CN1565842A - Structure and fabrication method for optical protective film - Google Patents
Structure and fabrication method for optical protective film Download PDFInfo
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- CN1565842A CN1565842A CN 03142808 CN03142808A CN1565842A CN 1565842 A CN1565842 A CN 1565842A CN 03142808 CN03142808 CN 03142808 CN 03142808 A CN03142808 A CN 03142808A CN 1565842 A CN1565842 A CN 1565842A
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Abstract
The invention relates to an optical protection film structure with anti-static and anti-glare functions and a making method therefor. The making method includes sequently coating two different resin film layers of resin A and resin B on a plastic substrate to form a conductive film structure. Wherein, two kinds of conductive particles with different particle diameters are charged in the resin A, and the particle diameter of the conductive particle with bigger diameter is equal or slightly bigger than the total thickness of the two resin film layers, and some of the conductive particles with bigger diameter can contact with or be exposed to the uppermost surface of the resin B film layer to make the film conductive and anti-static. And the resin B should have excellent hardness after being cured. In addition, microparticles of silicon dioxide can be charged near the uppermost of the resin B film layer to make the film anti-glare.
Description
Invention field
The invention reside in provides a kind of optics protective film structure and manufacture method that prevents static (anti-static) and anti-glare (anti-glare) function.Particularly, the present invention uses different conducting particles and the fine particles of particle diameter to be present in two functions that reach above-mentioned in the same structure in the plastic base structure.
Background technology
The plastic base of glass substrate or printing opacity is one of indispensable primary element in flat-panel screens, and wherein the plastic base of printing opacity is that benefits such as it is in light weight and be difficult for breaking are better than glass substrate.But its plastic base still has its shortcoming to exist: adsorb dust because of producing static easily.With the LCD is example; typical simple-type matrix drive type liquid crystal flat panel display (SM-LCD); its structure as shown in Figure 1, structure from top to bottom has respectively: hard protective layer 13 (hard coating layer), conductive layer 12 (conductive layer), diaphragm 11, Polarizer 10, glass substrate 30, row electrode 50, liquid crystal layer 80, column electrode 60, colored filter 70, glass substrate 40, Polarizer 20, diaphragm 21, conductive layer 22, hard protective layer 23.As shown in Figure 1, its liquid crystal molecule is positioned at 60 of row electrode 50 and column electrodes, provides driving voltage to rotate by liquid crystal by the outside.But because of simple-type matrix drive type liquid crystal flat panel display (SM-LCD) has following problems: one, along with interactive interference (cross-talk) two is followed in the increase of scanning electron number, Polarizer has electric charge accumulation, electric interfering field and liquid crystal work etc. up and down.In the Polarizer technological operation, descend the two sides will stick diaphragm and release film (release film) respectively thereon; The purposes of diaphragm is to protect the Polarizer face, avoids face impaired in making or transporting.Release film then is the protection of pasting before being used for carrying out panel and fitting.When diaphragm removed, face can produce buildup of static electricity because of friction, and residual static just can attract foreign matter; Also can produce buildup of static electricity when the release film in the manufacturing process is removed on the other hand, except identical attraction foreign matter, more can contraposition work generation deviation and then influence when next getting the panel applying make acceptance rate.Wherein antistatic anti-glare film (anti-static anti-glare film; ASAG film) just therefore produces.Its antistatic anti-glare film roughly has three-decker (as previously mentioned): hard protective layer 13, conductive layer 12, diaphragm 11.
