CN1553263A - Sealing structure of liquid-crystal displaying panel and producing process thereof - Google Patents
Sealing structure of liquid-crystal displaying panel and producing process thereof Download PDFInfo
- Publication number
- CN1553263A CN1553263A CNA031383289A CN03138328A CN1553263A CN 1553263 A CN1553263 A CN 1553263A CN A031383289 A CNA031383289 A CN A031383289A CN 03138328 A CN03138328 A CN 03138328A CN 1553263 A CN1553263 A CN 1553263A
- Authority
- CN
- China
- Prior art keywords
- display panels
- shared
- chip
- flexible circuit
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Liquid Crystal (AREA)
Abstract
In the present invention, a shared type of heterodirectivity conduction film is snuggled up to nondisplaying area of liquid crystal display panel so driving chip and soft circuit film set on shared type of heterodirectivity conduction film are electric-connected with circuit on non displaying area; thus only one step of snuggling is required in packaging procedure since shard type of heterodirectivity conduction film provided by the present invention is applied.
Description
Technical field
The invention relates to encapsulating structure and the manufacture craft thereof of a kind of display panels (LCD panel), and particularly relevant for a kind of encapsulating structure and manufacture craft thereof of using the display panels of shared anisotropy conductive film.
Background technology
Along with the fast development of lcd technology, the LCD of a new generation just develops towards the direction of high brightness, wide viewing angle, fast, the high image resolution of reaction rate and full-colorization.Yet the factor that influences these image characteristicss comprises the structure packing technique etc. of manufacture craft, alignment film (alignment layer), sealant (sealant) material and back segment of rerum natura, colored filter, the thin film transistor (TFT) of the structure of liquid crystal molecule, pixel electrode (pixel electrode).Because the demand of the high image resolution of LCD and compactization of electronic product, the structure packing technique is also by crystal grain-circuit board joining technique (Chip On Board, COB) change the automatic coating technique of film (Tape AutomatedBonding into, TAB), be evolved to again little spacing (fine pitch) now crystal grain-glass bond technology (Chip On Glass, COG).
(An-isotropic Conductive Film is ACF) as the media that electrically connects between chip for driving (driverIC) and the liquid crystal panel with the anisotropy conductive film usually to it should be noted that present common crystal grain-glass bond (COG) manufacture craft.
It illustrates process flow diagram into the encapsulation of known display panels Fig. 1.See also Fig. 1, the encapsulation flow process of known display panels provides a display panels (S10) earlier, this display panels has a viewing area and a non-display area, wherein have circuit on the non-display area of display panels, these circuits are in order to connect viewing area, chip for driving pressing zone and flexible circuit film laminating zone; Then carry out the attaching (S12) of one first anisotropy conductive film, in this step, this first anisotropy conductive film is attached on the chip for driving pressing zone in the non-display area; Then high-temperature high-pressure unification chip for driving is on the first anisotropy conductive film (S14), makes projection and the circuit on the liquid crystal panel on the chip for driving can pass through conducting particles in the first anisotropy conducting film and conducting; And then carry out the attaching (S16) of one second anisotropy conductive film, and this second anisotropy conductive film is attached on the flexible circuit film laminating zone in the non-display area; High-temperature high-pressure is unified flexible circuit film (Flexible Printed Circuit more at last, FPC) on the second anisotropy conductive film (S18), wherein the pin on the end and the circuit on the liquid crystal panel can the conductings by the conducting particles in the second anisotropy conducting film to make the flexible circuit film.
Fig. 2 illustrates the encapsulating structure synoptic diagram into known display panels.See also Fig. 2, the encapsulating structure of known display panels mainly comprises a display panels 100, one first anisotropy conducting film 110, one second anisotropy conducting film 120, a chip for driving 130 and a flexible circuit film 140.Wherein, display panels 100 has a viewing area 102 and a non-display area 104, have circuit (not illustrating) on the non-display area 104 of display panels 100, these circuits are in order to connect viewing area 102, chip for driving pressing zone 104a and flexible circuit film laminating zone 104b; The first anisotropy conducting film 110 is disposed on the chip for driving pressing zone 104a in the non-display area 104, and chip for driving 130 is disposed on the first anisotropy conducting film 110, it is by the conducting particles in the first anisotropy conducting film 110, and the circuit (figure does not show) on the non-display area 104 of projection (figure does not show) and liquid crystal panel 100 on the chip for driving 130 is electrically connected; The second anisotropy conducting film 120 is disposed on the flexible circuit film laminating zone 104b in the non-display area 104, one end of flexible circuit film 140 is disposed on the second anisotropy conducting film 120, and its pin electrically connects by the circuit on the non-display area 104 of conducting particles in the second anisotropy conducting film 120 and liquid crystal panel 100 (figure does not show).
