CN1687727A - Method for micro machining mini type multiple dimension force/moment sensor - Google Patents
Method for micro machining mini type multiple dimension force/moment sensor Download PDFInfo
- Publication number
- CN1687727A CN1687727A CN 200510009924 CN200510009924A CN1687727A CN 1687727 A CN1687727 A CN 1687727A CN 200510009924 CN200510009924 CN 200510009924 CN 200510009924 A CN200510009924 A CN 200510009924A CN 1687727 A CN1687727 A CN 1687727A
- Authority
- CN
- China
- Prior art keywords
- type multiple
- multiple dimension
- dimension force
- moment sensor
- mini type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Measurement Of Force In General (AREA)
Abstract
The invention is the micro multi-dimension /moment sensor processing method, which is to polish the surface of the sensor base body and splatter Al2O3 insulating layer on the surface; spray the sensitive layer on the Al2O3 insulating layer and dry it; expose, develop and clean the sensitive layer; implement metallization process on the splattering machine to form the strain-gauge metal film. The invention based on the Al alloy base body adopts the semiconductor facture to directly splatter the resistance film on the sensor elastomer and to lead the wire to the amplifying circuit, which not only improves the adhering density between the elastomer and the strain-gauge, but also ensures the accordance of the strain-gauges and promotes the quality and the measuring precision of the product.
Description
Technical field:
The present invention relates to a kind of method of on sensor elastomer, directly processing foil gauge.
Background technology:
The physical quantity that multiple dimension force/moment sensor is measured is three-dimensional force and three-dimensional moment, that is Fx, Fy, Fz, Mx, My, Mz, adopt semiconductor fabrication process to require diaphragm to be positioned at same plane, elastomer structure form such as Fig. 1 of design, the diameter 19mm of sensor, highly be 3mm, strain beam has 9.In order to make full use of the chromium film, the space of a whole page of design as shown in Figure 2.Robotics has entered the intelligent robot epoch, need abundant perceptional function, mini type multiple dimension force/moment sensor uses in the robot manipulation in a large number, but because its complex structure, foil gauge quantity is many, the foil gauge position of employing hand paste is difficult to accurately, and the manual welding poor reliability, thereby has influenced the precision of sensor.Adopt manual debugging sensor, manufacturing plant will drop in the correction that is operated in sensor in a large number, has restricted the development of multi-dimension force sensor.Electromechanical Design is machinery, sensing, the integrated design of circuit integrating, thereby satisfies the requirement of mini system.
Summary of the invention:
Precision and the production efficiency of the present invention in order to improve sensor, provide a kind of on mini type multiple dimension force/moment sensor elastic body alloy matrix aluminum the directly method of sputter foil gauge, i.e. method for micro machining mini type multiple dimension force/moment sensor.Miniature power of the present invention/torque sensor elastic body adopts semiconductor fabrication process, finish in German fraunhofer biological study, manufacturing process is as follows: (one) prepares insulation course: aluminium alloy matrix surface is carried out polishing, then sputter Al on matrix surface
2O
3Insulation course; (2) be coated with photoresists: at Al
2O
3The photographic layer of spraying on the insulation course, oven dry; (3) exposure: photographic layer is exposed, develops, cleans; (4) generate metal level: at last at the enterprising row metal processing of sputter, the foil gauge metal film of formative tissue compact structure, i.e. resistance film.The present invention proposes a kind of micro-force sensor based on the MEMS manufacturing technology, on alloy matrix aluminum, adopt semiconductor fabrication process direct sputter resistance film and line guided to amplifying circuit on sensor elastomer, so not only can improve the cohesive strength between elastic body and the foil gauge, but also can improve the quality and the measuring accuracy of product.Characteristics such as that the present invention has is highly sensitive, response soon, is easily produced in enormous quantities.
Description of drawings:
Fig. 1 is the one-piece construction synoptic diagram of miniature torque sensor, Fig. 2 is the layout structure synoptic diagram of miniature torque sensor, Fig. 3 is surface of elastomer crudy constitutional diagram (60un), Fig. 4 is surface of elastomer crudy constitutional diagram (3un), Fig. 5 is the surface of elastomer micrograph (5un) of sputter 1.5 μ m insulating layer thickness, Fig. 6 generates the surperficial micrograph of metal level for this method, Fig. 7 is the surperficial micrograph of diverse location sputter foil gauge, and Fig. 8 handles figure with sensor treatment circuit external lead wire.