Also can use sputtering way to form conductive layer on antistatic technology, its particle is more even, and good with the density of base material, and optical characteristics is preferable.But its equipment price is high, owing to need in vacuum chamber (chamber), to carry out, the computer hardware costliness, the glued membrane of former material is difficult for implementing operation and is its shortcoming in vacuum chamber.Another takes wet type coating method (wet-coating) to make conductive layer; be two layers of coating method that propose by Dai Nippon Printing; as United States Patent (USP) case numbers 6; 146; described in 753, go up a conductive layer (transparent conductive layer) and a hard protective layer (hard coat layer) that successively forms a tool light transmission at the diaphragm (to call plastic base in the following text) of tool printing opacity.Wherein conductive layer contains antimony tinoxide (ATO; Tin-antiomony oxide) or indium-tin oxide (ITO; Tin indium oxide) conducting particles and its surface impedance≤10
8Ω/ reduces the generation of static.The conductive layer that increases can make the surface impedance of substrate be reduced to 10
6Ω/ ~ 10
7About Ω/, prevent a large amount of generation of static electricity.Because the consideration on the light transmittance, general thickness is about about the 5 μ m.But conductive layer hardness is not good, also easily produced by collision and comes off, and therefore must be coated with hardening resin thereon and strengthen.Simultaneously hardening resin itself is not had conductivity, continue its conductivity so must add the conductive metal particle, the removal charges accumulated.Right conductive metal particle costs an arm and a leg and makes coating cost and the difficulty of making greatly improve.
Its hard protective layer is coated on the conductive layer with hardening resin and conductive metal mix particles, utilizes hardening resin that basic hardness demand is provided, in the conductive metal particle that adds then be conducting as electric current between coating surface and the conductive layer.If increase the anti-glare function of film, then be design extra fine particle that adds in the hard protective layer, utilize fine particle to produce anti-glare function for the scattering of light phenomenon.
The present invention promptly proposes to have the optics protective film structure of antistatic anti-glare function at the demand of plastic base, solve above-mentioned making problem.
Summary of the invention
Main purpose of the present invention is to provide a kind of manufacture method of optics protective film, when being the conductive layer on making plastic base, adding conducting particles and reaches the anlistatig function of tool.
Another object of the present invention is to provide a kind of manufacture method of optics protective film, when being the conductive layer on making plastic base, adding fine particle and reach anti-glare function in the conductive layer upper strata.
Another object of the present invention is to provide a kind of optics protective film structure, its structural rigidity good and with plastic base adherence height.
At first, get the plastic base that a material is triacetate fiber or polyester, then on plastic base, form conductive layer.Form this conductive layer and be to use two kinds of different resins, to form double-deck resin film structure.Earlier conducting particles is incorporated in the Resin A, make the conductive effect of Resin A preferable, the particle diameter specification of its conducting particles has two kinds of sizes.The Resin A that will contain conducting particles utilizes the wet type coating method to be coated with on substrate.Then, carry out the roasting step of heat the alcohols of major part in the Resin A is removed with cured resin A by the roasting step evaporation of heat, and the particle diameter of the Resin A thickness greater particle size conducting particles that ratio adds after making heat roasting is little.The mode that re-uses hot curing or ultraviolet light polymerization makes the polymer in the Resin A carry out polymerization reaction with reinforced structure.Follow again, resin B with preferable hardness is provided, and add silicon dioxide in resin B, and reaching anti-glare function as fine particle, the resin B that will contain fine particle is utilized the wet type coating method to be formed on the Resin A and with the gap between conducting particles and is filled up.Then, carry out roasting step of heat and step fortified resin B such as hot curing or ultraviolet light polymerization.At this moment, the conducting particles of greater particle size is bigger because of its particle diameter in the Resin A, so have at least its upper limb of conducting particles of part greater particle size can contact or be exposed to outside the upper surface of resin B, accumulates in the resin B to avoid electric charge, and then reaches anlistatig effect.So, just, finish the optics protective film of functions such as tool is antistatic and anti-glare.
The present invention mainly is the conducting particles that comprises at least two kinds of different-grain diameter specifications in constituting the Resin A of conductive layer, that is the conducting particles of greater particle size and than the conducting particles of small particle diameter, so that conduction and anti-static function to be provided.Wherein, the thickness of the Resin A film after the curing is greater than this particle diameter than the conducting particles of small particle diameter, and the thickness of the Resin A film after solidifying is then less than the particle diameter of the conducting particles of this greater particle size.Resin B is made of the higher relatively material of hardness; it is coated on the Resin A film with as the hard protective layer; and; in the aforesaid greater particle size conducting particles, the upper surface of the resin B film after having the apical margin contact of part greater particle size conducting particles at least or being exposed to curing and contacting with external environment.Thus, in resin B, add the conductive metal particle in addition, the electric charge in the Resin A film can be released into the external world, and avoid electric charge to accumulate in the resin B no longer needing, reaching anlistatig function, and have more and simplify technology and the effect that reduces cost.