It should be noted that, because in the packaging manufacturing process of display panels, chip for driving 130 and flexible circuit film 140 have the requirement of different joints (Bonding), (thickness at the anisotropy conductive film of chip for driving end for example is 23 μ m usually so known technology uses the different anisotropy conductive film of two kinds of thickness, and for example be 25 μ m at the thickness of the anisotropy conductive film of flexible circuit film end), and make chip for driving 130 and flexible circuit film 140 the two can electrically conduct with the pel array in the liquid crystal panel 100.Yet known technology uses two kinds of different anisotropy conductive films to have following shortcoming:
1. because use two kinds of different anisotropy conductive films, so in the process of encapsulation, need the attaching step of twice, so will make the manufacture craft time increase, and then cause production capacity to descend.
2. because the anisotropy conductive film costs an arm and a leg, so use two kinds of different anisotropy conductive films will make the cost of each piece display panels increase.
Summary of the invention
Therefore, purpose of the present invention is exactly in encapsulating structure that a kind of display panels is provided and manufacture craft thereof, attaching mode by a shared anisotropy conductive film, with media, and can effectively shorten the manufacture craft time and reduce material cost as chip for driving and the electric connection of flexible circuit film.
The present invention proposes the encapsulating structure of a display panels, mainly comprises a display panels, a shared anisotropy conductive film, at least one chip for driving and a flexible circuit film.Wherein, display panels has a viewing area and a non-display area, has at least one chip for driving pressing zone and at least one flexible circuit film laminating zone on the non-display area; Shared anisotropy conductive film is disposed on chip for driving pressing zone and the flexible circuit film laminating zone; Chip for driving is disposed on the shared anisotropy conductive film, and is positioned at top, chip for driving pressing zone; One end of flexible circuit film is disposed on the shared anisotropy conductive film, and is positioned at top, flexible circuit film laminating zone.
The present invention also proposes a kind of packaging manufacturing process of display panels, comprise the following steps: to provide earlier a display panels, wherein display panels has a viewing area and a non-display area, has at least one chip for driving pressing zone and at least one flexible circuit film laminating zone on the non-display area; Then attach a shared anisotropy conductive film on chip for driving pressing zone and flexible circuit film laminating zone; High-temperature high-pressure is closed at least one chip for driving on shared anisotropy conductive film afterwards, so that chip for driving is electrically connected on the chip for driving pressing zone; One end of final high temperature pressing one flexible circuit film is on shared anisotropy conductive film, so that the flexible circuit film is electrically connected on the flexible circuit film laminating zone.
In preferred embodiment of the present invention, above-mentioned shared anisotropy conductive film comprises a resin and plural conductive particle, and wherein, these conducting particless are disposed in this resin, and the particle diameter of these conducting particless for example is 4 μ m.In addition, the thickness of shared anisotropy conductive film for example is 23 μ m, and its width is for for example being 3mm.In addition, the other end of above-mentioned flexible circuit film further electrically connects with a control circuit board.
In preferred embodiment of the present invention, this pressure temperature of high temperature pressing in the above-mentioned packaging manufacturing process is lower than 200 ℃, and the high temperature pressing is for example carried out pressing by a pressure head, and the pressing of this super pressure-high temperature of FPC also can further provide a silicones (silicone) fender on pressure head, and carries out pressing by the silicones fender.
The present invention is by the attaching of a shared anisotropy conductive film, make chip for driving and flexible circuit film after the high temperature pressing, and electrically conduct with pel array in the liquid crystal panel, because the action that only need once attach in manufacture craft so can be shortened the manufacture craft time and reduce material cost.
For above and other objects of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. elaborate.
