CN1544550A - Hot curing solder resistant printing-ink composition - Google Patents
Hot curing solder resistant printing-ink composition Download PDFInfo
- Publication number
- CN1544550A CN1544550A CNA2003101051638A CN200310105163A CN1544550A CN 1544550 A CN1544550 A CN 1544550A CN A2003101051638 A CNA2003101051638 A CN A2003101051638A CN 200310105163 A CN200310105163 A CN 200310105163A CN 1544550 A CN1544550 A CN 1544550A
- Authority
- CN
- China
- Prior art keywords
- ink composition
- solder mask
- mask ink
- ether
- thermosetting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates a hot-set solder resisting ink composition for production of printed circuit board which is prepared by combining some of heat hardening resin 30-70% (weight ratio), curing agent 2-8%, deflocculating agent 5-30% and filler 0-30%. The printed circuit board made from the hot-set solder resisting ink composition provided by the invention possesses good heat-proof quality, fast adherence, high degree of glossiness, and less odor.
Description
Affiliated technical field
The present invention relates to the technical field of printing circuit board, especially a kind of thermofixation solder mask ink composition.
Background technology
The electronic product development is swift and violent, the update of electric equipment products such as communication is also very fast, the development of these products has driven the development of circuit-board industry, circuit card by single face to two-sided, even multilayer, the product precision requirement is more and more higher, requires strict more to the printing ink of material, the especially use in printed circuit board of making circuit card.Problems such as there is poor heat resistance to some extent in existing in the market thermofixation welding resistance printing ink, and sticking power is low, and gloss is low, and smell is big.
Summary of the invention
The objective of the invention is to overcome the poor heat resistance that present existing thermofixation welding resistance printing ink exists, shortcoming such as sticking power is low, and gloss is low, and smell is big.Provide a kind of good heat resistance, adhere firmly, glossiness height, a kind of thermosetting welding resistance printing ink that smell is little.
The technical solution adopted for the present invention to solve the technical problems is: a kind of thermofixation solder mask ink composition, having made up some can cured thermosetting 30～70% (weight ratio) after heating, solidifying agent 2～8%, materials such as thinner 5～30% and filler 0～30%.Said components is at room temperature mixed by a certain percentage, and the back that stirs is milled to fineness≤10 μ m on three-roller, be adjusted to working viscosity with solvent at last, can obtain thermofixation welding resistance printing ink of the present invention.
Thermosetting resin among the present invention is selected Resins, epoxy for use, can be selected from bisphenol A type epoxy resin, phenol phenol aldehyde type epoxy resin, cresols phenol aldehyde type epoxy resin, bisphenol-s epoxy resin, polyol shrinkaging glycerin ether type Resins, epoxy, triglycidyl group isocyanuric acid ester and contain compound of epoxy group(ing) etc.Its consumption is 30～70%, and preferred amounts is 40～65%, and consumption must not be less than 30%, otherwise can influence film-forming properties, high thermal resistance, glossiness and the sticking power etc. of printing ink; If be higher than 70%, the printing ink viscosity increases, and influences printing performance.
Solidifying agent among the present invention is the compound that has the reactive group that can make the epoxide group solidified.Be selected from glyoxaline compound, Dyhard RU 100, trimeric cyanamide, BF3 complex compound, acid anhydrides etc.
Thinner among the present invention is 2～4 kinds that are selected from acetone, pimelinketone, benzene,toluene,xylene, ethylene glycol ethyl ether, butyl glycol ether, propylene glycol butyl ether, diethylene glycol ether, ethyl acetate, ethylene glycol ethyl ether ethyl acetate, the butyl glycol ether ethyl acetate equal solvent, can not be lower than 5%, otherwise the too high unfavorable construction of viscosity; Also can not be higher than 30%, otherwise exert an influence for the performance of ink film.
Filler among the present invention is 2～4 kinds that are selected from talcum powder, kaolin, wilkinite, lime carbonate, barium sulfate or the silica powder.Can not be too high or too low, too high meeting makes the unfavorable construction of printing ink thickness, and ink performance is exerted an influence, and hangs down excessively to make the printing ink became uneven even.
The invention has the beneficial effects as follows, by the printed circuit board good heat resistance that thermosetting welding resistance printing ink is made, adhere firmly, the glossiness height, smell is little, through pyroprocessing more than 260 ℃, the ink coating nondiscoloration, not explosion does not come off.
Embodiment
The present invention is further described below in conjunction with embodiment.
Method with ink printing circuit card of the present invention is as follows, and on printed circuit board, 120～150 ℃ were dried by the fire 30～40 minutes with 180 purpose silk screen processes, and the tin stove was invaded 30 seconds more than 260 ℃, the ink coating nondiscoloration, non-foaming, do not come off, again through 240 ℃ of wickings, 240 ℃ of hot blasts, blast 3kg/cm
2Handle, make printed circuit board.