Description of drawings
Fig. 1 is the vertical stratification profile of typical simple-type matrix drive type liquid crystal flat panel display.
Fig. 2 A is the section of structure of plastic base in the embodiment of the invention.
Fig. 2 B is the making section of structure that forms conducting particles in the embodiment of the invention.
Fig. 2 C is the making section of structure that forms anti-glare functional conductive layer in the embodiment of the invention.
The figure number explanation:
10 Polarizers, 11 diaphragms
12 conductive layers, 13 hard protective layers
20 Polarizers, 21 diaphragms
22 conductive layers, 23 hard protective layers
30 plastic bases, 40 plastic bases
50 row electrodes, 60 column electrodes
70 colored filters, 80 liquid crystal layers
100 plastic bases, 200 conductive layers
220 conducting particless, 230 fine particles
A resin B resin
Embodiment
For describing invention emphasis of the present invention in detail, the present invention will provide the diaphragm of making flat-panel screens to illustrate as embodiment and cooperation.
At first, shown in figure 2A, plastic base 100, its material can be cellulose family (cellulose), its diacetate esters class (diacetate) and triacetate class (triacetate), cellulose acetate-butyrate class (cellulose acetate butyrate, polyester), polyamide resin lipid (polyamide), polyimide (polyimide), polyether sulfone (polyether sulfone), polysulfones (polysulfone), polypropylene type (polypropylene), polymethylpentene class (polymethylpentene), polyvinyl chloride (polyvinyl chloride), polyvinyl acetal group (polyvinyl acetal), polyethers ketone (polyether ketone), polymethacrylic acid (polymethacrylate), polymethyl methacrylate (polymethymethacrylate; PMMA), polycarbonate class (polycarbonate), and polyurethanes (polyurethane).Wherein preferable base material is triacetate cellulose membrane (cellulose triacetate; TAC) with polyethylene (Poly-Ethylene; PET).TAC or pet substrate mentioned in the present embodiment are to be the common baseplate material of industry, and for example manufacturer such as Fuji of Fuji or Konica Konica all provides this type of substrate.
Then, enter emphasis of the present invention, form the conductive layer 200 on the plastic base 100.This conductive layer 200 comprises in fact: have conducting particles with Resin A thin layer that preferable conductivity is provided, and material can be used as the resin B thin layer of hard protective layer relatively more firmly, be the pair of lamina structure.Form this conductive layer 200 and can be divided into two steps:, then form 230 layers of resin B and fine particles more thereon prior to deposition on the substrate 100 or coating conducting particles 220 and Resin A layer.Its detailed implementation step is as follows: shown in Fig. 2 B, earlier conducting particles 220 is incorporated in the Resin A, its Resin A is mainly by 1-butanols (1-Butanol), ethanol (Ethanol), ethyl acetate (Ethyl acetate; EAC), hexane (Hexane), isopropyl alcohol (80%) (isopropanol; IPA) and partly the polyacrylic acid resinoid is formed, and solid content is 5 ~ 25%.And conducting particles 220 in the percentage by weight of Resin A between 5 ~ 30%, the particle diameter of its conducting particles 220 has two kinds: be respectively the conducting particles (particle diameter is between 0.5 ~ 7 μ m) of greater particle size specification and than the conducting particles (particle diameter is about 0.1 ~ 0.5 μ m) of small particle diameter specification, the conducting particles content of the greater particle size specification of its particle diameter 0.5 ~ 7 μ m accounts for 0.5 ~ 10% in whole conducting particless 220.Particle diameter be about 0.5 μ m following then account for 90 ~ 99.5% in whole conducting particless 220 than small particle diameter specification conducting particles content.The material of its conducting particles 220 can be antimony tin (ATO) or tin indium oxide (ITO).The Resin A that will contain the conducting particles 220 of at least two kinds of particle diameter specifications utilizes the wet type coating method to form the film of the about 5 μ m of thickness on substrate 100, wherein the wet type coating can be adopted rotary coating (spin coating), roller coating (roll coating), and intaglio printing coating (gravure coating), line rod coating (barcoating) and slot die coating modes such as (slot die coating) are coated with.Can realize by Fig. 2 B, employed in embodiments of the present invention Resin A, will attenuation in its thickness after cured steps such as overheated roasting and UV-irradiation, and not exclusively cover all conducting particless, relatively, the thickness of the Resin A after the cured is only greater than than the particle diameter of the conducting particles of small particle diameter specification but less than the particle diameter of the conducting particles of greater particle size specification, and makes the conducting particles of all greater particle size specifications all have the upper surface outer (for example general shown in Fig. 2 B) that part protrudes in the Resin A layer after the curing.The conducting particles 220 of its ATO (or ITO) material is the conductive element as the conductive layer in the traditional structure.Except the particle (about 0.1 ~ 0.5 μ m) of the original ATO of identical adding with traditional handicraft (or ITO) particle size so that ATO (or ITO) particle of a small amount of greater particle size of the more extra interpolation of the present invention (about 0.5 ~ 7 μ m) to be provided conduction and the anti-static function.Under the prerequisite that does not influence original conductivity, utilize the ATO of greater particle size to fill and, also can not influence anti-static function even make resin B of the present invention not add any conducting particles across the thickness of Resin A and resin B.This mode to need can be avoided in prior art adding the conductive metal particle be avoided the electric charge accumulation in the hard protective layer shortcoming in addition, and can reduce technologic difficulty and reduce cost.
Then, be cured the roasting step (thermal curing) of heat in the processing, alcohols most in the Resin A is removed with cured resin A by the roasting step evaporation of heat.Its heat is baked temperature between 50 ~ 95 ℃, the about 0.5 ~ 5min of stoving time.The roasting temperature of its heat is decided by the solvent that is used for Resin A, need be lower than the boiling point of solvent, carries out the roasting step of heat, and the solvent of Resin A can be isopropyl alcohol in the present embodiment, and therefore the roasting temperature of the heat of using is about about in the of 60 ℃.Then re-use ultraviolet light (Ultra-Violate light), make the polymer in the Resin A carry out crosslinked (cross-link) polymerization reaction with reinforced structure, at this moment, the ultraviolet energy of being supplied with is between 150 ~ 1000mJ/cm
2Between, and the Resin A thickness after the sclerosis is about 0.5 ~ 2 μ m.
Follow, silicon dioxide (the silicon oxide or silica) fine particle 230 that adds 1 ~ 3wt% uses homogenizer to mix and stirs in resin B again, and the particle size of its silicon dioxide fine particle 230 is between 0.1 ~ 1.0 μ m.Main Ingredients and Appearance in its resin B is the polyacrylic acid resinoid, and solid content is 45 ~ 50%, can have higher relatively hardness after its cured with the usefulness as the hard protective layer.Because silicon dioxide fine particle 230 can upwards be gathered in the upper surface vicinity of resin B because of buoyancy own in resin B coating and solidification process.So, be positioned near the fine particle 230 (silica) that is had outermost layer (resin B) upper surface, after incident light enters,, thereby reach anti-glare effect because the existence of fine particle 230 allows incident light originally with the past different angles scattering of irregular mode.The resin B that will contain fine particle 230 utilizes wet type coating method 220 of conducting particless on Resin A to form the about 10 μ m of thickness and the gap of 220 of all conducting particless is filled up, and its fine particle 230 is brought into play its anti-dizzy function because of the near surface that the buoyancy relation can float over resin B.Wherein the identical or different coating method of Resin A film can be adopted and form to the wet type coating.Then, be cured processing, solvent evaporation most in the resin B removed with cured resin B by the roasting step of heat.The roasting temperature of its heat is toasted 0.5 ~ 5min between 50 ~ 95 ℃.It is crosslinked with reinforced structure then to use ultraviolet light that polymer in the resin B is carried out again, and at this moment, the ultraviolet energy of being supplied with is between 150 ~ 1000mJ/cm2, and the resin B thickness after the sclerosis is between 4 ~ 5 μ m.