Description of drawings
Fig. 1 is the process flow diagram that illustrates to the encapsulation of known display panels;
Fig. 2 is the encapsulating structure synoptic diagram that illustrates to known display panels;
Fig. 3 is the process flow diagram that illustrates according to the encapsulation of the display panels of a preferred embodiment of the present invention;
Fig. 4 is the encapsulating structure synoptic diagram that illustrates according to the display panels of a preferred embodiment of the present invention;
Fig. 5 is the temperature variation that illustrates according to the shared anisotropy conductive film of the chip for driving of a preferred embodiment of the present invention and flexible circuit film end;
Fig. 6 is the synoptic diagram that illustrates according to the chip for driving end pressing of a preferred embodiment of the present invention; And
Fig. 7 is the synoptic diagram that illustrates according to the flexible circuit film end pressing of a preferred embodiment of the present invention.
Indicate explanation
100,200: liquid crystal display face version
102,202: the viewing area
104,204: non-display area
104a, 204a: chip for driving pressing zone
104b, 204b: flexible circuit film laminating zone
110: the first anisotropy conductive films
120: the second anisotropy conductive films
130,220: chip for driving
140,230: the flexible circuit film
210: shared anisotropy conductive film
240: control circuit board
Embodiment
Fig. 3, it illustrates the process flow diagram according to the encapsulation of the display panels of a preferred embodiment of the present invention.See also Fig. 3, the encapsulation flow process of display panels of the present invention provides a display panels (S20) earlier, this display panels has a viewing area and a non-display area, wherein have a chip for driving pressing zone and a flexible circuit film laminating zone on the non-display area, and have circuit on the non-display area, these circuits are in order to connect viewing area, chip for driving pressing zone and flexible circuit film laminating zone; Then carrying out the attaching (S22) of a shared anisotropy conductive film, in this step, is that shared anisotropy conductive film is attached on chip for driving pressing zone and the flexible circuit film laminating zone; The chip for driving of high-temperature high-pressure unification afterwards is on shared anisotropy conductive film (S24), make that projection on the chip for driving and the circuit on the liquid crystal panel can the conductings by the conducting particles in the shared anisotropy conductive film, so that chip for driving is electrically connected on the chip for driving pressing zone; One end of final high temperature pressing one flexible circuit film is on shared anisotropy conductive film (S26), wherein the pin on the end and the circuit on the liquid crystal panel can the conductings by the conducting particles in the shared anisotropy conductive film to make the flexible circuit film, so that the flexible circuit film is electrically connected on the flexible circuit film laminating zone.
It should be noted that, this pressure temperature of above-mentioned high temperature pressing is for example controlled and is lower than 200 ℃, and the high temperature pressing is for example carried out pressing by a pressure head, and the high temperature pressing more can further provide a silicones fender on pressure head, and carries out pressing by the silicones fender.
It illustrates encapsulating structure synoptic diagram according to the display panels of a preferred embodiment of the present invention Fig. 4.See also Fig. 4, the encapsulating structure of display panels of the present invention mainly comprises a display panels 200, one shared anisotropy conducting film 210, at least one chip for driving 220 and a flexible circuit film 230.Wherein, display panels 200 has a viewing area 202 and a non-display area 204, the pixel (pixel) that has arrayed on the viewing area 202, combination by these pixels gets final product composing images, and having circuit (not illustrating) on the non-display area 204, these circuits are in order to connect viewing area 202, chip for driving pressing zone 204a and flexible circuit film laminating zone 204b.
Shared anisotropy conducting film 210 comprises a resin and plural conductive particle, and these conducting particless are disposed in the resin.This shared anisotropy conductive film 210 is disposed on chip for driving pressing zone 204a and the flexible circuit film laminating zone 204b.Chip for driving 220 is disposed on the shared anisotropy conductive film 210, and be positioned at 204a top, chip for driving pressing zone, it is by the conducting particles in the shared anisotropy conductive film 210, and the circuit (figure does not show) on the non-display area 204 of projection (figure does not show) and liquid crystal panel 200 on the chip for driving 220 is electrically connected.
Particle diameter that it should be noted that above-mentioned mentioned conducting particles for example is 4 μ m.In addition, the thickness of shared anisotropy conductive film 210 for example is 23 μ m, and its width is for for example being 3mm.And chip for driving 220 is not limited to its kenel, and it can be two types of grid drive chip (gate driver) or source driving chips (source driver), and its number can be one or more.
One end of flexible circuit film 230 is disposed on the shared anisotropy conductive film 210, and be positioned at 204b top, flexible circuit film laminating zone, it is by the conducting particles in the shared anisotropy conductive film 210, circuit (figure does not show) on the non-display area 204 of pin on the flexible circuit film 230 (figure does not show) and liquid crystal panel 200 is electrically connected, and the end in addition of flexible circuit film 230 more can further electrically connect with a control circuit board 240, but and by flexible circuit film 230 bending characteristics, and control circuit board 240 is disposed at liquid crystal panel 200 bottoms.
