of finding time.As mentioned above, imageing sensor 200 is by the assembly complete closed of substrate 100, housing strip 300 and cover plate 400.
Fig. 5 A and 5B show two step process that image sensor package is separated from each other of being used for according to the embodiment of the invention.
The image sensor package assembly 600 that it will be understood by those skilled in the art that substrate, housing strip and cover plate has completed.But, next it is cut, saws, rules and break disconnected or routine processes off with the fingers and thumb, to distribute individual imageing sensor in order to utilize single image sensor package in useful mode.As is known, this cutting technique can be substep cutting technique or single cut technology, carries out repeatedly cutting action in the substep cutting technique, and in single cut technology, only carries out cutting action one time.
For example, shown in Fig. 5 A, can use first blade, 610 cutting cover plates 400, make window 401 to be separated from each other.First blade 610 has been removed the part that cover plate 400 defines between window 401, make that the gap between the window 401 is can broad a little.As a result, as shown in the figure, expose the part of the housing strip 300 that attaches on the cover plate 400.
Shown in Fig. 5 B, then utilize the mid portion of each expose portion of second blade, 620 cutting housing strip 300, shell 310 is separated from each other.Utilize first blade 610 to be wider than the gap that forms by second blade 620, make that separately the part of the upper surface of shell 310 exposes by the gap between the window 401 that the first time, cutting action formed.That is therefore the cutting width of first blade 610 can form step greater than second blade 620 between the shell 310 of window 401 and support window 401.If mounting sleeve and/or set of lenses on window 401, this step can be used as alignment pin (alignment key).The feature of this set of lenses and sleeve pipe will be described in more detail below.
As mentioned above, by above-mentioned cutting action or another kind of suitable segmentation process, the image sensor package on the assembly 600 is separated each other.In addition, because cutting technique is that entire substrate 100 is carried out to make a plurality of discrete image sensor package, treatment effeciency is improved, and has therefore reduced cost.
According to present embodiment, carry out cutting and the expose portion of housing strip 300 and the cutting of substrate 100 of cover plate 400 like this, make the cutting surface of cover plate 400 more to lean on the lining than the expose portion of housing strip 300 and the cutting surface of substrate 100.In addition, can so carry out the cutting of cover plate 400, make that cover plate that separates or window 401 can coverage holes 311 when cover plate 401 separately is set on the housing strip 300.Cover plate 401 separately can be littler than the shell 310 that separates, but bigger than hole 311.
Fig. 6 A and 6B show according to the image sensor package embodiment of the invention, that assemble.
The image sensor package of separating from assembly 600 comprises substrate 100 as chip carrier, be arranged on imageing sensor 200 on the substrate 100, be arranged on the substrate 100, the window 401 in the hole 311 of the shell 310 of interlock imageing sensor 200 peripheral edges and can 310.
Can be applied to simply easily on the single-chip package shown in the twin-core sheet encapsulation shown in Fig. 6 B and Fig. 6 A to the assemble method of the described image sensor package of 5B with reference to Figure 1A.
Shown in Fig. 6 B, the encapsulation of twin-core sheet is that with the difference of single-chip package two chips 200 and 210 are stacked on top of each other.
For instance, digital signal processor 210 is installed on the substrate 100, and forms welding wire 104.Use die attach adhesives layer 250 that imageing sensor 200 is stacked on the digital signal processor 210.Then, as mentioned above with illustrated, package shell bar 300 and cover plate 400 cut and distribute each layer, thereby discrete, the encapsulation of twin-core sheet shown in Fig. 6 B is provided.
It will be understood by those skilled in the art that image sensor package 601 or 602 can be electrically connected to PCB or FPCB by splicing ear 105.The application of image sensor package of the present invention comprises various imaging applications, for example bar code reader, scanner, camera etc.Importantly, image sensor package of the present invention is higher than conventional image sensor package quality, cost is lower.
The assemble method of above-mentioned image sensor package can also be used to make the image sensor package that set of lenses is aimed on the infrared fileter window.
