CN1692389A - Pixel control element selection transfer method, pixel control element mounting device used for pixel control element selection transfer method, wiring formation method after pixel control element tra - Google Patents
Pixel control element selection transfer method, pixel control element mounting device used for pixel control element selection transfer method, wiring formation method after pixel control element tra Download PDFInfo
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- CN1692389A CN1692389A CN 200380100722 CN200380100722A CN1692389A CN 1692389 A CN1692389 A CN 1692389A CN 200380100722 CN200380100722 CN 200380100722 CN 200380100722 A CN200380100722 A CN 200380100722A CN 1692389 A CN1692389 A CN 1692389A
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Abstract
There is provided a method for selectively transferring pixel control devices onto a planar display substrate, which method enables prepared pixel control devices to be easily, reliably and inexpensively mounted without inducing any loss of pixel control devices. The pixel control devices ( 1 ) are formed in a large number at pitches ( 5, 6 ) obtained respectively by dividing pitches ( 105, 106 ) on the planar display substrate ( 100 ) by natural numbers. The pixel control devices corresponding to the number of the pitches ( 105, 106 ) on the planar display substrate ( 100 ) are picked up, retained on a transparent thermoplastic resin film ( 101 ) formed on the planar display substrate ( 100 ) utilizing the plastic deformation of the film and fixed at the peripheries thereof with a transparent ultraviolet curing resin film ( 104 ).
Description
[technical field]
The present invention relates on the flat-panel screens substrate of LCD and OLED display etc., be formed with the selection printing transferring method of selecting the pixel control element of transfer printing in the substrate of pixel control element of a plurality of thin film transistor (TFT)s etc. from it in advance, Wiring method after the pixel control element transfer printing, the erecting device of the pixel control element that in the selection printing transferring method of pixel control element, uses, and the flat-panel screens substrate, particularly pixel control element is the selection printing transferring method of the pixel control element under the situation of pixel control element of a plurality of pixels of control, the erecting device of the pixel control element that in the selection printing transferring method of pixel control element, uses, Wiring method after the pixel control element transfer printing, and flat-panel screens substrate.
[background technology]
With LCD and OLED display is that the display of representative is to go up with (CVD methods: Chemical VaporDeposition) sequential aggradation dielectric film, semiconductor film etc. such as chemical vapour deposition techniques at glass substrate (being also referred to as the 1st substrate or array substrate), through and make the identical operation of SIC (semiconductor integrated circuit), near each pixel that constitutes picture, form the small electron device of thin film transistor (TFT) (TFT:Thin FilmTransistor) etc.Open and close by controlling each pixel with this small electron device, deep or light etc. constitute displayed image.On the glass substrate that just in fact in flat-panel screens, uses, directly make the active electronic device of TFT etc.,, display area is strengthened, have following problem in order to tackle the needs that develop to big picture recently.
The first, along with the increasing of flat-panel screens, the manufacturing installation of making the CVD device etc. of small electron device on the flat-panel screens substrate also must become big.In addition, because small electronics element manufacturing operation is many, the manufacturing installation of above-mentioned increasing needs many, and also necessary increasing the in decontamination chamber of these devices is set.Its result becomes the predicament that is difficult to reduce manufacturing cost.
The second, amorphous silicon (a-Si) film of making because being used in deposit film in about 300 ℃ the low temperature that glass substrate can bear etc. is used as semiconductor film and uses, so to compare performance poor with the semi-conductor electronic device that uses crystalline silicon.For head it off, for example also studied with laser radiation the a-Si film fusion of deposition has been formed poly-silicon (poly-Si), utilize poly-silicon (poly-Si) film to make the big TFT of mobility, with the mobility that improves TFT, improve its performance.Particularly, it is generally acknowledged and utilizing to flow through the electric current of controlling each pixel respectively to come in the display of luminous organic EL that the holding function of a-Si TFT is insufficient, also expects to expand to lf poly-Si film on this aspect., because the cost of manufacture height of lf poly-Si film, prerequisite is only to use in limited scope.In addition, with regard to a-Si TFT, when the picture diagonal-size more than 40 inches, the degree of difficulty and the process cost of the deposition of a-Si film and graph transfer printing operation subsequently etc. all will increase.
The 3rd, be in using with the display of glass plate as substrate, picture dimension is 40 inches down to 100 inches words, owing to increase for the intensity that keeps glass substrate will make thickness of slab, so the display equipment overall weight increases, and, must make apparatus structure become big for it stably is provided with, its needed cost also increases simultaneously.
As solution to the problems described above, disclose small electron devices such as on other substrates that are not glass substrate, making a large amount of TFT in advance, it has been installed in the technology (for example with reference to non-patent literature 1, patent documentation 1, patent documentation 2) of assigned position on the glass substrate.
Non-patent literature 1
Anne Chiang, " Application of Fluidic Self Assembly TM Technologyto Flat Panel Displays ", the pre-original text collection of IDW ' OO, ITE, put down on November 29th, 12, p.195-198 at SID distribution
The mode of this pattern on making pixel control element (small electron device) the embedding flat-panel screens substrate is disclosed in non-patent literature 1, a large amount of pixel control elements of making flow into the method for installing with liquid in other places in advance., for the amount of the pixel control element that flows into liquid, because it is low, impracticable to flow into the ratio of the pixel control element in the model on the display substrate smoothly.Further, owing to will flow into display substrate to the pixel control element of Duoing, must reclaim the unnecessary pixel control element of not configuration than the ratio of expecting.In addition, when flowing into and when reclaiming redundance, because pixel control element directly moves on display substrate, so worry the damage display substrate with liquid.
On the other hand, the method that pixel control element is bumped into display depression position is disclosed in patent documentation 1, with be associated at the on-chip arrangement position of flat-panel screens, on silicon chip, form pixel control element, selection transfer position in display substrate forms the depression position that pixel control element (small electron device) is bumped into, on the display substrate the pixel control element group aligned position of silicon chip after, carry out the ultraviolet ray irradiation, the pixel control element of transfer printing and the bonding force of the bonding agent between other substrate are wanted in reduction selectively, and pixel control element is bumped into display depression position.In addition, also disclose in depression position formation bond layer, the method for fixed pixel control element.
, for pixel control element being bumped into the depression position, the depression position of formation is bigger slightly than pixel control element, and according to varying in size of it, pixel control element produces skew in the depression position, and it is difficult that follow-up cloth line procedures becomes.In order to prevent this point, the size difference at pixel control element and depression position is reduced, might cause pixel control element to tilt to be bumped into situation because of offset slightly.Therefore, the position of must caving in very accurately forms and the position of pixel control element is determined, but this is unpractical.In addition, form under the situation that bond layer fixes, when making pixel control element be bonded on the bond layer,, also can have near the danger of other pixel control elements bonding even on bond layer, produce small oozing out at the depression position.Therefore, must apply the very bonding agent of trace, and must be coated to very correct position, this just becomes the quite high reason of cost.
As mentioned above, in non-patent literature 1, not only having problems aspect the success ratio of configuration pixel control element on display substrate, and must remove and reclaim the not unnecessary pixel control element of configuration, like this, this method is not to reduce the method for manufacturing cost.In addition, when removing and reclaiming unnecessary pixel control element, worrying can the damage display substrate.
On the other hand, in the method for patent documentation 1, because pixel control element is different with the size at depression position, pixel control element may produce skew in the depression position, or tilts to be bumped at the depression position, in order to prevent this point, caving in very accurately, the position is shaped and the position of pixel control element is determined, difference according to circumstances simultaneously must be confirmed to reduce cost the degree of offset one by one.And, form under the situation of adhesive linkage at the depression position, ooze out in order to prevent bond layer, necessary High Accuracy Control coating amount and coating position, this also is the high reason of cost.In addition, utilize the ultraviolet ray irradiation, when the bonding force of the pixel control element of transfer printing and the bonding agent between other substrate is wanted in reduction selectively, owing to be difficult to make the ultraviolet wire harness to use the shape identical to shine, in fact can shine with the beam diameter bigger than pixel control element with pixel control element.In this case, make and become from little by little reduction of periphery with selecteed pixel control element bonding force contiguous, that do not have selecteed pixel control element, particularly in the pixel control element after selecting sequence is leaned on, select front attachment power to be weakened, becoming the reason that mistaken the confounding of the configuration of unselected pixel control element caused offset and peeled off.In patent documentation 1, owing to be to carry out ultraviolet ray irradiation under the downward state of whole pixel control elements making, like this, pixel control element has the danger of peeling off just to become important problem during transfer printing.
In addition; in the pixel control element of a plurality of pixels of control; after being installed in this pixel control element on the flat-panel screens substrate; also the wiring to this pixel control element is carried out in hope effectively; and existing wiring method is that wiring material is carried out thin film deposition on whole substrate; with photoetching process it is carried out graph transfer printing, etch wiring material film, the manufacturing process of the complexity of the high price of removal diaphragm etc.
In addition, in the LCD of Active Matrix LCD At, pixel (pixel electrode) and pixel control element (TFT) generally are configured in wiring in length and breadth one by one, and (wiring of longitudinal direction is a source wiring, the wiring of transverse direction is a wiring) crossover sites, TFT be mostly control 1 pixel on-off element.Because the wiring portion in the display becomes the shading position, it is limited that the many words in wiring position want to improve the bore ratio.Therefore, as shown in figure 38, be configured to 4 thin-film transistor elements 12 in the patent documentation 2 in these 4 pixels of central intensive control of 4 pixels of matrix pattern.Can think that this is the set (it being called " element group 13 " in patent documentation 2) of 4 pixels around 4 thin-film transistor elements 12 are controlled respectively., concentrate in the central authorities of matrix pattern to enter,, can only think control and pixel control element adjacent pixels (or pixel electrode) from the viewpoint of the shared property of wiring etc.In addition, in the method for patent documentation 2, because with 2 pel spacings configuration element, the shading position at wiring position enters in 2 pel spacings.In this case because RG, BR, GB, RG ... per 2 kinds of colors separately have problems on the generation color.Hope with the form of 3 kinds of colors gathering RGB separately but produces the colour mixture of neighbor in patent documentation 2, also can be influential to contrast.
So, the object of the present invention is to provide in the flat-panel screens of LCD and OLED display etc. and do not produce offset, easily, the selection printing transferring method of the selection transfer printing pixel control element of a plurality of pixels is controlled on correct and low price ground, and the erecting device that the selection printing transferring method that uses pixel control element is provided, provide the Wiring method after the pixel control element transfer printing that effectively to connect up to above-mentioned pixel control element with low-cost method, area and the color of generation and the flat-panel screens substrate of excellent contrast at the shading position that providing reduces to connect up when can reduce wiring number (saving wiring) causes.
[summary of the invention]
The described pixel control element of claim 1 of the present invention is selected printing transferring method, control the pixel control element transfer printing of a plurality of pixels in the on-chip pixel control element printing transferring method of flat-panel screens at handle, it is characterized in that having the pixel control element of a plurality of integrated circuit that form a plurality of pixels of control from the teeth outwards is fixed on operation on the positioning substrate with substrate, be fixed on absorption (pick up) and use on-chip operation on each integrated circuit, cutting off the pixel control element of pixel control element with substrate, transfer printing was in the on-chip operation of flat-panel screens after absorption was adsorbed on adsorbent equipment selectively with on-chip pixel control element; Form a plurality of pixel control elements at above-mentioned formation pixel control element on substrate, make for the 1st direction, become the arrangement pitches of removing the px/m of the pixel control element arrangement pitches px in on-chip the 1st direction of flat-panel screens with natural number m, and, become the arrangement pitches of removing the py/n of the pixel control element arrangement pitches py in on-chip the 2nd direction of flat-panel screens with natural number n for the 2nd direction vertical with the 1st direction; From be transferred to above-mentioned absorption with the on-chip pixel control element selectively only corresponding to the pixel control element absorption of arranging px, py at the on-chip pixel control element of flat-panel screens and be positioned in the adsorbent equipment, transfer printing is on the flat-panel screens substrate.
