CN1611339A - Resin enclosure forming device - Google Patents
Resin enclosure forming device Download PDFInfo
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- CN1611339A CN1611339A CN 200410089907 CN200410089907A CN1611339A CN 1611339 A CN1611339 A CN 1611339A CN 200410089907 CN200410089907 CN 200410089907 CN 200410089907 A CN200410089907 A CN 200410089907A CN 1611339 A CN1611339 A CN 1611339A
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Abstract
Provided is a low-cost, small-size resin sealing molding apparatus that can easily carry out multi-sort small quantity production as well as variable quantity production. For achieving this object, an inloader unit 800 and an unloader unit 900 are radially disposed in a manner so as to form a right angle with an axis 702 of rotation of a loader unit 700 as the center, and integrated with each other. The inloader unit 800 and the unloader unit 900 are supported so as to be integrally rotatable with the axis 702 of rotation of the loader unit 700 as the center.
Description
Technical field
The present invention relates to utilize resin material that the semiconductor device (hereinafter referred to as semiconductor chip) of electronic component especially shaped like chips is sealed the resin enclosure forming device that ends shaping with the substrate that carries this semiconductor chip.
Background technology
In recent years, as seen, differential more obvious for competing product has the requirement trend of special-purpose electronic component more from electronic equipments such as personal computer, mobile phone, digital camera, household appliances.In addition,, make and buy the increase in demand of changing, cause the lost of life of electronic equipment by shortening construction cycle, low price, the multifunction of new product.Therefore, the production of electronic component need be a small amount of many kinds, the production of energy variable.
In addition, miniaturization, variation, the cost degradation in order to tackle electronic equipment requires high-density installation and multi-functional, low-cost for the electronic component that is used for these electronic equipments in recent years.Thus, developed the component groups (FBGA, FLGA, SON, QFN etc.) of the so-called CSP (ChipSize Package) that miniaturization, thin typeization, the multi-pinization of resin enclosure type semiconductor device obtain making progress.Method for making as these component groups, use on a kind of single face that a large amount of semiconductor elements is arranged in 1 plate base and be electrically connected, after only sealing in the lump with resin, cut off separation along each assembly periphery, obtain the MAP method for making (Matrix Array Packaging Method) of single assembly.This method for making is such as carrying 1000 semiconductor chips on 1 plate base, a resin enclosure is shaped and 1000 semiconductor chips can be carried out resin enclosure.
But, in the operation that the semiconductor chip that carries to high-density on substrate is electrically connected, if traditional wire bonding, then required time of the wire bond operation of every plate base oversize, can only produce several pieces in 1 hour sometimes.Therefore, exist for the oversize problem of the stand-by time of resin enclosure plurality of substrates, resin enclosure forming device.
At these problems, in the resin enclosure forming device in recent years, have a kind of as shown in figure 14, for can a small amount of many variety production, variable production, the structure that can increase and decrease the molding unit of minimum component unit (such as, with reference to patent documentation 1: No. the 2932136th, patent).
That is, comprising: the preceding lead frame feed unit 1 of resin enclosure that electronic component is installed; The lead frame arrangement units 2 that lead frame before this resin enclosure is arranged towards prescribed direction; Resin sheet feed unit 3; Resin sheet is arranged the resin sheet of taking out of take out of unit 4; Electronic component is carried out the molding unit 5 that resin enclosure is shaped; To arrange good lead frame and resin sheet towards shipment device unit 6 that described molding unit 5 is transferred; The dispenser unit 7 that the lead frame that resin enclosure after being shaped is finished takes out; The cleaner unit 8 of metal die; The transfer unit 9 that lead frame after resin enclosure finished is transferred; The cast gate that the cast gate of the lead frame after resin enclosure finished is removed is removed unit 10; With the pickup unit 11 of clamping respectively of the lead frame 1 after removing resin enclosure behind the cast gate and finishing; With the lead frame retractable unit 12 of the indivedual folding and unfoldings of lead frame in each magazine behind each resin enclosure after the clamping; And be used for continuously and the controller unit of controlling automatically 13 etc. each action of above-mentioned each unit.
In addition, do not increase and decrease molding unit and as carrying out the resin enclosure forming device of a small amount of many variety production, have a kind of resin enclosure forming device shown in Figure 15 (such as, with reference to patent documentation 2: Japanese patent laid-open 9-314612 communique).
That is, described resin enclosure forming device comprises: the material filling department 22 that the lead frame 21 before will being shaped loads; To carry out the heating part in advance 23 of pre-heated lead frame from the lead frame 21 before the shaping of above-mentioned material filling department 22 supplies; The aligning section 24 of lead frame before this is shaped; Supply with the feed mechanism 26 of the resin sheet of resin sheet 25; The aligning section 27 of the resin sheet that will arrange from the resin sheet 25 that above-mentioned feed mechanism 26 is supplied with; Seal with resin material and end the resin enclosure forming section 28 (resin enclosure forming metal mould) that is shaped being installed in before the above-mentioned shaping electronic component on the lead frame 21; The material feed mechanism 29 (loader) that lead frame 21 before the shaping of above-mentioned two aligning section (24,27) and resin sheet 25 are transferred to the assigned position of above-mentioned resin enclosure forming section 28; The drip molding folding and unfolding portion 31 that the drip molding (lead frame 30 after envelope is ended) that utilizes above-mentioned resin enclosure forming section 28 to be shaped carries out folding and unfolding; Is the not resin molded body excision portion 33 (cast gate excision portion) that unwanted resin molded body 32 (hardening thing of not wanting) excises to what be connected with above-mentioned drip molding as product; With above-mentioned drip molding 30 and not resin molded body 32 transfer and above-mentioned drip molding 30 be transferred to the drip molding transfer mechanism 34 (dispenser) that above-mentioned drip molding folding and unfolding portion 31 carries out folding and unfolding to above-mentioned not resin molded body excision portion 33; The cleaning mechanism 35 that the die face of above-mentioned metal die is cleaned; And be used for controlling organization 36 that above-mentioned each one, each mechanism are controlled automatically etc.
