CN1697173A - Structure of constituting pins in high density - Google Patents
Structure of constituting pins in high density Download PDFInfo
- Publication number
- CN1697173A CN1697173A CN 200410044204 CN200410044204A CN1697173A CN 1697173 A CN1697173 A CN 1697173A CN 200410044204 CN200410044204 CN 200410044204 CN 200410044204 A CN200410044204 A CN 200410044204A CN 1697173 A CN1697173 A CN 1697173A
- Authority
- CN
- China
- Prior art keywords
- pin
- face
- connects
- composition structure
- blocks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention improves traditional interleaving type pins arranged on lead wire frame. The disclosed lead wire frame possesses multiple arranged blocky pins. At least one guiding and connecting face is formed on bottom of pin, and at least one blocking body is setup at the guiding and connecting face of selected pin. Blocking bodies of pins are arranged in special interleaving mode. Each blocking body and exposed guiding and connecting face is interlaced. Comparing with traditional arrangement of pins on lead wire frame, the invention solves issue of that two pins are contacted each other caused by diffused soldering tin. Thus, pins can be arranged in high density as well as prepared easily.
Description
Technical field
The present invention relates to a kind of composition structure of high-density pin, particularly a kind ofly be applied in the lead frame pin that carrying connecting wafer and constituting can externally conduct electricity and form structural improvement, but make the staggered and simple and easy arrangement of pin high density.
Background technology
Design of electronic products development trend now, be to turn to main flow with multi-functional, high power capacity (high memory capacitance), high transmission rates and exquisiteness, single product only has simple function very less, relative promptly requires the internal functionality electric crystal more smart little, and electric crystal must have the pin of more fine and closely woven and volume to be connected with circuit board, with at a high speed and the information that a large amount of output or record meet above-mentioned purpose.See also Fig. 8, shown in Figure 9, because of the pin 20 that carries brilliant first 30 lead frame 10 must have volume and high density structures, because of the scolding tin diffusion two pins, 20 contacted flaws take place easily, when therefore in the streets making pin 20 structures of lead frame 10, often be that punching press pin 20 bottoms have a projection 201, with these projection 201 bottoms as with the face that connects 202 of circuit board welding, and the projection 201 of adjacent another pin 20 is made as staggers especially, form staggered arrangement by this and be infected with mutually to prevent scolding tin in diverse location.
But, projection 201 structures of lead frame 10 each pin 20 of commonly seeing are to adopt die stamping to make moulding, be required that each projection 201 must constitute under the situation of staggered arrangement, not only mould is made difficulty (the especially pin 20 of punching press such as needle-like), lead frame 10 costs can't reduce, and the flaw situation when easily punching press taking place, not only cause quality-control cost to increase, and the yields of back electric crystal is formed in influence.
Summary of the invention
The contacted problem of two pins takes place because of the scolding tin diffusion in the pin that the objective of the invention is to solve above-mentioned lead frame, and a kind of composition structure that overcomes the high-density pin of above-mentioned shortcoming is provided.
The present invention has for the lead frame of wafer mounting with external electrical communication, it is characterized in that, this lead frame has the plural number bulk and is number arranges the pin of putting, this bulk pin have the lower surface as with the face that connects of extraneous electrical communication, the face of connecting of this pin is provided with at least one body that blocks and covers and connect a face part, the body that blocks of each pin is the setting of interleaved positional alignment shape, makes respectively to block the adjacent outer dewiness of the body face that connects and also form the interleaved ordered state; Form pin by this and have the face that the connects structure that staggered outer dewiness is arranged, can prevent that the contact problems that cause because of the scolding tin diffusion between two pins from taking place, use the enforcement of blocking body structure and ordered state because of the present invention, it is more convenient not only to implement manufacture than the staggered projection of known pin punching press, simple and easy, and can avoid adopting the direct punching press difficult technology of projection that is staggered, relative can make die cost, the stamped cost reduces, the face of connecting that is staggered is formed in accurate easily enforcement, and be easy to carry out quality management control, therefore, can improve crystal yields and stability.
Described pin can form rectangular shape; Described pin bottom forms at least one concave step surface, forms one of a projection and projection bottom surface in this concave step surface adjacent and connects face; The bottom inner edge of described pin and close middle place are formed with a concave step surface respectively, connect face to form one of two projections that are spaced apart and projection bottom surface; The described pin wherein face of connecting of a projection is provided with the body that blocks that covers; Describedly block body can to paste or put gelling with dielectric film solid or constitute with adhesive body; This blocks body and can implement to constitute before or after lead frame in the wafer mounting.
Description of drawings
Fig. 1 implements to block the cross-sectional schematic of body for rectangular block shape pin of the present invention.
Fig. 2 implements to block body for rectangular block shape pin of the present invention and exposes the staggered end of the face of connecting with formation and look schematic diagram.