The described pixel control element of claim 2 of the present invention is selected printing transferring method, it is characterized in that, the pixel control element transfer printing of controlling a plurality of pixels with an integrated circuit on the flat-panel screens substrate time, have the pixel control element that a plurality of integrated circuit of a plurality of pixels are controlled in formation from the teeth outwards and be fixed on operation on the positioning substrate with substrate, be fixed on the on-chip operation of absorption on each integrated circuit, cutting off the pixel control element of pixel control element with substrate, transfer printing was in the on-chip operation of flat-panel screens after absorption was adsorbed on adsorbent equipment selectively with on-chip pixel control element; Form a plurality of pixel control elements at above-mentioned formation pixel control element on substrate, make for the 1st direction, become the arrangement pitches of removing the px/m of the pixel control element arrangement pitches px in on-chip the 1st direction of flat-panel screens with natural number m, and, become the arrangement pitches of removing the py/n of the pixel control element arrangement pitches py in on-chip the 2nd direction of flat-panel screens with natural number n for the 2nd direction vertical with the 1st direction; Arrangement pitches with px forms the vacuum suction cave of blocking pixel control element on the direction of above-mentioned the 1st direction of correspondence in adsorbent equipment, and the arrangement pitches with py forms the vacuum suction cave of blocking pixel control element on the direction of above-mentioned the 2nd direction of correspondence; From be transferred to above-mentioned absorption with the on-chip pixel control element selectively only corresponding to the pixel control element absorption of arranging px, py at the on-chip pixel control element of flat-panel screens and be positioned in the adsorbent equipment, transfer printing is on the flat-panel screens substrate.In addition, the described pixel control element of claim 3 of the present invention is selected printing transferring method, it is characterized in that, the pixel control element transfer printing of controlling a plurality of pixels with an integrated circuit on the flat-panel screens substrate time, have the pixel control element that a plurality of integrated circuit of a plurality of pixels are controlled in formation from the teeth outwards and be fixed on operation on the positioning substrate with substrate, be fixed on the on-chip operation of absorption on each integrated circuit, cutting off the pixel control element of pixel control element with substrate, transfer printing is in the on-chip operation of flat-panel screens after being adsorbed on absorption on the adsorbent equipment selectively with on-chip pixel control element; Form a plurality of pixel control elements at above-mentioned formation pixel control element on substrate, make for the 1st direction, become the arrangement pitches of removing the px/m of the pixel control element arrangement pitches px in on-chip the 1st direction of flat-panel screens with natural number m, and, become the arrangement pitches of removing the py/n of the pixel control element arrangement pitches py in on-chip the 2nd direction of flat-panel screens with natural number n for the 2nd direction vertical with the 1st direction; Dispose settle above-mentioned absorption with the pixel control element platform of substrate, settle the chip bench of flat-panel screens substrate and have adsorbent equipment, the X-axis governor motion that makes the adsorbent equipment aligned position, Y-axis governor motion and the Z axle governor motion of the vacuum cup (chuck) in formation vacuum suction cave; Two platforms of above-mentioned pixel control element platform and chip bench have the rotational angle governor motion respectively; Utilization forms the erecting device that adsorbs the cave and form the absorption cave with the arrangement pitches of py on the direction of above-mentioned the 2nd direction of correspondence at the arrangement pitches with px on the direction of above-mentioned the 1st direction of correspondence; From be transferred to above-mentioned absorption with the on-chip pixel control element selectively only corresponding to the pixel control element absorption of arranging px, py at the on-chip pixel control element of flat-panel screens and be positioned in the adsorbent equipment, transfer printing is on the flat-panel screens substrate.In addition, the described pixel control element of claim 4 of the present invention is selected printing transferring method, it is characterized in that, be to be prerequisite with claim 1 each described invention to the claim 3, above-mentioned pixel control element is the pixel control element of 2 row, 6 row being arranged with an integrated circuit that 3 looks * 4 pixels are controlled, at the above-mentioned pixel control element of central transfer printing of 2 row, 6 row.
In claim 1 to the invention of claim 4, because at the arrangement pitches of removing the px/m of the pixel control element arrangement pitches px in on-chip the 1st direction of flat-panel screens on the positioning substrate with usefulness natural number m, and the arrangement pitches formation pixel control element of removing the py/n of the pixel control element arrangement pitches py in on-chip 2nd direction vertical of flat-panel screens with natural number n with the 1st direction, so when on the flat-panel screens substrate, selecting transfer printing, corresponding to arrangement pitches px, py, every natural number m (every m-1) selects on the 1st direction, and every natural number n (every n-1) selects on the 2nd direction.At this moment, if utilize the present invention, owing to use adsorbent equipment to carry out transfer printing,, can prevent to resemble existing patent documentation 1 and make a mistake and confound unselected pixel control element so on adsorbent equipment, only adsorb and locate selecteed pixel control element.
It is to be prerequisite with claim 1 each described invention to the claim 4 that the described pixel control element of claim 5 of the present invention is selected printing transferring method, it is characterized in that, in the operation that the pixel control element that forms a plurality of integrated circuit is fixed on substrate on the positioning substrate, on positioning substrate, make facing down of the integrated circuit that forms pixel control element, be bonded on the face that contacts with the positioning substrate of substrate with pixel control element, the cut-out pixel control element is fixed on absorption with in the on-chip operation with the pixel control element of substrate on each integrated circuit, above-mentioned pixel control element with after substrate pros and cons counter-rotating transfer printing is on adsorbing with substrate, is cut off the pixel control element substrate on each integrated circuit.
Adopt the words of this invention, pixel control element with substrate owing to make the integrated circuit face be transferred to absorption with after on the substrate towards the state on surface, form pixel control element, in being cut into the cut-out operation of given size, can confirm integrated circuit face, easily aligned position from a surperficial side.In addition, identical with the described invention of claim 1, owing under the state that keeps arrangement pitches px, py, making pixel control element absorption and being positioned on the adsorbent equipment, carry out transfer printing so can not confound the arrangement of unselected pixel control element.
It is to be prerequisite with claim 1 each described invention to the claim 4 that the described pixel control element of claim 6 of the present invention is selected printing transferring method, it is characterized in that, in the operation that the pixel control element that forms a plurality of integrated circuit is fixed on substrate on the positioning substrate, on positioning substrate, make facing down of the integrated circuit that forms pixel control element, be bonded on the face that contacts with the positioning substrate of substrate with pixel control element, make the integrated circuit face bonding under the state of positioning substrate one side, and on each integrated circuit, cut off pixel control element and be fixed on the pixel control element of substrate and adsorb with in the on-chip operation, after in each integrated circuit, the pixel control element on the above-mentioned positioning substrate being cut off with substrate, pixel control element with substrate pros and cons counter-rotating transfer printing absorption with substrate on.
If adopt this invention, because the integrated circuit face of pixel control element is formed towards the positioning substrate state, so being used for making pixel control element is the mechanical lapping operation of specific thickness and the cut-out operation that is cut into given size, can prevent that smear metal etc. is attached on the integrated circuit face.In addition, identical with the described invention of claim 1, owing under the state that keeps arrangement pitches px, py, making pixel control element absorption and being positioned on the adsorbent equipment, carry out transfer printing so can not confound the arrangement of unselected pixel control element.
Adopt words of the present invention, above-mentioned positioning substrate and pixel control element with substrate and the pixel control element bonding force with substrate, are set at the bonding force of any difference with the bonding force of substrate and above-mentioned absorption.It can be corresponding to the difference of the confining force that needs in confining force that needs in the operation of carrying out on positioning substrate and the operation of carrying out after absorption is with the substrate transfer printing.
If employing the present invention, above-mentioned positioning substrate and pixel control element with substrate and the pixel control element adhering device with substrate, are set at the adhering device of any difference with the adhering device of substrate and above-mentioned absorption.For example, above-mentioned positioning substrate and pixel control element or with pixel control element with in the adhering device of substrate, the thin slice that utilizes ultraviolet ray that bonding force is changed can be used, the hot thin slice that makes the bonding force change of utilization can be used with substrate and pixel control element or with pixel control element in the adhering device of substrate in above-mentioned absorption.
Adopt this invention, on the flat-panel screens substrate surface, form transparent thermoplastic resin film, utilize the plastic yield of transparent thermoplastic resin film to make the pixel control element location.The transparent thermoplastic resin film close that can produce plastic yield is attached to the bottom surface and the side of pixel control element, compare with the situation that only depends on the bottom surface closely to touch, the effect of friction force can be on the area of wide region more, obtained, the pixel control element location can be made securely.In addition, owing on the face of the absorption pixel control element of adsorbent equipment, apply fluorine resin in advance, can prevent adsorbent equipment and transparent thermoplastic resin film be not fit tightly, transparent thermoplastic resin film surface and pixel control element is made dirty or make a mistake the arrangement etc. of the pixel control element that confounds configuration.
In addition, wish to utilize the location of pixel control element of the plastic yield of above-mentioned transparent thermoplastic resin film, pixel control element on being attracted to adsorbent equipment is when transparent thermoplastic resin film contacts, by with adsorbent equipment to being pressed into air with the absorption affinity reverse direction, push after being configured in pixel control element on the transparent thermoplastic resin film, make transparent thermoplastic resin film distortion, make the pixel control element location.In addition, wish that above-mentioned transparent thermoplastic resin film is transparent thermoplasticity polymeric membrane to be carried out lamination process form on the flat-panel screens substrate.
If adopt this invention, at first be attracted to pixel control element on the adsorbent equipment when transparent thermoplastic resin film contacts, utilize adsorbent equipment to being pressed into air, pixel control element is configured on the transparent thermoplastic resin film with the absorption affinity reverse direction.Just, be pressed for pixel control element being had being pressed into air of adsorbent equipment formation, and be configured on the transparent thermoplastic resin film pixel control element and transparent thermoplastic resin film close applying.In addition, if adopt this invention, pixel control element is configured on the transparent thermoplastic resin film pushes later.The method of pushing can be utilizing press device etc. to push after the heating of transparent thermoplastic resin film, also can be pushing after the press device heating.To be after all pixel control elements configuration is finished, to push whole flat-panel screens substrate together on the opportunity of pushing, to push after also can just disposing the pixel control element of any amount.In addition,, wish transparent thermoplasticity polymeric membrane is carried out lamination process on the flat-panel screens substrate, form transparent thermoplastic resin film from forming the viewpoint of smooth film.
Adopt the words of this invention, pixel control element on the flat-panel screens substrate location after, form transparent ultraviolet hardening resin film, to cover pixel control element surface and display substrate surface, plane, and utilize from the flat-panel screens substrate back and carry out the ultraviolet ray irradiation, be generally transparent flat-panel screens substrate because ultraviolet ray sees through, institute so that the whole transparent ultraviolet hardening resin film except top (with flat-panel screens substrate or the transparent discontiguous face of thermoplastic resin film) of pixel control element harden.After this, after removing the non-sclerous transparent ultraviolet hardening resin film above the pixel control element, form the transparent resin molding of uniform usefulness after UV cured except the peripheral part above the pixel control element, stably form the wiring of above pixel control element, drawing.
In addition, wish claim 1 each described invention to the claim 6, consider from the easy-to-install aspect, be formed for connecting the electrode pad (pad) of signal wire on above-mentioned pixel control element surface, described electrode pad length and width are that the above 500 μ m of 30 μ m are following, thickness is following silicon metal substrate or the polycrystalline silicon substrates of the above 100 μ m of 20 μ m.In addition, consider, more wish to form the diaphragm of the oxide film of the nitride film of silicon or silicon on above-mentioned pixel control element surface from the aspect of protection pixel control element and the circuit that on it, forms.In addition, consider from production efficiency and machining precision aspect, wish that more above-mentioned pixel control element is after silicon metal substrate or polycrystalline silicon substrate surface formation pixel control function, mechanical lapping is carried out at the back side become the thickness below the 100 μ m more than the 20 μ m, after this utilizing sandblast processing or Laser Processing to cut into length and width is the following pixel control elements of the above 500 μ m of 30 μ m.
In addition, in the pixel control element of claim 1 a plurality of pixels of each described control to the claim 6, form wiring by its inside, when on the flat-panel screens substrate, forming wiring on the other hand, wish to utilize screen printing to form, wherein said screen printing has been to use the web plate mask of the compulsory figure corresponding with the linear flat-panel screens wiring that is connected of pixel control element internal wiring and point.Wherein wish for using the metal mask of thin metal foil as the web plate mask.