The resin enclosure forming device of patent documentation 1, its structure are the dispenser unit of the lead frame taking-up after the resin enclosure after driving shipment device unit that lead frame and resin sheet be transferred to molding unit respectively and will being shaped is finished.In addition, transfer unit and pickup unit and above-mentioned shipment device unit, dispenser unit are arranged for dividing, separately-driven structure.Therefore, each unit needs independently driving mechanism, the drive unit of high price.In addition, in the occasion of the kind switching of carrying out each unit, to mutual adjustment trouble, time-consuming.And, above-mentioned resin enclosure device, in order also to tackle a large amount of productions, molding unit can dismounting freely, thereby have the problem that is difficult to make the device integral miniaturization from structure.
In addition, the resin enclosure forming device of patent documentation 2, material feed mechanism (loader) is separately-driven structure with drip molding transfer mechanism (dispenser), so need driving mechanism, the drive unit of high price respectively.In addition, lead frame and described material feed mechanism and above-mentioned drip molding transfer mechanism are configured in the front face side of resin enclosure forming device before being shaped, so device integral body is elongated, have the problem that is difficult to miniaturization.
In view of this, the objective of the invention is to, provide a kind of carry out easily a small amount of many variety production, can variable production, low cost, small-sized resin enclosure forming device.
Content of the present invention
In order to achieve the above object, resin enclosure forming device of the present invention comprises: punching unit; The be formed part feed unit that is formed of part of supply; Supply with the resin material feed unit of resin material; Supply with the loader unit of the part that is formed to punching unit; Take out the dispenser unit of the drip molding behind the resin enclosure from punching unit; And the drip molding retractable unit of folding and unfolding resin enclosure postforming part, it is characterized in that, described loader unit and described dispenser unit radial configuration and by integrated, so that can be the angle that the center forms 90 degree mutually with the center of rotation, and can be that rotate integratedly at the center with described center of rotation.
Adopt the present invention, because loader unit and dispenser unit have the angle of 90 degree, so can be that rotate integratedly at the center with the center of rotation.Therefore, do not need on loader and dispenser, to be provided with respectively driving mechanism, the drive unit of high price, can make resin enclosure forming device at low cost.
Because of the structure that loader unit and dispenser unit are made of one, so can obtain than the small resin enclosure forming device of conventional art floor space.
As example of the present invention, also can be that the angle intervals of 90 degree at center disposes successively with the center of rotation with the part feed unit that is formed, punching unit, drip molding retractable unit.
This example, loader and dispenser too, each unit with 90 the degree angle intervals dispose successively.Therefore, different unit can carry out operation simultaneously, can obtain the high resin enclosure forming device of operating efficiency.
As other examples, also can utilize loader to carry the part that is formed to punching unit from the part feed unit that is formed, utilize dispenser from the drip molding of punching unit behind drip molding retractable unit carrying resin enclosure.
This example only utilizes loader to carry the part that is formed from the part feed unit that is formed to punching unit, only utilizes dispenser from the drip molding of punching unit behind drip molding retractable unit carrying resin enclosure.Therefore, do not need to be provided with in addition carrying mechanism, it is simple that kind is switched operation, can obtain cheap and small-sized resin enclosure forming device.
As other examples, also the cast gate excision unit that can separate with resin not with the part feed unit that is formed, punching unit, with the drip molding behind the resin enclosure is that the angle intervals of 90 degree at center dispose successively with the center of rotation.In addition, the cast gate excision unit that also can separate with resin not with the part feed unit that is formed, punching unit, with the drip molding behind the resin enclosure, the angle intervals that the drip molding retractable unit with the center of rotation is 90 degree at center dispose successively.
This example, loader and dispenser too, each unit with 90 the degree angle intervals dispose successively.Therefore, comprise that different unit can carry out operation simultaneously, can obtain the higher resin enclosure forming device of operating efficiency to not wanting the operation that resin separates.
As new example, also can utilize loader to carry the part that is formed to punching unit from the part feed unit that is formed, utilize dispenser from the drip molding of punching unit after cast gate is removed unit carrying resin enclosure.In addition, also can utilize loader from the part feed unit that is formed to the punching unit carrying part that is formed, utilize dispenser to remove the unit, and remove the drip molding of unit behind drip molding retractable unit carrying resin enclosure from cast gate to cast gate from punching unit.