Embodiment 1 prescription (quality %)
Thermosetting resin: bisphenol A epoxide resin 62
Thinner: butyl glycol ether 4.5
Pigment: phthalocyanine green 1.5
Filler: talcum powder 12
Barium sulfate 15
Solidifying agent: imidazoles 5
Said components is at room temperature mixed in proportion, after stirring, be milled to the green ink that fineness is 10 μ m on three-roller, viscosity is 4200cps/25 ℃.Gained printing ink has good performance, the printed circuit board good heat resistance of making, and adhere firmly, the glossiness height, smell is little, through pyroprocessing more than 260 ℃, the ink coating nondiscoloration, not explosion does not come off.
Embodiment 2 prescriptions (quality %)
Thermosetting resin: novolac epoxy 63
Thinner: Diethylene Glycol butyl ether 3.5
Pigment: phthalocyanine blue 1.5
Filler: talcum powder 12
Barium sulfate 15
Solidifying agent: imidazoles 5
Said components is at room temperature mixed in proportion, after stirring, be milled to the blue ink that fineness is 10 μ m on three-roller, viscosity is 4000cps/25 ℃.Gained printing ink has good performance, the printed circuit board good heat resistance of making, and adhere firmly, the glossiness height, smell is little, through pyroprocessing more than 260 ℃, the ink coating nondiscoloration, not explosion does not come off.
Embodiment 3 prescriptions (quality %)
Thermosetting resin: novolac epoxy 61
Thinner: butyl glycol ether 5
Pigment: carbon black 2
Filler: talcum powder 12
Barium sulfate 15
Solidifying agent: imidazoles 5
Said components is at room temperature mixed in proportion, and after stirring, the black ink viscosity that is milled to fineness and is 10 μ m on three-roller is 4600cps/25 ℃.Gained printing ink has good performance, the printed circuit board good heat resistance of making, and adhere firmly, the glossiness height, smell is little, through pyroprocessing more than 260 ℃, the ink coating nondiscoloration, not explosion does not come off.
Embodiment 4 prescriptions (quality %)
Thermosetting resin: novolac epoxy 53
Thinner: butyl glycol ether 15
Pigment: phthalocyanine green 1.5
Filler: talcum powder 10.5
Barium sulfate 15
Solidifying agent: imidazoles 5
Said components is at room temperature mixed in proportion, and after stirring, the green ink viscosity that is milled to fineness and is 10 μ m on three-roller is 3500cps/25 ℃.Gained printing ink has good performance, the printed circuit board good heat resistance of making, and adhere firmly, the glossiness height, smell is little, through pyroprocessing more than 260 ℃, the ink coating nondiscoloration, not explosion does not come off.
Embodiment 5 prescriptions (quality %)
Thermosetting resin: novolac epoxy 50
Thinner: ethylene glycol ethyl ether 10
Pimelinketone 6
Pigment: phthalocyanine green 1.5
Filler: talcum powder 12.5
Barium sulfate 15
Solidifying agent: imidazoles 5
Said components is at room temperature mixed in proportion, and after stirring, the look green oil China ink viscosity that is milled to fineness and is 10 μ m on three-roller is 3400cps/25 ℃.Gained printing ink has good performance, the printed circuit board good heat resistance of making, and adhere firmly, the glossiness height, smell is little, through pyroprocessing more than 260 ℃, the ink coating nondiscoloration, not explosion does not come off.
Comparative example 1: prescription (quality %)
Thermosetting resin: novolac epoxy 53
Thinner: butyl glycol ether 15
Pigment: phthalocyanine green 1.5
Filler: talcum powder 10.5
Barium sulfate 18
Solidifying agent: Dyhard RU 100 3
Said components is at room temperature mixed in proportion, and after stirring, the green ink viscosity that is milled to fineness and is 10 μ m on three-roller is 3300cps/25 ℃.Gained printing ink has good performance, the printed circuit board good heat resistance of making, and adhere firmly, the glossiness height, smell is little, through pyroprocessing more than 260 ℃, the ink coating nondiscoloration, not explosion does not come off.
Comparative example 2: prescription (quality %)
Thermosetting resin: bisphenol A epoxide resin 61
Thinner: butyl glycol ether 5
Pigment: phthalocyanine green 2
Filler: talcum powder 12
Barium sulfate 15
Solidifying agent: trimeric cyanamide 5
Said components is at room temperature mixed in proportion, and after stirring, the green ink viscosity that is milled to fineness and is 10 μ m on three-roller is 4200cps/25 ℃.Gained printing ink has good performance, the printed circuit board good heat resistance of making, and adhere firmly, the glossiness height, smell is little, through pyroprocessing more than 260 ℃, the ink coating nondiscoloration, not explosion does not come off.
Claims (6)
1, a kind of thermofixation solder mask ink composition is characterized in that, is made up of the weight percent of following each component: thermosetting resin 30～70%, solidifying agent 2～10%, thinner 5～30% and filler 0～30%.
2, a kind of thermosetting solder mask ink composition according to claim 1 is characterized in that described thermosetting resin is Resins, epoxy or the compound that a kind of end group contains epoxide function group.
3, according to claim 1 and 2 described a kind of thermofixation solder mask ink compositions, the weight percent that it is characterized in that described thermosetting resin is 40～65%.
4, a kind of thermosetting solder mask ink composition according to claim 1 is characterized in that described solidifying agent is the compound that has the reactive group that can make the epoxide group solidified, is selected from acid anhydrides, organic amine, imidazoles, Dyhard RU 100 etc. one or both.
5, a kind of thermosetting solder mask ink composition according to claim 1, it is characterized in that described thinner is to be selected from acetone, pimelinketone, ethylene glycol ethyl ether, butyl glycol ether, propylene glycol butyl ether, diethylene glycol ether, ethyl acetate, ethylene glycol ethyl ether ethyl acetate, in the butyl glycol ether ethyl acetate equal solvent 2～4 kinds.
6, a kind of thermosetting solder mask ink composition according to claim 1 is characterized in that described filler is to be selected from talcum powder, kaolin, wilkinite, lime carbonate, in barium sulfate or the silica powder 2～4 kinds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2003101051638A CN1544550A (en) | 2003-11-21 | 2003-11-21 | Hot curing solder resistant printing-ink composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2003101051638A CN1544550A (en) | 2003-11-21 | 2003-11-21 | Hot curing solder resistant printing-ink composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1544550A true CN1544550A (en) | 2004-11-10 |
Family
ID=34333647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2003101051638A Pending CN1544550A (en) | 2003-11-21 | 2003-11-21 | Hot curing solder resistant printing-ink composition |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1544550A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101560346B (en) * | 2009-05-11 | 2011-09-14 | 浙江金盾压力容器有限公司 | Printing ink composition used for spray painting of plastic sprayed gas cylinder |
| CN102286228A (en) * | 2011-06-20 | 2011-12-21 | 无锡广信感光科技有限公司 | Preparation method of high temperature resistant non-halogen fire resistant ultraviolet curing solder resist ink |
| CN102532996A (en) * | 2011-11-28 | 2012-07-04 | 东莞市群跃电子材料科技有限公司 | Flexible ink for white cover film of LED (Light Emitting Diode) soft light strip plate and preparation method of flexible ink |
| CN102643573A (en) * | 2012-04-21 | 2012-08-22 | 江门市阪桥电子材料有限公司 | Thermocuring character ink and preparation method thereof |
| CN102690612A (en) * | 2012-06-28 | 2012-09-26 | 东莞市群跃电子材料科技有限公司 | White insulation paper semi-solidified glue film structure for insulation bus and manufacturing method of white insulation paper semi-solidified glue film structure |
| CN102757692A (en) * | 2011-06-10 | 2012-10-31 | 戴龙飞 | Thermosetting system white ink composition of LED flexible strip plate |
| CN102863838A (en) * | 2012-09-29 | 2013-01-09 | 苏州安洁科技股份有限公司 | Black gland printing ink |
| CN103589225A (en) * | 2013-11-20 | 2014-02-19 | 苏州安洁科技股份有限公司 | Bluish violet ink for silk screen printing |
| CN106982517A (en) * | 2017-05-26 | 2017-07-25 | 东莞翔国光电科技有限公司 | A kind of method that use thermosetting ink prints PCB welding resisting layers |
| CN108410257A (en) * | 2018-03-15 | 2018-08-17 | 广州市红太电子科技有限公司 | White text ink, printed circuit board and preparation method thereof |
| CN110105867A (en) * | 2019-04-20 | 2019-08-09 | 无锡天杨电子有限公司 | A kind of formula and preparation method thereof of ceramic copper-clad plate high-temperature resistant welding resistance |
| CN110643218A (en) * | 2019-09-05 | 2020-01-03 | 江门市阪桥电子材料有限公司 | Gold immersion resistant and color-invariant thermosetting white character material and preparation method thereof |
| CN113025117A (en) * | 2020-08-20 | 2021-06-25 | 深圳市百柔新材料技术有限公司 | Solder resist ink, preparation method and use method thereof, and printed circuit board |
