CN1696179A - Method for grafting modifying silicone resin - Google Patents
Method for grafting modifying silicone resin Download PDFInfo
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- CN1696179A CN1696179A CN 200510010061 CN200510010061A CN1696179A CN 1696179 A CN1696179 A CN 1696179A CN 200510010061 CN200510010061 CN 200510010061 CN 200510010061 A CN200510010061 A CN 200510010061A CN 1696179 A CN1696179 A CN 1696179A
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- Prior art keywords
- silicone resin
- vinyl
- water
- toluene
- methyl phenyl
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 229920002050 silicone resin Polymers 0.000 title claims description 65
- -1 alkyl chlorosilane Chemical compound 0.000 claims abstract description 41
- 239000000203 mixture Substances 0.000 claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000006243 chemical reaction Methods 0.000 claims abstract description 18
- 239000005046 Chlorosilane Substances 0.000 claims abstract description 8
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 7
- 150000002978 peroxides Chemical class 0.000 claims abstract description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 63
- 239000000178 monomer Substances 0.000 claims description 23
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 23
- 229920002554 vinyl polymer Polymers 0.000 claims description 23
- 239000002904 solvent Substances 0.000 claims description 15
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 238000004821 distillation Methods 0.000 claims description 10
- 230000004048 modification Effects 0.000 claims description 8
- 238000012986 modification Methods 0.000 claims description 8
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 7
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 7
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 7
- 239000003999 initiator Substances 0.000 claims description 7
- 239000000460 chlorine Substances 0.000 claims description 6
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 claims description 6
- OSXYHAQZDCICNX-UHFFFAOYSA-N dichloro(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](Cl)(Cl)C1=CC=CC=C1 OSXYHAQZDCICNX-UHFFFAOYSA-N 0.000 claims description 6
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000005055 methyl trichlorosilane Substances 0.000 claims description 6
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 5
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 claims description 5
- 239000007795 chemical reaction product Substances 0.000 claims description 4
- 239000012153 distilled water Substances 0.000 claims description 4
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 3
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052801 chlorine Inorganic materials 0.000 claims description 3
- 238000006482 condensation reaction Methods 0.000 claims description 3
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 3
- 238000006068 polycondensation reaction Methods 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 3
- 238000006884 silylation reaction Methods 0.000 claims description 3
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 claims description 3
- 239000005050 vinyl trichlorosilane Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 abstract description 10
- 239000011347 resin Substances 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 125000004122 cyclic group Chemical group 0.000 abstract 1
- 230000003301 hydrolyzing effect Effects 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 abstract 1
- 230000004580 weight loss Effects 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 8
- 230000008901 benefit Effects 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000009835 boiling Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- 239000004693 Polybenzimidazole Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229920002480 polybenzimidazole Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229910018557 Si O Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- 229920006387 Vinylite Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Silicon Polymers (AREA)
- Graft Or Block Polymers (AREA)
Abstract
A process for modifying organic silica resin by graft in order to improve its high temp resistance and electromagnetic wave penetrability includes dripping the mixture of alkyl chlorosilane, aryl chlorosilane and vinyl silane coupling agent into the mixture of tulene solution and water, hydrolyzing, polycondensating, vacuum distilling to obtain vinylmethylphenyl silicon resin, adding nano-class cyclic cage-shaped polygonal sesquisiloxane and peroxide as trigger, and graft reaction.
Description
Technical field:
The present invention relates to a kind of modification technology of high molecular polymer.
