CN1665356A - Organic EL board manufacture method, organic EL board - Google Patents
Organic EL board manufacture method, organic EL board Download PDFInfo
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- CN1665356A CN1665356A CN 200510051514 CN200510051514A CN1665356A CN 1665356 A CN1665356 A CN 1665356A CN 200510051514 CN200510051514 CN 200510051514 CN 200510051514 A CN200510051514 A CN 200510051514A CN 1665356 A CN1665356 A CN 1665356A
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Abstract
A manufacturing method of organic EL panel and an organic EL panel, aimed to remove outgas generated from an adhesive out of a sealing space in a pasting process. This is the organic EL panel 1 in which an organic EL element 10 is formed on a support substrate 11, and the sealing space M to seal the organic EL element 10 is formed by pasting the support substrate 11 and a sealing member 15 at the adhering part, and at least either the support substrate 11 or the sealing member 15 is provided with an opening part 20 to penetrate through the sealing space M and an outside part of the organic EL panel 1, and after the support substrate 1 and the sealing member 15 are laminated, gas in the sealing space M is discharged via the opening part 20, and after this discharging, the opening part 20 is occluded by adjusting pressure in the sealing space M.
Description
Technical field
The present invention relates to a kind of manufacture method, organic EL panel of organic EL panel.
Background technology
Organic EL (electroluminescence) panel forms the organic EL that is contained the organic material layer of light emitting functional layer by the pair of electrodes clamping on supporting substrate, this organic EL as the luminous key element of face, is arranged the single or multiple viewing areas that form with it.In this organic EL panel, organic material layer or electrode are exposed to extraneous air state following time, the characteristics of luminescence meeting deterioration of organic EL, so it is must be obligato that the sealing unit that organic EL and extraneous air are completely cut off is set, general employing adhesive seal parts on the supporting substrate that forms organic EL cover it, form the method for the seal cavity of sealing organic el element between supporting substrate and seal member.
Fig. 1 is the key diagram (with reference to following patent documentation 1) of an example of this prior art of expression.According to this technology, at first shown in this figure (a), at the last formation of glass substrate (supporting substrate) J1 organic EL J0, on glass substrate J1, adhesive-applying J2 around this organic EL J0 under this state, is placed on seal member J3 on the glass substrate J1.And, shown in this figure (b),, further push seal member J3 bonding agent J2 extended with bonding glass substrate J1 of bonding agent J2 and seal member J3.Like this, compare, can be held in high pressure to the pressure in the seal cavity that is formed between glass substrate J1 and the seal member J3, the harmful composition of organic EL J0 is entered in the seal cavity from the outside by bonding agent J2 so can prevent moisture etc. with the outside.
Patent documentation 1 spy opens the 2001-210465 communique
According to above-mentioned prior art, can suppress moisture etc. really and enter in the seal cavity by bonding agent from the outside of seal member.But, bonding agent has the character that produces the distinctive emergent gas of organic substance, and the medial surface of bonding agent so the emergent gas that produces from bonding agent after sealing enters in the seal cavity, brings harmful effect will for the inscape of organic EL facing to seal cavity.
Said herein emergent gas is meant when bonding agent solidifies or solidifies the escaping gas that the back produces, and mainly produces reason as it, thinks to be added on solvent in the bonding agent when bonding agent solidifies or solidify the back gasification and effusion.This emergent gas is to produce at the sealing process to the supporting substrate adhesive seal parts of glass substrate etc., thus not only can't solve from panels outside, and can't solve in the processing before sealing process.Therefore, in the past in order to remove this emergent gas, except in advance the inner face of seal member is provided with GAS ABSORPTION parts etc., there is not effective solution, if a large amount of GAS ABSORPTION parts are set in order to remove emergent gas fully, then the plate thickness thickening will be produced, the problem of slimming requirement can not be satisfied.
On the other hand, the emergent gas of bonding agent is generally considered to be precise electronic parts and semiconductor element etc. is brought harmful effect, in order to prevent this point, is developing the bonding agent of various low emergent gass.But the bonding agent of low emergent gas may not have strong bonding force and low-moisture permeability, so if depend on this bonding agent, then produce the situation that can not obtain effective sealing effectiveness of organic EL.And the bonding agent of low emergent gas is generally relatively more expensive, so even developed the bonding agent that has both strong bonding force and low-moisture permeability, if use this bonding agent in a large number, then produce the problem that the manufacturing cost of organic EL panel significantly rises.
And, in the seal cavity of organic EL panel, disposing various resin beds such as dielectric film or colour filter sometimes, the emergent gas that produces from the initial stage of these resin beds after sealing also can bring harmful effect to organic EL.But, owing to can not address this problem by the improvement to above-mentioned bonding agent, so need work out a kind of countermeasure, fundamentally to eliminate emergent gas.
