CN1556540A - High vacuum packaging method of field emitting display device - Google Patents
High vacuum packaging method of field emitting display device Download PDFInfo
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- CN1556540A CN1556540A CNA2003101228816A CN200310122881A CN1556540A CN 1556540 A CN1556540 A CN 1556540A CN A2003101228816 A CNA2003101228816 A CN A2003101228816A CN 200310122881 A CN200310122881 A CN 200310122881A CN 1556540 A CN1556540 A CN 1556540A
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- glass
- field emission
- emission display
- high vacuum
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Abstract
The invention relates to a field emission display device high-vacuum packaging method, including the steps: placing a seal glass, assembling the filed emission display device, vacuumizing, heating and sealing edges, and cooling; where the steps of the cacuumizing and heating and sealing edges are primarily completed in a vacuum room. Compared with traditional packaging method, its characters: (1) omitting air pumping pipelines connected with the device to make the vacuumizing system directly match with the vacuum room, largely increasing vacuumizing speed and efficiency; (2) largely simplifying the device packaging procedures and reducing production cost; (3) vacuumizing at high temperature (above 300 deg.C) to make the vacuum of the sealed device higher and more stable; (4) the packaged device is more beautiful without air vents.
Description
Technical field
The present invention relates to the high vacuum encapsulation technology of feds, belong to the Field Emission Display field.
Background technology
In recent years, an emission becomes a very active field.Consistently in the world think that Field Emission Display (FED) has broad prospects and future in flat panel display market.Compare with LCD, the various performances of Field Emission Display are leading comprehensively, advantages such as simplification with high brightness, more good view effect, low-power consumption, the size of dwindling greatly, manufacture craft, therefore be described as the Display Technique (K.Derbyshire of 21st century, Solid State Technol.38,71 (1995); J.Roberston, Thin Solid Films 296,62 (1997)).
The basic principle of Field Emission Display as shown in Figure 1, utilize DC power supply or pulse dc power between two pole plates parallel to each other, to form DC electric field, under effect of electric field, electronics is overflowed from the surface of filed emission cathode material and is quickened, and the impact fluorescence material also makes it luminous.Filed emission cathode material and fluorescent material are coated on the cathode-anode plate respectively, and are connected with power supply with transparency electrode by metal electrode respectively.Numeral 101 expression anodic oxidation indium tin (ITO) electro-conductive glass among Fig. 1,102 expression fluorescent material, 103 expression supporters, 104 expression negative electrode electro-conductive glass, 105 expression filed emission cathode materials, arrow is represented the electronics transmit direction among the figure.The display degree that field emission display will obtain except the field-transmitting cathode that needs the electron emission capability excellence, need the most important thing is the high vacuum environment (about 10 of an internal stability
-5Pa).The vacuum degree of device has crucial influence to the reliability of field-transmitting cathode electronics emission and the life-span of FED device, and vacuum sealing technique is the bottleneck that the restriction field emission display moves towards practicability always.
The encapsulation of field emission display all is to continue to use traditional technology at present, the packaging technology of similar and vacuum fluorescent display (VFD), promptly around the glass substrate that has field-transmitting cathode, be coated with glass powder with low melting point, through high temperature sintering, fusion glass powder with low melting point device periphery is sealed in atmosphere with ito anode glass assembling back, vacuumize at the bleeding point of reserving, the sealing-in bleeding point is made product again.Said method has two big adverse effects to the performance of field emission display.One, the sintering temperature of glass powder with low melting point through high-temperature sintering process like this, to the toxic effect of field-transmitting cathode, influences the electron emission capability of negative electrode in atmosphere about 440 ℃.Two, because the characteristics of working under the high electric field strength of field emission display, spacing is less between its anode and cathode panel, hundreds of micron normally, the vapour lock of bleeding behind the edge sealing is big, and adopt said method also will be on device the long pump-line of adjunction, pipeline is long more, the detailed rules and regulations impedance of bleeding is big more more for diameter, pumping speed is low more, and it is just low more to vacuumize efficient, and vacuum degree is not just taken out, and bleeding point glass can be exitted during the sealing-in bleeding point, makes the internal vacuum of device lower.
Summary of the invention
The objective of the invention is in order to solve the problem that above-mentioned technology exists, a kind of high vacuum method for packing of field emission display is provided, it is characterized in that it is a kind of bleeding point that need not to reserve, adopt the sealing of vacuum hot melt once to finish, thereby obtain the field emission display method for packing of condition of high vacuum degree.
According to the high vacuum method for packing of a kind of field emission display provided by the invention, step is successively:
(1) placement of seal glass: seal glass is placed on ito anode glass that has fluorescent material or the negative electrode glass periphery that has field emission body;
(2) assembling of field emission display: with anode glass and negative electrode glass spaced (not contacting mutually) staggered relatively, a plurality of supporters of anode glass or negative electrode placement on glass are used to form the interval of encapsulated device;
(3) vacuumize: in the vacuum chamber of sealing, the anode and cathode bulk glass that assembles is vacuumized with said vacuum chamber, reach the required condition of high vacuum degree of device;
(4) heating edge sealing: vacuum chamber is heated to edge sealing seal glass fusion temperature, applies certain pressure anode and cathode glass is closely contacted, form airtight periphery;
(5) cooling: the vacuum chamber cooling, device is cooled off thereupon, obtain to have the field emission display of required condition of high vacuum degree thus.
Described seal glass can adopt commercially available seal glass, as seal glass bar, glass dust, glass powder with low melting point.Preferred seal glass is that glass powder with low melting point is used in sealing, selects the glass dust of its coefficient of expansion and face glass coupling often.
Described anode glass panel is an ito glass, the glass of cathode glass faceplate for using always, and as float glass, ito glass.
Described supporter is supporter commonly used, the supporter of being made by materials such as metal, glass, pottery or alloys.
Describedly vacuumize and heat edge sealing and carry out simultaneously.Reach 10 in vacuum degree
-3Behind the Pa, heat the sealing temperature of whole vacuum chamber until seal glass, the sealing temperature of the seal glass of selecting for use usually is 350 ℃～550 ℃, is incubated 1～2 hour, and seal glass is fully melted, and is evacuated down to the required vacuum degree of device (10 simultaneously
-5Pa～10
-6Pa), mobile at last anode and cathode face glass makes it to contact and keep certain pressure.
Described vacuum chamber cooling or device is cooled off thereupon or by water-cooled or direct air-cooled realization uniform decrease in temperature.
According to the present invention, the change of the vacuum degree of anode and cathode face glass inner space is that the vacuum degree of the vacuum chamber by changing anode and cathode face glass place realizes.Therefore when the vacuum up of vacuum chamber, the also corresponding raising of the vacuum degree in device inside space.
The high vacuum method for packing of this field emission display of the present invention is compared with aforesaid conventional method, its advantage is: (1) has saved the pump-line that is connected with field emission display, pumped vacuum systems and vacuum chamber are directly mated, whole field emission display is vacuumized with vacuum chamber in the vacuum chamber of sealing, so just improved vacuum pumping rate and efficient greatly; (2) simplify the canned program of field emission display greatly, vacuumized with sealing-in and once finish, reduced production cost, be convenient to suitability for industrialized production; (3) at high temperature vacuumize (more than 300 ℃), help the moisture of anode and cathode face glass inner surface absorption fully to discharge the device inner space, make component vacuum Du Genggao after the sealing-in, more stable; (4) owing to do not need to stay exhaust outlet, the device after the encapsulation is more attractive in appearance.
Description of drawings
The basic principle schematic of Fig. 1 field emission display;
Fig. 2 field emission display high vacuum of the present invention method for packing;
Embodiment
Describe the present invention in detail below in conjunction with accompanying drawing, these accompanying drawings and explanation thereof only are to be used for illustrating of the present invention, and they are not to be to carry out any qualification to the present invention, and protection scope of the present invention is defined by the claims.