Background technology:
Development and progress along with rocket and aerospace flight technology, the flight Mach number of aerospace flight vehicle improves constantly, it is more and more higher to be in temperature and thermal shocking that the radome of the pneumatic heating maximum position of aircraft need bear, requirement to space flight electromagnetic wave transparent material resistance to elevated temperatures is more and more higher, and this more closely depends on the research and development of high temperature resistant wave-permeable resin matrix.Therefore, the resistance toheat of raising resin matrix has become the direction of first developing of space flight electromagnetic wave transparent material.The resin matrix of early stage space flight wave-penetrating composite material mainly contains resol, Resins, epoxy, unsaturated polyester, Vinylite, polybutadiene, butadiene styrene resin, allyl ester resin etc., and the use temperature of these resins all is no more than 200 ℃.It is several that the fire resistant resin matrix that uses as the space flight electromagnetic wave transparent material mainly contains polyimide (PI), polybenzimidazole (PBI), polytetrafluoroethylene (PTFE) and silicone resin etc. at present.Wherein, silicone resin has excellent thermo-oxidative stability, this mainly is because silicone resin is to be skeleton with Si-O-Si, the bond energy of C-C key is 307kJ/mol, the bond energy of Si-O key is 450kJ/mol, so the thermostability of silicone resin is very high, can not decompose or variable color at 200～250 ℃ of following life-time service, the short period of time can anti-300 ℃ high temperature.In order to improve the resistance toheat of silicone resin matrix, mainly adopt following 3 kinds of approach at present, promptly change the structure of polysiloxane side group; Change the structure of main chain; Add high temperature filler etc.The structure that changes the polysiloxane side group mainly is to introduce the thermotolerance group on the side chain of polysiloxane, as make the side group etc. that additive, linking agent or introducing contain condensed ring with the silicoorganic compound that contain many phenyl; The method that changes backbone structure has: introduce heat-stable large volume segment or aromatic ring in main chain, synthesize the silicon double-strand polymer or introduce heteroatoms in main chain, as Ti, B, N etc.; Adding the high temperature filler mainly is to adopt some metal oxides to improve the high-temperature stability of silicone resin.These methods can both improve the resistance toheat of silicone resin to a certain extent, but since introduce contain the wave penetrate capability that phenyl compound or metal oxide have all reduced silicone resin.
Summary of the invention:
The objective of the invention is provides a kind of method of grafting modifying silicone resin for solving the problem that the development that can not adapt to rocket and aerospace flight technology that prior art exists is had relatively high expectations to the resistance to elevated temperatures and the wave penetrate capability of material.Method of the present invention has the advantages that technology is simple, flow process is short, productive rate is high, and the silicone resin of graft modification of the present invention has the strong characteristics that reach high heat resistance of stability.The step that the present invention comprises is: one, alkyl chlorosilane, arylchlorosilane and the monomer mixture that contains the silane coupling agent of vinyl are splashed into by dropping funnel in the mixing solutions of toluene and water, be hydrolyzed and polycondensation under 50～80 ℃ of conditions; Two, reaction product is poured in the separating funnel, is left standstill the branch water-yielding stratum, with distilled water rinse solvent layer repeatedly, again with among the NaOH and solvent layer to neutrality obtain vinyl methyl phenyl silicone resin prepolymer; Three, the prepolymer of underpressure distillation vinyl methyl phenyl silicone resin, distilling off solvent toluene at first, be warmed up to 70～80 ℃ then, further condensation reaction, again underpressure distillation when not having water to distill till, adding in the vinyl methyl phenyl silicone resin prepolymer of gained that toluene makes with toluene is the vinyl methyl phenyl silicone resin of solvent; Four, in the vinyl methyl phenyl silicone resin, add the annular lamina nanometer type cage type polytope silsesquioxane (POSS) and the peroxide initiator that contain vinyl and make vinyl methyl phenyl silicone resin and silsesquioxane carry out graft reaction, carry out the silicone resin that underpressure distillation promptly gets the POSS graft modification after the reaction.The monomer mixture of alkyl chlorosilane of the present invention and arylchlorosilane is made up of METHYL TRICHLORO SILANE, dimethyldichlorosilane(DMCS), phenyl-trichloro-silicane and diphenyl dichlorosilane respectively, and each monomeric mass percent is in the monomer mixture: METHYL TRICHLORO SILANE 25～35%, dimethyldichlorosilane(DMCS) 15～25%, phenyl-trichloro-silicane 30～40%, diphenyl dichlorosilane 10～20%.In the mixing solutions of described toluene and water in water and the monomer mixture mol ratio of chlorine be: n (H