And under the situation of the maximization of considering organic EL panel, the use amount of the bonding agent of each panel etc. increases, and is important very important problem for the performance that improves organic EL panel so eliminate the countermeasure of this emergent gas.
Summary of the invention
The present invention will address the above problem as a problem.Promptly, the objective of the invention is, fundamentally eliminate from the bonding agent of bonding supporting substrate and seal member or be configured in the emergent gas that other resin beds in the seal cavity produce, avoid the performance degradation of the organic EL that causes because of this emergent gas, bonding agent as bonding supporting substrate and seal member, both adopted the bonding agent of essential attributes with strong bonding force and low-moisture permeability etc., can effectively avoid the performance degradation of the above-mentioned organic EL that causes because of emergent gas again, and can not cause the above-mentioned advantage of performance under the condition that significantly rises of cost, and large-scale panel is being proposed a kind of countermeasure of effective elimination emergent gas again.
In order to achieve the above object, the present invention possesses the structure of the following invention at least.
The manufacture method of organic EL panel of the present invention, on supporting substrate, form organic EL, clamping contains the organic material layer of organic EL light emitting functional layer at least between the pair of electrodes of this organic EL, by forming the seal cavity that seals described organic EL at bonding this supporting substrate of adhesive portion and seal member, it is characterized in that, at least one side of described supporting substrate and described seal member has the peristome that connects described seal cavity and described organic EL panel outside, comprising: the bonding process of bonding described supporting substrate and described seal member; By the deairing step of described peristome with the discharge of the gas in the described seal cavity; With behind this deairing step, operation is stopped up in pressure pressure regulation in the described seal cavity and the peristome that stops up described peristome.
The manufacture method of organic EL panel of the present invention, on supporting substrate, form organic EL, clamping contains the organic material layer of organic EL light emitting functional layer at least between the pair of electrodes of this organic EL, by forming the seal cavity that seals described organic EL at bonding this supporting substrate of adhesive portion and seal member, it is characterized in that, at least one side of described supporting substrate and described seal member has the peristome that connects described seal cavity and described organic EL panel outside, comprising: the bonding process of bonding described supporting substrate and described seal member in vacuum atmosphere; With behind this bonding process, operation is stopped up in pressure pressure regulation in the described seal cavity and the peristome that stops up described peristome.
Organic EL panel of the present invention, on supporting substrate, be formed with organic EL, clamping has the organic material layer that contains organic EL light emitting functional layer at least between the pair of electrodes of this organic EL, this supporting substrate and seal member are bonded in adhesive portion, and be formed with the seal cavity of the described organic EL of sealing, it is characterized in that at least one side of described supporting substrate and described seal member has peristome that connects described seal cavity and described organic EL panel outside and the plugging material that stops up this peristome.
Description of drawings
Fig. 1 is the key diagram of prior art.
Fig. 2 is the key diagram of the organic EL panel of embodiment of the present invention.
Fig. 3 is the key diagram (process flow) of manufacture method of the organic EL panel of expression embodiment of the present invention.
Fig. 4 is the key diagram of the bonding process of expression embodiment of the present invention.
Fig. 5 is the key diagram of the deairing step of expression embodiment of the present invention.
Fig. 6 is the key diagram of the pressure regulation operation of expression embodiment of the present invention.
Fig. 7 is the key diagram that the peristome of expression embodiment of the present invention stops up operation.
Fig. 8 is the key diagram (process flow) of manufacture method of the organic EL panel of expression the present invention other execution modes.
Fig. 9 is the expression embodiments of the invention key diagrams of (being used for specifically implementing the equipment formation example of manufacture method).
Among the figure: 1 organic EL panel; 10 organic ELs; 11 supporting substrates; 12 the 1st electrodes; 13 the 2nd electrodes; 14 organic material layers; 15 seal members; 15 bond layers; 17 drying parts; 18 dielectric films; 11S, 15S adhesive portion; 20 peristomes; 21 plugging materials; 19 next doors; 30 gas-tight silos; 31 gas feed paths; 32 exhaust pathways; 33 vacuum pumps; 40 evaporation engineering departments; 41 supporting substrates are delivered the chamber; 42 Seal portions; 43 seal member preparatory construction portions; 44 seal members are delivered the chamber; Bonding chambers 45; 46 exhaust surge chambers; 47 panels counter-rotating chamber; 48 plugging material drip chamber; 49 plugging material curing rooms; 50 take out the chamber; The D instillator; The M seal cavity; Go
1, Go
2, Go
3, Go
1～Go
10Door.
