CN1708737A - 电气制造控制的概率约束优化 - Google Patents
电气制造控制的概率约束优化 Download PDFInfo
- Publication number
- CN1708737A CN1708737A CNA2003801023316A CN200380102331A CN1708737A CN 1708737 A CN1708737 A CN 1708737A CN A2003801023316 A CNA2003801023316 A CN A2003801023316A CN 200380102331 A CN200380102331 A CN 200380102331A CN 1708737 A CN1708737 A CN 1708737A
- Authority
- CN
- China
- Prior art keywords
- group
- constraints condition
- probability constraints
- build
- probability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 44
- 238000005457 optimization Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 131
- 230000008569 process Effects 0.000 claims abstract description 97
- 238000005516 engineering process Methods 0.000 claims description 45
- 238000012545 processing Methods 0.000 claims description 40
- 238000012544 monitoring process Methods 0.000 claims description 27
- 238000009434 installation Methods 0.000 claims description 5
- 238000012986 modification Methods 0.000 claims description 4
- 230000004048 modification Effects 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 12
- 230000006870 function Effects 0.000 description 10
- 230000001276 controlling effect Effects 0.000 description 9
- 239000011159 matrix material Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 238000009826 distribution Methods 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- 230000036541 health Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000033228 biological regulation Effects 0.000 description 3
- 230000000875 corresponding effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000007669 thermal treatment Methods 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000000513 principal component analysis Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000002790 cross-validation Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005315 distribution function Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000012010 growth Effects 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000006396 nitration reaction Methods 0.000 description 1
- 238000013386 optimize process Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000013139 quantization Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000010977 unit operation Methods 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- General Factory Administration (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42494402P | 2002-11-08 | 2002-11-08 | |
US60/424,944 | 2002-11-08 | ||
US10/335,748 | 2003-01-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1708737A true CN1708737A (zh) | 2005-12-14 |
CN100355053C CN100355053C (zh) | 2007-12-12 |
Family
ID=35581869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003801023316A Expired - Fee Related CN100355053C (zh) | 2002-11-08 | 2003-10-29 | 电气制造控制的概率约束优化 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100355053C (zh) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0616475B2 (ja) * | 1987-04-03 | 1994-03-02 | 三菱電機株式会社 | 物品の製造システム及び物品の製造方法 |
US6434441B1 (en) * | 1998-04-30 | 2002-08-13 | General Electric Company | Designing and making an article of manufacture |
EP1045304A1 (fr) * | 1999-04-16 | 2000-10-18 | Martine Naillon | Procédé de pilotage d'un processus décisionnel lors de la poursuite d'un but dans un domaine d'application déterminé, tel qu'économique, technique organisationnel ou analogue et système pour la mise en oeuvre du procédé |
-
2003
- 2003-10-29 CN CNB2003801023316A patent/CN100355053C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100355053C (zh) | 2007-12-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4472637B2 (ja) | 電気的製造制御に対する確率制約最適化 | |
CN100378941C (zh) | 在制造过程中预测装置的电气参数的方法及*** | |
CN100578747C (zh) | 用于模型预测的动态适应性取样率 | |
Purwins et al. | Regression methods for virtual metrology of layer thickness in chemical vapor deposition | |
CN101036092B (zh) | 动态控制量测中的工件的方法及*** | |
US8396583B2 (en) | Method and system for implementing virtual metrology in semiconductor fabrication | |
KR20030076672A (ko) | 식각 선택도를 제어하기 위한 방법 및 장치 | |
JP2007501517A (ja) | 動的測定サンプリング方法及びそれを行うシステム | |
CN1816905A (zh) | 用于刻蚀工艺的前馈和反馈晶片到晶片控制方法 | |
US6684122B1 (en) | Control mechanism for matching process parameters in a multi-chamber process tool | |
CN101032013A (zh) | 基于有效测量量程而动态调整测量采样的方法及*** | |
CN1860487A (zh) | 使用第一原理仿真分析半导体处理工具执行的处理的***和方法 | |
CN1867896A (zh) | 用于工具上半导体仿真的***和方法 | |
CN103247518A (zh) | 改进半导体制造中的fab工艺的工具功能的新型设计 | |
CN100345270C (zh) | 依据所检测的电特性控制制造过程的方法与装置 | |
JP7206961B2 (ja) | 半導体製造装置の管理システム及びその方法 | |
Chien et al. | A novel approach to hedge and compensate the critical dimension variation of the developed-and-etched circuit patterns for yield enhancement in semiconductor manufacturing | |
US20090306807A1 (en) | Multidimensional process window optimization in semiconductor manufacturing | |
CN113994453A (zh) | 半导体装置制造***以及半导体装置制造方法 | |
Tin et al. | A realizable overlay virtual metrology system in semiconductor manufacturing: Proposal, challenges and future perspective | |
CN1333312C (zh) | 依据批量与工具可用状态计划生产批次的方法与装置 | |
US8406904B2 (en) | Two-dimensional multi-products multi-tools advanced process control | |
CN1708737A (zh) | 电气制造控制的概率约束优化 | |
US11747774B2 (en) | Search device, search program, and plasma processing apparatus | |
Davis et al. | Automatic synthesis of equipment recipes from specified wafer-state transitions |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: GLOBALFOUNDRIES SEMICONDUCTORS CO., LTD Free format text: FORMER OWNER: ADVANCED MICRO DEVICES CORPORATION Effective date: 20100721 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: CALIFORNIA STATE, THE USA TO: GRAND CAYMAN ISLAND, BRITISH CAYMAN ISLANDS |
|
TR01 | Transfer of patent right |
Effective date of registration: 20100721 Address after: Grand Cayman, Cayman Islands Patentee after: Globalfoundries Semiconductor Inc. Address before: American California Patentee before: Advanced Micro Devices Inc. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071212 Termination date: 20181029 |
|
CF01 | Termination of patent right due to non-payment of annual fee |