Fig. 3 is provided with projection for pin of the present invention and blocks the cross-sectional schematic of body.
Fig. 4 is provided with projection for pin of the present invention and blocks another cross-sectional schematic of body.
Fig. 5 is provided with two projections for pin of the present invention and blocks the cross-sectional schematic of body.
Fig. 6 constitutes the schematic diagram that blocks body for the present invention with adhesive body.
Fig. 7 blocks the schematic diagram that body is implemented on four row's pins for the present invention.
Fig. 8 is staggered cross-sectional schematic for known pin.
Fig. 9 looks schematic diagram for known pin is the staggered end.
Embodiment
See also Fig. 1, Fig. 2, Fig. 3, Fig. 4, shown in Figure 5, The present invention be directed to provides wafer 3 mountings and the externally improvement of the pin 11 composition structures of the lead frame 1 of electrical communication, it has lead frame 1, this lead frame 1 is according to wafer 3 or extraneous electrically equipment (as the arrangement shape connecting point position and the number of circuit board) demand, constitute a plurality of rectangular block shape and be number and arrange metal material pin 11 structures of putting, make block pin 11 have the mounting surface 111 of at least one wafer 3 in upper end, and the lower surface as with the face that connects 112 of extraneous electrical communication, its number of permutations and ordered state such as Fig. 2, shown in Figure 7, can be two rows or four row or other numbers, and can be parallel or radiation or Else Rule or irregularly shaped arrangement; And each pin 11 arranges the mode that constitutes lead frames 1, can adopt metal material to make, and after directly bearing wafer 3 utilizes adhesive body 4 encapsulation and cuts, and constitutes pin 11 independent stationary and the lead frame 1 that can externally electrically connect; Or after making pin 11 with metal material, impose sealing earlier and fix and cut (promptly not the fixing pin 11 of first sealings before the mounting wafer 3), to constitute the lead frame 1 that independent article can supply mounting wafer 3.
The present invention is before 3 encapsulation of lead frame 1 mounting wafer or after 3 encapsulation of mounting wafer, the face that connects 112 places of selected especially each pin 11 lower end are provided with that at least one insulation material constitutes blocks body 2, as shown in Figure 2, mat blocks the face that connects 112 parts (this blocks body 2 and is shaped as various configuration) that body 2 covers pin 11, and the body 2 that blocks of each pin 11 is the setting of interleaved positional alignment shape, as shown in Figure 2, connect face 112 and also form the interleaved ordered state so that respectively block body 2 adjacent outer dewiness, the high-density pin 11 of promptly forming the present invention by this has the face that connects 112 structures of staggered outer dewiness arrangement, so that pin 11 high density settings and prevent that scolding tin is infected with mutually.
As mentioned above, these pin 11 bottom surfaces are provided with blocks body 2 to form the face that connects 112 that staggered outer dewiness is arranged, wherein, pin 11 structures are not exceeded with rectangular block shape, as Fig. 3, shown in Figure 4, can be in the block pin 11 and outer end or the inner concave step surface 113a of formation, 113b, with this concave step surface 113a, 113b connects for the plain conductor 5 that wafer 3 extends, and just in concave step surface 113a, the 113b adjacent forms a projection 114a, one of 114b and bottom surface thereof connects face 112, be provided with the staggered body 2 that blocks of formation by this and in the face of connecting 112, to form the face that connects 112 that staggered outer dewiness is arranged; Or as shown in Figure 5, this bulk pin 11 can form a concave step surface 113c respectively in the inner and near middle place, to form the face that connects 112 of two isolated projection 114c and bottom surface thereof, the selected respectively by this wherein face that connects 112 of a projection 114 is provided with and covers and constitute the staggered body 2 that blocks, the face that connects 112 of another projection 114 is exposed being the staggered shape of arranging, also can reach the above-mentioned function that prevents that 11 scolding tin of pin are infected with mutually; Therefore, the present invention's pin 11 structures needn't be arrested in specific, and every employing as any structure shape that externally connects a little, all can implement to block the part that body 2 covers according to above-mentioned feature with pin 11 bottoms according to this.
In addition, the present invention connects face 112 formations and at least one mode that blocks body 2 in the pin by this 11 of lead frame 1, be before lead frame 1 mounting wafer 3 or after mounting wafer 3 and the encapsulation, to adopt a kind of dielectric film to paste formation, or constitute in the solid mode of a gelling and to block body 2, or as shown in Figure 6, utilization constitutes the adhesive body 4 of encapsulation at wafer 3 or lead frame 1, make adhesive body 4 extend the face that connects 112 of pin 11, constitute by this and block the structure that body 2 covers the face of connecting 112 parts, and form all the other and connect face 112 and expose and be staggered ordered state; Therefore, everyly be enough to be shaped or paste that the bottom surface of being fixed in pin 11 connects face 112 and the embodiment of a part is covered in insulation, all described by the present inventionly block body 2 structures and staggered row puts contained lid of feature and enforceable state.
