CN1616939A - Polymerized material baroceptor chip - Google Patents
Polymerized material baroceptor chip Download PDFInfo
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- CN1616939A CN1616939A CNA2003101143396A CN200310114339A CN1616939A CN 1616939 A CN1616939 A CN 1616939A CN A2003101143396 A CNA2003101143396 A CN A2003101143396A CN 200310114339 A CN200310114339 A CN 200310114339A CN 1616939 A CN1616939 A CN 1616939A
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- polymeric material
- air pressure
- electrode
- pressure sensor
- bottom electrode
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Abstract
The present invention relates to sensing technology, and especially the structure and making process of baroceptor chip of polymer material. The baroceptor chip has polymer material as pressure sensing film, and plate electrodes and leads made on substrate of glass, silicon, etc. The pressure sensing film of SU-8 glue, polyimide or other polymer material and the plate electrodes below the film form one capacitor with air in certain pressure sealed inside. When there is some difference between the outer pressure and the sealed air, the film will produce some deformation to cause the capacitance between two electrodes to vary and the capacitance is measured to reach the aim of measuring pressure.
Description
Technical field
The present invention relates to field of sensing technologies, particularly a kind of structure and method for making that adopts the air pressure sensor chip of polymeric material making.
Background technology
Baroceptor is one of important directions of sensing technology application.Air pressure is the important physical amount in atmospheric surveillance, the weather forecast.A lot of production fields also need to monitor the pressure of all gases.What usually the atmospheric pressure force measurement is adopted is pneumatics box sensor, silicon pressure sensor.The shortcoming of pneumatics box sensor is that volume is bigger, is difficult to satisfy microminiaturized integrated requirement.The little precision height of silicon pressure sensor volume, but complex manufacturing technology, cost is also very high.
Micromechanics electronic system (MEMS:micro electronic mechanical system) is a new developing technology closely during the last ten years, and it is meant can be with the MEMS (micro electro mechanical system) that integrates parts such as microactrator, microsensor, integrated circuit of technique for manufacturing batch manufacturings such as microelectronics micromechanics.Be characterized in that volume is little, stable performance can be produced in batches, thereby cost is low, and consistency of performance is good.SU-8 glue is the novel polymeric material in the micromechanics electronic system MEMS process technology, and its advantage is to do the figure of high-aspect-ratio, and intensity and stability are better compared with low cost with silicon.Polyimide is a photoresist, and it has higher-strength after curing, therefore can make the pressure device, and cost is also cheaper.
Summary of the invention
The object of the present invention is to provide that a kind of manufacture craft is simple, volume is little, cost is low, the air pressure sensor chip and the method for making of making by new material.
For achieving the above object, technical solution of the present invention provides a kind of polymeric material air pressure sensor chip, it has a sealing box body on substrate, there is a polymeric material membrane box body crown center position, its side has a step, last pad is arranged on the step, and another side of sealing box body has following pad; Substrate and sealing have a cavity between the box body, and cavity is a microcavity, in be filled with air; Cavity floor has bottom electrode, and end face has top electrode; The just relative setting with bottom electrode of top electrode is in the centre position of the polymeric material membrane of cavity end face; Bottom electrode joins with following pad after extending the sealing box body, and bottom electrode and following pad all are fixed on the substrate; Top electrode joins with last pad after extending the sealing box body, and top electrode is fixed on the polymeric material membrane, and last pad is fixed on the step.
Described air pressure sensor chip, its described sealing box body is made by polymeric material.
Described air pressure sensor chip, its described polymeric material is SU-8 glue, polyimide.
Described air pressure sensor chip, its described substrate is silicon chip or glass sheet.
Described air pressure sensor chip, its described cavity is a microcavity, height is between 5～6 μ m.
Described air pressure sensor chip, its described top electrode and bottom electrode are plate electrodes, plate electrode is square, rectangle or circle.
Described air pressure sensor chip, its described top electrode, bottom electrode, last pad, following pad are made by platinum or gold thin film.
The preparation method of described air pressure sensor chip, it comprises the steps:
The first step: radio-frequency sputtering platinum or gold thin film on substrate, make a dull and stereotyped bottom electrode by lithography, and lead-in wire and following pad, this plate electrode is as the bottom electrode of pressure measurement electric capacity;
Second step: get rid of certain thickness polymeric material on bottom electrode, exposure is not developed after making the frame figure, as sacrifice layer, removes after treating;
The 3rd step: the finished product that second step was obtained places the darkroom, and make platinum or gold thin film by the method for evaporation, and make a dull and stereotyped top electrode by lithography, and lead-in wire and last pad, this plate electrode is as the top electrode of pressure measurement electric capacity;
The 4th step: in the darkroom, go on foot on the finished product that obtains, get rid of certain thickness polymeric material again as the presser sensor film the 3rd;
The 5th step: in the darkroom, with the 4th finished product that obtain of step solidify develop after, the polymeric material in second step is removed, and forms cavity, the cavity inside envelope has the air of certain air pressure;
The 6th step: go on foot on the finished product that obtains the 5th, get rid of one deck polymeric material again and do sealing and reinforce frame;
The 7th step: the finishing typing gets finished product.
Described air pressure sensor chip, described certain thickness polymeric material of second step in its method for making, thickness is between 5～6 μ m.
Described air pressure sensor chip, described certain thickness polymeric material of the 4th step in its method for making, thickness is between 20～25 μ m.
Sensor chip provided by the invention adopts polymeric material membrane as pressure-sensing device, with the capacitance method detected air pressure, have little, low in energy consumption, the advantages such as cost is low, high conformity of volume, its manufacture craft is simple, with the IC process compatible, therefore can satisfy a lot of demands.
Air pressure sensor chip of the present invention has following characteristics:
1, the polymeric material air pressure sensor chip provides a kind of novel barometric surveying sensor construction and manufacture craft.
2, utilize the manufacturing of micromechanics electronic system (MEMS) technology, to have a volume at silicon chip or air pressure sensor chip on glass little, low in energy consumption, characteristics such as cost is low, high conformity.
Description of drawings
Fig. 1 is a polymeric material air pressure sensor chip perspective view of the present invention;
Fig. 2 is a polymeric material air pressure sensor chip cross-sectional view of the present invention.
Embodiment
As shown in Figure 1 and Figure 2, be polymeric material air pressure sensor chip structural representation of the present invention.Wherein, a sealing box body 2 is arranged on substrate 1, box body 2 is made by polymeric material, and there is a polymeric material membrane 3 its crown center position, and its side has a step 4, and last pad 5 is arranged on the step 4, and another side that seals box body 2 has following pad 6.Between substrate 1 and the sealing box body 2 cavity 7 is arranged, cavity 7 is a microcavity, and height is filled with air in the cavity 7 between 5～6 μ m.There is bottom electrode 8 cavity 7 bottom surfaces, and end face has top electrode 9; The just relative setting with bottom electrode 8 of top electrode 9 is in the centre position of the polymeric material membrane 3 of cavity 7 end faces; Bottom electrode 8 joins with following pad 6 after extending sealing box body 2, and bottom electrode 8 and following pad 6 all are fixed on the substrate 1; Top electrode 9 joins with last pad 5 after extending sealing box body 2, and top electrode 9 is fixed on the polymeric material membrane 3, and last pad 5 is fixed on the step 4.
Substrate 1 can be silicon chip or glass sheet.
Polymeric material is polyimide or SU-8 glue.
Top electrode 9 and bottom electrode 8 are plate electrodes, constitute an air condenser between top electrode 9 and the bottom electrode 8, and that plate electrode can be is square, rectangle or circle.Top electrode 9, bottom electrode 8, last pad 5, following pad 6 are made by platinum or gold thin film.
Polymeric material air pressure sensor chip of the present invention, its method for making is as follows:
The first step: radio-frequency sputtering platinum or gold thin film on substrate 1, make a dull and stereotyped bottom electrode 8 by lithography, and lead-in wire and following pad 6, this plate electrode is as the bottom electrode 8 of pressure measurement electric capacity.
Second step: after getting rid of the polymeric material that thickness is 5 μ m (polyimide or SU-8 glue) exposure making frame figure on the bottom electrode 8, do not develop,, remove after treating as sacrifice layer.
The 3rd step: the finished product that second step was obtained places the darkroom, and make platinum or gold thin film by the method for evaporation, and make a dull and stereotyped top electrode 9 by lithography, and lead-in wire and last pad 5, this plate electrode is as the top electrode 9 of pressure measurement electric capacity.
The 4th step: in the darkroom, go on foot on the finished product that obtains, get rid of the thick polymeric material of 20 μ m (polyimide or SU-8 glue) again as presser sensor film 3 the 3rd.
The 5th step: in the darkroom, with the 4th finished product that obtain of step solidify develop after, ground floor SU-8 glue is removed, and forms cavity (pressure microcavity) 7, cavity 7 inner envelopes have the air of certain air pressure.
The 6th step: go on foot on the finished product that obtains the 5th, get rid of one deck polymeric material (polyimide or SU-8 glue) again and do sealing and reinforce frame.
The 7th step: the finishing typing gets finished product.