If adopt this invention, be to be prerequisite with the pixel control element of controlling a plurality of pixels, this pixel control element is between data line, door line and pixel line, and this pixel control element needs the wiring of data line etc. in direction in length and breadth being the center with the pixel control element.Therefore, in pixel control element, form wiring in advance by its inside, this pixel control element with above-mentioned claim 1 to the selection printing transferring method transfer printing of the pixel control element of claim 6, during the wiring of the data line that on the wiring that forms the pixel control element inside by controlling a plurality of pixels and the flat-panel screens substrate that is connected, forms etc., since data line etc. be routed to a wire, can use the web plate mask of formation corresponding to the predetermined pattern of the wiring of data line etc., its result can form the pattern wiring that is connected with above-mentioned pixel control element with the method that direct printing applies wiring material on the flat-panel screens substrate.In this, existing wiring method is that wiring material is carried out thin film deposition on whole substrate, with photoetching process it is carried out graph transfer printing, etch wiring material film, the manufacturing process of the complexity of the high price of removal diaphragm etc.In addition, do not use the above-mentioned web plate mask just can not screen printing.
In addition, the erecting device of the described pixel control element of claim 7, it is the erecting device that carries out claim 1 selection printing transferring method of each described pixel control element to the claim 6, it is characterized in that above-mentioned erecting device is to carry out above-mentioned absorption adsorbed selectively with on-chip pixel control element and be positioned on the adsorbent equipment back transfer printing at the device of the on-chip operation of flat-panel screens; Be provided with settle above-mentioned absorption with the pixel control element objective table of substrate, settle the flat-panel screens substrate the substrate objective table, have the adsorbent equipment of the vacuum cup in formation vacuum suction hole; Two objective tables of above-mentioned pixel control element objective table and substrate objective table have anglec of rotation governor motion respectively; Adsorbent equipment has and utilizes X-axis governor motion, Y-axis governor motion, Z axle governor motion in 3 vertical functions that direction moves freely, arrangement with px on corresponding to the direction of above-mentioned the 1st direction forms adsorption hole, and the arrangement with py forms adsorption hole on corresponding to the direction of above-mentioned the 2nd direction.
If adopt this invention, because the adsorption hole that forms on the pixel control element adsorption site forms with the px arrangement pitches on corresponding to the direction of above-mentioned the 1st direction, and form with the py arrangement pitches on corresponding to the direction of above-mentioned the 2nd direction, so available claim 1 selection printing transferring method of each described pixel control element to the claim 6 is installed pixel control element.
Wiring method after the described pixel control element transfer printing of claim 8 is characterised in that, on the pixel control element of claim 1 a plurality of pixels of each described control to the claim 6, form wiring by its inside, when on the flat-panel screens substrate, forming wiring on the other hand, utilize screen printing to form, wherein said screen printing uses the web plate mask of the compulsory figure corresponding with the linear flat-panel screens wiring that is connected of pixel control element internal wiring and point.Wherein wish to use the metal mask of thin metal foil as the web plate mask.
If adopt this invention, be prerequisite with the pixel control element of controlling a plurality of pixels, this pixel control element is between data line, door line and pixel line, and this pixel control element needs the wiring of data line etc. in direction in length and breadth being the center with the pixel control element.Therefore, in pixel control element, form wiring in advance by its inside, this pixel control element with above-mentioned claim 1 to the selection printing transferring method transfer printing of the pixel control element of claim 7, during the wiring of the data line that on the wiring that forms the pixel control element inside by controlling a plurality of pixels and the flat-panel screens substrate that is connected, forms etc., since data line etc. be routed to a wire, can use the web plate mask of formation corresponding to the predetermined pattern of the wiring of data line etc., its result can form the pattern wiring that is connected with above-mentioned pixel control element with the method for directly printing the coating wiring material on the flat-panel screens substrate.In this, existing wiring method is that wiring material is carried out thin film deposition on whole substrate, with photoetching process it is carried out graph transfer printing, etch wiring material film, the manufacturing process of the complexity of the high price of removal diaphragm etc.In addition, do not use the above-mentioned web plate mask just can not screen printing.
The described flat-panel screens substrate of claim 9 of the present invention be pixel and control this pixel pixel control element in the flat-panel screens substrate that the wiring that is connected them forms, it is characterized in that, pixel is arranged with the capable j row of i, above-mentioned pixel control element is a pixel control element of controlling a plurality of pixels with an integrated circuit, general arrangements is carried out the connection of above-mentioned each pixel in the central authorities of the capable j row of above-mentioned i by the wiring of using common zone.In addition, the described flat-panel screens substrate of claim 10 of the present invention is characterised in that, above-mentioned pixel control element is with above-mentioned printing transferring method transfer printing at claim 1 each described pixel control element to the claim 6.
If adopt this invention, above-mentioned pixel control element is a pixel control element of controlling a plurality of pixels (or pixel electrode) with an integrated circuit, be arranged in the central authorities of the capable j row of above-mentioned i substantially, owing to be connected with each pixel by above-mentioned wiring, so help to reduce wiring number (saving wiring), the area at the shading position of causing of reducing to connect up, improve the bore ratio.Because pixel control element is configured in the central authorities of the capable j row of i, with i * j the pixel words that are a pixel groups, each pixel that is included in the pixel groups is controlled with a pixel control element, become its center, can make that from then on the position is identical to the length of arrangement wire of symmetric position pixel, connect up.
The described display substrate of claim 11 of the present invention is characterised in that, be to be prerequisite with above-mentioned claim 9 or the described invention of claim 10, above-mentioned i is capable, and the j row are that i * j is 3 multiple, above-mentioned pixel control element as one group, is organized 3 pixels of 3 looks with an integrated circuit control more.Adopt this invention, owing to can be controlled with a pixel control element by 3 pixels that constitute of three primary colors (RGB), it is good that color of sending and contrast become.Specifically can consider 2 row, 6 row, 6 row, 2 row, 2 row, 12 row, 4 row, 12 row etc.
The described display substrate of claim 12 of the present invention is characterised in that, be to be prerequisite with above-mentioned claim 9 or the described invention of claim 10, above-mentioned pixel control element is the pixel control element of 2 row, 6 row being arranged with an integrated circuit that 3 looks * 4 pixels are controlled, at the above-mentioned pixel control element of central configuration of 2 row, 6 row.
Adopt this invention, owing to can be controlled with a pixel control element by 3 pixels that constitute of three primary colors (RGB), it is good that color of sending and contrast become.Here, pixel control element also can simply be controlled 3 looks * 4 pixels of the capable j row of i.Specifically can consider 2 row, 12 row, 4 row, 12 row etc.But increasing wiring quantity with pixel quantity also increases, and worries that its bore ratio worsens, and wishes that pixel control element carries out the control of 3 looks * 4 pixels of 2 row, 6 row arrangements with an integrated circuit, at the above-mentioned pixel control element of central configuration of 2 row, 6 row.
The described display substrate of claim 13 of the present invention is characterised in that, be to be prerequisite with above-mentioned claim 9 to each described invention of claim 12, above-mentioned pixel control element is to be transferred at the on-chip pixel control element of flat-panel screens, employing has the manufacture method of following operation, is transferred on the flat-panel screens substrate; The pixel control element of a plurality of integrated circuit that form a plurality of pixels of control from the teeth outwards with substrate be fixed on operation on the positioning substrate, cut off on each integrated circuit the pixel control element of pixel control element with substrate be fixed on adsorb with on-chip operation, adsorb be adsorbed on adsorbent equipment selectively with on-chip pixel control element after transfer printing in the on-chip operation of flat-panel screens.Specifically, wish to make with above-mentioned claim 1 printing transferring method transfer printing pixel control element of each described pixel control element to the claim 6.
Description of drawings
Fig. 1 is the vertical view of expression integrated circuit summary;
Fig. 2 is illustrated in the vertical view that forms the diaphragm state on the integrated circuit;
Fig. 3 is illustrated in the vertical view that forms the integrated circuit state on the silicon chip;
Fig. 4 is the vertical view of flat-panel screens substrate;
Fig. 5 is the vertical view of silicon chip;
Fig. 6 is the sectional view of the mechanical lapping of expression silicon chip;
The sectional view that Fig. 7 puts upside down the silicon chip pros and cons for expression;
Fig. 8 is the sectional view of the silicon chip of pros and cons after putting upside down;
Fig. 9 is the sectional view of the silicon chip of formation pattern;
Figure 10 is the synoptic diagram of sandblast processing;
Figure 11 is the silicon chip sectional view of peeling off behind the photoresist;
Figure 12 is the vertical view of vacuum cup;
Figure 13 is for selecting the synoptic diagram of pixel control element;
Figure 14 is the sectional view of expression absorption pixel control element;
Figure 15 is the sectional view through the flat-panel screens of lamination process thermoplastic resin film;
The synoptic diagram that Figure 16 installs for the remarked pixel control element;
Figure 17 is the sectional view of the flat-panel screens substrate behind the installation pixel control element;
Figure 18 is the sectional view of the flat-panel screens substrate of coating transparent, UV hardening resin film;
Figure 19 is the synoptic diagram of expression ultraviolet ray irradiation;
Figure 20 is the sectional view of the flat-panel screens substrate of a part of ultraviolet hardening resin film of removal;
Figure 21 is the sectional view of the flat-panel screens substrate of formation transparency electrode;
Figure 22 is for forming the sectional view of the flat-panel screens substrate that connects up;
Figure 23 is the vertical view of flat-panel screens substrate;
Figure 24 is the sectional view of LCD;
Figure 25 is the process flow diagram of LCD manufacturing process;
Figure 26 is the sectional view of the silicon chip of formation pattern;
Figure 27 is the synoptic diagram of sandblast processing;
Figure 28 is the silicon chip sectional view of peeling off behind the photoresist;
The synoptic diagram that Figure 29 puts upside down for expression silicon chip pros and cons;
Figure 30 is the sectional view of the silicon chip of pros and cons after putting upside down;
Figure 31 is the erecting device sketch of pixel control element;
The web plate mask example of Figure 32 (a) for the pixel control element example that forms the wiring by inside with when using this pixel control element to form wiring with screen printing, with the vertical view of flat-panel screens substrate diagram relatively, (b) be diagram corresponding to the web plate mask of the wiring of the flat-panel screens substrate of (c);
Figure 33 is the planimetric map of other examples of expression pixel arrangement of the present invention;
Figure 34 is the planimetric map of other examples of expression pixel arrangement of the present invention;
Figure 35 is for comparing content of the present invention and patent documentation 2 synoptic diagram of explanation;
Figure 36 is for comparing content of the present invention and patent documentation 2 synoptic diagram of explanation;
The synoptic diagram that Figure 37 arranges for the configuration pattern and the pixel of expression the application's pixel control element;
The synoptic diagram that Figure 38 arranges for the configuration pattern and the pixel of the existing pixel control element of expression.
Embodiment
With accompanying drawing embodiments of the present invention are described below.
(manufacture method of the flat-panel screens substrate of the 1st embodiment)
(1. liquid crystal display device structure)
Present embodiment is that the manufacture method with flat-panel screens substrate of the present invention is applied to the situation of LCD in making.As shown in figure 24, LCD 200 has the such structure of between flat-panel screens substrate 100 and color light filter substrate 111 holding liquid crystal 112.Form the pixel control element 1 and the transparency electrode (pixel) 102 of rectangular on the flat-panel screens substrate (being also referred to as the 1st substrate and array substrate) 100 that constitutes by plastic substrate by resin molding 101, formation alignment films 110 on it.On the other hand, on color light filter substrate 111, form the colored filter 114 relative, form colored filter usefulness transparency electrode 115 and alignment films 110 on its surface with above-mentioned transparency electrode 102 by anti-solvent layer 113.Pixel control element 1 has a plurality of thin film transistor (TFT)s (TFT:Thin Film Transistor), utilizes a plurality of transparency electrodes 102 of control that the connection of each pixel, disconnection, deep or light etc. controlled.
(the 2. selection printing transferring method of pixel control element)
The LCD 200 of said structure utilizes manufacture method shown in Figure 25 to make.It mainly comprises following operation: be fixed on the operation R1 on the positioning substrate 7 after pixel control element forms the integrated circuit 3 carry out a plurality of pixels controls on substrate 2; Grind the operation R2 of pixel control element with substrate 2; Pixel control element with substrate 2 move on to absorption with the operation R3 on the substrate 9, cut into the operation R4 of pixel control element 1; With adsorbent equipment 51 pixel control element 1 is transferred to operation R5 on the flat-panel screens substrate 100; Form the operation R6 of transparency electrode and wiring; The operation R7 that forms alignment films and rub; The operation R8 of color light filter substrate applying; Inject the operation R9 of liquid crystal.
At first, in above-mentioned operation R1, on silicon metal substrate or polycrystalline silicon substrate (below be called silicon chip) 2, form the integrated circuit 3 that carries out a plurality of pixels controls with substrate 2 as pixel control element.Forming integrated circuit 3 on silicon chip 2 adopts well-known semiconductor fabrication to carry out.Fig. 1 represents an example of this integrated circuit 3.In the integrated circuit 3 of Fig. 1, form 12 electron device 3a that carry out the thin film transistor (TFT) of pixel control.Just utilize an integrated circuit 3, can carry out the control of 3 looks (3 looks of RGB) * 4 pixels.In addition, also be pre-formed and be used to connect the current holding circuit 3b of each pixel and the electrode pad 3c of pixel line 107 equisignal lines.After forming such integrated circuit 3, as shown in Figure 2, the part beyond the electrode pad 3c is piled up silicon nitride film or silicon oxide film 4, protection integrated circuit 3.Wherein, in order to remain on the column direction rectilinearity with the wiring of the pixel of leaving pixel control element 1, implement the wiring (only can connect pixel control element and each pixel reliably) (with reference to Figure 37) of rectilinear row from pixel control element 1 with straight line.12 pixels of 3 looks * 4 pixels also can make its length elongated (with reference to Figure 37) along with the pixel control element 1 that disposes from described wiring crossover location leaves.In addition, other examples as the pixel arrangement, above-mentioned i is capable, and the j row are that i * j is 3 multiple, above-mentioned pixel control element 1 is one group with 3 pixels of 3 looks, with the many groups of an integrated circuit 3 controls, as shown in figure 33, can consider with 8 group (3 pixels with 3 looks are 24 pixels of the integral multiple of one group control 3) of an integrated circuit 3 controls as 2 row, 12 row, or as shown in figure 34, control 8 groups that go as 4 row 6 with an integrated circuit 3, configuration pixel control element 1 in the central is with the pixel control element 1 of a plurality of pixels of an integrated circuit 3 controls, also can be connected with above-mentioned each pixel by the wiring of using common region.Like this, the arrangement of pixel goes for the figure of the pixel arrangement of the capable j row of i.Like this, above-mentioned pixel control element 1 is the pixel control element with an integrated circuit 3 a plurality of pixels of control (or pixel electrode), be arranged in the central authorities of the capable j row of above-mentioned i substantially, owing to be connected with each pixel by above-mentioned wiring, so help to reduce wiring number (saving wiring), the area at the shading position of causing of reducing to connect up, improve the bore ratio.Wherein so-called wiring number is meant the number of the wiring group (being the set of data line 109 or the set of pixel line and door line 108 in the present embodiment) of the cloth wire harness formation that is arranged in line direction or column direction.
As shown in Figure 3, the spacing with standard forms a plurality of integrated circuit shown in Figure 13 on silicon chip 2.As following explanation, the spacing the 5, the 6th of this standard is corresponding to the spacing on the flat-panel screens substrate 100 105,106.Under the situation of carrying out 3 looks * 4 pixels control with an integrated circuit 3, as shown in Figure 4,1 couple the 1st direction X of the pixel control element on flat-panel screens substrate 100 installs with spacing 105, and the 2nd direction Y is installed with spacing 106.Then as shown in Figure 5, be that benchmark is determined in the spacing 5,6 that forms a plurality of integrated circuit 3 on the silicon chip 2 with the spacing 105,106 of the pixel control element on flat-panel screens substrate 100 1, and making and imbedding value therebetween is the individual pixel control element 1 of natural m, n.Just, the spacing 105 of establishing for the 1st direction X in the flat-panel screens substrate 100 is px, and the spacing 106 of establishing equally for the 2nd direction Y is that the spacing 5 of the 1st direction X in silicon chip 2 is px/m under the situation of py, and the spacing of same the 2nd direction Y is py/n.As shown in Figure 6, the face 2a that silicon chip 2 surfaces are just formed integrated circuit 3 is fixed on the positioning substrate 7 with the 1st splicing tape 8.
Then, in operation R2, the face 2b that the back side of silicon chip 2 is not just formed integrated circuit 3 carries out mechanical lapping, makes silicon chip 2 become the film of thickness about 20～100 μ m.The 1st splicing tape 8 can use through predetermined heating and come the hot soarfing of bonding force reduction from band.
Then, in operation R3, silicon chip 2 is transferred to absorption substrate 9.Specifically as shown in Figure 7, with the back side 2b and the absorption substrate 9 of the 2nd splicing tape 10 bonding silicon chips 2,, peel off the 1st splicing tape 8 and positioning substrate 7 by positioning substrate 7 heating the 1st splicing tape 8.Like this silicon chip 2 is transferred to absorption with on the substrate 9 from positioning substrate 7.This moment, the face 2a that forms integrated circuit 3 became a surperficial side as shown in Figure 8.Wherein, select hot soarfing that splicing tape 8,10 makes the 1st splicing tape 8 from temperature than the hot soarfing of the 2nd splicing tape 10 from the low words of temperature, can prevent from the heating of the 1st splicing tape 8 is transmitted to the 2nd splicing tape 10 by silicon chip 2 unfavorable situations such as offset that absorption causes with the bonding force reduction of substrate 9 and silicon chip 2.
In addition, the adhering method of splicing tape 8,10 also can be different, and the method that bonding force is changed also can be different.For example, make the 1st splicing tape 8 be splicing tape with ultraviolet ray irradiation reduction bonding force, make the 2nd splicing tape 10 for hot soarfing from band, utilize for the ultraviolet ray irradiation of peeling off the 1st splicing tape 8 can prevent the bonding force of the 2nd splicing tape 10 and reduce.
After this, in operation R4, on each integrated circuit 3, silicon chip 2 is cut into chip form, form pixel control element 1.Cutting-off method can adopt etching, sandblast processing, Laser Processing, mould processing at quarter etc. to carry out.From the production efficiency aspect, the sandblast processing that powder such as the most suitable employing high speed, high-pressure injection aluminium oxide cut still makes under the situation of the high processing of the form accuracy of pixel control element 1 in hope, is suitable for the Laser Processing that mobile laser cuts.Utilize and use the so-called dry etching of plasma also can process, but because process velocity is slower than additive method, production efficiency is low.In addition, because soup spreads, and the machining precision of pixel control element 1 is poor, carving in the processing at the mould that carries out mechanical cutting in using the wet etching of soup, because the blade that mould is carved causes that pixel control element 1 splashes etc., is disadvantageous aspect yield rate.Therefore, the selection of cutting-off method is important, resembles present embodiment and cuts off like this under the situation of silicon chip 2 of 20～100 μ m left and right thicknesses, is suitable for sandblast processing or Laser Processing.In the present embodiment the example with sandblast processing is described.
Fig. 9, Figure 10 represent the cut-out operation with sandblast processing.Carry out filming and after absorption is with substrate 9 transfer printings, carry out the patterning case of aligned position and pixel control element 1 in the 2 usefulness mechanical lappings of above-mentioned silicon chip, so that can between the integrated circuit 3 that forms on the silicon chip 2, cut off.Patterning case employing lithographic plate photoetching process etc. is carried out.Fig. 9 is the state after the patterning case is carried out in expression with the lithographic plate photoetching process a diagram.Then as shown in figure 10, the photoresist 11 that forms with the patterning case as mask, is carried out sandblast processing.After utilizing sandblast processing to be cut into one by one pixel control element 1, peel off photoresist 11.Figure 11 represents to peel off the situation behind the photoresist 11.
In the stage shown in Figure 11, pixel control element 1 is that the spacing 5 that is arranged at the 1st direction X is the state of py/n for the spacing 6 of px/m, the 2nd direction Y on adsorbing with substrate 9.Among the operation R5 below, absorption is heated under low state of temperature with substrate 9, the bonding force of the 2nd splicing tape 10 is reduced slightly, only adsorb the pixel control element 1 of regulation, pixel control element 1 is configured on the flat-panel screens substrate 100 from the pixel control element 1 of described arrangement.At this moment, before absorption process is finished, also can continue absorption is heated with substrate 9, also can when absorption, only heat near the pixel control element 1 that will adsorb.Heat time heating time and heat are reduced.In addition, use the material that utilizes the ultraviolet ray irradiation to reduce bonding force as the 2nd splicing tape 10, use absorption with seeing through on the substrate 9 under the situation of ultraviolet material, utilize near the only short irradiation ultraviolet beam pixel control element 1 that will adsorb, can reduce the bonding force that makes the 2nd splicing tape 10 and reduce time and the heat (ultraviolet irradiation amount) that needs.
Figure 12 is the vacuum cup 52 that is illustrated in the adsorbent equipment 51 that adsorbs in the operation 5.On the adsorption plane of vacuum cup 52, apply fluorine resin.This fluorine resin has the effect as the parting compound of the transparent heat moldable resin film that forms with described transparent thermoplastic resin film 101 grades in back.The vacuum suction hole 53 of carrying out the absorption (chucking) of pixel control element 1 forms natural number K row at the 1st direction X with the arrangement pitches 55 (px just) identical with pixel control element 1 on the flat-panel screens substrate 100, forms natural number L row with arrangement pitches 56 (py just) too at the 2nd direction Y.Therefore, utilize this vacuum cup 52, once can adsorb K * L to the pixel control element 1 of the spacing 106 of spacing 105 of filling up the 1st direction X on the flat-panel screens substrate 100 and the 2nd direction Y at most, can be transferred on the flat-panel screens substrate 100.
The part that has added oblique line in Figure 13 is illustrated in the 1st direction X with spacing 5 (px/m just), in the 2nd direction Y pixel control element 1 that correct standard is arranged with spacing 6 (py/n just), uses an example of the pixel control element 1 of vacuum cup 52 absorption.Just, because every natural number m (every m-1) selects on the 1st direction, every natural number n (every n-1) selects on the 2nd direction, so select absorption to add the pixel control element 1 at the position of oblique line.Then, next time is when adsorbing, for example use in the substrate 9 in absorption, vacuum cup 52 only is displaced to the words of width px/m at the 1st direction X (among Figure 13 to right), identical when adsorbing with last time, can select to adsorb the right side adjacent pixels control element 1 that is arranged in the pixel control element 1 (Figure 13 has added oblique line) that has adsorbed.Such selection adsorption operations at most can Repeated m * and n time.In addition, Figure 14 represents to use the state of vacuum cup 52 absorption pixel control elements 1.Carry out the selection transfer printing of pixel control element 1 by such one or many, can be transferred to pixel control element 1 on the whole flat-panel screens substrate 100.
Below the method that the pixel control element 1 of absorption is fixed on the flat-panel screens substrate 100 is described.As shown in figure 15, on flat-panel screens 100 surfaces, transparent thermoplastic resin film 101 is carried out lamination process.Also can apply transparent heat moldable resin formation film and replace transparent thermoplastic resin film 101, also can replace transparent thermoplastic resin film 101 with the flat-panel screens substrate 100 that the transparent heat moldable resin is done.As shown in figure 16, before transfer printing pixel control element 1, heating such as such flat-panel screens substrate 100 usefulness well heaters, on the transparent thermoplastic resin film 101 that can suitably produce plastic yield, carry out transfer printing in advance, imbed the pixel control element 1 that is adsorbed.
Perhaps, also can be placed on the pixel control element 1 that is adsorbed on the transparent thermoplastic resin film 101 after, push transfer printing and imbed.Fully do not heated owing to transparent thermoplastic resin film 101 this moment, a little less than the tack of pixel control element 1, attached to the pixel control element on the vacuum cup 52 1 with after transparent thermoplastic resin film 101 contacts, pixel control element 1 is 53 moments that break away from from the vacuum suction hole, and pixel control element 1 position can be departed from slightly sometimes.Therefore, pixel control element 1 is from the vacuum suction hole 53 when breaking away from, apply from the pressurized air in vacuum suction hole 53, the pressure that utilizes this pressurized air to form, pixel control element 1 is placed on the transparent thermoplastic resin film 101, pixel control element 1 and transparent thermoplastic resin film 101 close attachment are so reliably pixel control element 1 53 disengagings from the vacuum suction hole, can prevent the offset on the transparent thermoplastic resin film 101 simultaneously.