Utilize the present invention's insulating matter to block the face that connects 112 a part of structures that body 2 covers lead frame 1 pin 11, be to make all the other connect face 112 to expose and being the staggered shape of arranging, conductive materials such as scolding tin during with the prevention assembling are infected with mutually, so can make lead frame 1 be provided with more intensive and most pin 11, connect for wafer 3 and to use, meet to reach that electronic product now is multi-functional, the demand of high power capacity (high memory capacitance), high transmission rates and exquisitenessization.Especially block the enforcement of body 2 structures and ordered state because of insulating matter of the present invention, it is more convenient, simple and easy not only to implement manufacture than the staggered projection 201 of known pin 20 punching presses, and can avoid adopting the direct punching press difficult technology of projection 201 that is staggered, relative can make die cost, stamped cost reduce, the face of connecting 112 that is staggered is formed in accurate easily enforcement, and be easy to carry out quality management control, therefore, can improve crystal yields and stability.In addition, also can the face of connecting 112 area design are bigger, at any time control according to circuit board contact size and position again and block the magnitude range that body 2 is covered, so can make and expose and the face that connects 112 of the shape that is staggered has more specification elasticity and changes benefit, by this, can be fully and external device such as circuit board be used.
Claims (7)
1, a kind of composition structure of high-density pin, it is to have for the lead frame of wafer mounting with external electrical communication, it is characterized in that: this lead frame has the plural number bulk and is number arranges the pin of putting, this bulk pin have the lower surface as with the face that connects of extraneous electrical communication, the face of connecting of this pin is provided with at least one body that blocks and covers and connect a face part, the body that blocks of each pin is the setting of interleaved positional alignment shape, makes respectively to block the adjacent outer dewiness of the body face that connects and also form the interleaved ordered state; Form pin by this and have the face that the connects structure that staggered outer dewiness is arranged.
2, the composition structure of a kind of high-density pin according to claim 1, it is characterized in that: described pin can form rectangular shape.
3, the composition structure of a kind of high-density pin according to claim 1 is characterized in that: described pin bottom forms at least one concave step surface, forms one of a projection and projection bottom surface in this concave step surface adjacent and connects face.
4, the composition structure of a kind of high-density pin according to claim 1 is characterized in that: the bottom inner edge of described pin and close middle place are formed with a concave step surface respectively, connect face to form one of two projections that are spaced apart and projection bottom surface.
5, the composition structure of a kind of high-density pin according to claim 1 is characterized in that: the described pin wherein face of connecting of a projection is provided with the body that blocks that covers.
6. according to the composition structure of the described a kind of high-density pin of claim 1, it is characterized in that: describedly block body can to paste or put gelling with dielectric film solid or constitute with adhesive body.
7. according to the composition structure of the described a kind of high-density pin of claim 1, it is characterized in that: the described body that blocks can be implemented to constitute before or after lead frame in the wafer mounting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410044204 CN1697173A (en) | 2004-05-12 | 2004-05-12 | Structure of constituting pins in high density |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410044204 CN1697173A (en) | 2004-05-12 | 2004-05-12 | Structure of constituting pins in high density |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1697173A true CN1697173A (en) | 2005-11-16 |
Family
ID=35349793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410044204 Pending CN1697173A (en) | 2004-05-12 | 2004-05-12 | Structure of constituting pins in high density |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1697173A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102270620A (en) * | 2011-04-08 | 2011-12-07 | 日月光半导体制造股份有限公司 | Semiconductor package structure with groove at edge pin |
| CN102915989A (en) * | 2011-08-05 | 2013-02-06 | 南茂科技股份有限公司 | Chip packaging structure |
| CN103076937A (en) * | 2013-01-30 | 2013-05-01 | 福建科创光电有限公司 | Electrode pin of capacitive touch screen |
-
2004
- 2004-05-12 CN CN 200410044204 patent/CN1697173A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102270620A (en) * | 2011-04-08 | 2011-12-07 | 日月光半导体制造股份有限公司 | Semiconductor package structure with groove at edge pin |
| CN102915989A (en) * | 2011-08-05 | 2013-02-06 | 南茂科技股份有限公司 | Chip packaging structure |
| CN102915989B (en) * | 2011-08-05 | 2015-04-08 | 南茂科技股份有限公司 | Chip packaging structure |
| CN103076937A (en) * | 2013-01-30 | 2013-05-01 | 福建科创光电有限公司 | Electrode pin of capacitive touch screen |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned | ||
| C20 | Patent right or utility model deemed to be abandoned or is abandoned |