This example, only utilize loader from the part feed unit that is formed to the punching unit carrying part that is formed, only utilize dispenser to remove the unit and/or remove the drip molding of unit behind drip molding retractable unit carrying resin enclosure from cast gate to cast gate from punching unit.Therefore, do not need to be provided with in addition carrying mechanism, it is simple that kind is switched operation, can obtain cheap and small-sized resin enclosure forming device.
As different examples, also can with the center of rotation be with the part feed unit that is formed, resin material feed unit the center form mutually 90 the degree angles be configured.
This example can be supplied with resin material the part that is formed, so can obtain the big resin enclosure forming device of design freedom from different positions.
As other examples, also the metal die cleaner can be arranged on and the punching unit position adjacent.
This example can obtain having the cheapness of metal die cleaner, small-sized resin enclosure forming device.
Example as a supplement also can be arranged on the resin material delivery position of supplying with the resin material feed unit of resin material the part feed unit that is formed, punching unit, cast gate and remove between the center of rotation of any unit in unit and the drip molding retractable unit and loader unit and dispenser unit.
This example can be configured in the resin material delivery position on the desired position as required, thereby can obtain the big resin enclosure forming device of design freedom.
The simple declaration of accompanying drawing
Fig. 1 is the vertical view cutaway drawing of an example of expression semiconductor device resin enclosure forming device of the present invention.
Fig. 2 is the side view of expression semiconductor device resin enclosure forming device shown in Figure 1.
Fig. 3 is the detailed vertical view cutaway drawing of expression loader unit.
Fig. 4 is the A-A phantom of expression loader unit shown in Figure 3.But, dispenser is in the state that advances.
Fig. 5 is the B-B phantom of expression loader unit shown in Figure 3.But, dispenser is in the state that advances.
Fig. 6 is the specification figure of the semiconductor device resin enclosure forming device of this example of expression, represents that each unit is in the state of origin position.
Fig. 7 is the specification figure of the semiconductor device resin enclosure forming device of this example of expression.
Fig. 8 is the specification figure of the semiconductor device resin enclosure forming device of this example of expression.
Fig. 9 is the specification figure of the semiconductor device resin enclosure forming device of this example of expression.
Figure 10 is the specification figure of the semiconductor device resin enclosure forming device of this example of expression.
Figure 11 is the specification figure of the semiconductor device resin enclosure forming device of this example of expression.
Figure 12 is the specification figure of the semiconductor device resin enclosure forming device of this example of expression.
Figure 13 is the specification figure of the semiconductor device resin enclosure forming device of this example of expression.
Figure 14 is the vertical view of expression as the resin enclosure forming device of the patent documentation 1 of conventional case.
Figure 15 is the vertical view of expression as the resin enclosure forming device of the patent documentation 2 of conventional case.
The specific embodiment
Example 1 of the present invention is the occasion that is applied to semiconductor device resin enclosure forming device 100 shown in Fig. 1 to 13.
Semiconductor device resin enclosure forming device 100 comprises as shown in Figures 1 and 2: substrate feed unit 101; Feeding sheet materials unit 200 (Fig. 2); Punching unit 300; Metal die cleaning unit 400; Cast gate is removed unit 500; Drip molding retractable unit 600; And shipment device unit 700.
That is, magazine lifter 102 be equipped with folding and unfolding the part that is formed be the charging box 106 of the substrate 105 before a plurality of resin enclosures, the substrate 105 of substrate feed mechanism 103 before taking out resin enclosures from charging box 106 just makes 1 plate base rise.Utilize the substrate 105 before the chuck 107 of substrate feed mechanism 103 is clamped resin enclosure in the charging box 106, on preheater 104, determine extracting position.Preheater 104 is made of up and down movably cylinder etc., rises during the loader unit 800 chatted after the substrate before the resin enclosure 105 is given.It is such that substrate feed unit 101 is not limited to present embodiment, supplies with the method for the substrate 105 before the resin enclosures from charging box 106, also can utilize conveyer belt etc. automatically to supply with from the operation before the resin enclosure operation etc.
The change that each part of substrate feed unit 101 can suit to width, length according to the kind of substrate 105.In addition, the occasion of preheater 104 is not set, becomes the guide rail of guiding etc. when the substrate 105 before charging box 106 takes out resin enclosure can only be set.
Feeding sheet materials unit 200 is that to be used for loading the sealing resin material from spherical feed appliance 201 in the reciprocal shuttle 202 of sheet material be a plurality of sheet materials 203 as shown in Figures 1 and 2, and the loader 800 that sheet material 203 is chatted backward joins.The reciprocal shuttle 202 of sheet material is located at the sheet material delivery position 204 (Fig. 1) to loader 800, can move back and forth with respect to the direction of paper quadrature.And, the reciprocal shuttle 202 of sheet material can corresponding to after the replacing that suits of the appearance and size of the interval of still 306 of the counterdie 301 chatted and sheet material 203.In addition, the feed mechanism of sheet material 203 is not limited to spherical feed appliance, also can use variety of ways such as magazine mode, air force feed mode.
Counterdie 301, patrix 302 and plunger can suitably be changed according to the kind of substrate 105 and sheet material 203.