The method of pushing is can be when pixel control element 1 configuration back or configuration, 101 heating of transparent thermoplastic resin film, can produce after the plastic yield with press device etc. and push, and pushes after also can heating press device.In addition, can be after all pixel control elements 1 configuration is finished, to push whole flat-panel screens substrate 100 together on the opportunity of pushing (time), push after also can just disposing the pixel control element of any amount (for example being configured in the quantity on the flat-panel screens substrate 100 regulation areas).At this moment, wish residual slightly have vacuum suction hole 53 around, it is identical or thicker with the thickness of pixel control element 1 in advance residual part to be pruned.When for example having adsorbed pixel control element 1 on vacuum suction hole 53, the residual zone that hiding pixel control element 1 is arranged around adsorption hole 53 resembles and residual part is pruned above-mentioned etc.Can prevent that like this pixel control element 1 that has been configured from disturbing vacuum cup 52 (particularly edge) to produce position deviation.In addition, when absorption, can prevent to cause position deviation and damage pixel control element 1 because of vacuum cup 52 disturbs with the pixel control element that is not adsorbed 1 on the substrate 9 (pixel control element 1 that does not dispose just) in absorption.
In addition, as other the method for imbedding pixel control element 1, also can utilize laser radiation etc. to carry out spot heating.In this case, because plastic yield can take place in part, transfer printing pixel control element 1 position, when applying the power of imbedding and coming transfer printing, can prevent to make near transparent thermoplastic resin film 101 distortion the pixel control element 1 of transfer printing and cause position deviation.
In addition as mentioned above, owing to go up the coating fluorine resin, so the transparent heat moldable resin film that is made of transparent thermoplastic resin film 101 is non-cohesive on the adsorption plane of vacuum cup 52 at the face (adsorption plane) of vacuum cup 52 absorption pixel control elements 1.Owing to can correctly and reliably be configured in pixel control element 1 on the transparent thermoplastic resin film 101, therefore do not need on transparent thermoplastic resin film 101, to form in advance the operation of the pit in existing patent documentation 1 and the non-patent literature 1 so in the present invention.Figure 17 is illustrated in the state of imbedding on the transparent heat moldable resin film 101 after pixel control element 1 carries out transfer printing.
As shown in figure 17, after transparent heat moldable resin film 101 is imbedded pixel control element 1 and carried out transfer printing, particularly around pixel control element 1, produce the depressed deformation 103 of transparent heat moldable resin film 101 sometimes.In order to make this depressed deformation 103 smooth and secure fixation pixel control elements 1, as shown in figure 18, in the transfer printing of flat-panel screens substrate 100 coating transparent, UV hardening resin film 104 on the face of pixel control element 1, as shown in figure 19, from select transfer printing the face of an opposite side of pixel control element 1 carry out ultraviolet ray and shine.Because flat-panel screens substrate 100 and transparent thermoplastic resin film 101 see through ultraviolet ray, so transparent, UV hardening resin film 104 sclerosis except not seeing through ultraviolet pixel control element 1 surface.After this, remove non-sclerous transparent, UV hardening resin film 104 on the pixel control element 1.Figure 20 represents to remove the flat-panel screens substrate 100 after the processing.In addition, utilize the material of selecting to bear organic kind solvent processing of after this in LCD 200 assemblings, using as transparent, UV hardening resin film 104, can be from organic kind solvent protection transparent heat moldable resin film 101.
(Wiring method)
With above method, be fixed on pixel control element 1 on the flat-panel screens substrate 100 after, in operation R6, as shown in figure 21, form transparency electrodes (pixel or pixel electrode) 102 on flat-panel screens substrate 100 surface.As Figure 22 and shown in Figure 23, form the wiring of wiring (pixel line) 107, door line 108 and data line 109 etc. between pixel control element 1 and the transparency electrode 102 then.
In the present embodiment, use the pixel control element 1 of a plurality of pixels of control and the wiring of door line 108, data line 109, pixel line 107 etc. the printing coating methods such as screen printing of web plate mask MM to form figure.Shown in Figure 32 (a), in the pixel control element 1 of a plurality of pixels of control, form wiring D9, P7 by its inside, G8 (just can with the data line 109 maintenance linearities of longitudinal direction) with the structure of multilayer.Just, be pre-formed wiring D9, P7, the G8 of wirings such as connecting door line 108, data line 109, pixel line 107.On the other hand, metal mask and grid mask are arranged as web plate mask MM, with what can, wish to use metal mask MM according to the reason of narrating later.Figure 32 (b) is the example that the web plate mask MM of metal mask MM is used in expression, and the metal mask MM of metal forming goes up hole MD9, MP7, the MG8 that forms corresponding to the linear predetermined pattern of point (forming the pattern of slit in length and breadth) of pixel line 107, door line 108, data line 109.The screen printing of present embodiment is gone up perforate as metal mask MM at the pattern part (pattern) of thickness 20 μ m left and right sides metal formings, and from then on part applies printing ink (wiring material).Wherein, symbol M D9 is the pattern corresponding to the data line 109 of the flat-panel screens 100 of Figure 32 (c), and symbol M P7 is the pattern corresponding to pixel line 107 equally, and symbol M G8 is the pattern to the line 108 of answering the door equally.The pixel control element 1 of controlling a plurality of pixels is positioned at predetermined pattern MD9, MP7 in length and breadth, the middle position MS of MG8.Entire image for above-mentioned pixel control element 1 control gate line 108 and data line 109 etc., employing is arranged on the words of the structure of part wiring pixel control element 1 inside by being arranged on a plurality of pixels of control on the whole image on the whole image, when pattern wiring is carried out in the wiring of stating web plate mask MM opposite house line 108 and data line 109 etc. in the use, can form and resemble the MD9 that above-mentioned web plate mask MM is divided into each tiny area in length and breadth the predetermined pattern, MP7, MG8, use the above-mentioned web plate mask MM that forms them, on flat-panel screens substrate 100, can form the wiring of a line 108 grades simultaneously.Wiring in the available liquid crystal display is to accompany a TFT between the wiring of straight extension in length and breadth in this, and the signal wire (data line and door line) that sends signal to each pixel almost is linked to be a straight line in length and breadth, and the processing of metal mask itself is impossible.In addition; this wiring method becomes wiring material is deposited on the whole flat-panel screens substrate and forms film; by utilizing the lithographic plate photoetching process that it is carried out pattern transfer, etch wiring material film then, the manufacturing process of complexity of removing the high price of diaphragm or the like.In addition, in the present embodiment, on-chip wiring is owing to becoming the dotted line pattern (interrupted pattern) that the above-mentioned pixel control element 1 of whole usefulness separates, so can form whole wirings with above-mentioned method.But, also can use the formation method identical with existing method to be formed in length and breadth the major part (straight line portion) of the wiring such as door line 108 grades of wiring in advance, only forming above-mentioned with the wiring method of attachment of present embodiment is the coupling part at center with above-mentioned pixel control element 1.
In the present embodiment, for the linear central part of point between the wiring of above-mentioned pixel control element 1 is packed into data line 109 and door line 108 etc., owing to utilize the screen printing of metal mask MM, can on flat-panel screens substrate 100, directly print the coating wiring material and form all effectively good wiring pattern, so production efficiency increases substantially.But the reason of using metal mask MM is because in the method for using the web plate mesh, the fine rule of printing width 10～20 μ m is a boundary, and LCD signal wire present situation is to be generally about 10 μ m, is difficult to use.In contrast, in the method for the metal mask MM that uses screen printing, can directly print the following fine rule of 10 μ m, compared with prior art have the advantage that to implement to low price wiring.
Then, in operation R7, as shown in figure 24, on flat-panel screens substrate 100 surfaces, form alignment films 110, rub.And, in operation R8,, in operation R9, carry out the injection and the shutoff of liquid crystal 112 and lining (spacer) after color light filter substrate 111 applyings, finish LCD 200.
(manufacture method of the flat-panel screens substrate of the 2nd embodiment)
Shown in the process flow diagram of Figure 25, present embodiment is after the cut-out operation R10 of pixel control element 1, carries out to the mode of absorption with the transfer printing process R11 of substrate 9.In operation R2, after the mechanical lapping of silicon chip shown in Figure 62, carry out the patterning case of aligned position and pixel control element 1, so that can between the integrated circuit 3 that forms on the silicon chip 2, cut off as operation R10.At this moment, because integrated circuit 3 is not in the surface of silicon chip 2 side, be a side at contact positioning substrate 7, can not directly see from the top arrives confirms, makes integrated circuit 3 aligned position.Therefore, be provided with the aligned position sign of expression integrated circuit 3 positions at silicon chip 2 back side 2b, or on silicon chip 2 and positioning substrate 7, be provided with the through hole that aligned position is used, can aligned position.In addition, make positioning substrate 7 and the 1st splicing tape 8 adopt transparent material, can confirm the position of integrated circuit 3 from the back side.
Patterning case employing lithographic plate photoetching process etc. is carried out.Figure 26 represents the state after the patterning case.Then as shown in figure 27, as mask, carry out sandblast processing with the photoresist 11 that forms with the patterning case.After utilizing sandblast to process to be cut into one by one pixel control element 1, peel off photoresist 11.Figure 28 represents to peel off the situation behind the photoresist 11.
Then, as shown in figure 29,,, peel off the 1st splicing tape 8 and positioning substrate 7 by positioning substrate 7 heating the 1st splicing tape 8 as the back side and the absorption substrate 9 of operation R11 with the 2nd splicing tape 10 bonding pixel control elements 1.Wherein, worry because of bonding force reduces, is peeled off and can be caused pixel control element 1 to disperse during heating the 1st splicing tape 8, disarrays the arrangement of rule.Therefore, when utilizing heating to peel off, to heat the 1st splicing tape 8 by press fit a little to pixel control element 1 in one side, prevent that pixel control element 1 from dispersing or offset etc. on one side must pay close attention to.Like this pixel control element 1 is transferred to absorption substrate 9 from positioning substrate 7.This moment, the face that forms integrated circuit 3 became a surperficial side as shown in figure 30.
Wherein identical with the 1st embodiment, from preventing the viewpoint of offset, select splicing tape 8,10 respectively, make the hot soarfing of the 1st splicing tape 8 lower than the hot soarfing of the 2nd splicing tape 10 from temperature from temperature.In addition, also can make the bonding force difference of each splicing tape 8,10.In the mechanical lapping of silicon chip 2 with in the cutting operation of pixel control element 1, select to have the material that only can bear the bonding force that acts on the power on pixel control element 1 and the positioning substrate 7 as the 1st splicing tape 8, under the situation of the material of the bonding force that 10 selections are adsorbed easily as the 2nd splicing tape, prevent offset more reliably, absorption process after this can carry out smoothly.In addition, identical with the 1st embodiment, near the bonding force of the pixel control element 1 that adsorb is reduced.
(embodiment)
1 contrast of following one side and patent documentation, to make Diagonal Dimension be 50 inch, the case of liquid crystal displays of image resolution ratio SXGA (1280 * 3 looks * 1024), bore ratio 80% describe on one side.
(1) contrast of component shape
In the method, under the situation with 12 pixels of 1 element control, the size of Si sheet is about 200 μ m.In contrast, in patent documentation 1, under the situation with 1 pixel of 1 element control, the size of Si sheet is about 60 μ m.
(2) contrast of element spacing
In the present invention, element spacing is about horizontal 1.7mm, vertical 1.22mm.In patent documentation 1, element spacing is about horizontal 0.3mm, vertical 0.6mm.
With above-mentioned is the words that prerequisite compares this method and patent documentation 1, (1) for " throughput rate of element processing ", owing to the pixel control element of a plurality of pixels of control of using this method is more much bigger than the element of the method for patent documentation 1, can reduce chipping allowance, reduce consumption of materials, the machining period number obviously reduces.(2) for element to the substrate transfer printing, since with this method for pixel control element being transferred on the flat-panel screens substrate, with the vacuum cup of arrangements of components spacing processing vacuum hole from the regularly arranged element absorptive element selectively that comes together, be transferred on the substrate, and vacuum hole is to be arranged in horizontal 1.7mm, vertical 1.2mm with the diameter about φ 100 μ m.The size of Si sheet that is transferred a side can once be adsorbed the Si sheet about 9000 under the situation about 8 inches substrates.On the other hand, if adopt the method for patent documentation 1, need process vacuum hole about φ 40 μ m at interval with 0.3mm.In addition, if be under the situation of 8 inches substrate absorption Si sheets, need about 110,000 vacuum holes of processing.In the processing of the operable deep hole of vacuum cup, processing φ 100 μ m are possible in present process technology, the minute aperture processing difficulties of φ 40 μ m, and must process very manyly, in fact the method for patent documentation 1 can not realize now.(3) about " inspection of element and reparation ", this method is because the element number of configuration is few, the inspection of element, repair also easy.In addition, in the method (element is regularly arranged) of patent documentation 1, even implement the method for so-called " adsorb and imbed ", in the little element with 1 pixel of 1 element control, the vacuum cup itself that processing is used to adsorb is also very difficult as previously mentioned.Handlebar element itself strengthens again, because the bore ratio reduces, the performance of LCD will reduce.