From the above, it for example is 23 μ m that shared anisotropy conductive film 210 its specifications of the present invention are set its thickness, and its width is for for example being 3mm, and its conducting particles density for example is 4,4000pcs/mm
2And the particle diameter of conducting particles for example is 4 μ m, so can guarantee to have enough conducting particless on projection on the chip for driving 220 and the pin on the flexible circuit film 230, and meet the requirement of the bump height on the existing chip for driving 220, and can satisfy the demand (as the probability of short circuit between the projection that reduces chip for driving etc.) of others on the manufacture craft.
Fig. 5 is the temperature variation that illustrates according to the shared anisotropy conductive film of the chip for driving of a preferred embodiment of the present invention and flexible circuit film end.Can know by Fig. 5 and to learn, use shared anisotropy conductive film of the present invention, in the process of high temperature pressing chip for driving, when this pressure temperature during at 190 ℃, 200 ℃, shared anisotropy conductive film heating temperature near flexible circuit film end all is lower than 120 ℃, and the ratio that the shared anisotropy conductive film of its flexible circuit film end reacts in advance is lower than 30%.Changing speech talks about, when the flexible circuit film does not carry out the step of high temperature pressing as yet, be difficult for being subjected to thermal response and conducting in advance near the conducting particles in the flexible circuit film end, and then cause phenomenon such as short circuit, so the feasibility of provable shared anisotropy conductive film of the present invention.In addition, if the temperature control of the high temperature pressing of chip for driving is lower than 160 ℃, can make the temperature of the shared anisotropy conductive film of flexible circuit film end be reduced to 100 ℃ safer scope, the shared anisotropy conductive film of its flexible circuit film end promptly can not react in advance.In other words, the temperature control of the high temperature pressing of chip for driving is lower than 160 ℃ and is one of preferred embodiment.
Fig. 6 is the synoptic diagram that illustrates according to the chip for driving end pressing of a preferred embodiment of the present invention, and Fig. 7 is the synoptic diagram that illustrates according to the flexible circuit film end pressing of a preferred embodiment of the present invention.In aforementioned packaging manufacturing process, the control of the temperature of high temperature pressing is lower than 200 ℃, can know by Fig. 6 and learn that the present invention's its impression of conducting particles on the shared anisotropy conductive film of chip for driving end is clear and do not have a bad phenomenon of impression.And can know by Fig. 7 and to learn, owing to provide a silicones fender on pressure head, and carry out pressing by the silicones fender, the present invention's its impression of conducting particles on the shared anisotropy conducting film of flexible circuit film end is same clear and also do not have a bad phenomenon of impression.So from last more provable, chip for driving and flexible circuit film can be shared the anisotropy conductive film of same kenel.
In sum, the encapsulating structure of display panels of the present invention and manufacture craft thereof comprise following advantage:
1. display panels of the present invention so only need attaching step together in the process of encapsulation, makes the manufacture craft time shorten and then the lifting production capacity because of using a shared anisotropy conductive film.
2. display panels of the present invention uses a shared anisotropy conductive film, do not need as known technology, to use two kinds of different anisotropy conductive films, so that the pel array in chip for driving and flexible circuit and the liquid crystal panel electrically conducts, so can make the cost of each piece display panels descend.
3. display panels of the present invention uses a shared anisotropy conductive film, this shared anisotropy conductive film is the known anisotropy conductive film that is attached at the chip for driving end, so needn't plan again on the manufacture craft, and board is except carrying out the adjustment that ACF attaches the pressure head width, widening outside the replacing with this pressure of FPC fender of ACF roller, also needn't redesign its practicality height.
Though the present invention with a preferred embodiment openly as above; right its is not in order to limiting the present invention, anyly is familiar with this operator, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention defines and is as the criterion when looking claims.
Claims (14)
1. the encapsulating structure of a display panels is characterized in that: comprising:
One display panels has a viewing area and a non-display area, wherein also has at least one chip for driving pressing zone and at least one flexible circuit film laminating zone on this non-display area;
One shared anisotropy conductive film is disposed on this chip for driving pressing zone and this flexible circuit film laminating zone;
At least one chip for driving is disposed on this shared anisotropy conductive film, and is positioned at top, chip for driving pressing zone; And
One flexible circuit film, an end of this flexible circuit film are disposed on this shared anisotropy conductive film, and are positioned at this top, flexible circuit film laminating zone.
2, the encapsulating structure of display panels as claimed in claim 1 is characterized in that: this shared anisotropy conductive film comprises:
One resin; And
The plural conductive particle is disposed in this resin.
3, the encapsulating structure of display panels as claimed in claim 2 is characterized in that, the particle diameter of those conducting particless is 4 μ m.
4, the encapsulating structure of display panels as claimed in claim 1 is characterized in that, the thickness of this shared anisotropy conductive film is 23 μ m.
5, the encapsulating structure of display panels as claimed in claim 1 is characterized in that, the width of this shared anisotropy conductive film is 3mm.
6, the encapsulating structure of display panels as claimed in claim 1 is characterized in that, also comprises a control circuit board, and the other end of this control circuit board and this flexible circuit film electrically connects.
7, a kind of packaging manufacturing process of display panels is characterized in that, comprising:
One display panels is provided, and this display panels has a viewing area and a non-display area, wherein also has at least one chip for driving pressing zone and at least one flexible circuit film laminating zone on this non-display area;
Attach a shared anisotropy conductive film on this chip for driving pressing zone and this flexible circuit film laminating zone;
High-temperature high-pressure is closed at least one chip for driving on this shared anisotropy conductive film, so that this chip for driving is electrically connected on this chip for driving pressing zone; And
One end of high-temperature high-pressure unification flexible circuit film is on this shared anisotropy conductive film, so that this flexible circuit film is electrically connected on this flexible circuit film laminating zone.
8, the packaging manufacturing process of display panels as claimed in claim 7 is characterized in that, this pressure temperature of high temperature pressing is lower than 200 ℃.
9, the packaging manufacturing process of display panels as claimed in claim 7 is characterized in that, the high temperature pressing is to carry out pressing by a pressure head.
10, the packaging manufacturing process of display panels as claimed in claim 9 is characterized in that, the high temperature pressing also comprises provides a silicones fender on this pressure head, and carries out pressing by this silicones fender.
11, the packaging manufacturing process of display panels as claimed in claim 7 is characterized in that, this shared anisotropy conductive film comprises:
One resin; And
The plural conductive particle is disposed in this resin.
12, the packaging manufacturing process of display panels as claimed in claim 11 is characterized in that, the particle diameter of those conducting particless is 4 μ m.
13, the packaging manufacturing process of display panels as claimed in claim 7 is characterized in that, the thickness of this shared anisotropy conductive film is 23 μ m.
14, the packaging manufacturing process of display panels as claimed in claim 7 is characterized in that, the width of this shared anisotropy conductive film is 3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031383289A CN1325983C (en) | 2003-05-27 | 2003-05-27 | Sealing structure of liquid-crystal displaying panel and producing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031383289A CN1325983C (en) | 2003-05-27 | 2003-05-27 | Sealing structure of liquid-crystal displaying panel and producing process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1553263A true CN1553263A (en) | 2004-12-08 |
| CN1325983C CN1325983C (en) | 2007-07-11 |
Family
ID=34323697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031383289A Expired - Fee Related CN1325983C (en) | 2003-05-27 | 2003-05-27 | Sealing structure of liquid-crystal displaying panel and producing process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1325983C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101398539B (en) * | 2007-09-28 | 2010-09-29 | 群康科技(深圳)有限公司 | Display module |
| CN101382671B (en) * | 2008-08-27 | 2013-07-24 | 福建华冠光电有限公司 | Method for plastering IC to lcd display panel terminal |
| CN103247233A (en) * | 2013-04-28 | 2013-08-14 | 京东方科技集团股份有限公司 | Flexible substrate, display device and method for attaching electronic devices on flexible substrate |
| CN109429438A (en) * | 2017-08-25 | 2019-03-05 | 阳程科技股份有限公司 | The compression method and its pressing device of thin-film display and flexible circuit board |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100232680B1 (en) * | 1997-01-22 | 1999-12-01 | 구본준 | Acf structure |
