CN1629759A - Substrate temperature control device - Google Patents
Substrate temperature control device Download PDFInfo
- Publication number
- CN1629759A CN1629759A CN 200310121824 CN200310121824A CN1629759A CN 1629759 A CN1629759 A CN 1629759A CN 200310121824 CN200310121824 CN 200310121824 CN 200310121824 A CN200310121824 A CN 200310121824A CN 1629759 A CN1629759 A CN 1629759A
- Authority
- CN
- China
- Prior art keywords
- temperature
- substrate
- attemperating unit
- described substrate
- refrigeratory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Magnetic Bearings And Hydrostatic Bearings (AREA)
Abstract
This invention relates to a base plat temperature control device including a snug having a fix tank matched with said base plate and fixing the plate, a temperature sensing device for detecting temperature of up and down surfaces of the plate fixed in the tank, a cooler set in the snug for regulating temperature of the base plate and a heater in the snug for adjusting temperature of the base plate, which can reduce the over-large transient temperature variance in diamond filming to the plate.
Description
Technical field
The present invention relates to a kind of substrate attemperating unit, be applied to utilize the electricity slurry to carry out the basic of diamond coating film, especially relate to a kind of substrate attemperating unit of crossing the acute warpage that is produced because of temperature variation that reduces.
Background technology
In the conventional art, with thick silicon substrate (thickness is 5mm) during as the substrate (substrate) of the above large tracts of land diamond coating film of 4 inch, because adopt chemical vapor deposition (Chemical Vapor Deposition; CVD) mode forms diamond film, and electricity slurry (plasma) can cause surface temperature moment of substrate to improve, and makes excessive, the skewness of temperature contrast of surface and bottom surface, causes the phenomenon of substrate warp.
For addressing these problems, the practice of very early time is to adopt the mode of tempering, but the substrate that will finish plated film heats tempering once more, might change the structural strength on surface.In addition, also having a kind of common practice is after diamond coating film is finished, do not close earlier the electricity slurry, but adopt the mode that slowly reduces electricity slurry energy, slow down the problem of substrate surface temperature rapid drawdown, still, because after diamond coating film is finished, still continue to make the electricity consumption slurry, might make that the characteristic of substrate surface is uncontrollable, the state that can't obtain expecting.In addition, preceding case such as United States Patent (USP) are announced patent No. 5620745, and it is before carrying out diamond coating film to substrate, calculate the stress that can bear in advance, bestow reverse compression stress or stretching stress in advance and cooperate, mate the deformation that diamond coating film produces, reduce the phenomenon of warpage.Yet this kind practice is too theoretical, and in fact substrate is starched the stress that can bear under the reaction at the high temperature electricity, dyscalculia not only, and the each because slight change of external environment (such as the change of temperature, humidity etc.), all can cause the change of stress, and not reach expected effect.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of substrate attemperating unit, the excessive phenomenon of temperature instantaneous variation in the time of can reducing the substrate diamond coating film, and make the temperature of substrate more even, reduce the generation of thermal stress, thereby further reduce the phenomenon of warpage.
To achieve these goals, the invention provides a kind of substrate attemperating unit, be used for electricity slurry diamond coating film process, the substrate warp of the acute thermal stress that produces is crossed in reduction because of temperature variation, include: a bearing, have a pickup groove that cooperates described substrate, it is fixing to provide described substrate to put; One temperature inductor is seated in the temperature on the upper and lower surface of substrate in the described pickup groove in order to detecting; One refrigeratory is installed in the described bearing, in order to regulate the temperature of described substrate; And a well heater, be installed in the described bearing, in order to regulate the temperature of described substrate.
Aforesaid substrate attemperating unit, its characteristics are that described temperature inductor is installed in the bottom of described pickup groove and the surface of described bearing respectively, and can detect the temperature on the upper and lower surface of described substrate.
Aforesaid substrate attemperating unit, its characteristics be, described temperature inductor one of can be in thermocouple or the ultrared sensing.
Aforesaid substrate attemperating unit, its characteristics be, when the difference that described temperature inductor is detected described upper and lower surface temperature surpasses a predetermined temperature, can drive described well heater or described refrigeratory, to regulate the poor of the upper and lower surface temperature of described substrate.
Aforesaid substrate attemperating unit, its characteristics are that described well heater can be the chromium heating wire.
Aforesaid substrate attemperating unit, its characteristics are that described refrigeratory can be water-cooling system.
Effect of the present invention is, the excessive phenomenon of temperature instantaneous variation in the time of can reducing the substrate diamond coating film, and make the temperature of substrate more even, reduce the generation of thermal stress, thereby reduce the phenomenon of warpage further.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the structural representation of substrate attemperating unit of the present invention
Fig. 2 is the total system synoptic diagram that is applied to diamond coating film
Fig. 3 is the local enlarged diagram of the 2nd figure
Wherein, Reference numeral:
The 10-bearing, the 11-pickup groove
The 20-temperature inductor, 21-thermocouple, 22-thermocouple
The 30-well heater, 31-electric heater, 32-electric heater, 33-electric heater
The 40-refrigeratory, 41-cooling water pipe, 42-cooling water pipe, 43-cooling water pipe
The 50-outer cover
The 60-substrate, 61-upper surface, 62-lower surface
70-electricity slurry
Embodiment
Fig. 1 is the structural representation of substrate attemperating unit of the present invention, include bearing 10, temperature inductor 20, well heater 30 and refrigeratory 40, bearing 10 has a pickup groove 11, temperature inductor 20 includes the thermocouple 22,21 that is installed in pickup groove 11 bottoms and bearing 10 surfaces respectively, and well heater 30, refrigeratory 40 then are installed in the pickup groove 11.As Fig. 2, shown in Figure 3, be applied to the substrate 60 of diamond coating film, be placed in the outer cover 50, utilize electricity slurry 70 to carry out diamond coating film, substrate 60 is seated in the pickup groove 11 of bearing 10, the thermocouple 21,22 of temperature inductor 20 then is used for detecting the upper surface 61 of substrate 60, the temperature of lower surface 62 respectively, and this thermocouple 21 can adopt the mode of ultrared sensing.
When making electricity consumption slurry 70 add man-hour, because temperature can improve (working temperature is about 750 ℃-850 ℃) moment, especially the temperature with the upper surface 61 of substrate 60 rises at most, make with the temperature difference of lower surface 62 increasing, therefore, use well heater 30 to heat the temperature that improves lower surface 62, well heater 30 can include a plurality of electric heaters 31,32,33, it can adopt the chromium heating wire, can certainly improve temperature with other type of heating.
And after diamond coating film is finished, when electricity slurry 70 is closed, detect the temperature moment decline of upper surface 61 by thermocouple 21,22, then use refrigeratory 40 to make lower surface 62 coolings of substrate 60, and refrigeratory 40 can use the mode of water-cooled, and refrigeratory 40 includes a plurality of cooling water pipes 41,42,43.
On the other hand, the upper surface 61 of the substrate 60 that can be sensed according to temperature inductor 20 and the temperature contrast of lower surface 62, and set a predetermined temperature (for example be 0.1 ℃), when the temperature difference surpasses this predetermined temperature, then activate the temperature contrast that well heater 30 or refrigeratory 40 dwindle the upper surface 61 and the lower surface 62 of substrate 60, thereby can allow the temperature of substrate 60 more even, reduce the generation of thermal stress, reduce the phenomenon of warpage further.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of claim of the present invention.
Claims (6)
1, a kind of substrate attemperating unit is used for electricity slurry diamond coating film process, reduces the substrate warp of crossing the acute thermal stress that produces because of temperature variation, it is characterized in that, includes:
One bearing has a pickup groove that cooperates described substrate, and it is fixing to provide described substrate to put;
One temperature inductor is seated in the temperature on the upper and lower surface of substrate in the described pickup groove in order to detecting;
One refrigeratory is installed in the described bearing, in order to regulate the temperature of described substrate; And
One well heater is installed in the described bearing, in order to regulate the temperature of described substrate.
According to the described substrate attemperating unit of claim 1, it is characterized in that 2, described temperature inductor is installed in the bottom of described pickup groove and the surface of described bearing respectively, and can detect the temperature on the upper and lower surface of described substrate.
According to the described substrate attemperating unit of claim 2, it is characterized in that 3, described temperature inductor one of can be in thermocouple or the ultrared sensing.
4, according to the described substrate attemperating unit of claim 1, it is characterized in that, when the difference that described temperature inductor is detected described upper and lower surface temperature surpasses a predetermined temperature, can drive described well heater or described refrigeratory, to regulate the poor of the upper and lower surface temperature of described substrate.
5, according to the described substrate attemperating unit of claim 1, it is characterized in that described well heater can be the chromium heating wire.
6, according to the described substrate attemperating unit of claim 1, it is characterized in that described refrigeratory can be water-cooling system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310121824 CN1629759A (en) | 2003-12-19 | 2003-12-19 | Substrate temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310121824 CN1629759A (en) | 2003-12-19 | 2003-12-19 | Substrate temperature control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1629759A true CN1629759A (en) | 2005-06-22 |
Family
ID=34844290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200310121824 Pending CN1629759A (en) | 2003-12-19 | 2003-12-19 | Substrate temperature control device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1629759A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103176130A (en) * | 2011-12-20 | 2013-06-26 | 龙焱能源科技（杭州）有限公司 | Temperature regulating device for solar cell accelerated aging test |
| CN105783512A (en) * | 2016-02-23 | 2016-07-20 | 海安欣凯富机械科技有限公司 | Heating furnace |
| CN106887399A (en) * | 2010-12-20 | 2017-06-23 | Ev 集团 E·索尔纳有限责任公司 | Storing apparatus for keeping chip |
-
2003
- 2003-12-19 CN CN 200310121824 patent/CN1629759A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106887399A (en) * | 2010-12-20 | 2017-06-23 | Ev 集团 E·索尔纳有限责任公司 | Storing apparatus for keeping chip |
| US10325798B2 (en) | 2010-12-20 | 2019-06-18 | Ev Group E. Thallner Gmbh | Accommodating device for retaining wafers |
| CN106887399B (en) * | 2010-12-20 | 2020-02-21 | Ev 集团 E·索尔纳有限责任公司 | Accommodating device for holding wafers |
| US10886156B2 (en) | 2010-12-20 | 2021-01-05 | Ev Group E. Thallner Gmbh | Accomodating device for retaining wafers |
| US11355374B2 (en) | 2010-12-20 | 2022-06-07 | Ev Group E. Thallner Gmbh | Accommodating device for retaining wafers |
| US11756818B2 (en) | 2010-12-20 | 2023-09-12 | Ev Group E. Thallner Gmbh | Accommodating device for retaining wafers |
| CN103176130A (en) * | 2011-12-20 | 2013-06-26 | 龙焱能源科技（杭州）有限公司 | Temperature regulating device for solar cell accelerated aging test |
| CN103176130B (en) * | 2011-12-20 | 2015-08-05 | 龙焱能源科技（杭州）有限公司 | A kind of temperature regulating device for solar cell accelerated aging tests |
| CN105783512A (en) * | 2016-02-23 | 2016-07-20 | 海安欣凯富机械科技有限公司 | Heating furnace |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Wang et al. | What is going on in magnesium alloys? | |
| CN102272936B (en) | Solar power inverters, including temperature-controlled solar power inverters, and associated systems and methods | |
| CN102347211B (en) | Be kept for the method and apparatus of heat treated multiple planar substrates | |
| Cook | Passive cooling | |
| CN101900446B (en) | Radiation-selective absorber coating and absorber tube with radiation-selective absorber coating | |
| CN101160674A (en) | Composite films suitable for use in opto-electronic and electronic devices | |
| CN102007173A (en) | Coated and planarised polymeric films | |
| CN100485082C (en) | Method for preparing ZnO:Al transparent conductive film by direct magnetic control co-sputtering method | |
| US7803419B2 (en) | Apparatus and method for rapid cooling of large area substrates in vacuum | |
| CN1629759A (en) | Substrate temperature control device | |
| CN201817401U (en) | Double-silver low-emissivity coated glass capable of being processed in different places | |
| CN1205455C (en) | Cooling/heating apparatus for semiconductor processing liquid | |
| EP0400829B1 (en) | Temperature maintaining method for bioreactor | |
| CN110699540A (en) | Method for predicting warping in solution heat treatment process of stainless steel/carbon steel composite plate | |
| CN101036236A (en) | Apparatus and method of manufacturing solar cells | |
| CN111157566A (en) | Multifunctional full-automatic material thermal fatigue testing machine | |
| CN201575637U (en) | Energy-saving device for utilizing waste heat of system condensed water in production of methylamine and dimethyl formamide | |
| CN105553420B (en) | Photovoltaic and photo-thermal integrated photoelectric heat generator with high temperature self-protection mechanism | |
| CN202380087U (en) | Thermal insulation system for heating cavity | |
| CN101041890A (en) | Mask film cradle and deposition system | |
| CN105547024B (en) | Energy-saving device capable of automatically utilizing cold and heat sources of environment | |
| CN101899389A (en) | Small-sized fermentation thermostatic apparatus | |
| CN218372514U (en) | Heating cavity | |
| CN1173073C (en) | Hardness increasing method for chemical nickel boron alloy cladding | |
| CN106548961B (en) | The method for carrying out rapid thermal anneal process using heat annealing equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |