CN1574129A - Multilayer ceramic electronic component and mounting structure and method for the same - Google Patents
Multilayer ceramic electronic component and mounting structure and method for the same Download PDFInfo
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- CN1574129A CN1574129A CNA2004100476086A CN200410047608A CN1574129A CN 1574129 A CN1574129 A CN 1574129A CN A2004100476086 A CNA2004100476086 A CN A2004100476086A CN 200410047608 A CN200410047608 A CN 200410047608A CN 1574129 A CN1574129 A CN 1574129A
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- thermoplastic resin
- electronic component
- outer electrode
- ceramic electronic
- laminated ceramic
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- 239000000919 ceramic Substances 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims description 13
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 94
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000003990 capacitor Substances 0.000 claims abstract description 21
- 229920001577 copolymer Polymers 0.000 claims description 24
- 150000007514 bases Chemical class 0.000 claims description 23
- 238000003466 welding Methods 0.000 claims description 18
- -1 difluoroethylene, trifluoro-ethylene Chemical group 0.000 claims description 9
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 abstract description 28
- 239000011347 resin Substances 0.000 abstract description 28
- 229910000679 solder Inorganic materials 0.000 abstract description 28
- 238000005476 soldering Methods 0.000 abstract description 22
- 239000003985 ceramic capacitor Substances 0.000 description 29
- 229910045601 alloy Inorganic materials 0.000 description 12
- 239000000956 alloy Substances 0.000 description 12
- 229940126543 compound 14 Drugs 0.000 description 11
- 230000007547 defect Effects 0.000 description 11
- 238000009736 wetting Methods 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000009969 flowable effect Effects 0.000 description 7
- 230000004907 flux Effects 0.000 description 7
- 238000009434 installation Methods 0.000 description 7
- 239000003960 organic solvent Substances 0.000 description 7
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- 229920003002 synthetic resin Polymers 0.000 description 7
- 239000000057 synthetic resin Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 230000002688 persistence Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 2
- 229910020988 Sn—Ag Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- SZUVGFMDDVSKSI-WIFOCOSTSA-N (1s,2s,3s,5r)-1-(carboxymethyl)-3,5-bis[(4-phenoxyphenyl)methyl-propylcarbamoyl]cyclopentane-1,2-dicarboxylic acid Chemical compound O=C([C@@H]1[C@@H]([C@](CC(O)=O)([C@H](C(=O)N(CCC)CC=2C=CC(OC=3C=CC=CC=3)=CC=2)C1)C(O)=O)C(O)=O)N(CCC)CC(C=C1)=CC=C1OC1=CC=CC=C1 SZUVGFMDDVSKSI-WIFOCOSTSA-N 0.000 description 1
- MIZLGWKEZAPEFJ-UHFFFAOYSA-N 1,1,2-trifluoroethene Chemical group FC=C(F)F MIZLGWKEZAPEFJ-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910000905 alloy phase Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007850 degeneration Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000000640 hydroxylating effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/103—Sealings, e.g. for lead-in wires; Covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
A multilayer ceramic electronic component is prepared by covering a capacitor element with a thermoplastic resin layer that is mounted on a substrate by soldering. The thermoplastic resin layer is molten due to the heat required for soldering. The molten resin layer flows to expose external electrodes of the electronic component. The exposed external electrodes are soldered to electrodes of the substrate. In the resultant mounting structure, the thermoplastic resin layer covers substantially the entire surface except for the soldered portion of the electronic component and a portion of the solder.
Description
Technical field
The mounting structure and the method that the present invention relates to a kind of laminated ceramic electronic component and be used for this electronic component.Particularly, the present invention relates to a kind of for example monolithic ceramic capacitor laminated ceramic electronic component, a kind ofly structure and a kind of being used for that described ceramic component is installed on the substrate is installed on method on the substrate by welding with ceramic component by welding.
Background technology
Monolithic ceramic capacitor is the example of laminated ceramic electronic component.With reference to figure 5, monolithic ceramic capacitor 1 comprises the basic compound and the internal electrode 3 of ceramic layer 2.Pass the thickness of basic compound and arrange internal electrode 3, make its arbitrary end face that alternately leads to basic compound, and link to each other with the outer electrode 4 that is positioned over two end faces of basic compound.Electric charge between the monolithic ceramic capacitor 1 storage outer electrode 4.