Cast gate is removed unit 500 as shown in Figure 1, be with from after the unit that separates with resin 902 not of the substrate 901 of the resin enclosure that receives of the dispenser unit 900 chatted after finishing.The lower side of removing unit 500 at cast gate is provided with discarded case 501, can discard not resin 902.Cast gate unit 500 can be tackled the substrate 901 after the resin enclosure with different shape is finished and not want resin 902 by being changed each building block.In addition, this cast gate also can be set remove unit 500, in mould, automatically the substrate behind the resin enclosure be separated with resin not.This occasion does not need cast gate to remove unit 500, and the substrate 901 that clips behind the resin enclosure also can be set, and to the substrate correcting unit that the set-back of substrate 901 is corrected, removes unit 500 to substitute cast gate.
Drip molding retractable unit 600 is to receive substrate 901 behind the resin enclosures and the unit that carries out folding and unfolding from dispenser unit 900 as shown in Figure 1, can be provided with the 901 stacked folding and unfoldings of the substrate behind the resin enclosure are gone out magazine 601.But, go out magazine 601 and be not limited to the such form of present embodiment, the form that the substrate after also can using side from magazine with resin enclosure slides and carries out folding and unfolding the 901 overlapping folding and unfoldings of the substrate behind the resin enclosure.In addition, the folding and unfolding method of drip molding is not limited to the method for folding and unfolding in going out magazine, also can use carrying mechanisms such as being provided with conveyer belt, automatically is carried to the outer drip molding retractable unit of resin enclosure device.
Rotation section 701 is made of base plate 703, upper plate 704, turning cylinder 705 and unit base plate 718 as shown in Figure 4.
Said base plate 703 is installed on the framework 108 of semiconductor device resin enclosure forming device 100, and upper plate 704 is installed in the bottom of base plate 703 by pillar 707.Be fixed with bearing block 708 in the bottom of upper plate 704, turning cylinder 705 rotates by bearing 709 and is installed in bearing block inside freely.On the top of turning cylinder 705 timing belt pulley 710 is installed, rotor plate 711 is installed in its underpart, be connected with timing belt pulley 713 by synchronous belt 712 simultaneously.This timing belt pulley 713 is installed on the turning cylinder 716 of the servomotor 715 on the support 714 that is fixed in above-mentioned upper plate 704.
Therefore, the revolving force of servomotor 715 rotates rotor plate 711 by timing belt pulley 713, synchronous belt 712, timing belt pulley 710, turning cylinder 705, is that rotate at the center thereby make shipment device unit 700 with turning cylinder 702.
Bottom at rotor plate 711 is equipped with unit base plate 718 by pillar 717.Loader 800 and dispenser 900 are installed in the top and bottom of said units base plate 718 respectively, form the angle of 90 degree mutually.
Move into unit 801, the side in the side of the sheet material seat 802 of folding and unfolding sheet material 203 is equipped with contiguous block 803, and the opposing party is fixed with sliding axle 804.Protrudent pin 866 can be installed in front end the top of sheet material seat 802 down up or down by not shown guiding mechanism guiding from the state of the top insertion of sheet material patchhole 813.In addition, below the contiguous block 803 of the side that is installed in sheet material seat 802, be provided with the pin-and-hole 868 that is communicated with sheet material patchhole 813, latch 862 is by the guiding of not shown guiding mechanism, is mounted to front end is inserted under the state in the pin-and-hole 868, in the sheet material patchhole 813 of can coming in and going out.Opposition side in the side that is fixed in sheet material seat 802 of sliding axle 804 is equipped with contiguous block 805.On sliding axle 804, a pair of bar 807 is installed by lining 806.The side of this bar 807 is equipped with the chuck jaw 808 of clamping the preceding substrate 105 of resin enclosure, and pin 809 is installed on top.Form on above-mentioned contiguous block 803 and the contiguous block 805 can with after the contiguous block 859 chatted and the protuberance 810 of contiguous block 860 sliding gomphosis.
Sliding unit 850 be configured in unit base plate 718 above, can move back and forth in direction with center of rotation 702 quadratures, move into unit 801 dismounting and be arranged on the front end freely above-mentioned.This slip single 850 is made of base plate 851, rail plate 852.The piece 853 upright tops that are located at unit base plate 718, linear guide 854 (Fig. 3) is installed on this piece 853.Rail plate 852 is fixed on the top bar 855 that is installed in base plate 851, by linear guide 854 guiding.
In addition, being fixed with chuck jaw below base plate 851 opens and closes with actuator 856, calibration plunger 858, contiguous block 859, contiguous block 860.On base plate 851, be fixed with sheet material and eject cylinder 861.And, on contiguous block 859 and contiguous block 860, be separately installed with latch 811.And, be fixed with sheet material stop cylinder 864 in the side of contiguous block 860 by support 863.On the opposite face of contiguous block 859 and contiguous block 860, form guiding groove 865.Can the contiguous block 803 of unit 801 and the protuberance 810 and above-mentioned groove 865 sliding gomphosis of contiguous block 805 will be moved into.
When shipment device unit 700 is in state shown in Figure 1, moves into unit 801 and pass through sliding unit 850 towards the directions X sliding gomphosis, by latch 811 location, fixing by calibration plunger 858.Moving into unit 801 can easily suitably change according to the kind of substrate 105 and sheet material 203.
