CN1691875A - 印刷电路板不良区域的移植修护方法 - Google Patents
印刷电路板不良区域的移植修护方法 Download PDFInfo
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- CN1691875A CN1691875A CN 200410033887 CN200410033887A CN1691875A CN 1691875 A CN1691875 A CN 1691875A CN 200410033887 CN200410033887 CN 200410033887 CN 200410033887 A CN200410033887 A CN 200410033887A CN 1691875 A CN1691875 A CN 1691875A
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- circuit board
- printed circuit
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Abstract
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Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2004100338870A CN100379325C (zh) | 2004-04-19 | 2004-04-19 | 印刷电路板不良区域的移植修护方法 |
Applications Claiming Priority (1)
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CNB2004100338870A CN100379325C (zh) | 2004-04-19 | 2004-04-19 | 印刷电路板不良区域的移植修护方法 |
Publications (2)
Publication Number | Publication Date |
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CN1691875A true CN1691875A (zh) | 2005-11-02 |
CN100379325C CN100379325C (zh) | 2008-04-02 |
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CNB2004100338870A Expired - Fee Related CN100379325C (zh) | 2004-04-19 | 2004-04-19 | 印刷电路板不良区域的移植修护方法 |
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CN (1) | CN100379325C (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1997266B (zh) * | 2006-01-05 | 2010-09-01 | 辜省三 | 不良多联片印刷电路板重置方法及其*** |
CN101557680B (zh) * | 2008-04-10 | 2011-11-09 | 欣兴电子股份有限公司 | 多联电路板的移植方法 |
CN103200789A (zh) * | 2013-03-18 | 2013-07-10 | 昆山汇仁氏电子有限公司 | 一种印制线路板移植工艺 |
CN106714465A (zh) * | 2017-01-10 | 2017-05-24 | 昆山铭驰自动化科技有限公司 | 一种基于视觉检测的pcb板自动拼接方法 |
CN107486463A (zh) * | 2017-08-28 | 2017-12-19 | 杭州耕德电子有限公司 | 一种手机前壳上残次铝条热熔拆卸重装工艺 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1088899C (zh) * | 1997-07-18 | 2002-08-07 | 联华电子股份有限公司 | 可预老化测试的动态存储器模块及其电路板 |
US6195881B1 (en) * | 1997-10-08 | 2001-03-06 | The Erie Ceramic Arts Company | Multiple coated substrates |
CN1191745C (zh) * | 2001-07-24 | 2005-03-02 | 耀华电子股份有限公司 | 适用于各种印刷电路板的不良单位区块去除及填补方法 |
-
2004
- 2004-04-19 CN CNB2004100338870A patent/CN100379325C/zh not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1997266B (zh) * | 2006-01-05 | 2010-09-01 | 辜省三 | 不良多联片印刷电路板重置方法及其*** |
CN101557680B (zh) * | 2008-04-10 | 2011-11-09 | 欣兴电子股份有限公司 | 多联电路板的移植方法 |
CN103200789A (zh) * | 2013-03-18 | 2013-07-10 | 昆山汇仁氏电子有限公司 | 一种印制线路板移植工艺 |
CN103200789B (zh) * | 2013-03-18 | 2017-06-16 | 昆山汇仁氏电子有限公司 | 一种印制线路板移植工艺 |
CN106714465A (zh) * | 2017-01-10 | 2017-05-24 | 昆山铭驰自动化科技有限公司 | 一种基于视觉检测的pcb板自动拼接方法 |
CN107486463A (zh) * | 2017-08-28 | 2017-12-19 | 杭州耕德电子有限公司 | 一种手机前壳上残次铝条热熔拆卸重装工艺 |
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Publication number | Publication date |
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CN100379325C (zh) | 2008-04-02 |
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EE01 | Entry into force of recordation of patent licensing contract |
Assignee: HUATONG COMPUTER Co.,Ltd. Assignor: XIUSHENG TECHNOLOGY Co.,Ltd. Contract fulfillment period: 2008.9.20 to 2024.4.19 Contract record no.: 2008990001532 Denomination of invention: Transplanted repair method for bad region of printed circuit board Granted publication date: 20080402 License type: Fen Xuke Record date: 20081223 |
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Free format text: SEPARATELY LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.9.20 TO 2024.4.19; CHANGE OF CONTRACT Name of requester: HUATONG COMPUTER CO., LTD. Effective date: 20081223 |
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Owner name: COMPEQ MANUFACTURING CO., LTD. Free format text: FORMER OWNER: XIUSHENG TECHNOLOGY CO., LTD. Effective date: 20100625 |
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Free format text: CORRECT: ADDRESS; FROM: 000000 TAIWAN PROVINCE, CHINA TO: 000000 NO.91, LANE 814, DAXIN ROAD, XINZHUANG VILLAGE, LUZHU TOWNSHIP, TAOYUAN COUNTY, TAIWAN PROVINCE, CHINA |
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Effective date of registration: 20100625 Address after: 000000 Chinese Taiwan Taoyuan County Luchu Township village of Daxin Road No. 91 Lane 814 Patentee after: HUATONG COMPUTER Co.,Ltd. Address before: 000000 Taiwan, China Patentee before: XIUSHENG TECHNOLOGY Co.,Ltd. |
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