2O)/and n (Cl) is in 5: 1～10: 1 scopes, and the consumption of toluene is 50～65wt% of water consumption.The described silane coupling agent that contains vinyl is any in vinyl trichloro silane, vinyltriethoxysilane, 3-methacryloxypropyl trimethoxy silane or the vinyltriacetoxy silane, and its consumption accounts for 2～16% of mix monomer total mass.The described silsesquioxane that contains vinyl is any in eight vinyl silsesquioxanes (OctaVinyl-POSS), vinyl silsesquioxane cage type mixture (Vinyl-POSS Cage Mixture), eight vinyl-dimethyl silylation silsesquioxanes (OctaVinyl dimethylsilyl-POSS) or the prestox acryloxy silsesquioxane (Methacryl-POSS), its consumption be in the graft reaction system vinyl methyl phenyl silicone resin quality 0.5～16%; Described peroxide initiator is any in benzoyl peroxide (BPO), dicumyl peroxide (DCP) or the ditertiary butyl peroxide (DTBP), its consumption be in the graft reaction system all vinyl monomer total masses 1～2%; The temperature of reaction of described step 4 is 60～100 ℃, and the reaction times is 4～6 hours.Polyhedral oligomeric silsesquioxane of the present invention (polyhedral oligomeric_silsesquioxane, be called for short POSS) be a kind of polymkeric substance strongthener that is subjected to extensive concern in recent years in the world, it is the organic/inorganic nano hybrid systems with special microtexture of plurality of advantages, and this makes it have incomparable advantage aspect polymer-modified.POSS can be changed over the monomer that contains different functional groups, its active reactive group can react with multiple polymers, POSS as end-capping reagent or crosslinking curing center, is formed organic/inorganic nano-hybrid polymkeric substance, to satisfy the needs of the various different polymkeric substance of modification.Because organic group is connecting the very strong inorganic molecule of thermotolerance among the POSS, make the polymkeric substance that adds POSS under the degradation temperature of general polymerization thing, still can keep original state constant, thereby POSS is very stable under hot conditions; Simultaneously because POSS has special cage structure, the mineral filler that its molecular weight and molecular dimension are all more general is big, make it to have the ability of control backbone motion, its introducing will hinder the motion of polymer segment greatly, so it can make the use temperature of nearly all thermoplasticity and thermosetting polymer increase.In addition, this material structure contains uniform nano level hole, has good low-k, pure POSS nano molecular specific inductivity only is 2.1～2.7 (10GHz, 20 ℃), and the specific inductivity of silicone resin is 2.8～2.9 (10GHz, 20 ℃), the POSS monomer is incorporated in the silicone resin, can effectively reduces the specific inductivity of silicone resin.So adopt the monomer modified silicone resin of POSS can under the prerequisite that does not influence its wave penetrate capability, prepare the better modified silicone resin of resistance toheat.Method of the present invention has the advantage that technology is simple, flow process is short, productive rate is high, the silicone resin of graft modification of the present invention has the strong advantage that reaches high heat resistance of stability, can adapt to the requirement of the development of rocket and aerospace flight technology to material resistance to elevated temperatures and wave penetrate capability.
Embodiment:
Embodiment one: the step of present embodiment is: one, alkyl chlorosilane, arylchlorosilane and the monomer mixture that contains the silane coupling agent of vinyl are splashed into by dropping funnel in the mixing solutions of toluene and water, be hydrolyzed and polycondensation under 50～80 ℃ of conditions; Two, reaction product is poured in the separating funnel, is left standstill the branch water-yielding stratum, with distilled water rinse solvent layer repeatedly, again with among the NaOH and solvent layer to neutrality obtain vinyl methyl phenyl silicone resin prepolymer; Three, the prepolymer of underpressure distillation vinyl methyl phenyl silicone resin, distilling off solvent toluene at first, be warmed up to 70～80 ℃ then, further condensation reaction, again underpressure distillation when not having water to distill till, adding in the vinyl methyl phenyl silicone resin prepolymer of gained that toluene makes with toluene is the vinyl methyl phenyl silicone resin of solvent; Four, in the vinyl methyl phenyl silicone resin, add the annular lamina nanometer type cage type polytope silsesquioxane and the peroxide initiator that contain vinyl and make vinyl methyl phenyl silicone resin and silsesquioxane carry out graft reaction, carry out the silicone resin that underpressure distillation promptly gets (POSS) graft modification after the reaction.The monomer mixture of described alkyl chlorosilane and arylchlorosilane is made up of METHYL TRICHLORO SILANE, dimethyldichlorosilane(DMCS), phenyl-trichloro-silicane and diphenyl dichlorosilane respectively, and each monomeric mass percent is in the monomer mixture: METHYL TRICHLORO SILANE 25～35%, dimethyldichlorosilane(DMCS) 15～25%, phenyl-trichloro-silicane 30～40%, diphenyl dichlorosilane 10～20%.In the mixing solutions of described toluene and water in water and the monomer mixture mol ratio of chlorine be: n (H