Fig. 7 A and 7B show and are used for according to an embodiment of the invention set of lenses is assembled into two step process on the discrete image sensor package.
Common reference Fig. 6 A, 7A and 7B, sleeve pipe 810 are installed on the image sensor package 601 shown in Fig. 6 A.Sleeve pipe 810 pastes on the exposed upper surface 303 of shell 310 by the adhesive phase (not shown).Perhaps, sleeve pipe 810 can paste on the window 401 by adhesive phase, and it can also paste on the upper surface 303 and window 401 of exposure simultaneously.Adhesive phase can be made by suitable adhesive, such as passing through for example epoxy resin sill of the photo-hardening of ultraviolet ray (UV).Shown in Fig. 5 A and 5B, the encapsulation shown in Fig. 6 A can also be equipped with the step that forms between the upper surface 303 of shell 310 and window 401.During alignment sleeve 810, this step can be used as alignment pin on window 401.
Then, set of lenses 700 is assembled within the hole 811 of sleeve pipe 810.Set of lenses 700 comprise one or more lens 710 and 715 and be arranged between lens 710 and 715 and/or lens 710 and window 401 between one or more spacers 730 and 735.In other words, first lens 710 are aimed on first spacer 730, and second spacer 735 is aimed on first lens 710, and second lens 715 are aimed on second spacer 735.Lens entrance member 737 is aimed on second lens 715.
Such set of lenses 700 is inserted in the hole 811 of sleeve pipe 810 smoothly, slidably.The external diameter of all elements that constitutes set of lenses 700 is through design, with the internal diameter coupling in the hole 811 of sleeve pipe 810.Because sleeve pipe 810 has smooth inwall, set of lenses 700 can slip in the sleeve pipe 810 smoothly.Can realize by vacuum extractor in the hole 811 with lenticular unit 700 insertion sleeve pipes 810.Because do not produce screw thread or interference fit in the time of in the hole of set of lenses of the present invention being inserted sleeve pipe of the present invention or reverse or other frictions, so can not produce any free particle or other optics shelters of the imageing sensor of puzzlement prior art when carrying out insertion process.
One by one in the assembly insertion sleeve pipe 810 with set of lenses 700.Perhaps, the assembling lens group 700 in advance, and is with adhesive that its assembly is bonded to one another, then can be with in the disposable insertion sleeve pipe 810 of whole black box.
Because the inwall of sleeve pipe 810 is level and smooth formation, therefore in sleeve pipe 810, can keep equably spacer 730 and 735 and lens 710 and 715 between relative position.
When the thickness of the height of the active surface 201 of the height of shell 310, imageing sensor 200 and window 401 be fix the time, focal length only depends on the thickness of first spacer 730 basically.Therefore, back focal length (back focal length, i.e. length between window 401 and the active surface 201) is fixed, and focus simply and is directly regulated by the thickness of first spacer 730.When the thickness of first spacer 730 evenly keeps according to given expectation focal length, because first spacer 730 aims on window 401, so can keep the height of first lens 710 on active surface 201 equably.
As a result, even when sleeve pipe 810 and set of lenses 700 are assembled on the image sensor package 601, the distance between surface 201 and lens 710 and 715 of also can remaining valid equably is to realize the focal length of expectation.This means the required any extra focus adjustment process of imageing sensor that in assembling process, can omit prior art, further simplified assembling process thus.
Provide lens entrance member 737 to prevent to be inserted into set of lenses 700 activities in the sleeve pipe 810, this lens entrance member 737 is preferably made by printing ink carbon black or metal.For this reason, after lens component 700 is inserted sleeve pipe 810, preferably lens entrance member 737 is bonded on the sleeve pipe 810 by adhesive.Because sleeve pipe 810 forms the right cylindrical shape, lens entrance member 737 can form the annular corresponding to cylindrical casing 810.Like this, lens entrance member 737 also plays the effect of screen, prevents that light from passing through the edge incident of second lens 715.Person of skill in the art will appreciate that lens entrance member 737 has played the effect of the permanent opening aperture (fixed-opening iris) of camera effectively.