Embodiment 1
The high vacuum method for packing of the said field emission display of the present invention as shown in Figure 2.Anode glass panel 2 is placed in opposite directions with cathode glass faceplate 4, and two panels begin not to be in contact with one another, and leave certain clearance so that vacuumize; Wherein a panel around seal glass 3 is arranged, and on panel, be placed with a plurality of supporters 103, be used to keep the spacing between the device anode and cathode panel after the sealing-in.The glass that is used to make face glass is the ITO electro-conductive glass.The preferred seal glass of present embodiment is the sealing glass powder with low melting point.Glass dust has a lot of types, preferably the glass dust of its coefficient of expansion and face glass coupling.The supporter that present embodiment is selected for use is the supporter of being made by ceramic material.With the field emission display that assembles be positioned over a volume enough big can airtight cavity such as vacuum chamber 1 in, vacuum chamber 1 links to each other with pumped vacuum systems 6 by large diameter pipeline 5, can make this vacuum chamber reach the required condition of high vacuum degree of device when needed.
At first whole vacuum chamber is vacuumized, reach 10 in vacuum degree
-3Behind the Pa, heat the sealing temperature of whole vacuum chamber until seal glass.The seal glass sealing temperature that present embodiment is selected for use is 450 ℃.Under this temperature, be incubated 1.5 hours then, seal glass is fully melted, continue to be evacuated down to 10 simultaneously
-5Pa.Mobile at last anode and cathode face glass makes it to contact and keep certain pressure, and cooling is solidified seal glass to seal the periphery of anode and cathode face glass.Cooling is lowered the temperature naturally for device.
Embodiment 2
The glass that is used to make cathode glass faceplate is float glass, the negative electrode glass that the seal glass of selecting for use places field emission body all round, place the supporter of a plurality of glass material preparations on negative electrode and the anode, be used to form the interval of encapsulated device, vacuumizing the heating package temperature is 400 ℃, the sealing-in temperature retention time is 1 hour, and vacuum degree is 10
-6Pa, all the other are with embodiment 1.
Claims (8)
1, a kind of high vacuum method for packing of field emission display is characterized in that adopting the sealing of vacuum hot melt once to finish.
2, by the high vacuum method for packing of the described field emission display of claim 1, it is characterized in that comprising the following steps: successively
1) seal glass is placed step: seal glass is placed on ito anode glass that has fluorescent material or the negative electrode glass periphery that has field emission body;
2) field emission display installation step: anode glass and negative electrode glass is spaced staggered relatively, and a plurality of supporters of anode glass or negative electrode placement on glass are used to form the interval of encapsulated device;
3) vacuumize step: in the vacuum chamber of sealing, the anode and cathode bulk glass that assembles is vacuumized with vacuum chamber, reach the required condition of high vacuum degree of device;
4) heating edge sealing step: vacuum chamber is heated to edge sealing seal glass fusion temperature, applies certain pressure anode and cathode glass is closely contacted, form airtight periphery;
5) cooling step: the vacuum chamber cooling, device is cooled off thereupon, obtain to have the field emission display of required condition of high vacuum degree thus.
3, the high vacuum method for packing of the described field emission display of claim 2 is characterized in that described anode glass panel is an ito glass, and cathode glass faceplate is glass commonly used, or is float glass, and is a kind of in the ito glass.
4,, it is characterized in that between the described anode and cathode supporter or make by metal, glass, pottery or alloy material by the high vacuum method for packing of the described field emission display of claim 2.
5,, it is characterized in that described seal glass or be seal glass bar, glass dust or glass powder with low melting point by the high vacuum method for packing of the described field emission display of claim 2.Its sealing temperature is 350 ℃～550 ℃.