2O)/and n (Cl) is in 5: 1～10: 1 scopes, and the consumption of toluene is 50～65wt% of water consumption.The described silane coupling agent that contains vinyl is any in vinyl trichloro silane, vinyltriethoxysilane, 3-methacryloxypropyl trimethoxy silane or the vinyltriacetoxy silane, and its consumption accounts for 2～16% of mix monomer total mass.The described silsesquioxane that contains vinyl is any in eight vinyl silsesquioxanes (OctaVinyl-POSS), vinyl silsesquioxane cage type mixture (Vinyl-POSS Cage Mixture), eight vinyl-dimethyl silylation silsesquioxanes (OctaVinyl dimethylsilyl-POSS) or the prestox acryloxy silsesquioxane (Methacryl-POSS), its consumption be in the graft reaction system vinyl methyl phenyl silicone resin quality 0.5～16%; Described peroxide initiator is any in benzoyl peroxide (BPO), dicumyl peroxide (DCP) or the ditertiary butyl peroxide (DTBP), its consumption be in the graft reaction system all vinyl monomer total masses 1～2%; The temperature of reaction of described step 4 is 60～100 ℃, and the reaction times is 4～6 hours.
Embodiment two: the step of present embodiment is: the four-hole boiling flask that, the 250ml of agitator, dropping funnel, reflux condensing tube and thermometer will be housed places water-bath, adds 100g water, 65g toluene in four-hole boiling flask, stirs; Two, in dropping funnel, add 8g Ph
2SiCl
2, 18g PhSiCl
3, 9g (CH
3)
2SiCl
2, 15g (CH
3) SiCl
3, these several monomers are mixed; Three, four-hole boiling flask is warming up to 50 ℃, begins to drip monomeric mixture, controlled temperature dropwised with 1 hour between 50～70 ℃; Four, dropwise the back and continue to stir 30min; Five, reaction product being poured in the separating funnel, left standstill the branch water-yielding stratum, with 60 ℃ of distilled water washing solvent layers 4 times, is among the NaOH of 20～40wt% with 0.01～0.05ml concentration and solvent layer obtains the prepolymer of silicone resin to neutrality then; Six, underpressure distillation silicone resin prepolymer, the vacuum tightness of system is at 9～11mmHg; Seven, distilling off solvent toluene and water under 70-80 ℃ of condition make the further condensation of resin prepolymer, obtain methyl phenyl silicone resin, add mass concentration per-cent that toluene is made into methyl phenyl silicone resin again and be 80% solution.The initial heat decomposition temperature of present embodiment synthetic silicone resin in air atmosphere is 415 ℃, and rate of weight loss was 22% when rate of weight loss was 16%, 700 ℃ when rate of weight loss was 11%, 600 ℃ in the time of 500 ℃.
Embodiment three: the difference of present embodiment and embodiment two is that the monomer of adding is 8g Ph
2SiCl
2, 18g PhSiCl
3, 9g (CH
3)
2SiCl
2, 15g (CH
3) SiCl
3, 4gKH-570, other steps are identical with embodiment two.The present embodiment synthetic is the methyl phenyl silicone resin that contains vinyl, and the initial heat decomposition temperature in air atmosphere is 400 ℃, and rate of weight loss was 23.5% when rate of weight loss was 19.5%, 700 ℃ when rate of weight loss was 15%, 600 ℃ in the time of 500 ℃.
Embodiment four: the silicone resin of embodiment three preparations is carried out graft modification with the polyhedral oligomeric silsesquioxane that contains vinyl.With prestox acryloxy silsesquioxane (Methacryl-POSS) is properties-correcting agent, benzoyl peroxide (BPO) is an initiator, its quality proportioning is: 20g silicone resin, 0.4gMethacryl-POSS, 0.03gBPO, by Methacryl-POSS and vinyl methyl phenyl silicone resin graft reaction modified organic silicone resin, control reaction temperature is at 60 ℃～100 ℃, reacted 5 hours, and made the Methacryl-POSS modified organic silicone resin.The initial heat decomposition temperature of present embodiment synthetic POSS modified organic silicone resin in air atmosphere is 475 ℃, and rate of weight loss was 17% when rate of weight loss was 12%, 700 ℃ when rate of weight loss was 5%, 600 ℃ in the time of 500 ℃.Embodiment two and three is a prior art, and the initial heat decomposition temperature of its silicone resin in air atmosphere is 400～415 ℃, and rate of weight loss is 22～23.5% in the time of 700 ℃; Embodiment four is a technology of the present invention, and the initial heat decomposition temperature of its silicone resin in air atmosphere is 475 ℃, and the rate of weight loss in the time of 700 ℃ only is 17%.By above contrast as can be seen, the high temperature resistant degree of grafting modifying silicone resin of the present invention has improved at least 60 ℃ than prior art.