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.Fig. 2 is the key diagram (fragmentary cross-sectional view) of the organic EL panel of expression an embodiment of the present invention.The organic EL panel 1 of this execution mode, on supporting substrate 11, be formed on pair of electrodes (the 1st electrode 12, the 2nd electrode 13) clamping contains the organic material layer 14 of organic EL light emitting functional layer at least (herein by hole transporting layer 14A between, luminescent layer 14B, electron supplying layer 14C formation) (the 1st electrode 12 is insulated film 18 and divides organic EL 10, in a unit that is divided, form organic EL 10), at adhesive portion (11S: supporting substrate side, 15S: the seal member side) by bond layer 16 bonding supporting substrate 11 and seal members 15, thus the seal cavity M of formation sealing organic el element 10.As required drying part 17 can be set at the inner face of seal member 15.
And in the organic EL panel 1 of this execution mode, seal member 15 has the peristome 20 that connects seal cavity M and organic EL panel 1 outside, has the plugging material 21 that stops up this peristome 20 simultaneously.In illustrated example, form peristome 20 at seal member 15, but this peristome 20 also can be located at supporting substrate 11 sides, and can be arranged on supporting substrate 11 sides and seal member 15 side both sides.As long as this peristome 20 has the function that the gas outside gas in the seal cavity M and the seal cavity M can be replaced, the size of peristome 20 or shape or quantity can be set arbitrarily, but require finally can guarantee by plugging material 21 air-tightness of seal cavity M.
Organic EL panel according to this execution mode, the manufacture method of organic EL panel shown below can be realized, the performance degradation (symbol of the symbol corresponding diagram 2 of the each several part of the organic EL panel in the following description) of the organic EL 10 in the seal cavity M can be prevented to be configured in thus.
Fig. 3 is the key diagram (process flow) of manufacture method of the organic EL panel of explanation embodiment of the present invention.In the manufacture method of the organic EL panel of embodiment of the present invention, at first, the element of supporting substrate 11 being implemented organic EL 10 forms operation (operation S11), and parallel therewith, seal member 15 is implemented the processing of seal member 15 or the preparatory process such as installation (operation S12) of drying part 17.Become above-mentioned peristome 20 at supporting substrate 11 and seal member 15 at least one square in advance herein.
And, at least one side's adhesive-applying at the adhesive portion 15S of the adhesive portion 11S of supporting substrate 11 or seal member 15, form bond layer 16 (operation S13 or S13 '), by bonding supporting substrate 11 and seal member 15 (bonding process: S14), form the seal cavity M of sealing organic el element 10.
Then, through the deairing step (operation S15) of the gas in the seal cavity M being discharged by peristome 20, the pressure regulation operation (operation S16) of regulating the pressure in the seal cavity M afterwards at this deairing step (operation S15), utilize the peristome of plugging material 21 occlusion of openings portions 20 to stop up operation (operation S17), can obtain above-mentioned organic EL panel 1.
Below, illustrate in greater detail the later operation of bonding process (operation S14) (giving same-sign and clipped explanation) in conjunction with Fig. 4～Fig. 7 with the part that above-mentioned explanation repeats.The key diagram of the bonding process (operation S14) when Fig. 4 is the expression single sided board.In this bonding process (operation S14), either party or both sides' adhesive-applying at the adhesive portion 15S of the adhesive portion 11S of the supporting substrate 11 that forms element or seal member 15 form bond layer 16, and be by this bond layer 16 that both are bonding.
Below, the formation of the organic EL 10 on the simple declaration supporting substrate 11 shown in Figure 4 and element form operation (operation S11).Carrying out at first forming the 1st electrode 12 on the pretreated supporting substrates 11 such as cleaning, grinding, coating, and carrying out figure processing.By the processing of this figure, simultaneously that the part of the lead-out wiring 13A of the lead-out wiring 12A of the 1st electrode and the 2nd electrode is graphical.Then, form dielectric film 18, and carry out figure processing, dividing the light-emitting zone of each organic EL 10, for the banded pattern, orthogonal of the 1st electrode 12, separate the interval of above-mentioned light-emitting zone, on dielectric film 18, form the banded figure in next door 19.Then, form above-mentioned organic material layer 14 and the 2nd electrode 13.
In the bonding agent cured that forms bond layer 16 at last of bonding process (operation S14), change the deairing step (operation S15) of back then over to.Ultraviolet curable resin is being used as under the situation of bonding agent, by carry out the cured of bonding agent when seal member 15 is transparent component to adhesive portion 11S (also can be adhesive portion 15S) irradiation ultraviolet radiation.If do not carrying out reliable cured and emergent gas is carried out after bonding agent is discharged, the meaning of later deairing step (operation S15) will reduce by half.
Fig. 5 is the key diagram of the concrete example of expression deairing step (operation S15).This deairing step (operation S15) be the panel configuration of bonding supporting substrate 11 and seal member 15 in gas-tight silo (container) 30, carry out vacuumizing in the sealing storehouse 30.
The gas-tight silo 30 of example is communicated with gas feed path 31 with valve 31A and the exhaust pathway 32 with valve 32A, under the state of shut off valve 31A, open valve 32A, make vacuum pump 33 actions that connect by exhaust pathway 32, carry out vacuumizing thus gas-tight silo 30 inside.
Like this, the seal cavity M inside of the atmosphere gas by 30 inside, peristome 20 communication seals storehouses be carried out and gas-tight silo 30 in identical decompressions, thus the gas in the seal cavity M is discharged to gas-tight silo 30 outsides, so the emergent gas that produces from bonding agent at above-mentioned bonding process (operation S14) or be present in other pernicious gas compositions in the seal cavity M (becoming the composition of deterioration factor of the inscape of organic EL) originally in sealing and be discharged to seal cavity M outside.
Fig. 6 is the key diagram that is illustrated in the concrete example of the pressure regulation operation (operation S16) that above-mentioned deairing step (operation S15) carries out afterwards.This pressure regulation operation (operation S16) is filled inert gas by peristome 20 afterwards at deairing step (operation S15) in seal cavity M, thereby carries out the pressure regulation in the seal cavity M.
Promptly, in this pressure regulation operation (operation S16), under the state of the valve 32A that closes gas-tight silo 30, open valve 31A, by gas feed path 31 inert gas is entered in the gas-tight silo 30, this inert gas of filling in by the seal cavity M of the atmosphere gas in the peristome 20 communication seals storehouses 30 is adjusted into atmospheric pressure with the pressure in the seal cavity M or more than it.As inert gas, can use the pyrophorisity gas O that contains 2～3 volume %
2Deng N
2, Ar etc. gas etc.
Fig. 7 is illustrated in the key diagram that peristome that above-mentioned pressure regulation operation (operation S16) carries out afterwards stops up the concrete example of operation (operation S17).Stop up operation (operation S17) at this peristome, make the bonding panel counter-rotating that finishes, the peristome 20 of top opening is provided with drip chambers D relatively, and instillation plugging material 21 on peristome 20 solidifies the air-tightness of guaranteeing seal cavity M by making this plugging material 21., form at the same time under the situation of a plurality of panels herein, increase the cutting action of panel in obstruction operation (operation S17) afterwards.
Can obtain above-mentioned organic EL panel 1 by above operation.Manufacture method according to the organic EL panel of embodiment of the present invention with these operations, can fundamentally remove from the bonding agent of bonding supporting substrate 11 and seal member 15 or be configured in the emergent gas that the gas resin bed in the seal cavity M produces, can prevent the performance degradation of the organic EL 10 that causes because of this emergent gas.
Fig. 8 is the key diagram (process flow) of manufacture method of the organic EL panel of expression other execution modes of the present invention.In the manufacture method of the organic EL panel that this execution mode relates to, identical with above-mentioned execution mode, the element of supporting substrate 11 being implemented organic EL 10 forms operation (operation S21), and parallel therewith, seal member 15 is carried out the processing of seal member 15 or the preparatory process such as installation (operation S22) of drying part 17.Become above-mentioned peristome 20 at supporting substrate 11 and seal member 15 at least one square in advance herein.
And, at least one side's adhesive-applying at the adhesive portion 15S of the adhesive portion 11S of supporting substrate 11 or seal member 15 forms bond layer 16 (operation S3 or S3 '), carry out the bonding process S24 of bonding supporting substrate 11 and seal member 15, but in this embodiment, under vacuum atmosphere, carry out this bonding process S24.Promptly, become bond layer 16 at supporting substrate 11 and seal member 15 at least one square, they are moved in the vacuum tank, carry out bonding (perhaps, can in vacuum tank, carry out the formation of bond layer 16 and bonding) of supporting substrate 11 and seal member 15 by the operation in this vacuum tank.
And,, keep vacuum state up to the cured of finishing bonding agent at bonding process S24.Thus, carry out the deairing step (with reference to Fig. 5) of above-mentioned execution mode simultaneously.Then, carry out pressure regulation operation identical (operation S25 :) and peristome and stop up operation (operation S26 :), can obtain above-mentioned organic EL panel 1 with reference to Fig. 7 and declaratives thereof with reference to Fig. 6 and declaratives thereof with above-mentioned execution mode.
Manufacture method according to the organic EL panel of this execution mode, in bonding process S24, in the emergent gas in removing seal cavity M, the bond layer 16 that will be formed on supporting substrate 11 or the seal member 15 before bonding is exposed under the vacuum atmosphere, and (removing the bubble in the bond layer) handled in the deaeration that can carry out bond layer 16 thus.Therefore, on the basis of the effect of removing emergent gas, obtain further to improve bonding adhesive strength and bubble-tight effect.In addition, it is poor to eliminate the panel external and internal pressure, so also have the effect that prevents the bonding agent distortion.
Fig. 9 is the example (embodiment) that the equipment of the manufacture method that constitutes of the concrete process flow of implementing by above-mentioned Fig. 3 of expression constitutes.It is to form the equipment that has bubble-tight space at least that evaporation engineering department 40, supporting substrate deliver that chamber 41, Seal portion 42, seal member preparatory construction portion 43, seal member deliver chamber 44, bonding chamber 45, exhaust surge chamber 46, panel counter-rotating chamber 47, plugging material drip chamber 48, plugging material curing room 49, take out chamber 50, and can carry out as required from the high vacuum state to the atmospheric pressure state or the pressure adjustment of pressurized state.And, door Go
1, Go
2, Go
3, Go
1～Go
10Be used for forming material transport path to each engineering department or each chamber by discharging airtight conditions.In Fig. 9, solid arrow is represented the transport path of supporting substrate 11, and dotted arrow is represented the transport path of seal member 15, and the doublet arrow is represented the transport path of the bonding panel that finishes.
Evaporation engineering department 40 has single or multiple deposited chambers and conveying device, is the equipment that can form high vacuum state.Herein, from door Go
1Moving into Surface Machining has on the supporting substrate 11 of the 1st electrode 12 and lead-out wiring 12A, 13A figure, forms organic material layer 14 and the 2nd electrode 13, implements above-mentioned element formation operation (operation S11).Form in supporting substrate 11 sides under the situation of peristome 20, the supporting substrate 11 that forms peristome 20 in advance in the position of regulation is moved into evaporation engineering department 40.
Deliver chamber 41 at supporting substrate, under high vacuum state, open a G
1Move into supporting substrate 11, close a G then
1Make the indoor atmospheric pressure state that becomes, open a G
2Take out of supporting substrate 11.
In Seal portion 42, under atmospheric pressure state, to passing through a door G
2The supporting substrate of moving into 11 is implemented necessary processing, and this supporting substrate 11 is passed through a door G
5Be transported to bonding chamber 45.
On the other hand, in seal member preparatory construction portion 43, from door G
02Move into seal member 15, under atmospheric pressure state, carry out the seal member preparatory process (operation S12) such as installation of drying part 17.And,, on adhesive portion 15S, form bond layer 16 in sealing parts preparatory construction portion 43.Form in seal member 15 sides under the situation of peristome 20 in hope, the seal member 15 that has formed peristome 20 in advance on the position of regulation is moved in the seal member preparatory construction portion 43.
Deliver chamber 44 at seal member, by door G
3Move into seal member 15, make the indoor high vacuum state that becomes, the bond layer 16 that is formed on the seal member 15 is carried out the deaeration processing.Then, make indoor recovery atmospheric pressure state, by door G
4Seal member 15 is moved in the Seal portion 42, after implementing necessary processing, sealing parts 15 are passed through a door G
5Be transported to bonding chamber 45.
In bonding chamber 45, under atmospheric pressure state, carry out above-mentioned bonding process (operation S14).Then, oneself bonding panel that finishes is carried out the cured of bonding agent in bonding chamber 45 or Seal portion 42, then, by door G
6Be moved to exhaust surge chamber 46.At this exhaust surge chamber 46, make the indoor high vacuum state that becomes for the time being, implement above-mentioned deairing step (operation S15), make the indoor for example N that becomes then
2Atmosphere is implemented above-mentioned pressure regulation operation (operation S16).
The bonding panel that finishes of finishing pressure regulation operation (operation S16) is by door G
7Be moved to panel counter-rotating chamber 47, carry out the counter-rotating (form in seal member 15 sides under the situation of peristome 20, make seal member 15 be upside) of panel herein, by door G
8Be moved to plugging material drip chamber 48.In plugging material drip chamber 48, under atmospheric pressure utilize drip chambers D shown in Figure 7 to carry out the instillation of plugging material 21, plugging material 21 is filled on the peristome 20.Herein, panel counter-rotating chamber 47 and plugging material drip chamber 48 all are retained as the N2 atmosphere after the pressure regulation operation (operation S16), before plugging material 21 is filled on the peristome 20 during, gas is not entered in the seal cavity M.
Then, the panel that plugging material 21 is filled on the peristome 20 passes through a door G
9Be transported to plugging material curing room 49, under atmospheric pressure carry out the cured of plugging material 21, finish above-mentioned peristome and stop up operation (operation S17).Peristome 20 blocked panels pass through a door G
10Be moved to and take out chamber 50.Taking out chamber 50, taking off panel and from door G from Handling device
3Take out of, but owing to when taking out of panel, be the extraneous gas opened state, thus for fear of moisture etc. attached on the Handling device, after taking out of panel, vacuumize, carry out the transfer of Handling device then.
According to the organic EL panel 1 that the manufacture method of above-mentioned organic EL panel is made, can be after sealing process, behind sealing process, discharging from seal cavity M from the emergent gas of generations such as bonding agent.Therefore, at the emergent gas of bonding agent that before this can't be corresponding except GAS ABSORPTION parts such as drying part are set in seal cavity M etc., can fundamentally it be got rid of from seal cavity M.So, can make the drying part that in the past was installed in the seal cavity M etc. GAS ABSORPTION quantity as far as possible less or do not have, can effectively advance the slimming of organic EL panel 1.
And, can in seal cavity M, remove the emergent gas that produces later at sealing process substantially fully, so can avoid the performance degradation of the organic EL 10 that causes because of this emergent gas, can improve the performance of organic EL panel 1 and increase the service life.
In addition, according to this manufacture method,,, obtain organic EL panel 1 firm and that air-tightness is high so can select the bonding agent of strong cementability or low-moisture permeability owing to do not limit the kind of the bonding agent of bonding process (operation S14, S24) use.
And, at the large-scale organic EL panel 1 that when bonding, uses a large amount of bonding agents, also can implement effectively to eliminate the emergent gas countermeasure, can obtain not have the long-life large-scale panel of performance degradation.
Below, be described more specifically the organic EL panel 1 of embodiment of the present invention and the detailed content of manufacture method thereof.
A. supporting substrate:
Supporting substrate 11 as organic EL panel 1 can use glass, plastics, quartz, metal etc.As mode (bottom shoot mode) from supporting substrate 11 side-draw bright dippings, preferably have transparent tabular, laminar, its material can be used glass or plastics etc.
B. electrode:
The 1st electrode the 12, the 2nd electrode 13 1 sides are set to negative electrode, and the opposing party is set to anode.Anode-side is made of the material that work function is higher than negative electrode, can use the nesa coating of chromium (Cr), molybdenum (Mo), nickel (Ni), platinum metal films such as (Pt) or oxidized metal films such as ITO, IZO etc.To this, cathode side is made of the material that work function is lower than anode, can use work functions such as alkali metal (Li, Na, K, Rb, Cs), alkaline-earth metal (Be, Mg, Ca, Sr, Ba), rare earth metal low metal, its compound or contain their alloy, polyaniline that has mixed or the noncrystalline semiconductors such as polyphenylacetylene that mixed, Cr
2O
3, NiO, Mn
2O
5Deng oxide.In addition, under the situation that the 1st electrode the 12, the 2nd electrode 13 constitutes by transparent material, reflectance coating is set in the electrode side opposite with the emitting side of light.
C. organic material layer
Organic material layer 14 is made of the organic compound material layer that single or multiple lift has organic EL light emitting functional layer at least, and layer structure can form any form.Generally as shown in Figure 2, can use from the combining structure of anode-side towards cathode side lamination hole transporting layer 14A, luminescent layer 14B, electron supplying layer 14C, not only multilayer laminated hole transporting layer 14A, luminescent layer 14B, the electron supplying layer 14C of one deck also can be set respectively, can also omit hole transporting layer 14A and any one deck of electron supplying layer 14C, also can two-layerly all omit.In addition, can insert the organic material layer of hole injection layer, electron injecting layer etc. according to purposes.Hole transporting layer 14A, luminescent layer 14B, electron supplying layer 14C can suitably select the material (can be macromolecular material or low molecular material) that in the past used.
In addition, as the luminescent material that forms luminescent layer 14B, can be the material that presents luminous (fluorescence) when singlet exciton state returns ground state, also can be the material that presents luminous (phosphorescence) when ternary exciton state returns ground state.
D. seal member
The organic EL panel 1 of embodiment of the present invention uses seal member 15 sealing organic el elements 10 such as metallic, glass, plastics system.Seal member 15 can use by carry out processing such as drawing, etching, blasting treatment on the glass hermetic sealing substrate and form the parts of sealing with recess (one-level is recessed or two-stage is recessed), perhaps use plate glass, utilize glass (plastics also can) system sept, make the seal member of between plate glass and supporting substrate 11 formation seal cavity M etc.
E. adhesive linkage
The bonding agent that forms adhesive linkage 16 can use bonding agents such as thermohardening type, chemosetting type (solvent pairs mixing), light (ultraviolet ray) curing type, and its material can use acrylic resin, epoxy resin, polyester, polyolefin etc.Especially preferably use the ultraviolet hardening epoxy resin adhesive.
F. drying part
Drying part 17 can use following drier to form: physical dryness agent such as zeolite, silica gel, carbon, carbon nano-tube; Chemical driers such as alkali metal oxide, metal halide, chlorine peroxide; In petroleum-type solvents such as toluene, dimethylbenzene, aliphat organic solvent, dissolved the drier of metal-organic complex; Desiccant particle is dispersed in drier in the adhesives such as the polyethylene, polyisoprene with transparency, poly-meat silicic acid vinyl acetate etc.
G. the variety of way of panel
Organic EL panel 1 as embodiment of the present invention, can form the display floater of passive drive mode that selection shown in Fig. 2,4 drives the 1st, the 2nd electrode of banded quadrature, perhaps can form the display floater that utilizes TFT (thin-film transistor) to drive the active type of drive of pixel electrode.And, can be that monochromatic the demonstration also can be multicolor displaying, but in order to form the multicolor displaying panel, can utilize branch to be coated with mode, with colour filter or be combined to mode (the CF mode of monochromatic organic EL 10 such as white or blueness by the color conversion layer that fluorescent material forms, the CCM mode), by the multicolor luminous modes (photochromic mode) of realization such as light-emitting zone irradiation electromagnetic wave to monochromatic light emitting functional layer, with 2 looks or form the mode (operation SOLED (transparent stacker OLED) mode) etc. of a pixel more than the sub-pixel of 2 looks vertical lamination, form full color organic EL panel or broken colour organic EL panel.And, as the organic EL panel of embodiment of the present invention, can be the bottom shoot mode that penetrates light from the display panel substrate side, also can be from penetrating the top shoot mode of light with the opposition side of display panel substrate.
H. concrete manufacture method example
On glass supporting substrate 11, will form films by methods such as evaporation, sputters, and utilize photoetching process etc. to form desirable shape as the 1st electrode 12 of the ITO of anode etc.
In order on the 1st electrode 12, to divide the light-emitting zone of organic EL 10, form by polyimides, SiN, SiO
2Dielectric film 18 Deng insulating material constitutes forms banded next door 19 in the direction with the 1st electrode 12 quadratures on this dielectric film 18.The purpose that this next door 19 is based on the effect of each line electricity insulation of the 2nd adjacent electrode 13 or performance mask forms, and is preferably formed to having down trapezoidal cross-section.And, when forming the 2nd electrode 13, utilizing other masks etc. to carry out also next door 19 can not being set under the situation of figure processing.
Then, utilize the wet process of printing processes such as coating processs such as whirl coating, infusion process, silk screen print method, ink-jet method etc. or the dry process of vapour deposition method, laser transfer method etc. to form organic layer.Specifically, each material by evaporation order lamination hole transporting layer 14A, luminescent layer 14B, electron supplying layer 14C.
Be coated with in the mode at above-mentioned branch, use the film forming mask when forming luminescent layer 14B, the branch that carries out luminescent layer 14B according to multiple glow color is coated with.Dividing when being coated with, forming the luminous organic material that presents RGB three colors or the composition of a plurality of organic materials respectively, forming luminescent layer 14B at the pixel region that belongs to RGB.Utilize same material to form more than twice at place's pixel region, can prevent the not formation of pixel region thus.
Then, for the 1st electrode 12 quadratures, utilize the metallic film become negative electrode to make the 2nd electrode 13 form the multi-ribbon shape, form organic EL 10 in the intersection region that is forming the 1st rectangular electrode 12 and the 2nd electrode 13.The 2nd electrode 13 utilizes methods such as evaporation or sputter to form.
Then, by bond layer 16 bonding supporting substrate 11 and seal members 15.This bonding process is: the particle diameter that mixes an amount of (about 0.1～0.5 weight %) is the spacer (preferred glass or plastic spacer) of 1～300 μ m, and use drip chambers D etc. is coated in adhesive portion 11S (15S).Then, under inert gas atmosphere such as argon gas, make seal member 15 by bonding agent contact supporting substrate 11.Afterwards, to the bonding agent irradiation ultraviolet radiation, bonding agent is solidified from supporting substrate 11 sides (or seal member 15 sides).
After the sealing process of this organic EL 10, organic EL panel 1 is moved in the container that vacuumizes (decompression), the emergent gas in the seal cavity M is discharged (deairing step) by peristome 20.And inclosure contains the inert gases such as argon gas of the non-flammable gases of 2～3 volume % in seal cavity M, with seal cavity M internal pressure-regulating (pressure regulation operation).At last, occlusion of openings portion 20 (peristome obstruction operation) obtains above-mentioned organic EL panel 1.
Manufacture method and organic EL panel about the organic EL panel of embodiment of the present invention generally speaking, have following feature.
(1) at bonding process, even the emergent gas that produces from the bonding agent of bonding supporting substrate 11 and seal member 15 enters in the seal cavity M, by the deairing step that behind bonding process, carries out, also can emergent gas be removed from seal cavity M by peristome 20.
(2) after deairing step, in making seal cavity M, the pressure regulation operation forms suitable pressure state, be difficult for entering state in the seal cavity M so form at occlusion of openings portion 20 back extraneous gass.
(3) because the amount of the plugging material 21 of occlusion of openings portion 20, the amount of the bonding agent that uses during with seal member 15 with bonding supporting substrate 11 is compared seldom, even, also its influence can be suppressed at Min. when plugging material 21 solidifies so the emergent gas that produces enters in the seal cavity M.
(4) vacuumizing in the gas-tight silo by having disposed the bonding panel that finishes 30 are implemented deairing step, and the equipment that can directly adopt the manufacturing process at existing organic EL panel to use thus carries out deairing step.And, after being vacuumized, the sealing storehouse make internal ambience form inert gas atmosphere, can implement in seal cavity M, to fill the pressure regulation operation of inert gas thus simply.
(5) and, after deairing step, in seal cavity M, fill inert gas by peristome 20, be difficult for entering state in the seal cavity M so can be formed in harmful components such as occlusion of openings portion 20 back moisture.
(6) in vacuum atmosphere, in the execution mode of bonding supporting substrate 11 and seal member 15, carry out above-mentioned deairing step, so can simplify working process in the operation identical with bonding process.And bonding preceding bond layer 16 is exposed under the vacuum atmosphere, also has the advantage of the deaeration processing that can carry out bond layer 16 simultaneously.
Claims (6)
1. the manufacture method of an organic EL panel, on supporting substrate, form organic EL, clamping contains the organic material layer of organic EL light emitting functional layer at least between the pair of electrodes of this organic EL, by forming the seal cavity that seals described organic EL at bonding this supporting substrate of adhesive portion and seal member, it is characterized in that
At least one side of described supporting substrate and described seal member has the peristome that connects described seal cavity and described organic EL panel outside,
Comprise:
The bonding process of bonding described supporting substrate and described seal member;
By the deairing step of described peristome with the discharge of the gas in the described seal cavity; With
Behind this deairing step, operation is stopped up in pressure pressure regulation in the described seal cavity and the peristome that stops up described peristome.
2. the manufacture method of organic EL panel according to claim 1 is characterized in that, described deairing step is the panel of the bonding described supporting substrate of configuration and described seal member in gas-tight silo, by carrying out vacuumizing in the sealing storehouse.
3. the manufacture method of organic EL panel according to claim 1 and 2 is characterized in that, behind described deairing step, carries out described pressure regulation by filling inert gas from described peristome in described seal cavity.
4. the manufacture method of an organic EL panel, on supporting substrate, form organic EL, clamping contains the organic material layer of organic EL light emitting functional layer at least between the pair of electrodes of this organic EL, by forming the seal cavity that seals described organic EL at bonding this supporting substrate of adhesive portion and seal member, it is characterized in that
At least one side of described supporting substrate and described seal member has the peristome that connects described seal cavity and described organic EL panel outside,
Comprise:
The bonding process of bonding described supporting substrate and described seal member in vacuum atmosphere; With
Behind this bonding process, operation is stopped up in pressure pressure regulation in the described seal cavity and the peristome that stops up described peristome.
5. the manufacture method of organic EL panel according to claim 4 is characterized in that, behind described deairing step, carries out described pressure regulation by filling inert gas from described peristome in described seal cavity.
6. organic EL panel, on supporting substrate, be formed with organic EL, clamping has the organic material layer that contains organic EL light emitting functional layer at least between the pair of electrodes of this organic EL, this supporting substrate and seal member are bonded in adhesive portion, and be formed with the seal cavity of the described organic EL of sealing, it is characterized in that
At least one side of described supporting substrate and described seal member has peristome that connects described seal cavity and described organic EL panel outside and the plugging material that stops up this peristome.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004062484A JP2005251631A (en) | 2004-03-05 | 2004-03-05 | Manufacturing method of organic el panel and organic el panel |
| JP2004062484 | 2004-03-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1665356A true CN1665356A (en) | 2005-09-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510051514 Pending CN1665356A (en) | 2004-03-05 | 2005-03-01 | Organic EL board manufacture method, organic EL board |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2005251631A (en) |
| CN (1) | CN1665356A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107887528A (en) * | 2017-11-03 | 2018-04-06 | 合肥福映光电有限公司 | A kind of OLED display method for packing |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007234499A (en) * | 2006-03-03 | 2007-09-13 | Seiko Epson Corp | Organic el panel, gas exchange device, organic el device, and electronic equipment |
-
2004
- 2004-03-05 JP JP2004062484A patent/JP2005251631A/en not_active Withdrawn
-
2005
- 2005-03-01 CN CN 200510051514 patent/CN1665356A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107887528A (en) * | 2017-11-03 | 2018-04-06 | 合肥福映光电有限公司 | A kind of OLED display method for packing |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005251631A (en) | 2005-09-15 |
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