Embodiment:
Embodiment one: present embodiment is achieved in that (one) preparation insulation course: polishing is carried out on the sensor base surface, then sputter Al on matrix surface
2O
3Insulation course; (2) be coated with photoresists: at Al
2O
3The photographic layer of spraying on the insulation course, oven dry; (3) exposure: photographic layer is exposed, develops, cleans; (4) generate metal level:, form the foil gauge metal film, i.e. resistance film at last in the enterprising row metal processing of sputter.Described thickness of insulating layer is 40~60 microns; The working temperature of step 1 is 500~550 ℃; The thickness of photographic layer is 60~70 microns; Metal in the step 4 is nickel/evanohm or copper.
Embodiment two: present embodiment is achieved in that
(1) preparation insulation course: at first polishing is carried out on the sensor base surface, then 510 ℃, adopt insulation course sputter IP9025 50 microns insulation courses of sputter on aluminum substrate of Heraeus company.
(2) be coated with photoresists: because it is very much not easy to operate that the whole space of a whole page of this structure is put into the solution volume, so adopt sprayer to be coated with photoresists.According to experiment, Resist Ti35 demonstrate to alundum (Al have best reliability and concentration adjustable, can on insulation course, generate the photographic layer of high-quality, so at Al
2O
3The photographic layer of spraying on the insulation course, the thickness of sense of control photosphere is 60~70 microns, oven dry.
(3) exposure: in 4 cun common exposure machines, expose, about 30 minutes of time shutter, guarantee that peripheral per two beams all are in aligned position and guarantee the time shutter unanimity, the exposure back is cleaned.
(4) generate metal level: in the enterprising row metal processing of Magnetron sputter, magnetic sputter sputter thickness is 1 micron, thickness 100 nanometers of resistance wire, pad thickness 850 nanometers, pressure 1.5 * 10
-2Mbar, 90 ℃ of working temperatures; The ratio of the nickel/chromium of foil gauge metal film is respectively 80% and 20%, experimental results show that this composition and alundum (Al have good affinity, foil gauge pin splash-proofing sputtering metal gold.
(5) external lead wire: with welding (bonding) gold thread between sensor signal processing circuit plate and the sensor.
Claims (8)
1, method for micro machining mini type multiple dimension force/moment sensor, it is characterized in that it carries out according to following step: (one) prepares insulation course: polishing is carried out on the sensor base surface, then sputter Al on matrix surface
2O
3Insulation course; (2) be coated with photoresists: at Al
2O
3The photographic layer of spraying on the insulation course, oven dry; (3) exposure: photographic layer is exposed, develops, cleans; (4) generate metal level:, form the foil gauge metal film at last in the enterprising row metal processing of sputter.
2, method for micro machining mini type multiple dimension force/moment sensor according to claim 1 is characterized in that thickness of insulating layer is 40~60 microns.
3, method for micro machining mini type multiple dimension force/moment sensor according to claim 1, the working temperature that it is characterized in that step 1 is 500~550 ℃.
4, method for micro machining mini type multiple dimension force/moment sensor according to claim 1, the thickness that it is characterized in that photographic layer is 60~70 microns.
5, method for micro machining mini type multiple dimension force/moment sensor according to claim 1 is characterized in that the time shutter is 30 minutes.
6, method for micro machining mini type multiple dimension force/moment sensor according to claim 1 is characterized in that the metal in the step 4 is nickel/evanohm or copper.
7, method for micro machining mini type multiple dimension force/moment sensor according to claim 6 is characterized in that the shared ratio of nickel/chromium is respectively 80% and 20% in nickel/evanohm.