When moving into unit 801 and being connected with sliding unit 850, the pin 809 that is installed in the top of the bar 807 of moving into unit 801 opens and closes with actuator 856 chimeric with chuck jaw.And protrudent pin 866 ejects cylinder 861 with sheet material and is connected, and latch 862 is connected with sheet material stop cylinder 864.Move when chuck jaw opens and closes with actuator 856, then chuck jaw 808 opens and closes, and can keep the preceding substrate 105 of resin enclosure.When sheet material 203 inserts from the lower side of sheet material seat 802, then make 864 actions of sheet material stop cylinder, latch 862 is ejected, sheet material 203 can not fallen.Sheet material ejects cylinder 861 makes sheet material 203 eject from the top, so that sheet material 203 is dropped in the still 306 of counterdie 301 reliably.
And screw mandrel 870 is installed in frame on the piece on the bar 855 869 abreast with slide rail 852.One end of above-mentioned screw mandrel 870 is connected with saddle 872 on being installed in unit base plate 718 by nut 871.This nut 871 is installed in the nut seat 873.Above-mentioned nut seat 873 is installed in rotation in the saddle 872 by bearing 874.Timing belt pulley 875 is installed on nut seat 873, is connected with timing belt pulley 877 by synchronous belt 876.This timing belt pulley 877 is installed on the turning cylinder 721 of the motor 720 that founds the top support 719 of being located at unit base plate 718.
Therefore, the rotatory force of motor 720 rotates nut 871 by timing belt pulley 877, synchronous belt 876, timing belt pulley 875, nut seat 873, and this rotational motion is transformed to straight reciprocating motion, and sliding unit 850 is moved back and forth.
When shipment device unit 700 rotated, sliding unit 850 moved (retreating) towards the direction of turning cylinder 702.
Take out of unit 903, the cross section is that the sliding shoe 906 of T font is fixed on to be equipped with resin 902 is not carried out on the integrated package (マ ニ ホ one Le De Block ロ ッ Network) 905 of the adsorbent pad of vacuum suction.And sliding axle 907 is fixed on the side of above-mentioned integrated package 905.Plate 908 is installed in the opposition side of a side that is fixed with sliding axle 907 on the integrated package 905.In addition, a pair of bar 910 is installed on the sliding axle 907 by lining 909 (Fig. 3).Catch the chuck jaw 911 of the substrate 901 behind the resin enclosure to be installed in the side of this bar 910, sell 912 mounted thereto.
Sliding unit 950 be installed in unit base plate 718 below, can move back and forth towards direction with center of rotation 702 quadratures, take out of unit 903 and be installed on the front end removably.This sliding unit 950 is made of base plate 951, rail plate 952, movable platen 953.Below unit base plate 718, stand and establish piece 954, on this piece 954 (Fig. 3), linear guide 955 (Fig. 3) is installed.Rail plate 952 is fixed on the top piece 956 that is installed in base plate 951, by linear guide 955 guiding.On base plate 951, stand and establish piece 957, on this piece 957, linear guide 958 is installed.Movable platen upper and lower air cylinders 959 is installed on base plate 951.
Guide pad 960, guide pad 961, chuck jaw switching actuator 962, latch 963 are installed below the movable platen 953.In addition, plate 964 be installed in movable platen 953 above, on the piston 965 by this plate 964 and movable platen upper and lower air cylinders 959.And, be fixed with calibration plunger 966 on the movable platen top 953.Guide rail 967 is fixed on the side of guide pad 960, and by linear guide 958 guiding, movable platen 953 can move up and down.
Above-mentioned sliding shoe 906 of taking out of unit 903 is chimeric with the slot part 969 that is roughly the T font by guide pad 960, guide pad 961 and movable platen 953 formed cross sections slidably, and fixing by calibration plunger 966.
Take out of unit 903 when being connected, be installed in above-mentioned top pin 912 of taking out of the bar 910 of unit 903 and open and close with actuator 962 chimeric with chuck jaw with movable platen 953.Move when chuck jaw opens and closes with actuator 962, then chuck jaw 911 opens and closes, and the substrate behind the resin enclosure 901 can be kept.In addition, by the action of above-mentioned movable platen upper and lower air cylinders 959, movable platen 953 is moved up and down.Therefore, after resin enclosure is shaped, catch the substrate 901 behind the resin enclosure that ejects from counterdie 301 by ejection pin (not shown), can not adsorb, take out from counterdie 301 with wanting resin 902.
And, screw mandrel 971 by support 970 and rail plate 952 be installed in abreast base plate 951 above, an end of this screw mandrel 971 is identical with loader unit 800, is connected with the following saddle 973 (Fig. 5) that is installed in unit base plate 718 by nut.This nut is installed on the nut seat.Above-mentioned nut seat is installed in rotation in the saddle 973 by bearing.And timing belt pulley 976 is installed on the above-mentioned nut seat, is connected with timing belt pulley 978 by synchronous belt 977.Above-mentioned timing belt pulley 978 is installed on the turning cylinder of motor 723, and this motor 723 is fixed on upright being located on the following support 722 of unit base plate 718.
Therefore, the rotatory force of motor 723 rotates nut by timing belt pulley 978, synchronous belt 977, timing belt pulley 976, nut seat, and this rotational motion is transformed to straight reciprocating motion, and sliding unit 950 is moved back and forth.When shipment device unit 700 rotated, sliding unit 950 moved (retreating) towards turning cylinder 702 directions.
Below, the action of the semiconductor device resin enclosure forming device 100 of said structure is described.
The turned position of shipment device unit 700 shown in Figure 6 describes clockwise direction as origin position (absolute coordinate 0 degree) as positive direction.
At first, as shown in Figure 7, from putting the charging box 106 on the magazine lifter 102 of substrate feed unit 101, utilize the chuck 107 of substrate feed mechanism 103 that 105 slices of the substrate before the resin enclosure are caught, extraction positions on preheater 104.Substrate 105 before resin enclosure is extracted out from above-mentioned charging box 106, just the rise size of 1 plate base of magazine lifter 102, and the substrate 105 before the next subsequently resin enclosure is in the state that is drawn out of.At this moment, the sheet material seat 802 of moving into unit 801 of loader 800 is in sheet material delivery position 204, with the sheet material axle 202 that is equipped with sheet material 203 of feeding sheet materials unit 200 rise to sheet material seat 802 under.The not shown ejector of sheet material 203 usefulness that carries on sheet material seat 802 is ejected, from the lower opening portion insertion of sheet material seat 802.When sheet material 203 inserts sheet material seat 802, then make 864 actions of sheet material stop cylinder, latch 862 is ejected, so that sheet material 203 does not fall (Fig. 5) from sheet material seat 802.
Below, as shown in Figure 8, will load and transport device unit 700 towards counterclockwise rotating 90 degree (absolute coordinate-90 degree).Then, the sliding unit 850 of loader unit 800 is advanced, make and move into the top that unit 801 is positioned at preheater 104.After the preheater 104 that has loaded the substrate 105 before the resin enclosure was risen, chuck jaw opened and closed with actuator 856 actions, utilized the chuck jaw 808 of moving into unit 801 to catch the substrate 105 before the resin enclosure to keep (Fig. 5).
Then, preheater 104 is descended, sliding unit 850 is retreated after, as shown in Figure 9, will load and transport device unit 700 and rotate 90 degree (absolute coordinate 0 is spent) toward the clockwise direction.The sliding unit 850 of loader unit 800 is advanced, insert between the patrix of opening 302 and counterdie 301 moving into unit 801, the assigned position place on counterdie 301 carries out standby.Then, counterdie 301 is risen a little after, open the chuck jaw 808 of moving into unit 801, the substrate before the resin enclosure 105 is put on counterdie 301.And, retract latch 862 from sheet material seat 802, sheet material knock pin 866 is ejected, sheet material 203 is dropped in the still 306 of counterdie 301.
Then, counterdie 301 is risen carries out matched moulds, clamp the substrate 105 before the resin enclosure and form cavity, plunger (not shown) is pushed up up by patrix 302 and counterdie 301, to sheet material 203 heat fused, with resin to carrying out filling in the cavity.
Behind the hardening of resin of filling, decline counterdie 301 is opened patrix 302 and counterdie 301 in the cavity.At this moment, the ejection pin of patrix 302 (not shown) ejects, with the substrate behind the resin enclosure 901 and not resin 902 on counterdie 301, eject.And, when counterdie 301 is opened with patrix 302, as shown in figure 10, will load and transport device unit 700 and turn 90 degrees (absolute coordinate-90 degree) towards counterclockwise revolving.The sliding unit 950 of dispenser 900 is advanced, enter between the patrix of opening 302 and counterdie 301, be positioned at assigned position on the counterdie 301 taking out of unit 903.Then, the ejection pin (not shown) of counterdie 301 is ejected, make behind the resin enclosure substrate 901 and not resin 902 eject from counterdie 301, simultaneously, make and take out of unit 903 and descend.Utilize the substrate 901 after chuck jaw 911 is caught resin enclosure, utilize 904 pairs of adsorbent pad not want resin 902 and adsorb.Make then and take out of unit 903 risings,, sliding unit 950 is retreated with the substrate behind the resin enclosure 901 with under the state that resin 902 does not keep.
When the sliding unit 950 of dispenser unit 900 retreated, the land area of 400 pairs of patrixes 302 of mould cleaning unit and counterdie 301 was cleaned with water, and vacuum draw begins cleaning.
In addition, during dispenser unit 900 carries out above-mentioned action, the sliding unit 850 of loader unit 800 is advanced, carry out the reception action of the preceding substrate 105 of above-mentioned resin enclosure.
In addition, cleaning mold makes the sliding unit 850 of loader 800 advance after finishing immediately, as mentioned above, substrate before the resin enclosure 105 and sheet material 203 are supplied with to counterdie 301, and after sliding unit 850 retreated, punching unit 300 carried out resin enclosure operation same as described above.
Not utilizing dispenser unit 900 that the substrate behind the resin enclosure 901 is excised the occasion that unit 500 is carried to drip molding retractable unit 600 from cast gate, sliding unit 950 is retreated, then become state shown in Figure 7, repeat above-mentioned action.