So the conductive layer 200 that forms just has hard protection, function such as antistatic and anti-glare; no matter its conducting particles 220 makes conductive layer 200 is that Resin A film or resin B film all have to express and separate the static function; and the hardness of resin B is also enough protected conductive layer 200 and substrate 100, so that the effect of hard protective layer in the traditional handicraft to be provided.The present invention can apply to flat-panel screens (as LCD; PDA; PDP; NOTE-PC; CRT etc.) surface optical film.Utilize the antistatic and anti-glare function of this optical thin film, LCD panel manufacturers with the antistatic demand demand for former material is provided, and can reduce the absorption of flat-panel screens dust and increase user's comfortableness.
In sum, the present invention is by comprising the conducting particles of at least two kinds of different-grain diameter specifications in Resin A, wherein, the particle diameter of the conducting particles of greater particle size specification is not only greater than the thickness of the Resin A film after solidifying and more equal or even greater than the gross thickness after Resin A and the resin B curing.Make the conducting particles have part greater particle size specification at least the apical margin contact or be exposed to curing after the resin B film upper surface and contact with external environment.Thus, in the resin B protective layer used, add the conductive metal particle in addition, the electric charge in the Resin A film can be released into the external world, and avoid electric charge to accumulate in the resin B, to reach anlistatig function with no longer needing as hard.Therefore; (for example the United States Patent (USP) case numbers 6 compared to known technology; 146,753) need to add in addition the shortcoming that the conductive metal particle causes difficulty in process and cost to improve in the hard protective layer, technology of the present invention has more simplifies technology and the effect that reduces cost.
Above-described only is preferred embodiment of the present invention with reference to example, and the technical staff who therefore knows this field should be able to understand that the present invention will put the place, and all equalizations of doing according to claim of the present invention change and modify, and all should still belong to protection scope of the present invention.
Claims (10)
1. the manufacture method of an optics protective film comprises the steps:
(a) prepared substrate, Resin A, and resin B include the conducting particles of two kinds of different size specifications at least in this Resin A, that is the conducting particles of greater particle size and than the conducting particles of small particle diameter;
(b) Resin A is coated on the substrate and carried out cured, with the Resin A film that form to solidify on substrate, and the thickness of the Resin A film after should solidifying is less than the particle diameter of this greater particle size conducting particles, and the thickness of the Resin A film after solidifying is then greater than this particle diameter than the small particle diameter conducting particles; And,
(c) resin B is coated on the Resin A film and carried out cured, with the resin B film that form to solidify on the Resin A film, and, in the conducting particles of aforementioned greater particle size, the upper surface of the resin B film after having the apical margin contact of part greater particle size conducting particles at least or being exposed to curing and contacting with external environment.
2. the manufacture method of optics protective film according to claim 1; wherein the particle diameter of the conducting particles of the greater particle size specification described in the step (a) is 0.5 ~ 7 μ m; particle diameter than the conducting particles of small particle diameter specification is 0.1 ~ 0.5 μ m; and, described conducting particles be antimony tin (ATO) and tin indium oxide (ITO) one of them.
3. the manufacture method of optics protective film according to claim 1, wherein said Resin A mainly comprises 1-butanols, isopropyl alcohol and polyacrylic acid resinoid, the solid content of Resin A is 5 ~ 25%; And described resin B is mainly the polyacrylic acid resinoid, and the solid content of described resin B is 45 ~ 50%.
4. the manufacture method of optics protective film according to claim 1, also comprise in the wherein said resin B silicon dioxide material, the fine particle of particle diameter between 0.1 ~ 1.0 μ m, this fine particle is distributed in the position of resin B film upper surface.