8, method for micro machining mini type multiple dimension force/moment sensor according to claim 1 is characterized in that sputter thickness is 1 micron in the step 4, and the thickness of resistance wire is 100 nanometers, and pad thickness is 850 nanometers, and pressure is 1.5 * 10
-2Mbar, working temperature is 90 ℃.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200510009924 CN1687727A (en) | 2005-04-26 | 2005-04-26 | Method for micro machining mini type multiple dimension force/moment sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200510009924 CN1687727A (en) | 2005-04-26 | 2005-04-26 | Method for micro machining mini type multiple dimension force/moment sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1687727A true CN1687727A (en) | 2005-10-26 |
Family
ID=35305769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200510009924 Pending CN1687727A (en) | 2005-04-26 | 2005-04-26 | Method for micro machining mini type multiple dimension force/moment sensor |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1687727A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103542963A (en) * | 2013-10-24 | 2014-01-29 | 东南大学 | Variable-gain three-dimensional force sensor |
CN109084916A (en) * | 2018-09-27 | 2018-12-25 | 海伯森技术(深圳)有限公司 | Fixation device, method and the sensor of foil gauge in a kind of multi-dimension force sensor |
CN109682318A (en) * | 2018-12-19 | 2019-04-26 | 中国电子科技集团公司第四十八研究所 | A kind of engine blade dynamic strain measure sensor and manufacturing method |
CN114720028A (en) * | 2022-03-03 | 2022-07-08 | 陕西电器研究所 | Integrated multidimensional force sensor based on thin film sputtering technology |
-
2005
- 2005-04-26 CN CN 200510009924 patent/CN1687727A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103542963A (en) * | 2013-10-24 | 2014-01-29 | 东南大学 | Variable-gain three-dimensional force sensor |
CN103542963B (en) * | 2013-10-24 | 2015-10-07 | 东南大学 | A kind of three-dimensional force sensor of variable gain |
CN109084916A (en) * | 2018-09-27 | 2018-12-25 | 海伯森技术(深圳)有限公司 | Fixation device, method and the sensor of foil gauge in a kind of multi-dimension force sensor |
CN109084916B (en) * | 2018-09-27 | 2023-08-22 | 海伯森技术(深圳)有限公司 | Device and method for fixing strain gauge in multidimensional force sensor and sensor |
CN109682318A (en) * | 2018-12-19 | 2019-04-26 | 中国电子科技集团公司第四十八研究所 | A kind of engine blade dynamic strain measure sensor and manufacturing method |
CN114720028A (en) * | 2022-03-03 | 2022-07-08 | 陕西电器研究所 | Integrated multidimensional force sensor based on thin film sputtering technology |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1687727A (en) | Method for micro machining mini type multiple dimension force/moment sensor | |
US7313854B2 (en) | Method of manufacturing a tactile sensor | |
CN104649217B (en) | A kind of single-chip processing method of MEMS sensor | |
CN110487166B (en) | Preparation method of thin film strain sensor | |
CN101211773B (en) | Method for preventing chip back metal peeling | |
CN105300572A (en) | Piezoelectric-type flexible three-dimensional tactile sensing array and preparation method of same | |
CN109507451B (en) | Acceleration sensor chip based on molybdenum disulfide film and processing method thereof | |
KR20140017445A (en) | Method for producing a bonding pad for thermocompression bonding and bonding pad | |
CN106441650B (en) | A kind of diaphragm pressure sensor and preparation method | |
CN105908139A (en) | Laminated wiring film for electronic components and sputtering target material for forming coating layer | |
US20080251914A1 (en) | Semiconductor device | |
CN110849508B (en) | Flexible pressure sensor based on discrete contact structure and preparation method thereof | |
CN108132115A (en) | A kind of diaphragm pressure sensor chip and manufacturing method | |
JPS6321530A (en) | Force detector | |
JP2018054594A (en) | Contact type probe | |
JP2003042861A (en) | Solid type strain sensor | |
CA1178083A (en) | Measuring device using a strain gauge | |
Panas et al. | Non-lithographically-based microfabrication of precision MEMS nanopositioning systems | |
KR100735295B1 (en) | Fabrication method of flexible tactile sensor using polymer film | |
Knutti | Finding markets for microstructures | |
TWI625228B (en) | A roll-to-roll sputtering process with a hybrid target and a product thereof | |
CN202957229U (en) | Calibration device | |
CN107265398A (en) | The silicon that is etched based on mechanical scratching and metal catalytic is micro-/micro-nano structure preparation method | |
CN220933002U (en) | High-reliability MEMS acceleration sensor connection structure | |
Chow et al. | Wafer-level packaging with soldered stress-engineered micro-springs |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |