CN1658736A - 电路装置 - Google Patents
电路装置 Download PDFInfo
- Publication number
- CN1658736A CN1658736A CN2005100081230A CN200510008123A CN1658736A CN 1658736 A CN1658736 A CN 1658736A CN 2005100081230 A CN2005100081230 A CN 2005100081230A CN 200510008123 A CN200510008123 A CN 200510008123A CN 1658736 A CN1658736 A CN 1658736A
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- China
- Prior art keywords
- framework
- circuit arrangement
- semiconductor element
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 109
- 239000000463 material Substances 0.000 claims abstract description 26
- 239000007767 bonding agent Substances 0.000 claims description 28
- 239000011148 porous material Substances 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 14
- 238000007789 sealing Methods 0.000 description 10
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- 238000010586 diagram Methods 0.000 description 3
- 230000037361 pathway Effects 0.000 description 3
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- 238000009736 wetting Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 241001062009 Indigofera Species 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
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- 230000003321 amplification Effects 0.000 description 2
- -1 copper Chemical class 0.000 description 2
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- 239000010949 copper Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
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- 150000002739 metals Chemical class 0.000 description 2
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- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Light Receiving Elements (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (28)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP040883/04 | 2004-02-18 | ||
JP2004040883A JP4315833B2 (ja) | 2004-02-18 | 2004-02-18 | 回路装置 |
JP040883/2004 | 2004-02-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1658736A true CN1658736A (zh) | 2005-08-24 |
CN1333459C CN1333459C (zh) | 2007-08-22 |
Family
ID=35007918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100081230A Expired - Fee Related CN1333459C (zh) | 2004-02-18 | 2005-02-05 | 电路装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7317199B2 (zh) |
JP (1) | JP4315833B2 (zh) |
CN (1) | CN1333459C (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102074543B (zh) * | 2009-11-20 | 2012-08-29 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体封装基座 |
CN106206614A (zh) * | 2016-08-25 | 2016-12-07 | 上海天马微电子有限公司 | 一种柔性显示面板和柔性显示装置 |
JP2019169669A (ja) * | 2018-03-26 | 2019-10-03 | キヤノン株式会社 | 電子モジュールおよび撮像システム |
CN117374014A (zh) * | 2023-12-07 | 2024-01-09 | 潮州三环(集团)股份有限公司 | 一种封装基座及其制备方法 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007012895A (ja) * | 2005-06-30 | 2007-01-18 | Sanyo Electric Co Ltd | 回路装置およびその製造方法 |
JP4463793B2 (ja) * | 2006-10-10 | 2010-05-19 | 浜松ホトニクス株式会社 | 光検出装置 |
JP2008227233A (ja) * | 2007-03-14 | 2008-09-25 | Matsushita Electric Ind Co Ltd | 半導体デバイスの製造方法、光ピックアップモジュール、および半導体デバイス |
JP5132957B2 (ja) * | 2007-03-14 | 2013-01-30 | パナソニック株式会社 | 半導体デバイス、その製造方法および光ピックアップモジュール |
DE102008021091A1 (de) * | 2008-04-28 | 2009-10-29 | Epcos Ag | Drucksensor |
JP5543724B2 (ja) * | 2008-08-28 | 2014-07-09 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 樹脂封止型半導体装置及びその製造方法 |
JP5363789B2 (ja) * | 2008-11-18 | 2013-12-11 | スタンレー電気株式会社 | 光半導体装置 |
US20100207140A1 (en) * | 2009-02-19 | 2010-08-19 | Koninklijke Philips Electronics N.V. | Compact molded led module |
JP2010245337A (ja) * | 2009-04-07 | 2010-10-28 | Elpida Memory Inc | 半導体装置及びその製造方法 |
JP6051577B2 (ja) * | 2012-04-20 | 2016-12-27 | セイコーエプソン株式会社 | 電子デバイスおよび電子機器 |
JP7362280B2 (ja) * | 2019-03-22 | 2023-10-17 | キヤノン株式会社 | パッケージユニットの製造方法、パッケージユニット、電子モジュール、および機器 |
US11500433B2 (en) * | 2020-01-14 | 2022-11-15 | Au Optronics Corporation | Flexible electronic device |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6021414B2 (ja) * | 1978-12-29 | 1985-05-27 | ソニー株式会社 | テ−プレコ−ダ等のモ−ド切換え装置 |
US4399707A (en) * | 1981-02-04 | 1983-08-23 | Honeywell, Inc. | Stress sensitive semiconductor unit and housing means therefor |
US4843454A (en) * | 1985-11-26 | 1989-06-27 | Nippondenso Co., Ltd. | Semiconductor pressure transducer |
US4732042A (en) * | 1986-04-22 | 1988-03-22 | Motorola Inc. | Cast membrane protected pressure sensor |
TW332348B (en) * | 1992-06-23 | 1998-05-21 | Sony Co Ltd | Manufacturing method for solid state motion picture device provides a highly accurate and low cost solid state motion picture device by use of empty package made of resin. |
JPH07263591A (ja) * | 1994-03-22 | 1995-10-13 | Mitsubishi Materials Corp | マイクロ波パッケージ及びその製造方法 |
JPH09222372A (ja) * | 1996-02-19 | 1997-08-26 | Mitsubishi Electric Corp | 半導体式センサ |
JPH10104101A (ja) * | 1996-10-02 | 1998-04-24 | Mitsubishi Electric Corp | 半導体圧力センサ |
FR2764113B1 (fr) * | 1997-05-28 | 2000-08-04 | Motorola Semiconducteurs | Dispositif capteur et son procede de fabrication |
JP3958864B2 (ja) | 1998-05-21 | 2007-08-15 | 浜松ホトニクス株式会社 | 透明樹脂封止光半導体装置 |
US6229190B1 (en) * | 1998-12-18 | 2001-05-08 | Maxim Integrated Products, Inc. | Compensated semiconductor pressure sensor |
JP2001077277A (ja) * | 1999-09-03 | 2001-03-23 | Sony Corp | 半導体パッケージおよび半導体パッケージ製造方法 |
JP4156154B2 (ja) * | 1999-11-26 | 2008-09-24 | 富士フイルム株式会社 | 固体撮像装置 |
JP4020624B2 (ja) * | 2001-11-08 | 2007-12-12 | 三洋電機株式会社 | 半導体装置の製造方法 |
US6680525B1 (en) * | 2003-01-09 | 2004-01-20 | Kingpak Technology Inc. | Stacked structure of an image sensor |
-
2004
- 2004-02-18 JP JP2004040883A patent/JP4315833B2/ja not_active Expired - Fee Related
-
2005
- 2005-02-05 CN CNB2005100081230A patent/CN1333459C/zh not_active Expired - Fee Related
- 2005-02-14 US US11/057,932 patent/US7317199B2/en active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102074543B (zh) * | 2009-11-20 | 2012-08-29 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体封装基座 |
CN106206614A (zh) * | 2016-08-25 | 2016-12-07 | 上海天马微电子有限公司 | 一种柔性显示面板和柔性显示装置 |
CN106206614B (zh) * | 2016-08-25 | 2019-03-12 | 上海天马微电子有限公司 | 一种柔性显示面板和柔性显示装置 |
JP2019169669A (ja) * | 2018-03-26 | 2019-10-03 | キヤノン株式会社 | 電子モジュールおよび撮像システム |
CN117374014A (zh) * | 2023-12-07 | 2024-01-09 | 潮州三环(集团)股份有限公司 | 一种封装基座及其制备方法 |
CN117374014B (zh) * | 2023-12-07 | 2024-03-08 | 潮州三环(集团)股份有限公司 | 一种封装基座及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
US7317199B2 (en) | 2008-01-08 |
US20050248009A1 (en) | 2005-11-10 |
JP2005235886A (ja) | 2005-09-02 |
CN1333459C (zh) | 2007-08-22 |
JP4315833B2 (ja) | 2009-08-19 |
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