Claims (8)
1, a kind of method of grafting modifying silicone resin, it is characterized in that it comprises following steps: one, alkyl chlorosilane, arylchlorosilane and the monomer mixture that contains the silane coupling agent of vinyl are splashed into by dropping funnel in the mixing solutions of toluene and water, under 50～80 ℃ of conditions, be hydrolyzed and polycondensation; Two, reaction product is poured in the separating funnel, is left standstill the branch water-yielding stratum, with distilled water rinse solvent layer repeatedly, again with among the NaOH and solvent layer to neutrality obtain vinyl methyl phenyl silicone resin prepolymer; Three, the prepolymer of underpressure distillation vinyl methyl phenyl silicone resin, distilling off solvent toluene at first, be warmed up to 70～80 ℃ then, further condensation reaction, again underpressure distillation when not having water to distill till, adding in the vinyl methyl phenyl silicone resin prepolymer of gained that toluene makes with toluene is the vinyl methyl phenyl silicone resin of solvent; Four, in the vinyl methyl phenyl silicone resin, add the annular lamina nanometer type cage type polytope silsesquioxane and the peroxide initiator that contain vinyl and make vinyl methyl phenyl silicone resin and silsesquioxane carry out graft reaction, carry out the silicone resin that underpressure distillation promptly gets graft modification after the reaction.
2, the method for a kind of grafting modifying silicone resin according to claim 1, the monomer mixture that it is characterized in that described alkyl chlorosilane, arylchlorosilane is made up of METHYL TRICHLORO SILANE, dimethyldichlorosilane(DMCS), phenyl-trichloro-silicane and diphenyl dichlorosilane, and each monomeric mass percent is in the monomer mixture: METHYL TRICHLORO SILANE 25～35%, dimethyldichlorosilane(DMCS) 15～25%, phenyl-trichloro-silicane 30～40%, diphenyl dichlorosilane 10～20%.
3, the method for a kind of grafting modifying silicone resin according to claim 1 is characterized in that in the mixing solutions of described toluene and water that the mol ratio of chlorine is in the water and monomer mixture: n (H
2O)/and n (Cl) is in 5: 1～10: 1 scopes, and the consumption of toluene is 50～65wt% of water consumption.
4, the method for a kind of grafting modifying silicone resin according to claim 1, it is characterized in that the described silane coupling agent that contains vinyl is any in vinyl trichloro silane, vinyltriethoxysilane, 3-methacryloxypropyl trimethoxy silane or the vinyltriacetoxy silane, its consumption accounts for 2～16% of mix monomer total mass.
5, the method for a kind of grafting modifying silicone resin according to claim 1, it is characterized in that the described silsesquioxane that contains vinyl is any in eight vinyl silsesquioxanes, vinyl silsesquioxane cage type mixture, eight vinyl-dimethyl silylation silsesquioxanes or the prestox acryloxy silsesquioxane, its consumption be in the graft reaction system vinyl methyl phenyl silicone resin quality 0.5～16%.
6, the method for a kind of grafting modifying silicone resin according to claim 1, it is characterized in that described peroxide initiator is any in benzoyl peroxide, dicumyl peroxide or the ditertiary butyl peroxide, its consumption be in the graft reaction system all vinyl monomer total masses 1～2%.
7, the method for a kind of grafting modifying silicone resin according to claim 1, the temperature of reaction that it is characterized in that described step 4 is 60～100 ℃.
8, the method for a kind of grafting modifying silicone resin according to claim 1, the reaction times that it is characterized in that described step 4 is 4～6 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100100617A CN1320035C (en) | 2005-06-03 | 2005-06-03 | Method for grafting modifying silicone resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100100617A CN1320035C (en) | 2005-06-03 | 2005-06-03 | Method for grafting modifying silicone resin |
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| Publication Number | Publication Date |
|---|---|
| CN1696179A true CN1696179A (en) | 2005-11-16 |
| CN1320035C CN1320035C (en) | 2007-06-06 |
Family
ID=35349085
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100100617A Expired - Fee Related CN1320035C (en) | 2005-06-03 | 2005-06-03 | Method for grafting modifying silicone resin |
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| Country | Link |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102516774A (en) * | 2011-12-07 | 2012-06-27 | 中国科学院过程工程研究所 | Preparation method of modified silicon resin matrix and application of the modified silicon resin matrix |
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| CN107366159A (en) * | 2017-08-29 | 2017-11-21 | 中国科学院长春应用化学研究所 | A kind of preparation method polymer-modified POSS |
| CN113105862A (en) * | 2021-05-25 | 2021-07-13 | 哈尔滨工业大学 | Preparation method of heat-resistant organic silicon pressure-sensitive adhesive |
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Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2697680B2 (en) * | 1995-05-31 | 1998-01-14 | 日本電気株式会社 | Silicon-containing polymer compound and photosensitive resin composition |
| JP5362160B2 (en) * | 1999-08-04 | 2013-12-11 | ハイブリッド・プラスチックス・インコーポレイテッド | Method for forming polyhedral oligomeric silsesquioxane |
| US6100417A (en) * | 1999-08-31 | 2000-08-08 | The United States Of America As Represented By The Secretary Of The Air Force | Functionalizing olefin bearing silsesquioxanes |
| TWI338701B (en) * | 2002-09-30 | 2011-03-11 | Nippon Steel Chemical Co | Cage-type silsesquioxanes resin cotaining functional group and manufacture method thereof |
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| CN102516774A (en) * | 2011-12-07 | 2012-06-27 | 中国科学院过程工程研究所 | Preparation method of modified silicon resin matrix and application of the modified silicon resin matrix |
| CN102627769A (en) * | 2012-03-15 | 2012-08-08 | 中国科学院化学研究所 | Room temperature curing ultrahigh temperature-resistant adhesive, liquid silicon resin dedicated for the room temperature curing ultrahigh temperature-resistant adhesive and their preparation methods |
| CN102627769B (en) * | 2012-03-15 | 2014-01-29 | 中国科学院化学研究所 | Room temperature curing ultrahigh temperature-resistant adhesive, liquid silicon resin dedicated for the room temperature curing ultrahigh temperature-resistant adhesive and their preparation methods |
| CN103275617A (en) * | 2013-05-17 | 2013-09-04 | 涌奇材料技术（上海）有限公司 | Preparation method and application of organosilicon photo-diffusion particle |
| CN103275617B (en) * | 2013-05-17 | 2016-03-02 | 涌奇材料技术（上海）有限公司 | The preparation method of organosilicon photo-diffusion particle and application thereof |
| CN104193995A (en) * | 2014-08-20 | 2014-12-10 | 江西省科学院应用化学研究所 | Organic silicon packaging material for 3D printing devices and preparation method thereof |
| CN104193995B (en) * | 2014-08-20 | 2016-06-29 | 江西省科学院应用化学研究所 | A kind of organosilicon encapsulating material for 3D printing equipment and preparation method |
| CN107366159A (en) * | 2017-08-29 | 2017-11-21 | 中国科学院长春应用化学研究所 | A kind of preparation method polymer-modified POSS |
| CN113105862A (en) * | 2021-05-25 | 2021-07-13 | 哈尔滨工业大学 | Preparation method of heat-resistant organic silicon pressure-sensitive adhesive |
| CN113105862B (en) * | 2021-05-25 | 2022-07-15 | 哈尔滨工业大学 | Preparation method of heat-resistant organic silicon pressure-sensitive adhesive |
| CN115160901A (en) * | 2022-07-06 | 2022-10-11 | 海利得新材料研究(上海)有限公司 | Cigarette end burning resistant UV coating and preparation method thereof, cigarette end burning resistant UV coating and preparation method thereof |
| CN115160901B (en) * | 2022-07-06 | 2024-06-21 | 海利得新材料研究(上海)有限公司 | Cigarette end scalding resistant UV coating and preparation method thereof, and cigarette end scalding resistant UV coating and preparation method thereof |
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