Above, in the 1st and the 2nd embodiment, be illustrated the present invention being useful in the occasion of making LCD, but the present invention is not limited to this, also extend to the manufacturing that is applicable to the flat-panel screens of organic EL etc.
(erecting device of pixel control element)
Below the device that utilizes the method that illustrates in the 1st and the 2nd embodiment that the pixel control element installation is installed is described.Figure 31 represents the erecting device 300 with the pixel control element 1 of present embodiment.This erecting device 300 has adsorption function and the configuration feature of pixel control element 1 when flat-panel screens substrate 100 is selected transfer printing, is the device of implementing the operation R5 of Figure 25.Configuration feature is by the pixel control element objective table 301 of settling pixel control element 1 and settle the substrate objective table 302 of flat-panel screens substrate 100 to constitute.Equipment such as pixel control element objective table 301 usefulness electrostatic chucks, low cementability splicing tape are settled pixel control element 1, have the mechanism for stripping 303 of well heater or ultraviolet lamp etc.In addition, substrate objective table 302 is to wait the mechanism that settles flat-panel screens substrate 100 with vacuum cup, electrostatic chuck, mechanical chuck, has the mechanism 309 with heating such as well heaters.The situation of using mechanical chuck is the situation of settling flat-panel screens 100 ends.In addition, pixel control element objective table 301 and substrate objective table 302 have anglec of rotation governor motion respectively, utilize by computing machine equal controller 308 and regulate the control anglec of rotation.Adsorption function is to be made of with video camera 304, X-axis governor motion 305, Y-axis governor motion 306, Z axle governor motion 307 adsorbent equipment 51 of selecting absorption pixel control element 1, the aligned position that is attached to adsorbent equipment 51.Each governor motion the 305,306, the 307th the mechanism of adsorbent equipment 51 in only local aligned position, utilizes control device 308 control for separately axle, distinguishes aligned position.In addition, aligned position is sent to control device 308 with the view data of video camera 304, goes up display image at the monitor (not expression among the figure) of control device 308.
Installation to the pixel control element 1 that utilizes erecting device 300 describes below.The absorption that is mounted with pixel control element 1 is placed on the pixel control element objective table 301 with substrate 9, flat-panel screens substrate 100 is placed on the substrate objective table 302, carry out parallel adjustment then respectively.Parallel adjustment is an anglec of rotation governor motion of adjusting objective table 301,302 respectively, makes absorption parallel with the movable direction of the 1st direction X, the 1st direction X on the flat-panel screens substrate 100 on the substrate 9, X-axis governor motion 305.Also can make the 2nd direction Y of substrate 9,100 respectively, the parallel parallel adjustment of movable direction of Y and Y-axis governor motion 306.As the affirmation benchmark of the depth of parallelism, utilize at the silicon chip 2 that forms pixel control element 1 in advance or on adsorbing with substrate 9 and plane display substrate 100 aligned position mark M1 is set and easily carry out.Or can be benchmark also with the end of pixel control element 1 and the end of plane display substrate 100.Aligned position video camera 304 is used in the affirmation of the depth of parallelism, confirm the monitor of control device 308 on one side, observe on one side silicon chip 2 or absorption with the end of the aligned position mark M2 of substrate 9 or pixel control element 1 and plane display substrate 100 and rotate pixel control element objective table 301, make the 1st direction X of absorption usefulness substrate 9 parallel with the movable direction of X-axis governor motion 305.Substrate objective table 302 is rotated, make the 1st direction X of flat-panel screens substrate 100 parallel with the movable direction of X-axis governor motion 305.At this moment, also can be in control device 308, by being carried out Flame Image Process with the signal of video camera 304, aligned position carries out parallel adjustment automatically.
The parallel back of adjusting is stored the silicon chip 2 or the positional information of adsorbing with the aligned position mark M1 of the positional information of the aligned position mark M2 of substrate 9 and plane display substrate 100 in the control device 308 into.These positional informations are made of the positional information of X-axis governor motion 305, Y-axis governor motion 306, Z axle governor motion 307 respectively.For example, also can use the position of the sheet of the lower left of pixel control element 1 (as the sheet of benchmark) and flat-panel screens the preceding left side of body of substrate 100 as the reference position, these positional informations are stored in the control device 308, replace each aligned position mark M1, M2.
Behind stored position information, carry out the absorption of pixel control element 1.Before absorption, drive the well heater and the ultraviolet lamp of stripping off device 303 in advance, make absorption be in low cementability state with the 2nd splicing tape 10 of substrate 9.In addition, drive heating arrangements 309 in advance, make transparent thermoplastic resin film 101 plastically deformables of flat-panel screens substrate 100.Described in the 1st embodiment, in adsorbent equipment 51, has vacuum cup 52, with the spacing 55,56 identical with the spacing 105,106 of pixel control element 1 on the flat-panel screens substrate 100 vacuum suction hole 53 is set, the positional information in vacuum suction hole 53 stores in the control device 308 in advance.Utilize control device 308 to drive X-axis governor motion 305, Y-axis governor motion 306, Z axle governor motion 307, vacuum cup 52 is moved to the top of pixel control element objective table 301, absorption pixel control element 1.The pixel control element 1 of initial absorption as with the pixel control element 1 of previous reference position proximal most position, control after this just can be carried out efficiently, so preferably.
Described in the 1st embodiment,, when making the 2nd splicing tape 10 become low cementability, can utilize the energy line of ultraviolet wire harness etc. to carry out according to different with the kind of substrate 9 of the 2nd splicing tape 10 and absorption.Use the energy line generating means that produce heat ray and ultraviolet wire harness as stripping off device 303 this moment, makes them become standby condition before the absorption in advance.(or begin absorption before) only near the irradiation energy line of the pixel control element 1 of absorption, makes the 2nd splicing tape 10 parts become low cementability state when adsorbing then.Therefore, before finishing, absorption process need not keep heated condition (or ultraviolet irradiating state), near the splicing tape 10 of non-adsorbable pixel control element 1 does not become low cementability state, so can not disarray the arrangement of pixel control element 1 on absorption substrate 9.
Drive X-axis governor motion 305, Y-axis governor motion 306 and Z axle governor motion 307, the vacuum cup 52 that has adsorbed pixel control element 1 is transported to the top of flat-panel screens substrate 100, pixel control element 1 is installed on the flat-panel screens substrate 100.Carry out the absorption and the installation of these pixel control elements 1 repeatedly, pixel control element 1 is installed on the whole flat-panel screens substrate 100.In addition, set in advance many pixel control element objective tables 301 and adsorbent equipment 51, several batches pixel control element 1 is installed simultaneously, and throughput rate is improved.
In addition, owing to can utilize heating arrangements 309 to make transparent thermoplastic resin film 101 plastically deformables in advance, vacuum cup 52 is installed pixel control element 1 by being pressed on the transparent thermoplastic resin film 101, pixel control element 1 is configured to imbed in the transparent thermoplastic resin film 101.Also can heat in advance without heating arrangements 309, or heating arrangements 309 is not set on substrate objective table 302, after also can being configured to pixel control element 1 on the flat-panel screens substrate 100 (transparent thermoplastic resin film 101), push from the top heating, be mounted to and imbed transparent thermoplastic resin film 101.In addition, also can carry out spot heating to transparent thermoplastic resin film 101 by from back side illuminaton laser.
After pixel control element 1 is installed, under the situation of using transparent, UV hardening resin film 104, behind the transparent ultraviolet hardening resin film 104 of coating on the face of the configuration pixel control element 1 of flat-panel screens substrate 100, utilize other ultraviolet lamp (not expression among the figure), carry out the ultraviolet ray irradiation from flat-panel screens substrate 100 back sides, carry out the fixing of pixel control element 1.At this moment, also can be assembled into ultraviolet lamp on the substrate objective table 302.
This erecting device 300 is the devices that are installed to after absorption is adsorbed with the pixel control element on the substrate 91 on the flat-panel screens substrate 100, and in the operation except absorption and installation procedure R5 in the 1st and the 2nd embodiment, can use well-known manufacturing installation (for example semiconductor-fabricating device and light flat plate printing apparatus etc.).Just under the situation of introducing the relevant device that pixel control element 1 is installed,, just can carry out the installation method of the pixel control element that illustrates in the 1st and the 2nd embodiment as long as introduce the erecting device 300 of present embodiment again.
(embodiment)
On the flat-panel screens substrate 100 that LCD is used, select the example of transfer printing pixel control element 1 to describe with 300 pairs of reality of above-mentioned erecting device.The LCD 200 of present embodiment is that 50 inches, image resolution ratio are SXGA for Diagonal Dimension.On the silicon chip 2 of 8 inches (diameter 200mm), is under the situation of the 0.06mm pixel control element 1 of making vertical 200 μ m * horizontal 150 μ m sizes with the spacing 5 of the 1st direction X for 0.244mm, thickness for the spacing 6 of 0.215mm, the 2nd direction Y, and (pixel forms part and is 140mm * 140mm) can make 370,000 pixel control elements 1 for 1 silicon chip.(1107mm * 623mm) makes under the situation of LCD 200 of image resolution ratio of SXGA (1280 * 1024 * 3 look), and a pixel (3 look) is of a size of 0.86mm * 0.61mm to be 50 inches in Diagonal Dimension.Just the spacing of the pixel control element on flat-panel screens substrate 100 1 is that the spacing 105 of the 1st direction X is 1.22mm for the spacing 106 of 1.72mm, the 2nd direction Y.The pixel control element 1 that need this moment is about 330,000.Just can enough be produced on the pixel control element 1 of the flat-panel screens substrate 100 that uses on one 50 inches the LCD 200 with a silicon chip 2.
On the vacuum cup 52 of the pixel control element 1 that absorption is made like this, use to form the 1st direction X last 80 (=K) row and the 2nd direction Y last 102 (=L) vacuum suction holes 53 that go, diameter 100 μ m, the spacing 55 that makes the 1st direction is that the spacing 56 of 1.72mm, the 2nd direction Y is 1.22mm.
With this vacuum cup 52, from pixel control element 1 with the spacing 105 of the 1st direction X of flat-panel screens substrate 100 (=1.72mm), the spacing 106 of the 2nd direction Y (=1.22mm), (=80 * 102=8160) individual pixel control elements 1, transfer printing is on flat-panel screens substrate 100 for absorption K * L.Carry out this operation repeatedly, pixel control element 1 transfer printing on whole flat-panel screens substrate 100.Its result amounts to 40 times selection transfer printing last 5 times by last 8 times of the 1st direction X, the 2nd direction Y, can be transferred to pixel control element 1 on the whole flat-panel screens substrate 100.
(contrast of present embodiment and patent documentation 2)
The invention handle of patent documentation 2 is opposite with the situation that " the element group 13 " that be equivalent to pixel control element of the present invention adsorbs the back transfer printing one by one, and the present invention is the spacing absorption back transfer printing of a plurality of pixel control elements with regulation.Just in patent documentation 2, record " peel off (paragraph 0018) that carries out forming from element substrate 11 ", " pitch enlargement after the transfer printing between the element group 13 (paragraph 0023) " with the unit of element group 13.In addition, in paragraph 0030 and Fig. 8, the locating device (adsorbent equipment of the present invention) that uses in patent documentation 2 is illustrated.Record the hollow space 35 and the aspirating hole 34 (vacuum suction of the present invention hole) of absorptive element group 13 in locating device (pixel control element of the present invention), and hollow space 35 and aspirating hole 34 are one, and the pixel groups that can adsorb the location with locating device (adsorbent equipment) is one.Just in patent documentation 2, use can be adsorbed the locating device (adsorbent equipment) of the element group 13 in location (pixel control element of the present invention), adsorb each element group 13, be transferred to display device substrate 14 (flat-panel screens substrate) and go up (Figure 36 (a)).Therefore, absorption needs to carry out the number of times identical with its number with transfer printing in each element group 13 (pixel control element of the present invention), and adsorbs and element group 13 of transfer printing at every turn, must be on display device substrate 14 aligned position.