6, by the high vacuum method for packing of the described field emission display of claim 5, it is characterized in that described seal glass is a low-melting glass.
7, by the high vacuum method for packing of claim 2,5 or 6 described field emission displays, it is characterized in that describedly vacuumizing and heating edge sealing and carry out simultaneously, reach 10 in vacuum degree
-3Behind the Pa, heat the sealing temperature of whole vacuum chamber, be incubated 1～2 hour, seal glass is fully melted until seal glass, be evacuated down to simultaneously device required 10
-5Pa～10
-6Pa vacuum degree.
8,, it is characterized in that described vacuum chamber cooling or natural cooling or pass through water-cooled or direct air-cooled realization uniform decrease in temperature by the high vacuum method for packing of the described field emission display of claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2003101228816A CN1556540A (en) | 2003-12-30 | 2003-12-30 | High vacuum packaging method of field emitting display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2003101228816A CN1556540A (en) | 2003-12-30 | 2003-12-30 | High vacuum packaging method of field emitting display device |
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| CN1556540A true CN1556540A (en) | 2004-12-22 |
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| CNA2003101228816A Pending CN1556540A (en) | 2003-12-30 | 2003-12-30 | High vacuum packaging method of field emitting display device |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101148313B (en) * | 2006-09-20 | 2011-01-12 | 黄家军 | One-step forming vacuum glass and its manufacturing method and device |
| CN102173569A (en) * | 2011-03-08 | 2011-09-07 | 李梦琪 | System and method for processing material assembly body |
| CN101302081B (en) * | 2007-04-05 | 2012-01-11 | 格伦策巴赫机械制造有限公司 | Vacuum insulated glass building component and method and apparatus for its manufacture |
| WO2012037733A1 (en) * | 2010-09-26 | 2012-03-29 | 海洋王照明科技股份有限公司 | Field emission anode plate, filed emission light source and manufacturing method for light source |
| CN102617025A (en) * | 2011-01-31 | 2012-08-01 | 洛阳兰迪玻璃机器股份有限公司 | Method for acquiring vacuum during making vacuum glass member |
| CN106698976A (en) * | 2015-11-18 | 2017-05-24 | 中国南玻集团股份有限公司 | Low-pressure vacuum energy-saving glass and preparation method thereof |
-
2003
- 2003-12-30 CN CNA2003101228816A patent/CN1556540A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101148313B (en) * | 2006-09-20 | 2011-01-12 | 黄家军 | One-step forming vacuum glass and its manufacturing method and device |
| CN101302081B (en) * | 2007-04-05 | 2012-01-11 | 格伦策巴赫机械制造有限公司 | Vacuum insulated glass building component and method and apparatus for its manufacture |
| WO2012037733A1 (en) * | 2010-09-26 | 2012-03-29 | 海洋王照明科技股份有限公司 | Field emission anode plate, filed emission light source and manufacturing method for light source |
| CN103003910A (en) * | 2010-09-26 | 2013-03-27 | 海洋王照明科技股份有限公司 | Field emission anode plate, filed emission light source and manufacturing method for light source |
| CN102617025A (en) * | 2011-01-31 | 2012-08-01 | 洛阳兰迪玻璃机器股份有限公司 | Method for acquiring vacuum during making vacuum glass member |
| WO2012103745A1 (en) * | 2011-01-31 | 2012-08-09 | Luoyang Landglass Technology Co., Ltd. | Method for vacuum acquisition during manufacturing of vacuum glass component |
| CN102617025B (en) * | 2011-01-31 | 2014-06-25 | 洛阳兰迪玻璃机器股份有限公司 | Method for acquiring vacuum during making vacuum glass member |
| CN102173569A (en) * | 2011-03-08 | 2011-09-07 | 李梦琪 | System and method for processing material assembly body |
| CN106698976A (en) * | 2015-11-18 | 2017-05-24 | 中国南玻集团股份有限公司 | Low-pressure vacuum energy-saving glass and preparation method thereof |
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