By set of lenses 700 is inserted sleeve pipe 810 and utilized adhesive that set of lenses 700 is bonded on the sleeve pipe 810, just realized the image sensor package 601 shown in Fig. 7 B.
As mentioned above, shown in Fig. 7 A, can on discrete image sensor package 601, individually assemble sleeve pipe 810.Perhaps, connect the sleeve pipe bar of a plurality of sleeve pipes 810 above can on cover plate 400, assembling, made sleeve pipe 810 can attach on window 401 and/or the shell 310.In this case, should prepare the sleeve pipe bar of making by injection molding technology in advance.
Fig. 8 shows the sleeve pipe bar of image sensor package according to an embodiment of the invention.
Fig. 9 has provided the technology that is used to prepare the image sensor package assembly according to the embodiment of the invention, will assemble the sleeve pipe bar on this assembly.
At first prepare assembly 600 (with reference to figure 5A and 5B), housing strip 300 and the cover plate 400 of substrate 100, wherein be provided with imageing sensor 200 on the assembly 600.Then, cover plate 400 is cut into a plurality of parts corresponding to respective image sensor 200.For instance, utilize first blade 610 to remove, expose the part of the upper surface 303 of housing strip 300 by this by the part that saw or other proper handlings will be defined in the cover plate 400 between the imageing sensor 200.
Step between upper surface 303 that housing strip 300 exposes and the window 401 that separates is serving as and be used for alignment pin that sleeve pipe 810 is aimed on the active surface 201 of imageing sensor 200.In other words, sleeve pipe bar 800 is aimed on window 401 assembly 600 spaced apart.
Figure 10 show according to the embodiment of the invention, be used for the sleeve pipe bar is assembled into technology on the image sensor package assembly.
The lower surface of sleeve pipe bar 800 is aimed at and is attached on the upper surface 303 of exposure of the housing strip 300 that the window 401 on it separated.At this moment, for instance, with can sleeve pipe bar 800 being attached on the housing strip 300 by the adhesive phase that UV cured thermosetting resin or epoxy resin are made.
Figure 11 shows the separately technology of image sensor package that is used for according to the embodiment of the invention, and wherein said each image sensor package all has the sleeve pipe from the sleeve pipe bar.
The part of the sleeve pipe bar 800 that defines between the sleeve pipe 810 is with the cutting of second blade 620, during substrate 100 also be cut into a plurality of parts, the image sensor package that will be furnished with sleeve pipe by this is separated from each other.
On the other hand, though it is not shown, according to an aspect of the present invention, can carry out the cutting of sleeve pipe bar 800 like this, make the housing strip 300 and the substrate 100 that are arranged on sleeve pipe bar 800 belows in the single cut operation, to be cut, thereby the cutting surface of sleeve pipe bar 800, housing strip 300 and substrate 100 can be in the same plane.Similarly, though it is also not shown, can carry out cutting and the expose portion of housing strip 300 and the cutting of substrate 100 of cover plate 400 like this, make that the cutting surface of cover plate 400 can be in the same plane with the cutting surface of the expose portion of housing strip 300 and substrate 100.
Figure 12 shows the image sensor package with sleeve pipe according to the embodiment of the invention.
As with reference to shown in Figure 11, the image sensor package 601 that all has sleeve pipe 810 is separated from each other.Set of lenses 700 is assembled on the image sensor package 601 separately with reference to the described technology of Fig. 7 A by above, finishes the image sensor package shown in Fig. 7 B by this.
When as during above-mentioned use sleeve pipe bar 800 because assembling all has a plurality of image sensor package of sleeve pipe 810 simultaneously, therefore can boost productivity and can significantly improve tolerance between the image sensor package.
Figure 13 to 16 shows technology according to another embodiment of the present invention, and each transparent cover plate that this technology is used for separating is assembled into the housing strip assembly.
With reference to Figure 13, as described in reference Figure 1A and 1B, a plurality of imageing sensors 1200 bondings and being arranged on the substrate 1100, the active surface that makes imageing sensor 1200 is up.In addition, as described in reference Fig. 2 A and 2B, a plurality of shells 1310 that all have hole 1311 are connected to each other, to define housing strip assembly 1300.
As described in reference Fig. 4 A and 4B, housing strip assembly 1300 pastes on the substrate 1100.As described in reference Fig. 4 A and 4B, as shown in figure 14, a plurality of discrete transparent cover plates 1401 are arranged and are sticked within the corresponding hole 1311.
As shown in figure 14, can adhere to corresponding transparent cover plate 1401 on it in the interior week formation supporting projections 1315 in each hole 1311.
With reference to Figure 15, as described in reference Fig. 5 B, utilize the 3rd blade 630 to separate the shell 1310 of having assembled corresponding transparent cover plate 1401 on it, finish the making of a plurality of individual images sensor package 605 by this.
With reference to Figure 16, as described in reference Fig. 7 A and 7B, sleeve pipe 810 is assembled on each image sensor package 605, and set of lenses 700 is assembled within the hole 811 of sleeve pipe 810.As a result, can form image sensor package 605 with set of lenses 700.
According to an aspect of the present invention, image sensor package that can miniaturization such as air chamber type ceramic lead chip carrier, and can improve rate of finished products.
In typical C CD,, therefore reducing there is restriction aspect its size and the cost because ceramic packaging has step.And, owing to handle ceramic packaging by part, so process complications.In addition, may produce particle, therefore influence picture quality, and must regulate lens focus through additional processing step at sleeve portion.The invention solves distinctive these problems of prior art device.
According to another aspect of the present invention, owing to slide the set of lenses sleeve pipe of packing into, therefore can prevent to generate free particle or other pollutants by level and smooth, friction free.
In addition, because lens subassembly is simply to insert in the sleeve pipe, by the reference window, promptly the fixing given back focal length of infrared fileter is provided with the spacer of lens subassembly, therefore do not generate the particle that forms because of screw thread or other interference fits, and can omit extra focus and adjust operation.
Owing on housing strip, assembled cover plate with a plurality of infrared fileter windows, compare with the situation of on shell, assembling the infrared fileter window by part ground, can improve the efficient of processing.
A series of operations that are used to form image sensor package have been finished by many (multi-strip) assemblies.In other words, after all assemblies are assembled each other, break disconnected or sequencing division process off with the fingers and thumb by saw or cutting or line the image sensor package of individuality is separated from each other.Therefore, might realize the batch process of image sensor package.
Although the present invention has been carried out concrete displaying and description with reference to its one exemplary embodiment, those of ordinary skill in the art should be understood that, under the prerequisite that does not deviate from by the defined the spirit and scope of the present invention of claim, can make various variations in form and details.
The application requires to Korea S Department of Intellectual Property, the priority of korean patent application No.10-2004-0042501 that submits to June in 2004 10 and the korean patent application No.10-2005-0037018 that submits on May 3rd, 2005 is openly introduced it to do reference in full at this.
Claims (52)
1. the assemble method of an image sensor package comprises:
One substrate is provided, a plurality of imageing sensors are installed on it;
One housing strip is provided, it comprises a plurality of shells, described shell is arranged corresponding to the arrangement of a plurality of imageing sensors on the described substrate, each of described a plurality of shells includes hole and chamber, described hole is corresponding to corresponding one active surface of described a plurality of imageing sensors, and described chamber is used for receiving at least in part therein corresponding of described a plurality of imageing sensors;
Described housing strip is pasted on the described substrate;
Attach transparent cover plate to seal the hole of a plurality of shells on the described housing strip; And
Cut described transparent cover plate, described housing strip and described substrate, described a plurality of image sensor package are separated from each other.
2. the assemble method of image sensor package as claimed in claim 1, it further comprises:
Between described substrate and each imageing sensor, form integrated circuit (IC) chip.
3. the assemble method of image sensor package as claimed in claim 1, wherein said housing strip forms by injection molding technology.
4. the assemble method of image sensor package as claimed in claim 1, wherein said housing strip sticks on by adhesive on the middle broad area of the described substrate that defines between the described imageing sensor.
5. the assemble method of image sensor package as claimed in claim 1, the attaching of wherein said transparent cover plate comprises:
On the contact-making surface between described substrate and the described transparent cover plate, deposit gel type binder; And
By with described substrate and transparent cover plate to described housing strip hot pressing, described gel type binder hardens.
6. the assemble method of image sensor package as claimed in claim 5 further is included in described gel type binder and carries out between hardening period and vacuumize operation.
7. the assemble method of image sensor package as claimed in claim 1 wherein separates described image sensor package and comprises, with the middle part of the middle broad area between a plurality of shells of the described housing strip of blade cuts.
8. the assemble method of image sensor package as claimed in claim 1, wherein separate described a plurality of image sensor package and comprise:
Cut described cover plate, expose the part of described housing strip by this; And
Cut the expose portion of described substrate and described housing strip.
9. the assemble method of image sensor package as claimed in claim 8, wherein carry out cutting and the expose portion of described housing strip and the cutting of substrate of cover plate like this, make the cutting surface of cover plate more to lean on the lining than the expose portion of housing strip and the cutting surface of substrate.
10. the assemble method of image sensor package as claimed in claim 8, wherein carry out cutting and the expose portion of described housing strip and the cutting of substrate of cover plate like this, make that the cutting surface of cover plate can be in the same plane with the cutting surface of the expose portion of housing strip and substrate.
11. the assemble method of image sensor package as claimed in claim 8, the cutting of wherein said cover plate is so carried out, and makes the size of cover plate separately can cover described hole.
12. the assemble method of an image sensor package comprises:
One substrate is provided, a plurality of imageing sensors are installed on it;
One housing strip is provided, and it comprises a plurality of shells, and each described shell comprises the hole corresponding to the active surface of respective image sensor;
On described substrate, attach described housing strip and transparent cover plate; And
Cutting described transparent cover plate, described housing strip and described substrate is separated from each other described image sensor package continuously.
13. the assemble method of an image sensor package comprises:
One substrate is provided, a plurality of imageing sensors are installed on it;
Attach a housing strip to described substrate, it comprises a plurality of shells, described shell is arranged corresponding to the arrangement of a plurality of imageing sensors on the described substrate, each of described a plurality of shells includes hole and chamber, described hole is corresponding to corresponding one active surface of described a plurality of imageing sensors, and described chamber is used for receiving at least in part therein corresponding of described a plurality of imageing sensors;
Attach transparent cover plate to seal the hole of a plurality of shells on the described housing strip;
Cut transparent cover plate, described housing strip and the described substrate that is attached continuously, described image sensor package is separated from each other;
Assemble sleeve pipe on the image sensor package of separating, described sleeve pipe has the collar aperture corresponding to the hole of described shell;
Set of lenses is inserted described sleeve pipe; And
Seal the inlet region of described sleeve pipe, so that described set of lenses is fixed within the sleeve pipe.
14. the assemble method of image sensor package as claimed in claim 13, the attaching of wherein said transparent cover plate comprises:
On the contact-making surface between described substrate and the described transparent cover plate, deposit gel type binder; And
By with described substrate and transparent cover plate to described housing strip hot pressing, described gel type binder hardens.
15. the assemble method of image sensor package as claimed in claim 14 further is included in described gel type binder and carries out between hardening period and vacuumize operation.
16. the assemble method of image sensor package as claimed in claim 13 wherein separates described image sensor package and comprises:
Utilize the first of the described transparent cover plate of first blade cuts, described transparent cover plate is divided into a plurality of windows, each window seals the first that exposes described housing strip in the lump of the respective aperture of corresponding shell; And
Utilize effective cutting width be narrower than described first blade the described housing strip of second blade cuts first with and the substrate of below.
17. the assemble method of image sensor package as claimed in claim 13, wherein said sleeve pipe be with cylindrical formation, described cylindrically have smooth positive internal surface of column and with respect to the perpendicular orientation of described transparent cover plate.
18. the assemble method of image sensor package as claimed in claim 13 wherein inserts described set of lenses and comprises:
The lens that will be inserted in the described sleeve pipe are provided;
Alignment spaces device between described lens and transparent cover plate;
On described lens, aim at aperture;
Described lens, spacer and aperture are inserted described sleeve pipe; And
Use first adhesive described aperture to be bonded to the upper edge surfaces of described sleeve pipe.
19. the assemble method of image sensor package as claimed in claim 18 further comprises and uses second adhesive that described spacer, lens and aperture are pasted each other.
20. the assemble method of image sensor package as claimed in claim 18 wherein inserts described set of lenses and further comprises:
On described lens, aim at second spacer; And
On described second spacer, aim at second lens.
21. the assemble method of an image sensor package comprises:
One substrate is provided, a plurality of imageing sensors are installed on it;
One housing strip is provided, and it has a plurality of shells, and each described shell has the hole corresponding to the active surface of respective image sensor;
On described substrate, attach described housing strip and transparent cover plate;
Cut transparent cover plate, described housing strip and the described substrate that is attached continuously, described image sensor package is separated from each other;
Assemble sleeve pipe on the image sensor package of separating, described sleeve pipe has the hole corresponding to corresponding one hole of described a plurality of shells; And
In the hole of described sleeve pipe, insert and the stickup set of lenses.
22. the assemble method of an image sensor package comprises:
A plurality of imageing sensors are installed on substrate;
Paste a housing strip to described substrate, it has a plurality of shells, described shell is arranged corresponding to the arrangement of described a plurality of imageing sensors, each of described a plurality of shells all has hole and chamber, described hole is corresponding to corresponding one active surface of described a plurality of imageing sensors, and described chamber is used for receiving at least in part therein corresponding of described a plurality of imageing sensors;
Attach transparent cover plate to seal the hole of a plurality of shells on the described housing strip;
Utilize the first of the described transparent cover plate of first blade cuts, described transparent cover plate is divided into the window in the hole of the corresponding shell of a plurality of sealings, so that expose the first of described housing strip;
First to the exposure of described housing strip attaches a sleeve pipe bar, and described sleeve pipe bar comprises a plurality of sleeve pipes, and each in described a plurality of sleeve pipes is connected to another one at least; And
Utilize effective cutting width to be narrower than of the first cutting of second blade of first blade, by this described a plurality of image sensor package are separated from each other by described sleeve pipe bar and substrate.
23. the assemble method of image sensor package as claimed in claim 22, wherein said sleeve pipe bar forms by injection molding technology.
24. the assemble method of image sensor package as claimed in claim 22, the attaching of wherein said sleeve pipe bar are included between described sleeve pipe bar and the housing strip or coating adhesive between described sleeve pipe bar and the window.
25. the assemble method of image sensor package as claimed in claim 22, it further comprises:
Set of lenses is inserted in the hole of each sleeve pipe, the corresponding optical alignment ground of described set of lenses and described a plurality of imageing sensors inserts; And
The inlet that seals each sleeve pipe is with fixing corresponding set of lenses.
26. the assemble method of image sensor package as claimed in claim 22 wherein cuts the part of described cover plate, makes that when the transparent cover plate that separates was arranged on the described housing strip, the described transparent cover plate that separates can cover described hole.
27. the assemble method of an image sensor package comprises:
One substrate is provided, a plurality of imageing sensors are installed on it;
Attach a housing strip to described substrate, it has a plurality of shells, described shell is arranged corresponding to the arrangement of described a plurality of imageing sensors, each of described a plurality of shells all has hole and chamber, described hole is corresponding to corresponding one active surface of described a plurality of imageing sensors, and described chamber is used for receiving at least in part therein corresponding of described a plurality of imageing sensors;
Attach transparent cover plate to seal the hole of a plurality of shells on the described housing strip;
Attach the sleeve pipe bar on described transparent cover plate, described sleeve pipe bar has a plurality of sleeve pipes connected to one another; And
Broad area in the middle of described sleeve pipe bar is carried out cutting technique, and described a plurality of image sensor package are separated from each other.
28. the assemble method of image sensor package as claimed in claim 27, wherein said sleeve pipe bar forms by injection molding technology.
29. the assemble method of image sensor package as claimed in claim 27 further is included in before described sleeve pipe bar attaches on the described transparent cover plate, cuts described cover plate.
30. the assemble method of image sensor package as claimed in claim 29, wherein carry out cutting and the expose portion of described housing strip and the cutting of substrate of cover plate like this, make the cutting surface of cover plate more to lean on the lining than the expose portion of housing strip and the cutting surface of substrate.
31. the assemble method of image sensor package as claimed in claim 27 wherein so carries out the cutting of described cover plate, makes that described divided portion can cover described hole when being arranged on the described housing strip by the divided portion of cutting the cover plate acquisition.
32. the assemble method of image sensor package as claimed in claim 27, wherein carry out the cutting of described sleeve pipe bar like this, make the housing strip and the substrate that are arranged on described sleeve pipe bar below in single operation, to cut, thereby the cutting surface of described sleeve pipe bar, housing strip and substrate can be in the same plane.
33. the assemble method of image sensor package as claimed in claim 27, wherein said transparent cover plate are littler but bigger than described hole than described shell.
34. the assemble method of an image sensor package comprises:
One substrate is provided, a plurality of imageing sensors are installed on it;
On described substrate housing strip is installed, described housing strip has a plurality of shells, and each shell all has the hole corresponding to corresponding one active surface of described a plurality of image sensors;
On described substrate, attach described housing strip and transparent cover plate;
Mounting sleeve bar on described transparent cover plate, described sleeve pipe bar comprises a plurality of sleeve pipes of aiming at the hole of corresponding shell, described sleeve pipe is used for corresponding set of lenses is received in wherein;
Described a plurality of image sensor package are separated from each other; And
A plurality of set of lenses are inserted in a plurality of sleeve pipes of a plurality of imageing sensors separately.
35. the assemble method of an image sensor package comprises:
One assembly is provided, and it comprises substrate, be installed in imageing sensor on the described substrate, comprise corresponding to the shell in the hole of the active surface of described imageing sensor and seal the window in the hole of described shell;
Mounting sleeve on described assembly, described sleeve pipe has the collar aperture of aiming at the hole of described shell;
Set of lenses is inserted described collar aperture; And
The inlet of Sealed casing pipe is to firmly fix described set of lenses.
36. the assemble method of image sensor package as claimed in claim 35 wherein provides described assembly to comprise:
Form described window, make described window expose the upper surface of described shell; And
Use on the exposed upper surface of described shell, the bond lower surface of described sleeve pipe of adhesive.
37. the assemble method of image sensor package as claimed in claim 35, wherein said sleeve pipe forms with right cylindrical, and described right cylindrical is aimed at respect to the perpendicular of described window, and described sleeve pipe has slippery inner surface.
38. the assemble method of image sensor package as claimed in claim 35 wherein inserts described set of lenses and comprises:
The lens that will be inserted in the described sleeve pipe are provided;
Alignment spaces device between described lens and transparent cover plate;
On described lens, aim at aperture;
Described lens, spacer and aperture are slipped into described sleeve pipe; And
Use first adhesive that described aperture is bonded on the top edge of described sleeve pipe.
39. the assemble method of image sensor package as claimed in claim 38 further comprises and uses second adhesive that described spacer, lens and aperture are pasted each other.
40. the assemble method of image sensor package as claimed in claim 38 wherein inserts described set of lenses and further comprises:
On described lens, aim at second spacer; And
On described second spacer, aim at second lens.
41. an image sensor package comprises:
One assembly, it comprises substrate, be installed in imageing sensor on the described substrate, have corresponding to the shell in the hole of the active surface of described imageing sensor and seal the window in the hole of described shell;
Be installed in the sleeve pipe on the described assembly, described sleeve pipe has the hole of aiming at the hole of described shell; And
Insert the set of lenses in the hole of described sleeve pipe.
42. image sensor package as claimed in claim 41, wherein said sleeve pipe is to be that right cylindrical forms substantially, and described right cylindrical is with respect to the perpendicular orientation of described window, and described sleeve pipe has essentially smooth inner surface.
43. image sensor package as claimed in claim 41, wherein said set of lenses comprises:
Insert the lens in the described sleeve pipe;
The spacer that between described lens and transparent cover plate, is provided with; And
The aperture of on described lens, aiming at.
44. image sensor package as claimed in claim 43, wherein said spacer, lens and aperture are bonded to each other by adhesive.
45. image sensor package as claimed in claim 43, wherein said set of lenses further comprises:
Second spacer of on described lens, aiming at; And
Second lens of on described second spacer, aiming at.
46. an image sensor package comprises:
One assembly, it comprises substrate, be installed in imageing sensor on the described substrate, have corresponding to the shell in the hole of the active surface of described imageing sensor and seal the window in the hole of described shell;
The sleeve pipe of on described assembly, installing, described sleeve pipe has the hole of aiming at the hole of described shell; And
Be arranged on one or more lens and one or more spacer in the hole of the sleeve pipe between described imageing sensor and the window.
47. a method comprises:
One substrate is provided, a plurality of imageing sensors are installed on it;
One housing strip is provided, described housing strip comprises a plurality of shells, described shell is arranged corresponding to the arrangement of a plurality of imageing sensors on the described substrate, and each in described a plurality of shells comprises and is used for receiving therein at least in part corresponding one opening of described a plurality of imageing sensor;
Described housing strip is pasted on the described substrate; And
Attach cover plate to seal the hole of a plurality of shells on the described housing strip.
48. method as claimed in claim 47 further comprises:
Cut described transparent cover plate, described housing strip and described substrate, described a plurality of image sensor package are separated from each other.
49. the assemble method of an image sensor package comprises:
One substrate is provided, a plurality of imageing sensors are installed on it;
Attach a housing strip to described substrate, described housing strip has a plurality of shells, described shell is arranged corresponding to the arrangement of a plurality of imageing sensors on the described substrate, and at least one has and is used for around corresponding one hole of described a plurality of imageing sensors in described a plurality of shells; And
The individual transparent cover plate that separates is sticked at least one hole of described a plurality of shells.
50. method as claimed in claim 49 further comprises described housing strip of cutting and substrate, so that the image sensor package of a plurality of individualities to be provided.
51. method as claimed in claim 50 further is included on each individual images sensor package and assembles sleeve pipe, described sleeve pipe has the opening of aiming at corresponding one hole of described a plurality of shells.
52. method as claimed in claim 51 further comprises set of lenses is inserted in the opening of each sleeve pipe.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
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| KR42501/04 | 2004-06-10 | ||
| KR20040042501 | 2004-06-10 | ||
| KR37018/05 | 2005-05-03 | ||
| KR1020050037018A KR100712509B1 (en) | 2004-06-10 | 2005-05-03 | Assembling method and structure of image sensor packages |
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| CN1722456A true CN1722456A (en) | 2006-01-18 |
| CN1722456B CN1722456B (en) | 2010-05-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200510076348XA Active CN1722456B (en) | 2004-06-10 | 2005-06-10 | Image sensor package and method of manufacturing the same |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR100712509B1 (en) | 2007-04-30 |
| CN1722456B (en) | 2010-05-05 |
| KR20060045888A (en) | 2006-05-17 |
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