Utilize solder bonds 5 that the outer electrode 4 of monolithic ceramic capacitor 1 is linked to each other with electrode 7 on being formed at substrate 6.If the edges cover of the surface of basic compound and outer electrode 4 epoxy resin layer 8 (for example, seeing the open No.8-162357 of Japanese laid-open patent application), then the soldered part on the surface of outer electrode 4 is less than the layout that does not comprise epoxy resin layer 8.This less soldered part has reduced to be applied to the thermal stress of basic compound and the physical property stress that is applied to basic compound at the weld period of monolithic ceramic capacitor 1 by extension and compression substrate 6 by heating or cooling.Therefore, this epoxy resin layer 8 has reduced the damage of these stress to basic compound.
With reference to figure 6, for example polyethylene synthetic resin layer 9 can be formed on the whole surface of monolithic ceramic capacitor 1 and (for example, see the open No.9-69468 of Japanese laid-open patent application).This synthetic resin layer 9 has prevented the oxidation of outer electrode 4, the wettability of scolder shown in therefore having guaranteed.In addition, be used to the heat fusing that welds or decomposed the synthetic resin layer 9 that is covered in outer electrode 9.With reference to figure 7, the result has removed these parts to guarantee solderability preferably then.
But according to the mounting structure of Fig. 5, outer electrode 4 is exposed to the outside.Therefore, be easy to these outer electrodes 4 of oxidation, this oxidation is degenerated solderability.In addition, the outer electrode 4 with less soldered part has increased the possibility of set up a monument (tombstoning) of monolithic ceramic capacitor.Setting up a monument is the phenomenon that a kind of surface tension by melting solder has been raised soldered element.According to the mounting structure among Fig. 7, covered the edge of external voltage 4 by solder bonds 5, but being heated after the part of the synthetic resin layer 9 around having removed solder bonds 5 there is not coverage of synthetic resin layer 9.Therefore, if high voltage is applied on this monolithic ceramic capacitor 1, then occur surface leakage (passing the discharge of outer electrode 4) easily, this has reduced proof voltage.
In addition, in recent years, encourage minimizing is included in the effort that the environmental pollution in electrical equipment and the electronic component is done, thereby protect the global environment and human body.A kind of effort is to use leadless welding alloy to be used for installing.The actual example of leadless welding alloy comprises Sn-Ag alloy, Sn-Ag-Cu alloy and the Sn-Cu alloy that is used for flow soldering, and the Sn-Ag alloy, Sn-Ag-Cu alloy, Sn-Ag-Bi alloy and the Sn-Zn alloy that are used for reflow soldering.But with traditional Sn-Pb alloy phase ratio, these solder alloys have relatively poor wettability.Therefore, if the surface of oxidized outer electrode 4 then uses these scolders may cause unsuccessful installation.
Summary of the invention
In order to overcome the problems referred to above, a kind of be used to the provide mounting structure of the multilayer electronic component with high voltage withstanding property, a kind of installation method and a kind of laminated ceramic electronic component that has significant installability and can be used in described installation method that is used to construct this mounting structure are provided the preferred embodiments of the present invention.
A preferred embodiment of the present invention provides a kind of mounting structure that is used for laminated ceramic electronic component, comprises that it is provided with the substrate of electrode and has outer electrode and the laminated ceramic electronic component of thermoplastic resin.Described outer electrode is welded on the electrode of substrate.Thermoplastic resin has covered in fact except that the soldered part of laminated ceramic electronic component and the whole surface the part scolder.
An alternative embodiment of the invention provides a kind of being used for that laminated ceramic electronic component is installed on method on the substrate, and the method comprising the steps of: utilize thermoplastic resin to cover the whole surface of laminated ceramic electronic component and the outer electrode of described laminated ceramic electronic component is welded on the electrode of substrate.Since the required heat fusing of welding described thermoplastic resin.The scolder of fusing has been got rid of near the fusing thermoplastic resin it.
An alternative embodiment of the invention provides a kind of ceramic multilayer ceramic electron element that comprises electronic unit, and described electronic unit comprises ceramic substrate compound and outer electrode, and thermoplastic resin has covered the whole surface of described electronic unit in fact.Described thermoplastic resin preferably is made up of copolymer, and described copolymer has a selected backbone units from the group that comprises single PVF, difluoroethylene, trifluoro-ethylene and tetrafluoroethene.
For example, described thermoplastic resin preferably has about 1.0 to about 50 microns thickness.
Above-mentioned mounting structure has prevented the surface leakage during applying high voltage.The thermoplastic resin that covered whole surface except that the soldered part of laminated ceramic electronic component and part scolder has in fact prevented the externally intensive Potential Distributing of the outer electrode edge between the electrode and dielectric ceramic surface.That is, thermoplastic resin has reduced electric field density, thereby has prevented surface leakage.Therefore, this structure provides higher proof voltage (voltage resistance).
In order to realize this structure, before welding, utilize thermoplastic resin to cover the whole surface of laminated ceramic electronic component.When this electronic component is welded to substrate,, and around melting solder, got rid of the fusing thermoplastic resin by the described thermoplastic resin of the heat fusing that is used to weld.As a result, electronic component is installed on the substrate, thereby thermoplastic resin has covered the whole surface except that the soldered part of electronic component in fact.Owing to do not remove resin bed, therefore described thermoplastic resin has also covered the part scolder, but the scolder of fusing is with near its eliminating from soldered part.
For this installation method, described thermoplastic resin preferably is made up of copolymer, and described copolymer has a selected backbone units from the group that comprises single PVF, difluoroethylene, trifluoro-ethylene and tetrafluoroethene.
Described have about 1.0 and prevented the oxidation of outer electrode effectively to the thermoplastic resin of about 50 microns thickness, and by the thermal capacitance that is used to weld easily with the resin bed fusing, so that the cover part scolder.
According to another embodiment of the invention, utilize thermoplastic resin to cover the whole surface of laminated ceramic electronic component.This thermoplastic resin has also guaranteed the cleaning of outer electrode, so that the remarkable wettability (wettability) of the scolder that uses is provided, as mentioned above, even use lead-free solder, this also guarantees significant solderability.Therefore, this thermoplastic resin has prevented weld defect, thereby can efficiently install.
In addition, during installation, electronic component is welded on the substrate, melts thermoplastic resin simultaneously so that it flows.After installing, described thermoplastic resin has covered the whole surface of the laminated ceramic electronic component except that soldered part in fact.Therefore, thermoplastic resin prevents to pass the surface leakage of outer electrode, thereby has guaranteed higher proof voltage.
With reference to the accompanying drawings, from following detailed description of preferred embodiments, other characteristics of the present invention, parts, step, character and advantage can become more apparent.
Description of drawings
Fig. 1 is the perspective view as the monolithic ceramic capacitor of the example of the laminated ceramic electronic component of the preferred embodiment of the present invention;
Fig. 2 is the cross-sectional view of monolithic ceramic capacitor among Fig. 1;
Fig. 3 is the cross-sectional view of monolithic ceramic capacitor among the Fig. 1 that is installed on the substrate;
Fig. 4 is the cross-sectional view of another monolithic ceramic capacitor according to the preferred embodiment of the invention;
Fig. 5 is the cross-sectional view that is installed on the known monolithic ceramic capacitor on the substrate;
Fig. 6 is the cross-sectional view of another kind of known monolithic ceramic capacitor; And
Fig. 7 is the cross-sectional view of monolithic ceramic capacitor among the Fig. 6 that is installed on the substrate.
Embodiment
Fig. 1 is the perspective view as the monolithic ceramic capacitor of the laminated ceramic electronic component example of the preferred embodiment of the present invention.Monolithic ceramic capacitor 10 comprises capacitor part 12, and capacitor part 12 comprises basic compound 14.With reference to figure 2, this basis compound 14 comprises ceramic layer 16 and internal electrode 18a and 18b.Internal electrode 18a extends to its center from arbitrary end face of basic compound 14.The outer end of internal electrode 18a is exposed to arbitrary end face of basic compound 14.The inner of the internal electrode 18a that extends from end face inner relative with from the internal electrode 18a of another end face extension.On the other hand, internal electrode 18b is set, internal electrode 18b and the internal electrode 18a that extends from an end face and all relative from the internal electrode 18a of another end face extension at the center of basic compound 14.
Two end faces at basic compound 14 have all been placed outer electrode 20.Form these outer electrodes 20 by following steps: the conduction that comprises silver for example or copper is stuck with paste add on the basic compound 14, paste that sintering added to be to form electrode and to utilize the tin that for example prevents the capillary nickel of scolder and have a better solderability to come electroplated electrode.
Subsequently, thermoplastic resin 22 is formed on the whole surface of capacitor part 12.This thermoplastic resin 22 is made up of for example copolymer, and described copolymer has a selected backbone units from the group that comprises single PVF, difluoroethylene, trifluoro-ethylene and tetrafluoroethene.The thickness range of thermoplastic resin 22 is at for example 1.0 to 50 microns.
Now the method that is used to make monolithic ceramic capacitor 10 is described.At first, for example dielectric ceramic powder, adhesive, plasticizer and solvent are prepared ceramic slurry by mixing.This ceramic slurry is qualitative, to form the ceramic green plate.Then, by printing, nickel electrode stuck with paste be applied to independently on the ceramic green plate according to the form of internal electrode 18a or 18b.These ceramic green plates of lamination, and the additional ceramic green flaggy that does not apply electrode paste on it is pressed onto the top and the bottom of described thin plate.
Cut this thin slice to form raw cook.Fire each raw cook, thereby formed the basic compound 14 that comprises ceramic layer 16 and internal electrode 18a and 18b.Then, outer electrode is formed on two end faces of basic compound 14, thereby has formed capacitor part 12.This capacitor part 12 is immersed by thermoplastic resin being dissolved in the solution that organic solvent prepares, and (about 50 ℃) oven dry at a lower temperature, thereby utilize thermoplastic film, promptly thermoplastic resin layer 22 has covered the whole surface of capacitor part 12.
Can control the thickness of thermoplastic resin film by any-mode: an example is to adjust the mixing ratio of thermoplastic resin and organic solvent.The thermoplastic resin 22 that has covered the whole surface of capacitor part 12 has prevented the corrosion of basic compound and outer electrode, the particularly oxidation of outer electrode 20.Therefore, this thermoplastic resin film 22 has guaranteed solderability preferably when mounted.
This monolithic ceramic capacitor 10 for example is installed on the circuit board.With reference to figure 3, be engaged on the electrode 32 that is formed at substrate 30 by the outer electrode 20 of solder bonds 34 with monolithic ceramic capacitor 10.Before installing, covered the thermoplastic resin 22 of outer electrode 20 by the heat fusing that is used to weld.The solder of fusing outer electrode 20, thereby from having got rid of the thermoplastic resin film of fusing near it.
Before welding, be not heated to its softening point or higher thermoplastic resin film is not enough to adhere to capacitor part 12 and in uneven thickness, i.e. thin part of outer electrode 12.When reflux temperature met or exceeded the melting point of the scolder that uses, scolder began wetting outer electrode 20 from the thin part of thermoplastic resin 22 or the expose portion of outer electrode 20.Have the melting solder of the stronger wettable performance of thermoplastic resin than fusing with thermoplastic resin from getting rid of near it.The thermoplastic resin that is excluded flows to the edge of outer electrode 30.
As a result, monolithic ceramic capacitor 10 is installed on the substrate 30, so that thermoplastic resin 22 has covered in fact except that the scolder part of multilayer ceramic capacitor 10 and the whole surface the part solder bonds 34.At weld period, thermoplastic resin 22 is heated to its softening point or higher, thereby obtains the better adhesion of capacitor part 12 and uniform thickness.
In addition, thermoplastic resin 22 has covered outer electrode 20 with blocks air, up to melting solder with wetting outer electrode 20.Therefore, thermoplastic resin 22 has prevented the dioxygen oxidation outer electrode 20 that comprises in the air, therefore the medium of also having served as solder flux.Especially, thermoplastic resin 22 prevents the oxidation or the hydroxylating of outer electrode 20.If keep the cleaning on outer electrode 20 surfaces, the tin electrodeposited coating on the wetting smoothly outer electrode 20 of scolder then, thereby diffusion each other.Even under higher humidity, outer electrode 20 is because the protection of thermoplastic resin 22 also can remain on chemically constant.
Therefore, thermoplastic resin 22 provides anti-environmental characteristics and the non-oxidizability in the welding to outer electrode 20.As a result, the surface of outer electrode 20 keeps clean to guarantee wettability preferably.In order to obtain this effect, preferably, owing to need flow by heating (about 250 ℃) at the weld period thermoplastic resin, so thermoplastic resin has about 200 ℃ or higher fusing point.If have enough low glass transfer point or softening point, then having the thermoplastic resin that is higher than the welding temperature fusing point can provide gratifying flowable.In addition, preferably, thermoplastic resin 22 has about 0.5% or the water absorption rate of lower (in 24 hours), thereby has kept environment resistant preferably.
In addition and since the required heat fusing of welding thermoplastic resin 22, thereby allow the most surfaces of solder outer electrode 20, therefore prevented the defective such as setting up a monument.In addition, after installing, thermoplastic resin 22 has covered the whole surface except that the soldered part of monolithic ceramic capacitor in fact, therefore, has prevented to pass the surface leakage of two outer electrodes 20, thereby has guaranteed higher proof voltage.
If have less than about 1.0 microns thickness, then thermoplastic resin 22 has been showed relatively poor environment resistant, especially relatively poor moisture resistance.The water that infiltrates may arrive outer electrode 20, thereby externally produces oxide or hydroxylate layer on the electrode 20.So the surface of outer electrode 20 has lost cleaning, this has worsened the wettability of melting solder and has hindered stable solderability.
If have greater than about 50 microns thickness, then thermoplastic resin 22 showed environment resistant preferably, but relatively poor flowable in welding.This relatively poor flowable has worsened the scolder of fusing and contacting of outer electrode 20, and this has hindered wetting, or has caused the variation of wetting time started, has hindered stable solderability.As a result, especially for less element, two outer electrodes 20 have the different wetting time starteds, and this has produced sets up a monument or the weld defect such as position deviation.This thicker thermoplastic resin 20 can't form normal outline line (fillet), and this has reduced the electrical connection between monolithic ceramic capacitor 10 and the substrate 30 and the reliability of mechanical connection.Therefore, preferably, the thickness range of thermoplastic resin 22 is from about 1.0 to 50 microns.
The operating temperature of laminated ceramic electronic component or electronic component self temperature during operation surpasses normal temperature through regular meeting.Some electronic components have the product that is higher than 100 ℃ and guarantee temperature.Therefore, thermoplastic resin 22 needs thermal endurance to prevent the degeneration such as peeling off and decomposing.Thermoplastic resin 22 also needs non-adhesiveness, thereby prevents that the electronic component that covered from adhering to for example another element or substrate, and also need be for not the melting property of the solder flux that uses in installing and so on organic solvent, thereby keeps higher insulation property.
In order to realize above-mentioned characteristic, described thermoplastic resin 22 preferably is made up of copolymer, and described copolymer has a selected backbone units from the group that comprises single PVF, difluoroethylene, trifluoro-ethylene and tetrafluoroethene.Be applied on the adhesion even will for example have the organic solvent of higher cohesive energy or water and so on, the thermoplastic resin 22 that has than low-surface-energy also can provide bigger contact angle.Therefore, this thermoplastic resin 22 is compared with other polymer based resin has adherence and the solubility that reduces, and this compares with other polymer based resin, and the more excellent persistence that comprises anti-chemical characteristic is provided.This relatively poor adherence has prevented the accident adhesion between the sheet, thereby has guaranteed workability, but simultaneously preferably persistence guaranteed that capacitor part 12 is in state preferably.In addition, thermoplastic resin 22 provides enough flowables, and this is that this is higher than welding temperature (250 ℃), but also has about 120 ℃ to 150 ℃ glass transfer point because fluorocarbon resin has about 320 ℃ melting point.
On the other hand, the general polymer resin has increasing kinetic energy along with temperature raises.Therefore, in the easier infiltration resin of water to cause that from the deterioration of resin inside, this causes lower persistence.The water of this infiltration also causes being difficult to keeping the cleaning on the surface of outer electrode 20, therefore can not guarantee weldability.In addition, this fluoropolymer resin is dissolved in the organic solvent that uses in the solder flux, for example alcohol easily.Therefore, in welding or afterwards, cleaning so that remove solder flux when residual, this fluoropolymer resin dissolves easily or peels off.Even just part is peeled off, the resin bed that peels off can not have normal function.Therefore, after installation, can not provide environment resistant.Appear between two outer electrodes 20 if peel off, the then this resin bed that peels off can not provide proof voltage.By using the above-mentioned copolymer that comprises fluorine to solve these problems relevant with the general polymer resin.
With reference to figure 4, capacitor part 12 can also comprise internal electrode 24, and internal electrode 24 passes the thickness arrangement of basic compound 14 and alternately leads to arbitrary end face of basic compound 14.Also can utilize thermoplastic resin 22 to cover such capacitor part 12, thereby obtain above-mentioned effect.That is, can apply the present invention to have in the capacitor part of any appropriate configuration.In addition, the present invention is not limited to monolithic ceramic capacitor, can also apply the present invention in the multiple laminated ceramic electronic component, and for example multilayer transistor and multi-layer inductor, thus realize above-mentioned effect.
As mentioned above, the invention provides laminated ceramic electronic component with the thermoplastic resin that before installing, provides environment resistant.This thermoplastic resin has guaranteed the cleaning of the outer electrode of electronic component, thereby the better wettability of the scolder that uses is provided, even therefore also can guarantee solderability preferably for lead-free solder.In addition, after installing, the thermoplastic resin that has covered whole surface except that the soldered part of electronic component in fact provides environment resistant.In addition, after installing, thermoplastic resin has also covered the electronic component part between the outer electrode, thereby has guaranteed proof voltage preferably.
Example
As the example of the laminated ceramic electronic component of multiple preferred embodiment, made monolithic ceramic capacitor according to the present invention.At first, from dielectric ceramic material, prepare ceramic slurry.This slurry is fixed to the PET film, thereby forms ceramic green plate with about 20.0 micron thickness.Then, utilize the nickel paste on the ceramic green plate, to print and be provided with thousands of internal electrode pattern for each printing area.Adjust the amount that institute adds paste, so that when heating the thickness of rear electrode about 1.0 microns.
Dry these ceramic green plates.Then, at the plate of predetermined condition laminated, extruding predetermined number, and be cut into preliminary dimension, thereby form raw cook, the target capacitance here is 1,000 pico farad.These raw cooks of heating under predetermined temperature, thereby the compound of preparation ceramic layer and internal electrode.Subsequently, form copper electrode by heating on the end face that has exposed internal electrode at each basic compound.By wetting technology nickel and tin are electroplated onto on these electrodes, thereby have prepared to have about 3.2 millimeters length, the capacitor part of about 1.6 millimeters width and about 1.6 millimeters height.
Each capacitor is immersed by thermoplastic resin being dissolved in the solution that organic solvent prepares, and in stove, dry, thereby on the whole surface of capacitor part, formed thermoplastic resin.By the mix thickness of recently controlling thermoplastic resin of adjustment thermoplastic resin with organic solvent.Table 1 shows the sample of result's monolithic ceramic capacitor.
Table 1
| Sample number | Resinous type | Resin layer thickness (micron) |
| ????1 | Single fluoride copolymers | ????28.3 |
| ????2 | Fluoride copolymers | ????43.2 |
| ????3 | Trifluoro-ethylene copolymer | ????11.4 |
| ????4 | TFE copolymer | ????1.3 |
| ????5 | TFE copolymer | ????26.7 |
| ????6 | TFE copolymer | ????49.6 |
| ????7 | TFE copolymer | ???0.2 |
| ????8 | TFE copolymer | ???78.5 |
| ????9 | Acrylic acid | ???28.1 |
| ???10 | Alkyd resins | ???37.6 |
| ???11 | Polyurethane | ???40.2 |
| ???12 | ????None | ????- |
Sample in the table 1 was placed 6 hours in the constant temperature high humility is bathed, and wherein temperature is set to about 60 ℃, and relative humidity is set to about 95%RH.In order to check its wettability, by the wettability equilibrium thermometrically zero crossing time of 10 samples of each sample number, zero crossing time is the measurement of speed, with this speed solder, wherein welding temperature is about 250 ℃, be 10 seconds weld time, and preheat temperature is about 100 ℃, and be about 30 seconds warm-up time.The solder alloy that uses is Sn-3.5Ag-0.5Cu scolder (percentage by weight), and this is typical leadless welding alloy.Employed solder flux is the R type.In addition, under basis, check 1,000 sample of each group sample number in the reflow soldering of tabulation 2 and the flow soldering, thereby observed the percentage of formed outline line shape and definite weld defect.
The outline line shape that table 3 shows the zero crossing time of each sample number, form by reflow soldering and flow soldering and the percentage of weld defect.
Table 2
| Welds types | Preheating condition | Main heating condition | Solder alloy | Solder flux |
| Reflow soldering (infrared type) | 100 ℃ → 150 ℃ 60 seconds | 210 ℃ to 235 | ???Sn-3.5Ag- ???0.5Cu | ?RM ?A |
| Flow soldering (double wave) | Room temperature → 150 ℃ 45 seconds | 260 | ???Sn-3.5Ag- ???0.5Cu | ?RM ?A |
Table 3
| Sample number | Zero crossing time (second) | Outline line shape by reflow soldering formation | Outline line shape by flow soldering formation | Weld defect (%) | Judge |
| 1 | ???1.6 | Good | Good | ??0.0 | Accept |
| 2 | ???2.2 | Good | Good | ??0.0 | Accept |
| 3 | ???1.5 | Good | Good | ??0.0 | Accept |
| 4 | ???1.2 | Good | Good | ??0.0 | Accept |
| 5 | ???1.6 | Good | Good | ??0.0 | Accept |
| 6 | ???2.5 | Good | Good | ??0.0 | Accept |
| 7 | ???3.1 | Difference | Difference | ??5.2 | Do not accept |
| 8 | ???4.0 | Good | Difference | ??3.5 | Do not accept |
| 9 | ???3.8 | Difference | Difference | ??12.4 | Do not accept |
| 10 | ???3.7 | Difference | Difference | ??21.2 | Do not accept |
| 11 | ???3.8 | Difference | Difference | ??18.6 | Do not accept |
| 12 | 5 or more | Do not form | Do not form | ??100 | Do not accept |
Explanation now is used for the zero crossing time of each sample number.Not having the outer electrode of sample of the sample number 12 of resin bed to have can not be by the surface that is corroded of solder.On the other hand, the zero crossing time that is included in the sample number 1 to 6 in the scope of the invention was represented wettability preferably less than 3 seconds.
The thermoplastic resin type of sample number 7 and 8 sample is included in the scope of the present invention.But the thickness of these thermoplastic resins has exceeded scope of the present invention.The zero crossing time of sample number 7 to 8 has surpassed 3 seconds, has represented relatively poor wettability.For sample number 7, the thermoplastic resin of each sample has less than about 1.0 microns thickness.Therefore, under higher levels of humidity, water section ground infiltrates resin bed.The water of this infiltration has externally produced oxide or hydroxide layer on the electrode.Therefore, the surface of outer electrode has lost cleaning, thereby has reduced the wettability of scolder, causes the weld defect such as nonwetting.
For sample number 8, the thermoplastic resin of each sample has greater than about 50 microns thickness.Therefore, even under higher levels of humidity, water can not infiltrate resin bed yet.But when the heat fusing that is used to weld, resin bed shows relatively poor flowable, and this has slackened the scolder of fusing and contacting of outer electrode, thereby causes lower wetting speed.Therefore, because above-mentioned physical factor, the resin bed with very large thickness has slackened wettability, although resin bed has environment resistant preferably and kept the cleaning of external electrode surface.
The zero crossing time scope of sample that does not have the sample number 9 to 11 of thermoplastic resin of the present invention is about 3.7 to 3.8 seconds.The wettability of these samples is better than the sample of the sample number 12 that does not have resin bed, but is worse than the sample of sample number 1 to 6.This relatively poor wettability of these samples of sample number 9 to 11 is because its relatively poor moisture resistance.That is, this relatively poor moisture resistance has slackened the cleaning of external electrode surface, and this has reduced wettability.Therefore, in order to realize stable wettability, the resin that is used to cover the whole surface of capacitor part that comprises outer electrode preferably is made up of copolymer, and described copolymer has a selected backbone units from the group that comprises single PVF, difluoroethylene, trifluoro-ethylene and tetrafluoroethene.The thickness of thermoplastic resin 22 is preferably in about 1.0 to 50 microns scope.
Explanation reflow soldering and flow soldering now be the solderability of monolithic ceramic capacitor afterwards.The outer electrode of the sample of sample number 12 has the surface that is corroded.Therefore, scolder can not wetting outer electrode, and this hinders the formation of normal rounds profile in reflow soldering or flow soldering.The weld defect percentage of specimen number 12 is 100%.
Sample with sample number 1 to 6 of thermoplastic resin of the present invention does not have the welding defective and all formed normal outline line in reflow soldering or flow soldering.Although experienced high humility, these samples have also provided the better solderability that effective installation can be carried out.In addition, the thermoplastic resin of these samples has solvent resistance preferably.Therefore, these resin beds can not be dissolved in the solvent of solder flux use, but the not welding portion after installing has coating preferably, thereby have kept higher insulation property.
On the other hand, there is weld defect in the sample of finding sample number 7 and 8 after installing.In flow soldering, because its resin bed has less thickness, therefore the weld defect of the sample of sample number 7 has appearred, simultaneously, because its resin bed has the big thickness that has slackened flowable at weld period, therefore the weld defect of the sample of sample number 8 has appearred.Flow soldering needs the resin bed on the outer electrode to flow at short notice.But the resin bed of sample with sample number 8 of relatively poor flowable has hindered solder to outer electrode.As a result, although the surface of outer electrode has kept cleaning, the outer electrode of these samples still shows the weld defect such as not wetting and defectiveness outline line.Comparatively speaking, in warm-up time and main heating time all in the reflow soldering greater than warm-up time in the flow soldering and main heating time, provide to have the resin bed that the enough time contacts with the scolder of fusing.Therefore, even have big thickness, resin bed also provides wettability preferably, thereby forms normal outline line.The sample of comparing the sample number 9 to 11 with low moisture resistance with the sample of other sample number has caused that part is not wetting.
Although describe the present invention about preferred embodiment, it will be apparent to those skilled in the art, can revise invention disclosed according to multiple mode, and adopt except that specify above those a plurality of embodiment.Therefore, the appended claim of expectation has covered all modifications of the invention within spirit and scope of the invention.
Claims (16)
1. mounting structure that is used for laminated ceramic electronic component comprises:
It is provided with the substrate of electrode; And
The laminated ceramic electronic component of the thermoplastic resin that has outer electrode and externally be provided with on the electrode, described outer electrode is welded on the electrode of substrate, thermoplastic resin has covered in fact except that the soldered part of laminated ceramic electronic component and the whole surface the part scolder.
2. mounting structure according to claim 1 is characterized in that described thermoplastic resin comprises copolymer, and described copolymer has a selected backbone units from the group that comprises single PVF, difluoroethylene, trifluoro-ethylene and tetrafluoroethene.
3. mounting structure according to claim 1 is characterized in that described thermoplastic resin has about 1.0 to about 50 microns thickness.
4. mounting structure according to claim 1 is characterized in that described laminated ceramic electronic component comprises capacitor part, and described capacitor part comprises basic compound.
5. mounting structure according to claim 4 is characterized in that described basic compound comprises a plurality of ceramic layers and the internal electrode that is electrically connected with described outer electrode.
6. mounting structure according to claim 1 is characterized in that described outer electrode is positioned on the end face of described laminated ceramic electronic component.
7. mounting structure according to claim 1 is characterized in that described outer electrode comprises conductor paste, and described conductor paste comprises one of silver and copper.
8. one kind is used for laminated ceramic electronic component is installed on method on the substrate, comprises step:
Utilize thermoplastic resin to cover the whole surface of laminated ceramic electronic component; And
The outer electrode of described laminated ceramic electronic component is welded on the electrode of substrate and since the required heat fusing of welding described thermoplastic resin, the scolder of fusing has been got rid of near the fusing thermoplastic resin the outer electrode.
9. method according to claim 8 is characterized in that described thermoplastic resin comprises copolymer, and described copolymer has a selected backbone units from the group that comprises single PVF, difluoroethylene, trifluoro-ethylene and tetrafluoroethene.
10. method according to claim 8 is characterized in that described thermoplastic resin has about 1.0 to about 50 microns thickness.
11. a ceramic multilayer ceramic electron element comprises:
The electronic unit that comprises ceramic substrate compound and outer electrode; And
Covered the thermoplastic resin on the whole surface of described electronic unit in fact, described thermoplastic resin comprises copolymer, and described copolymer has a selected backbone units from the group that comprises single PVF, difluoroethylene, trifluoro-ethylene and tetrafluoroethene.
12. laminated ceramic electronic component according to claim 11 is characterized in that described thermoplastic resin has about 1.0 to about 50 microns thickness.
13. laminated ceramic electronic component according to claim 11 is characterized in that described electronic unit comprises capacitor part.
14. laminated ceramic electronic component according to claim 13 is characterized in that the basic compound of described pottery comprises a plurality of ceramic layers and the internal electrode that is electrically connected with described outer electrode.
15. laminated ceramic electronic component according to claim 11 is characterized in that described outer electrode is positioned on the end face of described electronic component.
16. laminated ceramic electronic component according to claim 11 is characterized in that described outer electrode comprises conductor paste, described conductor paste comprises one of silver and copper.
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| JP2004036089A JP4093188B2 (en) | 2003-05-27 | 2004-02-13 | Multilayer ceramic electronic component and its mounting structure and mounting method |
| JP2004036089 | 2004-02-13 |
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| JP (1) | JP4093188B2 (en) |
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- 2004-04-23 US US10/830,721 patent/US6903919B2/en not_active Expired - Lifetime
- 2004-04-27 TW TW093111715A patent/TWI234791B/en not_active IP Right Cessation
- 2004-05-25 KR KR1020040037201A patent/KR100610493B1/en active IP Right Grant
- 2004-05-27 CN CNB2004100476086A patent/CN100521001C/en not_active Expired - Lifetime
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Also Published As
| Publication number | Publication date |
|---|---|
| US20040240146A1 (en) | 2004-12-02 |
| KR100610493B1 (en) | 2006-08-08 |
| CN100521001C (en) | 2009-07-29 |
| JP2005012167A (en) | 2005-01-13 |
| US6903919B2 (en) | 2005-06-07 |
| JP4093188B2 (en) | 2008-06-04 |
| TW200426865A (en) | 2004-12-01 |
| KR20040102326A (en) | 2004-12-04 |
| TWI234791B (en) | 2005-06-21 |
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