Sliding unit 950 when dispenser unit 900 retreats, and then cast gate is removed unit 500 substrate behind the resin enclosure 901 is separated with resin 902 not, will not want resin 902 and discards in discarded case 501.After cast gate excision unit 500 finishes detached job, as shown in figure 12, the sliding unit 950 of dispenser unit 900 is advanced, make and take out of unit 903 declines.Close chuck jaw 911 then, catch the substrate 901 behind the resin enclosure to keep.Then, make and take out of unit 903 risings, sliding unit 950 retreats.
After dispenser unit 900 takes out substrate 901 behind the resin enclosures from cast gate excision unit 500, as shown in figure 13, will load and transport device unit 700 and revolve toward the clockwise direction and turn 90 degrees (absolute coordinate 90 is spent).Then, the sliding unit 950 of dispenser unit 900 is advanced, be positioned at the top that goes out magazine 601 that is arranged on the drip molding retractable unit 600 taking out of unit 903.Then, open chuck jaw 911, in going out magazine 601, sliding unit 950 is retreated 901 folding and unfoldings of the substrate behind the resin enclosure.
Then, as shown in Figure 7, make shipment device unit 700 turn 90 degrees (absolute coordinate 0 degree) towards counterclockwise revolving.After, repeat action same as described above.
In the above-mentioned example 1, the sheet material axle 202 of feeding sheet materials unit 200 is configured between punching unit 300 and the shipment device unit 700, and is provided with sheet material delivery position 204.Therefore, in the example 1, loader 800 rotates-90 degree (absolute coordinate-90 degree) with after sheet material 203 folding and unfoldings are in sheet material seat 802.Then, above-mentioned loader unit 800 rotates+90 degree after receiving substrate 105 before the resin enclosures from preheater 104, and making absolute coordinate is 0 degree.Substrate before sheet material 203 and the resin enclosure 105 is supplied with the counterdie 301 of punching unit 300.
And, use examples as other of example 1, such as, can consider that also above-mentioned loader unit 800 receives substrate 105 before the resin enclosures from preheater 104 after, rotate+90 degree.And, receive sheet material 203 with absolute coordinate 0 degree from sheet material axle 202, then with the method in the counterdie 301 of the 105 supply punching units 300 of the substrate before sheet material 203 and the resin enclosure.
Adopt this use example, received sheet material 203 before just moulding material will being supplied with punching unit 300, so the dust that sticks on the sheet material 203 can not disperse in mobile route, this is good.And above-mentioned other make use-case as long as the change operation program is changed easily.
Example 2, be by changing sheet material axle 202 the position, sheet material delivery position 204 is configured in substrate feed unit 101 and the situation of loading and transporting between the device unit 700.
Adopting this example, is that sheet material delivery position 204 is configured between substrate feed unit 101 and the shipment device unit 700.Therefore, during dispenser unit 900 enters between patrix 302 and the counterdie 301 substrate 901 after taking out resin enclosure, the action that loader unit 800 can carry out the reception action of the substrate 105 before the resin enclosure simultaneously and carry out receiving from above-mentioned sheet material axle 202 sheet materials 203.Its result has the operating efficiency that can improve device, shortens the device advantage of whole circulation timei.
The possibility of utilizing on the industry
Above-mentioned resin enclosure forming device of the present invention is certainly also applicable to other electronic components are carried out The occasion of resin enclosure.
Claims (10)
1. a resin enclosure forming device comprises: punching unit; The be formed part feed unit that is formed of part of supply; Supply with the resin material feed unit of resin material; Supply with the loader unit of the part that is formed to punching unit; Take out the dispenser unit of the drip molding behind the resin enclosure from punching unit; And the drip molding retractable unit of the drip molding behind the folding and unfolding resin enclosure, it is characterized in that,
Described loader unit and described dispenser unit radial configuration and by integrated so that can be the angles that the center forms 90 degree mutually with the center of rotation, and can be that rotate integratedly at the center with described center of rotation.
2. resin enclosure forming device as claimed in claim 1 is characterized in that, the part feed unit that is formed, punching unit, drip molding retractable unit are that the angle intervals of 90 degree at center dispose successively with the center of rotation.
3. resin enclosure forming device as claimed in claim 1 or 2, it is characterized in that, utilize loader to carry the part that is formed to punching unit, utilize dispenser from the drip molding of punching unit behind drip molding retractable unit carrying resin enclosure from the part feed unit that is formed.
4. resin enclosure forming device as claimed in claim 1, it is characterized in that the part feed unit that is formed, punching unit, the cast gate excision unit that the drip molding behind the resin enclosure is separated with resin not are that the angle intervals of 90 degree at center dispose successively with the center of rotation.
5. resin enclosure forming device as claimed in claim 4, it is characterized in that, the cast gate excision unit, the drip molding retractable unit that separate with resin not with the part feed unit that is formed, punching unit, with the drip molding behind the resin enclosure are that the angle intervals of 90 degree at center dispose successively with the center of rotation.
6. as claim 4 or 5 described resin enclosure forming devices, it is characterized in that, utilize loader to carry the part that is formed to punching unit, utilize dispenser from the drip molding of punching unit after cast gate is removed unit carrying resin enclosure from the part feed unit that is formed.
7. as each described resin enclosure forming device in the claim 4 to 6, it is characterized in that, utilize loader from the part feed unit that is formed to the punching unit carrying part that is formed, utilize dispenser to remove the unit, and remove the drip molding of unit behind drip molding retractable unit carrying resin enclosure from cast gate to cast gate from punching unit.
8. as each described resin enclosure forming device in the claim 1 to 7, it is characterized in that the part feed unit that is formed, resin material feed unit are that the angles that the center forms 90 degree mutually are configured with the center of rotation.
9. as each described resin enclosure forming device in the claim 1 to 8, it is characterized in that the metal die cleaning unit is located at and the punching unit position adjacent.
10. as each described resin enclosure forming device in the claim 1 to 9, it is characterized in that, supply with the resin material delivery position of the resin material feed unit of resin material, be located at the part feed unit that is formed, punching unit, cast gate and remove between the center of rotation of any unit in unit and the drip molding retractable unit and loader unit and dispenser unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003370707A JP3609824B1 (en) | 2003-10-30 | 2003-10-30 | Resin sealing molding equipment |
| JP2003370707 | 2003-10-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1611339A true CN1611339A (en) | 2005-05-04 |
| CN100366414C CN100366414C (en) | 2008-02-06 |
Family
ID=34101303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100899076A Active CN100366414C (en) | 2003-10-30 | 2004-10-29 | Resin enclosure forming device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP3609824B1 (en) |
| KR (1) | KR100675466B1 (en) |
| CN (1) | CN100366414C (en) |
| HK (1) | HK1074816A1 (en) |
| TW (1) | TWI251885B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101168275B (en) * | 2006-10-25 | 2011-02-09 | 株式会社Nft | Resin mold casting device |
| CN102785326A (en) * | 2011-05-19 | 2012-11-21 | 深圳市安托山特种机电有限公司 | Novel injection machine for package materials |
| CN104162954A (en) * | 2013-05-15 | 2014-11-26 | 东芝机械株式会社 | Molding system and method of manufacturing molded article |
| CN104576475A (en) * | 2013-10-17 | 2015-04-29 | 东和株式会社 | Method and apparatus for supplying semiconductor substrate |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5387646B2 (en) * | 2011-10-07 | 2014-01-15 | 第一精工株式会社 | Resin sealing device |
| JP7335647B2 (en) * | 2018-08-10 | 2023-08-30 | アピックヤマダ株式会社 | Work transfer device and resin molding device |
| JP7068094B2 (en) * | 2018-08-10 | 2022-05-16 | アピックヤマダ株式会社 | Work transfer device, resin transfer device and resin molding method |
| JP7203414B2 (en) * | 2018-12-27 | 2023-01-13 | アピックヤマダ株式会社 | Resin supply/take-out device, workpiece transfer device, and resin molding device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06830A (en) * | 1992-06-22 | 1994-01-11 | Toshiba Corp | Mold system |
| TW257745B (en) * | 1993-07-22 | 1995-09-21 | Towa Kk | |
| TW410194B (en) * | 1996-08-20 | 2000-11-01 | Apic Yamada Kk | Resin molding machine |
| JP4327986B2 (en) * | 2000-04-21 | 2009-09-09 | アピックヤマダ株式会社 | Resin sealing device |
| TW509615B (en) * | 2000-04-21 | 2002-11-11 | Apic Yamada Corp | Resin molding machine and resin tablet feeding machine |
-
2003
- 2003-10-30 JP JP2003370707A patent/JP3609824B1/en not_active Expired - Fee Related
-
2004
- 2004-10-18 TW TW93131520A patent/TWI251885B/en active
- 2004-10-21 KR KR20040084461A patent/KR100675466B1/en active IP Right Grant
- 2004-10-29 CN CNB2004100899076A patent/CN100366414C/en active Active
-
2005
- 2005-08-17 HK HK05107137A patent/HK1074816A1/en not_active IP Right Cessation
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101168275B (en) * | 2006-10-25 | 2011-02-09 | 株式会社Nft | Resin mold casting device |
| CN102785326A (en) * | 2011-05-19 | 2012-11-21 | 深圳市安托山特种机电有限公司 | Novel injection machine for package materials |
| CN104162954A (en) * | 2013-05-15 | 2014-11-26 | 东芝机械株式会社 | Molding system and method of manufacturing molded article |
| US9636856B2 (en) | 2013-05-15 | 2017-05-02 | Toshiba Kikai Kabushiki Kaisha | Molding system and method of manufacturing molded article |
| US10093048B2 (en) | 2013-05-15 | 2018-10-09 | Toshiba Kikai Kabushiki Kaisha | Molding system and method of manufacturing molded article |
| CN104576475A (en) * | 2013-10-17 | 2015-04-29 | 东和株式会社 | Method and apparatus for supplying semiconductor substrate |
| CN104576475B (en) * | 2013-10-17 | 2017-05-17 | 东和株式会社 | Method and apparatus for supplying semiconductor substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100675466B1 (en) | 2007-01-26 |
| KR20050041890A (en) | 2005-05-04 |
| JP2005136193A (en) | 2005-05-26 |
| CN100366414C (en) | 2008-02-06 |
| HK1074816A1 (en) | 2005-11-25 |
| TW200529335A (en) | 2005-09-01 |
| TWI251885B (en) | 2006-03-21 |
| JP3609824B1 (en) | 2005-01-12 |
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