5. the structure of an optics protective film comprises:
Substrate;
The Resin A film, be formed on this substrate, the conducting particles and the some conducting particless that in this Resin A film, include some greater particle size specifications at least than the small particle diameter specification, and the thickness of this Resin A film is between this particle diameter than small particle diameter and greater particle size conducting particles; And,
The resin B film is formed on the Resin A film, and, have the apical margin contact of part greater particle size conducting particles at least or be exposed to the upper surface of resin B film and contact with external environment.
6. as the structure of optics protective film as described in the claim 5; wherein said conducting particles be antimony tin (ATO) and tin indium oxide (ITO) one of them; and the particle diameter of this greater particle size conducting particles is 0.5 ~ 7 μ m, is 0.5 μ m than the particle diameter of small particle diameter conducting particles.
7. as the structure of optics protective film as described in the claim 5, also comprise the fine particle of the some silicon dioxide materials of particle diameter between 0.1 ~ 1.0 μ m in the wherein said resin B film, this fine particle is distributed in the position of resin B film upper surface.
8. the structure of an optics protective film includes:
Substrate;
The Resin A film is formed on this substrate;
The resin B film is formed on the Resin A film;
Some conducting particless than the small particle diameter specification, its particle diameter are less than the thickness of Resin A film, and the conducting particles that is somebody's turn to do than the small particle diameter specification only is distributed in the Resin A film; And,
The conducting particles of some greater particle size specifications, its particle diameter is greater than the thickness of Resin A film, the conducting particles of this greater particle size specification is distributed in the scope of Resin A film and resin B film, and has the apical margin contact of part greater particle size conducting particles at least or be exposed to the upper surface of resin B film and contact with external environment.
9. as the structure of optics protective film as described in the claim 8; wherein said conducting particles be antimony tin (ATO) and tin indium oxide (ITO) one of them; and the particle diameter of the conducting particles of this greater particle size specification is 0.5 ~ 7 μ m, is about 0.5 μ m than the particle diameter of the conducting particles of small particle diameter specification.
10. as the structure of optics protective film as described in the claim 8, also comprise the fine particle of the some silicon dioxide materials of particle diameter between 0.1 ~ 1.0 μ m in the wherein said resin B film, this fine particle is distributed in the position of resin B film upper surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03142808 CN1565842A (en) | 2003-06-13 | 2003-06-13 | Structure and fabrication method for optical protective film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03142808 CN1565842A (en) | 2003-06-13 | 2003-06-13 | Structure and fabrication method for optical protective film |
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| Publication Number | Publication Date |
|---|---|
| CN1565842A true CN1565842A (en) | 2005-01-19 |
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ID=34471180
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03142808 Pending CN1565842A (en) | 2003-06-13 | 2003-06-13 | Structure and fabrication method for optical protective film |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102211435A (en) * | 2010-04-02 | 2011-10-12 | 素塔电子科技(上海)有限公司 | Anti-dazzling film |
| CN101321426B (en) * | 2007-06-06 | 2013-02-27 | 3M创新有限公司 | Electrostatic resistant film and product including the same |
| CN107471795A (en) * | 2016-06-07 | 2017-12-15 | 上海劲嘉建材科技有限公司 | Composite veneer and preparation method thereof |
| US10393924B2 (en) | 2016-09-02 | 2019-08-27 | Au Optronics Corporation | Polarizer and display device |
-
2003
- 2003-06-13 CN CN 03142808 patent/CN1565842A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101321426B (en) * | 2007-06-06 | 2013-02-27 | 3M创新有限公司 | Electrostatic resistant film and product including the same |
| CN102211435A (en) * | 2010-04-02 | 2011-10-12 | 素塔电子科技(上海)有限公司 | Anti-dazzling film |
| CN107471795A (en) * | 2016-06-07 | 2017-12-15 | 上海劲嘉建材科技有限公司 | Composite veneer and preparation method thereof |
| CN107471795B (en) * | 2016-06-07 | 2019-08-23 | 上海劲嘉建材科技有限公司 | Composite veneer and preparation method thereof |
| US10393924B2 (en) | 2016-09-02 | 2019-08-27 | Au Optronics Corporation | Polarizer and display device |
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