Barometric surveying principle of the present invention is: during outside air pressure change, cause polymeric material membrane deformation, cause that electric capacity changes.When external pressure during less than air pressure inside, two electrode separations increase, and electric capacity diminishes.Otherwise, then become big.Therefore can determine air pressure by measurement to electric capacity.
If electrode and polymeric material membrane are square, its electric capacity can calculate by following formula:
ε is a dielectric constant of air in the formula, and S is the film zone, d
0During for the outer pressure equilibrium of the pressure in the film and film, the distance between the upper/lower electrode, (x is that (film can approximate representation be when very little for deformation for x, the amount of deflection of the film of y) locating apart from thin film center y) to W
A is that one side of something of film is long, wherein W
0Be the center amount of deflection of film, can be expressed as:
Wherein σ is an inherent stress, and h is a film thickness, P
InBe internal gas pressure, P
OutwardBe ambient atmos pressure, for acting on the pressure on the film, K is a factor.
As can be seen, external pressure P
OutwardDiminishing then, (x y) becomes big to W, and promptly the denominator of integration becomes big, so capacitor C diminishes.Otherwise, external pressure P
Outward(x y) diminishes, and promptly the denominator of integration diminishes, so capacitor C becomes greatly to become greatly then W.Therefore can determine air pressure by measurement to electric capacity.
Embodiment:
This example is at a 3 * 3mm
2Glass substrate 1 on, cured polymer chamber wall constitutes box body 2, is 1.5 * 1.5mm
2Square, intermediate polymer film 3 thickness 20 μ m also are 1 * 1mm
2Square.Be cavity 7 between substrate 1 and the thin polymer film 3, microcavity body room height is 5 μ m, and cavity 7 inner envelopes have the air of certain air pressure.Substrate 1 middle part upper surface has dull and stereotyped bottom electrode 8, thin polymer film 3 middle part following tables and dull and stereotyped top electrode 9 is arranged, and top electrode 9 is just relative up and down with bottom electrode 8, and an extension line is respectively arranged.After two extension lines are extended by the upper right corner of box body 2 and bottom, respectively with last pad 5, pad 6 joins down.Last pad 5, following pad 6 are for making things convenient for welding lead.Constitute an air condenser between top electrode 9 and the bottom electrode 8.Above-mentionedly promptly constitute a polymeric material pressure sensor chip.
Its process is an evaporated gold film on glass substrate 1 at first, is made into bottom electrode 8 and the lead-in wire and the following pad 6 of pressure measurement electric capacity.Getting rid of thickness more thereon is the thick SU-8 glue of 5 μ m, and exposure is not developed after making the frame figure, removes later on as sacrifice layer.Following technology will be descended operation under the darkroom.The evaporated gold film is as top electrode 9, lead-in wire and last pad 5, as the top electrode of pressure measurement electric capacity.Get rid of the thick SU-8 glue of 20 μ m thereon again as presser sensor film 3.After solidifying development, ground floor SU-8 glue is removed, and forms pressure microcavity 7.According to dimensional requirement, get rid of one deck SU-8 glue again, around cavity 7, solidify to form the chamber wall, play the effect of support film 3 and enhanced leaktightness, and constitute the reinforcing frame.At last, after the finishing typing, get finished product.
Claims (10)
1, a kind of polymeric material air pressure sensor chip is characterized in that, a sealing box body is arranged on substrate, and there is a polymeric material membrane box body crown center position, and its side has a step, and last pad is arranged on the step, and another side of sealing box body has following pad; Substrate and sealing have a cavity between the box body, and cavity is a microcavity, in be filled with air; Cavity floor has bottom electrode, and end face has top electrode; The just relative setting with bottom electrode of top electrode is in the centre position of the polymeric material membrane of cavity end face; Bottom electrode joins with following pad after extending the sealing box body, and bottom electrode and following pad all are fixed on the substrate; Top electrode joins with last pad after extending the sealing box body, and top electrode is fixed on the polymeric material membrane, and last pad is fixed on the step.
2, air pressure sensor chip as claimed in claim 1 is characterized in that, described sealing box body is made by polymeric material.
3, air pressure sensor chip as claimed in claim 1 or 2 is characterized in that, described polymeric material is SU-8 glue, polyimide.
4, air pressure sensor chip as claimed in claim 1 is characterized in that, described substrate is silicon chip or glass sheet.
5, the described air pressure sensor chip of claim 1 is characterized in that, described cavity is a microcavity, and height is between 5～6 μ m.
6, air pressure sensor chip as claimed in claim 1 is characterized in that, described top electrode and bottom electrode are plate electrodes, and plate electrode is square, rectangle or circle.
As claim 1 or 6 described air pressure sensor chips, it is characterized in that 7, described top electrode, bottom electrode, last pad, following pad are made by platinum or gold thin film.
8, the preparation method of air pressure sensor chip as claimed in claim 1 is characterized in that, comprises the steps:
The first step: radio-frequency sputtering platinum or gold thin film on substrate, make a dull and stereotyped bottom electrode by lithography, and lead-in wire and following pad, this plate electrode is as the bottom electrode of pressure measurement electric capacity;
Second step: get rid of certain thickness polymeric material on bottom electrode, exposure is not developed after making the frame figure, as sacrifice layer, removes after treating;
The 3rd step: the finished product that second step was obtained places the darkroom, and make platinum or gold thin film by the method for evaporation, and make a dull and stereotyped top electrode by lithography, and lead-in wire and last pad, this plate electrode is as the top electrode of pressure measurement electric capacity;
The 4th step: in the darkroom, go on foot on the finished product that obtains, get rid of certain thickness polymeric material again as the presser sensor film the 3rd;
The 5th step: in the darkroom, with the 4th finished product that obtain of step solidify develop after, the polymeric material in second step is removed, and forms cavity, the cavity inside envelope has the air of certain air pressure;
The 6th step: go on foot on the finished product that obtains the 5th, get rid of one deck polymeric material again and do sealing and reinforce frame;
The 7th step: the finishing typing gets finished product.
9, method as claimed in claim 8 is characterized in that, described certain thickness polymeric material of second step in its method for making, and thickness is between 5～6 μ m.
10, method as claimed in claim 8 is characterized in that, described certain thickness polymeric material of the 4th step in its method for making, and thickness is between 20～25 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101143396A CN1330952C (en) | 2003-11-14 | 2003-11-14 | Polymerized material baroceptor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101143396A CN1330952C (en) | 2003-11-14 | 2003-11-14 | Polymerized material baroceptor chip |
Publications (2)
| Publication Number | Publication Date |
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| CN1616939A true CN1616939A (en) | 2005-05-18 |
| CN1330952C CN1330952C (en) | 2007-08-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2003101143396A Expired - Fee Related CN1330952C (en) | 2003-11-14 | 2003-11-14 | Polymerized material baroceptor chip |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101013726B (en) * | 2007-02-02 | 2010-05-19 | 中国石油大学(华东) | New material of carbon/silicon heterojunction with gas pressure sensitive effect |
| CN102804354A (en) * | 2010-03-05 | 2012-11-28 | 应用材料公司 | Measuring flow properties of multiple gas nozzles of a gas distributor |
| CN106477512A (en) * | 2016-11-23 | 2017-03-08 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor and its method for packing |
| WO2018191860A1 (en) * | 2017-04-18 | 2018-10-25 | 深圳大学 | Method and device for manufacturing optical fiber end face thin film air pressure sensor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102494833A (en) * | 2011-12-16 | 2012-06-13 | 淮阴工学院 | Mini-type pressure sensor based on SU-8 polymer |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5189777A (en) * | 1990-12-07 | 1993-03-02 | Wisconsin Alumni Research Foundation | Method of producing micromachined differential pressure transducers |
| EP0645613B1 (en) * | 1993-08-20 | 1998-03-25 | Endress U. Hauser Gmbh U. Co. | Method of manufacturing thin-film absolute-pressure sensors |
| CN1139087C (en) * | 1998-02-04 | 2004-02-18 | 胡耿 | Shape-changeable and resilience film capacitor having additional electrode plate |
| JP2000022172A (en) * | 1998-06-30 | 2000-01-21 | Matsushita Electric Ind Co Ltd | Converter and manufacture thereof |
-
2003
- 2003-11-14 CN CNB2003101143396A patent/CN1330952C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101013726B (en) * | 2007-02-02 | 2010-05-19 | 中国石油大学(华东) | New material of carbon/silicon heterojunction with gas pressure sensitive effect |
| CN102804354A (en) * | 2010-03-05 | 2012-11-28 | 应用材料公司 | Measuring flow properties of multiple gas nozzles of a gas distributor |
| CN102804354B (en) * | 2010-03-05 | 2015-07-08 | 应用材料公司 | Measuring flow properties of multiple gas nozzles of a gas distributor |
| CN106477512A (en) * | 2016-11-23 | 2017-03-08 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor and its method for packing |
| CN106477512B (en) * | 2016-11-23 | 2018-07-31 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor and its packaging method |
| WO2018191860A1 (en) * | 2017-04-18 | 2018-10-25 | 深圳大学 | Method and device for manufacturing optical fiber end face thin film air pressure sensor |
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| Publication number | Publication date |
|---|---|
| CN1330952C (en) | 2007-08-08 |
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Granted publication date: 20070808 Termination date: 20131114 |