In contrast, the present invention resemble recorded and narrated " form a plurality of pixel control elements at above-mentioned pixel control element on substrate; make for the 1st direction; become the arrangement pitches of removing the px/m of the pixel control element arrangement pitches px in on-chip the 1st direction of flat-panel screens with natural number m; and, become the arrangement pitches of removing the py/n of the pixel control element arrangement pitches py in on-chip the 2nd direction of flat-panel screens with natural number n with respect to the 2nd direction vertical with the 1st direction; In adsorbent equipment, with arrangement pitches corresponding to px on the direction of above-mentioned the 1st direction, and form the vacuum suction hole that clamps pixel control element with arrangement pitches corresponding to py on the direction of above-mentioned the 2nd direction, selectively only corresponding to arranging px at the on-chip pixel control element of flat-panel screens, the pixel control element absorption of py also is positioned in the adsorbent equipment, transfer printing is (with reference to claim 1) on the flat-panel screens substrate " like that; pixel control element is with the arrangement pitches of on-chip pixel control element (px/m; py/n) and the arrangement pitches in the vacuum suction hole of adsorbent equipment (px; Py) with the arrangement pitches of flat-panel screens substrate (px; Py) be associated; utilization is once adsorbed with at the on-chip arrangement pitches (px of flat-panel screens, Py) select a plurality of pixel control elements, keep its arrangement pitches directly to be transferred to (Figure 36 (b)) on the flat-panel screens substrate.Just described as the 23rd page of the 5th row, because every natural number m (every m-1) selects on the 1st direction, every natural number n (every n-1) selects on the 2nd direction, and a plurality of pixel control elements 1 that add the oblique line position of Figure 13 are adsorbed selectively.Therefore, and as patent documentation 2, each element group 13 (pixel control element of the present invention) is adsorbed with the situation of transfer printing and is compared, and the number of times of absorption and transfer printing is few, the production efficiency height.
In addition, with in display device substrate 14 (flat-panel screens substrate of the present invention), each element group 13 (pixel control element of the present invention) needs the patent documentation 2 of aligned position to compare, because when absorption is at the on-chip arrangement pitches of flat-panel screens (px, py), once carries out aligning of a plurality of pixel control elements position.For its effect, be illustrated at the 25th page of the 18th row: " therefore; utilize this vacuum cup 52 once can adsorb K * L to the pixel control element 1 of the spacing 106 of spacing 105 of filling up the 1st direction X on the flat-panel screens substrate 100 and the 2nd direction Y at most, can be transferred on the flat-panel screens substrate 100."; Also be illustrated: " when absorption next time; for example vacuum cup 52 only is displaced to the words of width px/m at the 1st direction X (right among Figure 13) in substrate 9; identical when adsorbing, can selects to adsorb the right side adjacent pixels control element 1 that is arranged in the pixel control element 1 (Figure 13 has added oblique line) that has adsorbed with last time in absorption at the 26th page of the 2nd row." and like this one side to carry out the absorption correctly of aligned position one side be feature of the present invention.
This point records " being spaced apart of each thin film transistor (TFT) 12 just can separate can " between element in the paragraph 0017 in patent documentation 2, can give no thought to the arrangement pitches that forms each thin-film transistor element 12 on the usefulness substrate 11 (pixel control element substrate of the present invention) in pixel.This shows as the arrangement pitches of the element group 13 (pixel control element) of the aggregate of each thin-film transistor element 12 and also can not consider fully.
Shown in Figure 36 (a), in patent documentation 2, in transfer printing source (pixel control element substrate) and transfer printing purpose side (flat-panel screens substrate), can consider that the arrangement pitches corresponding to pixel groups 13 (pixel control element) is identical.With so simple correspondence, form with on-chip state to be diffused into pixel control with pixel groups 13 (pixel control element), become considerably less with the production quantity of the pixel control element of the area of substrate with respect to each pixel control element.
In contrast, the present invention pixel control element with substrate on natural number (m, n) divided by the arrangement pitches (px of flat-panel screens substrate, py) arrangement pitches (px/m, py/n) form pixel control element, make " form a plurality of pixel control elements; for the 1st direction; become the arrangement pitches of removing the px/m of the pixel control element arrangement pitches px in on-chip the 1st direction of flat-panel screens with natural number m; and with respect to 2nd direction vertical with the 1st direction; become the arrangement pitches of removing the py/n of the pixel control element arrangement pitches py in on-chip the 2nd direction of flat-panel screens with natural number n ", carry out on one side the correspondence of pixel control with substrate and plane display substrate, can with intensive state at pixel control element with substrate on form pixel control element (Figure 36 (a)) on one side.With above-mentioned simple corresponding comparing, increase substantially like this with respect to the production efficiency of each pixel control with the pixel control element of the area of substrate.
In addition as mentioned above, can consider that " element group 13 " is the set that 4 thin-film transistor elements 12 are controlled its 4 pixels on every side respectively.Shown in Figure 35 (a), be central intensive 4 thin-film transistor elements 12 that are used to control these 4 pixels that are configured in 4 pixels of matrix pattern specifically.Citing document 2 also identical therewith (with reference to Fig. 5).Just concentrate situations a plurality of and that control a plurality of pixels with a plurality of thin-film transistor elements 12 opposite with a thin-film transistor element 12 of a pixel of the element group 13 (being equivalent to pixel control element of the present invention) of patent documentation 2 control, difference of the present invention is that pixel control element is to control a plurality of pixels with an integrated circuit.Claim 1 " controlling the pixel control element of a plurality of pixels with an integrated circuit " is applicable under the situation in the LCD of an embodiment of the invention, on the flat-panel screens substrate 100 relative, can dispose a plurality of pixel control elements of controlling a plurality of pixels (for example 3 looks * 4 pixels) with an integrated circuit by liquid crystal 112 with its wiring with color light filter substrate 111.Generally the wiring portion at display is a shading light part.Therefore, resemble the patent documentation 2 with an element and control under the situation that a plurality of pixels use, wiring portion concentrates on the element, and this part becomes shading light part.In contrast, owing to can save wiring, be effective among the present invention at aspects such as raising bore ratios with above-mentioned pixel control element and its wiring.
The possibility of on industry, utilizing
Adopt pixel control element of the present invention to select the words of printing transferring method, so that the arrangement pitches in on-chip the 1st direction of flat-panel screens and the 2nd direction is formed pixel control element with the arrangement pitches that natural number is removed respectively, wherein, can make whole pixel control elements easily not carry out transfer printing lavishly owing to only select the pixel control element of transfer printing corresponding to the on-chip arrangement pitches of flat-panel screens.At this moment, absorption with substrate on transfer printing, make the integrated circuit face become state towards the surface, then under the situation of cutting pixel control element owing to can confirm the integrated circuit face from a surperficial side on one side, on one side aligned position, so the cutting operation is carried out easily.On the other hand; transfer printing on adsorbing behind the cutting pixel control element with substrate; the integrated circuit face is become under the situation on surface; in mechanical lapping operation and cutting operation, can protect the integrated circuit face reliably; can set simultaneously the bonding force of positioning substrate; can bear the strong bonding force of mechanical lapping and cutting operation, make absorption with the easy transfer printing of bonding force of substrate, according to the bonding force of separately purpose.Can improve the reliability of each operation like this.This external cause adhering method difference separately when substrate transfer printing pixel control element is used in absorption, can prevent to disarray the arrangement of pixel control element from positioning substrate.
Utilization is fixed on the flat-panel screens substrate of transparent thermoplastic resin film of plastically deformable pixel control element, in the time of can preventing to install with easy and reliable method and the offset of the pixel control element after installing.At this moment, by on the face of the absorption pixel control element of adsorbent equipment, applying fluorine resin in advance, can on adsorbent equipment, not adhere to transparent thermoplastic resin film.In addition, particularly behind the configuration pixel control element, push, pixel control element is positioned under the situation on the transparent thermoplastic resin film, utilize adsorbent equipment to being pressed into air with the absorption affinity reverse direction, pixel control element is being configured on the transparent thermoplastic resin film, pixel control element contacts with transparent thermoplastic resin film close, in the time of from adsorbent equipment reliable separation pixel control element, can prevent the offset of the pixel control element on transparent thermoplastic resin film.
Utilize pixel control element above, just utilize and remove the lateral parts that forms integrated circuit and cover with transparent ultraviolet resin molding, fixed pixel control element reliably, the while stably forms the wiring of drawing above pixel control element.
In addition, be installed in the device of the on-chip operation of flat-panel screens after the erecting device of the pixel control element that uses mainly is the absorption pixel control element in pixel control element selection printing transferring method of the present invention.In the selection printing transferring method of pixel control element of the present invention, because the operation except this operation can be used well-known manufacturing installation, as long as introduce the erecting device of new pixel control element of the present invention, just can easily realize the selection printing transferring method of pixel control element of the present invention.Owing to can utilize existing equipment, can implement at an easy rate in addition.
The wiring method of pixel control element of the present invention after the pixel control element transfer printing is to form the wiring of inside of controlling the pixel control element of a plurality of pixels by it, and utilize and use the screen printing of the web plate mask that forms predetermined pattern to form wiring, so the efficient of the existing complicated formation wiring operations that can only high price forms is increased substantially, can connect up at low cost.
Adopt the words of flat-panel screens substrate of the present invention, on the flat-panel screens substrate relative, dispose the pixel control element that integrated circuit of a plurality of usefulness is controlled a plurality of pixels with its wiring with side's substrate, so can save wiring, be effective at aspects such as raising bore ratios.That is to say that pixel control element is a pixel control element of controlling a plurality of pixel electrodes with an integrated circuit, be configured in the position near central authorities of the pixel arrangement of the capable j row of i, owing to be connected with pixel by above-mentioned wiring, the quantity of wiring is reduced (saving wiring), reduce the shading light part that wiring causes.
In addition, owing to the spacing configuration element with 2 pixels, the shading position at the wiring position of wiring portion enters in 2 pel spacings in patent documentation 2.In this case because RG, BR, GB, RG ... per 2 kinds of colors separately have problems on the generation color.In contrast, resemble the present invention like this, above-mentioned i is capable, and the j row are that i * j is 3 multiple, above-mentioned pixel control element is the words of 3 pixels of 3 looks as one group, during with the many group of integrated circuit control, because the form cutting that can gather with 3 looks of RGB, so utilize the colour developing that needed originally, because the colour mixture of the pixel that can prevent and be close to is so also can expect to improve contrast.The words that the control of 3 looks * 4 pixels of using the 6 row arrangements of 2 row is arranged again, because element is arranged with 6 pel spacings, so can keep improving the effect of bore ratio, simultaneously because can be to gather the 3 look form cuttings of RGB, so the colour developing that can need originally.Useful again RGB cutting can prevent and the colour mixture of contiguous pixel, also can expect to improve contrast.
Claims (13)
1, a kind of selection printing transferring method of pixel control element, it is characterized in that, the pixel control element transfer printing of a plurality of pixels of control in the on-chip pixel control element printing transferring method of flat-panel screens, comprise following operation: the pixel control element of a plurality of integrated circuit of form controlling a plurality of pixels from the teeth outwards is fixed on operation on the positioning substrate with substrate; Be fixed on the on-chip operation of absorption on each integrated circuit, cutting off the pixel control element of pixel control element with substrate; Transfer printing was in the on-chip operation of flat-panel screens after absorption was adsorbed on adsorbent equipment selectively with on-chip pixel control element;
Form a plurality of pixel control elements at above-mentioned formation pixel control element on substrate, make for the 1st direction, become the arrangement pitches of removing the px/m of the pixel control element arrangement pitches px in on-chip the 1st direction of flat-panel screens with natural number m, and, become the arrangement pitches of removing the py/n of the pixel control element arrangement pitches py in on-chip the 2nd direction of flat-panel screens with natural number n for the 2nd direction vertical with the 1st direction;
From be transferred to above-mentioned absorption with the on-chip pixel control element selectively only corresponding to the pixel control element absorption of arranging px, py at the on-chip pixel control element of flat-panel screens and be positioned in the adsorbent equipment, transfer printing is on the flat-panel screens substrate.
2, a kind of selection printing transferring method of pixel control element, it is characterized in that, the pixel control element transfer printing of controlling a plurality of pixels with an integrated circuit on the flat-panel screens substrate time, is being comprised following operation: the pixel control element of formation from the teeth outwards being controlled a plurality of integrated circuit of a plurality of pixels is fixed on operation on the positioning substrate with substrate; Be fixed on the on-chip operation of absorption on each integrated circuit, cutting off the pixel control element of pixel control element with substrate; Transfer printing was in the on-chip operation of flat-panel screens after absorption was adsorbed on adsorbent equipment selectively with on-chip pixel control element;
Form a plurality of pixel control elements at above-mentioned formation pixel control element on substrate, make for the 1st direction, become the arrangement pitches of removing the px/m of the pixel control element arrangement pitches px in on-chip the 1st direction of flat-panel screens with natural number m, and, become the arrangement pitches of removing the py/n of the pixel control element arrangement pitches py in on-chip the 2nd direction of flat-panel screens with natural number n for the 2nd direction vertical with the 1st direction;
Arrangement pitches with px forms the vacuum suction cave of blocking pixel control element on the direction of above-mentioned the 1st direction of correspondence in adsorbent equipment, and the arrangement pitches with py forms the vacuum suction cave of blocking pixel control element on the direction of above-mentioned the 2nd direction of correspondence; From be transferred to above-mentioned absorption with the on-chip pixel control element selectively only corresponding to the pixel control element absorption of arranging px, py at the on-chip pixel control element of flat-panel screens and be positioned in the adsorbent equipment, transfer printing is on the flat-panel screens substrate.
3, a kind of selection printing transferring method of pixel control element,
It is characterized in that, the pixel control element transfer printing of controlling a plurality of pixels with an integrated circuit on the flat-panel screens substrate time, is being comprised following operation: the pixel control element of the integrated circuit that forms a plurality of pixels of a plurality of controls from the teeth outwards is fixed on operation on the positioning substrate with substrate; Be fixed on the on-chip operation of absorption on each integrated circuit, cutting off the pixel control element of pixel control element with substrate; Transfer printing was in the on-chip operation of flat-panel screens after absorption was adsorbed on adsorbent equipment selectively with on-chip pixel control element;
Form a plurality of pixel control elements at above-mentioned formation pixel control element on substrate, make for the 1st direction, become the arrangement pitches of removing the px/m of the pixel control element arrangement pitches px in on-chip the 1st direction of flat-panel screens with natural number m, and, become the arrangement pitches of removing the py/n of the pixel control element arrangement pitches py in on-chip the 2nd direction of flat-panel screens with natural number n for the 2nd direction vertical with the 1st direction; Dispose: settle above-mentioned absorption with the pixel control element platform of substrate, settle the chip bench of flat-panel screens substrate and have adsorbent equipment, the X-axis governor motion that makes the adsorbent equipment aligned position, Y-axis governor motion and the Z axle governor motion of the vacuum cup that forms the vacuum suction cave; Two platforms of above-mentioned pixel control element platform and chip bench have the rotational angle governor motion respectively; Utilization forms the absorption cave and adsorb the erecting device in cave with the arrangement pitches of py on the direction of above-mentioned the 2nd direction of correspondence at the arrangement pitches with px on the direction of above-mentioned the 1st direction of correspondence;
From be transferred to above-mentioned absorption with the on-chip pixel control element selectively only corresponding to the pixel control element absorption of arranging px, py at the on-chip pixel control element of flat-panel screens and be positioned in the adsorbent equipment, transfer printing is on the flat-panel screens substrate.
4, select printing transferring method as claim 1 each described pixel control element to the claim 3, it is characterized in that, above-mentioned pixel control element is the pixel control element of 2 row, 6 row being arranged with an integrated circuit that 3 looks * 4 pixels are controlled, at the above-mentioned pixel control element of central transfer printing of 2 row, 6 row.
5, select printing transferring method as claim 1 each described pixel control element to the claim 3, it is characterized in that, in the operation that the pixel control element that forms described a plurality of integrated circuit is fixed on substrate on the positioning substrate, on positioning substrate, make facing down of the integrated circuit that forms pixel control element, be bonded on the face that contacts with the positioning substrate of substrate with pixel control element; The described pixel control element of cut-out is fixed on absorption with in the on-chip operation with the pixel control element of substrate on each integrated circuit, above-mentioned pixel control element is reversed transfer printing on adsorbing with substrate with the substrate pros and cons, with the face that forms integrated circuit is a surperficial rear flank, cuts off the pixel control element substrate on each integrated circuit.
6, select printing transferring method as claim 1 each described pixel control element to the claim 3, it is characterized in that, in the operation that the pixel control element that forms described a plurality of integrated circuit is fixed on substrate on the positioning substrate, on positioning substrate, make facing down of the integrated circuit that forms pixel control element, be bonded on the face that contacts with the positioning substrate of substrate with pixel control element, make the integrated circuit face bonding under the state of positioning substrate one side; The cut-out pixel control element is fixed on absorption with in the on-chip operation with the pixel control element of substrate on each integrated circuit, in each integrated circuit, cut off the integrated circuit on the above-mentioned positioning substrate towards the pixel control element of location substrate one side state with substrate after, pixel control element with substrate pros and cons counter-rotating transfer printing on adsorbing with substrate.
7, a kind of erecting device of pixel control element, it is the erecting device that carries out claim 1 selection printing transferring method of each described pixel control element to the claim 6, it is characterized in that above-mentioned erecting device is to carry out above-mentioned absorption adsorbed selectively with on-chip pixel control element and be positioned at behind the adsorbent equipment transfer printing at the device of the on-chip operation of flat-panel screens; Be provided with settle above-mentioned absorption with the pixel control element objective table of substrate, settle the flat-panel screens substrate the substrate objective table, have the adsorbent equipment of the vacuum cup in formation vacuum suction hole; Two objective tables of above-mentioned pixel control element objective table and substrate objective table have anglec of rotation governor motion respectively; Adsorbent equipment has and utilizes X-axis governor motion, Y-axis governor motion, Z axle governor motion in 3 vertical functions that direction moves freely, arrangement with px on corresponding to the direction of above-mentioned the 1st direction forms adsorption hole, and the arrangement with py forms adsorption hole on corresponding to the direction of above-mentioned the 2nd direction.
8, the Wiring method after a kind of pixel control element selection transfer printing, it is characterized in that, on the pixel control element of claim 1 a plurality of pixels of each described control to the claim 6, form wiring by its inside, when on the flat-panel screens substrate, forming wiring on the other hand, utilize screen printing to form, wherein said screen printing uses the web plate mask of the compulsory figure corresponding with the linear flat-panel screens wiring that is connected of pixel control element internal wiring and point.
9, a kind of flat-panel screens substrate, it is characterized in that, in the flat-panel screens substrate that pixel and the pixel control element of controlling this pixel form with connecting wiring, pixel is arranged with the capable j row of i, above-mentioned pixel control element is a pixel control element of controlling a plurality of pixels with an integrated circuit, general arrangements is carried out the connection of above-mentioned each pixel in the central authorities of the capable j row of above-mentioned i by the wiring of using common zone.
10, a kind of flat-panel screens substrate, it is characterized in that, pixel and control this pixel pixel control element in the flat-panel screens substrate that the wiring that is connected them forms, pixel is arranged with the capable j row of i, above-mentioned pixel control element is a pixel control element of controlling a plurality of pixels with an integrated circuit, general arrangements is carried out the connection of above-mentioned each pixel in the central authorities of the capable j row of above-mentioned i by the wiring of using common zone; Above-mentioned pixel control element is with above-mentioned printing transferring method transfer printing at claim 1 each described pixel control element to the claim 6.
As claim 9 or the described flat-panel screens substrate of claim 10, it is characterized in that 11, above-mentioned i is capable, and the j row are that i * j is 3 multiple, above-mentioned pixel control element as one group, is organized 3 pixels of 3 looks with an integrated circuit control more.
12, as claim 9 or the described flat-panel screens substrate of claim 10, it is characterized in that, above-mentioned pixel control element is the pixel control element of 2 row, 6 row being arranged with an integrated circuit that 3 looks * 4 pixels are controlled, at the above-mentioned pixel control element of central transfer printing of 2 row, 6 row.
13, as claim 9 each described flat-panel screens substrate to the claim 12, it is characterized in that, above-mentioned pixel control element is to be transferred at the on-chip pixel control element of flat-panel screens, employing has the pixel control element of a plurality of integrated circuit that form a plurality of pixels of control from the teeth outwards is fixed on operation on the positioning substrate with substrate, be fixed on the on-chip operation of absorption on each integrated circuit, cutting off the pixel control element of pixel control element with substrate, absorption is adsorbed on the adsorbent equipment manufacture method of transfer printing afterwards in the on-chip operation of flat-panel screens etc. selectively with on-chip pixel control element, is transferred on the flat-panel screens substrate.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP334604/2002 | 2002-11-19 | ||
| JP2002334604 | 2002-11-19 | ||
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| JP196610/2003 | 2003-07-14 | ||
| JP301478/2003 | 2003-08-26 |
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| CN102160181A (en) * | 2008-08-14 | 2011-08-17 | 全球Oled科技有限责任公司 | Oled device with embedded chip driving |
| CN102405493A (en) * | 2009-02-17 | 2012-04-04 | 全球Oled科技有限责任公司 | Chiplet driver pairs for two-dimensional display |
| CN102473719A (en) * | 2009-08-20 | 2012-05-23 | 全球Oled科技有限责任公司 | Optically testing chiplets in display device |
| CN102804381A (en) * | 2009-06-23 | 2012-11-28 | 全球Oled科技有限责任公司 | Applying chiplets to substrates |
| CN102187461B (en) * | 2008-08-14 | 2013-11-13 | 全球Oled科技有限责任公司 | Display device with embedded chip driving |
| CN103854570A (en) * | 2014-02-20 | 2014-06-11 | 北京京东方光电科技有限公司 | Display substrate and driving method thereof and display device |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06148677A (en) * | 1992-11-06 | 1994-05-27 | Naoto Nakagawa | Matrix element and manufacture of the same |
| JP3406207B2 (en) * | 1997-11-12 | 2003-05-12 | シャープ株式会社 | Method of forming transistor array panel for display |
| JP3447619B2 (en) * | 1999-06-25 | 2003-09-16 | 株式会社東芝 | Active matrix substrate manufacturing method, intermediate transfer substrate |
| JP3574865B2 (en) * | 1999-11-08 | 2004-10-06 | 株式会社 日立インダストリイズ | Substrate assembly method and apparatus |
| JP3492284B2 (en) * | 2000-04-19 | 2004-02-03 | 株式会社 日立インダストリイズ | Substrate bonding device |
| JP2002244576A (en) * | 2001-02-21 | 2002-08-30 | Sony Corp | Method for manufacturing display device, display device and liquid crystal display device |
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2003
- 2003-11-19 CN CNB2003801007224A patent/CN100365673C/en not_active Expired - Fee Related
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| CN102160181A (en) * | 2008-08-14 | 2011-08-17 | 全球Oled科技有限责任公司 | Oled device with embedded chip driving |
| CN102187461B (en) * | 2008-08-14 | 2013-11-13 | 全球Oled科技有限责任公司 | Display device with embedded chip driving |
| CN102160181B (en) * | 2008-08-14 | 2013-12-25 | 全球Oled科技有限责任公司 | OLED device with embedded chip driving |
| CN102405493A (en) * | 2009-02-17 | 2012-04-04 | 全球Oled科技有限责任公司 | Chiplet driver pairs for two-dimensional display |
| CN102804381A (en) * | 2009-06-23 | 2012-11-28 | 全球Oled科技有限责任公司 | Applying chiplets to substrates |
| CN102804381B (en) * | 2009-06-23 | 2015-05-13 | 全球Oled科技有限责任公司 | Applying chiplets to substrates |
| CN102473719A (en) * | 2009-08-20 | 2012-05-23 | 全球Oled科技有限责任公司 | Optically testing chiplets in display device |
| CN103854570A (en) * | 2014-02-20 | 2014-06-11 | 北京京东方光电科技有限公司 | Display substrate and driving method thereof and display device |
| US9601082B2 (en) | 2014-02-20 | 2017-03-21 | Boe Technology Group Co., Ltd. | Display substrate and driving method thereof and display device |
| WO2021120974A1 (en) * | 2019-12-17 | 2021-06-24 | Tseng Shih Hsien | Display apparatus, pixel array and manufacturing method thereof |
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