| KR100386758B1 (en) * | 1998-12-02 | 2003-06-09 | 세이코 엡슨 가부시키가이샤 | Anisotropic conductor film, semiconductor chip, and method of packaging |
| JP3826605B2 (en) * | 1999-03-08 | 2006-09-27 | セイコーエプソン株式会社 | Method for manufacturing semiconductor device mounting structure, liquid crystal device, and electronic apparatus |
| JP2000284308A (en) * | 1999-03-30 | 2000-10-13 | Ricoh Co Ltd | Method for connecting liquid crystal display device |
| JP3642239B2 (en) * | 1999-10-06 | 2005-04-27 | セイコーエプソン株式会社 | Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus |
| JP2001230510A (en) * | 2000-02-16 | 2001-08-24 | Sanyo Electric Co Ltd | Flexible board structure used for connection of electrical device |
| JP3329328B2 (en) * | 2000-03-28 | 2002-09-30 | 日本電気株式会社 | Mounting structure of liquid crystal display device and method of manufacturing the same |
| JP3439443B2 (en) * | 2000-09-07 | 2003-08-25 | 鹿児島日本電気株式会社 | Thermocompression bonding method for substrates |
| JP2002343834A (en) * | 2001-05-21 | 2002-11-29 | Matsushita Electric Ind Co Ltd | Apparatus for pasting anisotropically conductive film for flexible printed board |
-
2003
- 2003-05-27 CN CNB031383289A patent/CN1325983C/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101398539B (en) * | 2007-09-28 | 2010-09-29 | 群康科技(深圳)有限公司 | Display module |
| CN101382671B (en) * | 2008-08-27 | 2013-07-24 | 福建华冠光电有限公司 | Method for plastering IC to lcd display panel terminal |
| CN103247233A (en) * | 2013-04-28 | 2013-08-14 | 京东方科技集团股份有限公司 | Flexible substrate, display device and method for attaching electronic devices on flexible substrate |
| CN103247233B (en) * | 2013-04-28 | 2015-09-23 | 京东方科技集团股份有限公司 | Flexible base, board, display device and attach the method for electron device on flexible substrates |
| US9651996B2 (en) | 2013-04-28 | 2017-05-16 | Boe Technology Group Co., Ltd. | Flexible substrate, display device and method for bonding electronic devices on flexible substrate |
| CN109429438A (en) * | 2017-08-25 | 2019-03-05 | 阳程科技股份有限公司 | The compression method and its pressing device of thin-film display and flexible circuit board |
| CN109429438B (en) * | 2017-08-25 | 2020-08-14 | 阳程科技股份有限公司 | Method and device for laminating thin film display and flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1325983C (en) | 2007-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1172211C (en) | Electrooptical device assembling basic parts and its mfg. method, terminal connection method | |
| CN1227735C (en) | Installation structure of semi-conductor apparatus, electro-optical apparatus and electronic apparatus | |
| US9148957B2 (en) | Electronic circuit substrate, display device, and wiring substrate | |
| US20090310314A1 (en) | Flexible Display Module and Method of Manufacturing the same | |
| CN1945398A (en) | Liquid crystal display panel and method for fabricating the same | |
| CN1570718A (en) | Method for joining chip and other devices to liquid crystal display panel and display device | |
| US7489382B2 (en) | Liquid crystal display module | |
| CN1753603A (en) | Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus | |
| CN1912698A (en) | Liquid crystal display and method of assembling the same | |
| CN1841720A (en) | Substrate of display device for packaging driving integrated circuit | |
| CN1683960A (en) | Display device and manufacturing method of the same | |
| CN1892371A (en) | Liquid crystal display device | |
| US20090197111A1 (en) | Method of producing electro-optical device and electro-optical device | |
| CN1955794A (en) | Liquid crystal display device | |
| CN1892331A (en) | Display panel and method of manufacture | |
| JP3025256B1 (en) | Mounting method of TCP film on display panel | |
| CN1184509C (en) | Liquid crystal display plate, liquid crystal device and manufacturing method, substrate connector | |
| US20230147166A1 (en) | Display device and method of manufacturing the same | |
| CN1716056A (en) | Plane display device | |
| CN1651991A (en) | System and method of manufacturing liquid crystal display | |
| US20100214519A1 (en) | Tape carrier package and liquid crystal display device having the same | |
| CN1374635A (en) | Electro-optical device and electronic apparatus | |
| CN1553263A (en) | Sealing structure of liquid-crystal displaying panel and producing process thereof | |
| CN1755465A (en) | Liquid crystal display device | |
| CN1273855C (en) | Liquid crystal device its mfg. method, and electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070711 Termination date: 20210527 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |