CN1646989B - 用于反射硬掩膜层的组合物及形成有图案材料特征的方法 - Google Patents
用于反射硬掩膜层的组合物及形成有图案材料特征的方法 Download PDFInfo
- Publication number
- CN1646989B CN1646989B CN03807642XA CN03807642A CN1646989B CN 1646989 B CN1646989 B CN 1646989B CN 03807642X A CN03807642X A CN 03807642XA CN 03807642 A CN03807642 A CN 03807642A CN 1646989 B CN1646989 B CN 1646989B
- Authority
- CN
- China
- Prior art keywords
- layer
- composition
- radiation
- hard mask
- polymkeric substance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0276—Photolithographic processes using an anti-reflective coating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0381—Macromolecular compounds which are rendered insoluble or differentially wettable using a combination of a phenolic resin and a polyoxyethylene resin
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/151—Matting or other surface reflectivity altering material
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
成膜聚合物 | n | k |
聚合物A | 1.656 | 0.006 |
聚合物B | 1.726 | 0.390 |
聚合物C | 1.556 | 0.000 |
聚合物C&D(重量比1∶1) | 1.689 | 0.205 |
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/124,087 | 2002-04-16 | ||
US10/124,087 US6730454B2 (en) | 2002-04-16 | 2002-04-16 | Antireflective SiO-containing compositions for hardmask layer |
PCT/US2003/010590 WO2003089992A1 (en) | 2002-04-16 | 2003-04-01 | Antireflective sio-containing compositions for hardmask layer |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1646989A CN1646989A (zh) | 2005-07-27 |
CN1646989B true CN1646989B (zh) | 2011-06-01 |
Family
ID=29214533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN03807642XA Expired - Lifetime CN1646989B (zh) | 2002-04-16 | 2003-04-01 | 用于反射硬掩膜层的组合物及形成有图案材料特征的方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6730454B2 (zh) |
EP (1) | EP1495365A4 (zh) |
JP (1) | JP4384919B2 (zh) |
KR (1) | KR100910901B1 (zh) |
CN (1) | CN1646989B (zh) |
AU (1) | AU2003230825A1 (zh) |
TW (1) | TWI268950B (zh) |
WO (1) | WO2003089992A1 (zh) |
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US6268457B1 (en) * | 1999-06-10 | 2001-07-31 | Allied Signal, Inc. | Spin-on glass anti-reflective coatings for photolithography |
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JPH06138664A (ja) * | 1992-10-26 | 1994-05-20 | Mitsubishi Electric Corp | パターン形成方法 |
US6410209B1 (en) * | 1998-09-15 | 2002-06-25 | Shipley Company, L.L.C. | Methods utilizing antireflective coating compositions with exposure under 200 nm |
EP1190277B1 (en) | 1999-06-10 | 2009-10-07 | AlliedSignal Inc. | Semiconductor having spin-on-glass anti-reflective coatings for photolithography |
US6890448B2 (en) * | 1999-06-11 | 2005-05-10 | Shipley Company, L.L.C. | Antireflective hard mask compositions |
JP3795333B2 (ja) | 2000-03-30 | 2006-07-12 | 東京応化工業株式会社 | 反射防止膜形成用組成物 |
US6420088B1 (en) * | 2000-06-23 | 2002-07-16 | International Business Machines Corporation | Antireflective silicon-containing compositions as hardmask layer |
JP3767676B2 (ja) * | 2000-09-12 | 2006-04-19 | 信越化学工業株式会社 | オルガノシロキサン系高分子化合物及び光硬化性樹脂組成物並びにパターン形成方法及び基板保護用皮膜 |
WO2002025374A2 (en) * | 2000-09-19 | 2002-03-28 | Shipley Company, L.L.C. | Antireflective composition |
TW538319B (en) * | 2000-10-10 | 2003-06-21 | Shipley Co Llc | Antireflective composition, method for forming antireflective coating layer, and method for manufacturing electronic device |
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2002
- 2002-04-16 US US10/124,087 patent/US6730454B2/en not_active Expired - Lifetime
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2003
- 2003-04-01 WO PCT/US2003/010590 patent/WO2003089992A1/en active Application Filing
- 2003-04-01 KR KR1020047014412A patent/KR100910901B1/ko not_active IP Right Cessation
- 2003-04-01 JP JP2003586669A patent/JP4384919B2/ja not_active Expired - Lifetime
- 2003-04-01 EP EP03723925A patent/EP1495365A4/en not_active Withdrawn
- 2003-04-01 AU AU2003230825A patent/AU2003230825A1/en not_active Abandoned
- 2003-04-01 CN CN03807642XA patent/CN1646989B/zh not_active Expired - Lifetime
- 2003-04-11 TW TW092108405A patent/TWI268950B/zh not_active IP Right Cessation
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US5180655A (en) * | 1988-10-28 | 1993-01-19 | Hewlett-Packard Company | Chemical compositions for improving photolithographic performance |
US5399462A (en) * | 1992-09-30 | 1995-03-21 | International Business Machines Corporation | Method of forming sub-half micron patterns with optical lithography using bilayer resist compositions comprising a photosensitive polysilsesquioxane |
US6287951B1 (en) * | 1998-12-07 | 2001-09-11 | Motorola Inc. | Process for forming a combination hardmask and antireflective layer |
US6268457B1 (en) * | 1999-06-10 | 2001-07-31 | Allied Signal, Inc. | Spin-on glass anti-reflective coatings for photolithography |
TW439117B (en) * | 1999-12-28 | 2001-06-07 | Applied Materials Inc | A method for measuring thickness of layers in chemical mechanic polishing process |
Also Published As
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EP1495365A1 (en) | 2005-01-12 |
KR20040099326A (ko) | 2004-11-26 |
TWI268950B (en) | 2006-12-21 |
KR100910901B1 (ko) | 2009-08-05 |
CN1646989A (zh) | 2005-07-27 |
JP2005523474A (ja) | 2005-08-04 |
EP1495365A4 (en) | 2009-06-03 |
WO2003089992A1 (en) | 2003-10-30 |
AU2003230825A1 (en) | 2003-11-03 |
JP4384919B2 (ja) | 2009-12-16 |
TW200307014A (en) | 2003-12-01 |
US20030198877A1 (en) | 2003-10-23 |
US6730454B2 (en) | 2004-05-04 |
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