| CN115304955A (en) * | 2022-08-25 | 2022-11-08 | 佛山市西伦化工有限公司 | Thermosetting solder mask ink and preparation method thereof |
-
2003
- 2003-11-21 CN CNA2003101051638A patent/CN1544550A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101560346B (en) * | 2009-05-11 | 2011-09-14 | 浙江金盾压力容器有限公司 | Printing ink composition used for spray painting of plastic sprayed gas cylinder |
| CN102757692B (en) * | 2011-06-10 | 2014-11-12 | 戴龙飞 | Thermosetting system white ink composition of LED flexible strip plate |
| CN102757692A (en) * | 2011-06-10 | 2012-10-31 | 戴龙飞 | Thermosetting system white ink composition of LED flexible strip plate |
| CN102286228A (en) * | 2011-06-20 | 2011-12-21 | 无锡广信感光科技有限公司 | Preparation method of high temperature resistant non-halogen fire resistant ultraviolet curing solder resist ink |
| CN102532996A (en) * | 2011-11-28 | 2012-07-04 | 东莞市群跃电子材料科技有限公司 | Flexible ink for white cover film of LED (Light Emitting Diode) soft light strip plate and preparation method of flexible ink |
| CN102532996B (en) * | 2011-11-28 | 2014-02-19 | 芜湖群跃电子科技有限公司 | Flexible ink for white cover film of LED (Light Emitting Diode) soft light strip plate and preparation method of flexible ink |
| CN102643573A (en) * | 2012-04-21 | 2012-08-22 | 江门市阪桥电子材料有限公司 | Thermocuring character ink and preparation method thereof |
| CN102690612A (en) * | 2012-06-28 | 2012-09-26 | 东莞市群跃电子材料科技有限公司 | White insulation paper semi-solidified glue film structure for insulation bus and manufacturing method of white insulation paper semi-solidified glue film structure |
| CN102863838A (en) * | 2012-09-29 | 2013-01-09 | 苏州安洁科技股份有限公司 | Black gland printing ink |
| CN103589225A (en) * | 2013-11-20 | 2014-02-19 | 苏州安洁科技股份有限公司 | Bluish violet ink for silk screen printing |
| CN106982517A (en) * | 2017-05-26 | 2017-07-25 | 东莞翔国光电科技有限公司 | A kind of method that use thermosetting ink prints PCB welding resisting layers |
| CN108410257A (en) * | 2018-03-15 | 2018-08-17 | 广州市红太电子科技有限公司 | White text ink, printed circuit board and preparation method thereof |
| CN108410257B (en) * | 2018-03-15 | 2021-04-13 | 广州市红太电子科技有限公司 | White character printing ink, printed circuit board and preparation method thereof |
| CN110105867A (en) * | 2019-04-20 | 2019-08-09 | 无锡天杨电子有限公司 | A kind of formula and preparation method thereof of ceramic copper-clad plate high-temperature resistant welding resistance |
| CN110643218A (en) * | 2019-09-05 | 2020-01-03 | 江门市阪桥电子材料有限公司 | Gold immersion resistant and color-invariant thermosetting white character material and preparation method thereof |
| CN113025117A (en) * | 2020-08-20 | 2021-06-25 | 深圳市百柔新材料技术有限公司 | Solder resist ink, preparation method and use method thereof, and printed circuit board |
| CN115304955A (en) * | 2022-08-25 | 2022-11-08 | 佛山市西伦化工有限公司 | Thermosetting solder mask ink and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1544550A (en) | Hot curing solder resistant printing-ink composition | |
| TWI541286B (en) | A white thermosetting resin composition, and a printed circuit board having the cured product or a reflective plate for a light-emitting element | |
| CN104974594B (en) | The ink composite of a kind of water-soluble solvent, its application and printed circuit board (PCB) | |
| CN103515025B (en) | A kind of low temperature curing type conductive photoreceptor slurry and the method with its making conducting wire | |
| JP4864545B2 (en) | Thermosetting solder resist composition for flexible substrate, flexible substrate and method for producing flexible substrate | |
| CN101974205A (en) | Resin composition for embedded capacitor, and dielectric layer and metal foil-clad plate manufactured by using same | |
| CN1170908C (en) | Interlamellar insulation adhesive using for multilayer printed circuit board | |
| CN107674491B (en) | A kind of white photosensitive solder resist ink and preparation method thereof | |
| CN101003690B (en) | Heat radiation insulation resin composition and printing circuit board using same | |
| KR101397221B1 (en) | Insulation resin composition for printed circuit board having thermal conductivity and improved electrical properties, insulating film, prepreg and printed circuit board | |
| KR102002881B1 (en) | Ink jet for resin composition and printed wiring board manufactured using the same | |
| CN104364290A (en) | Curable resin composition, resin composition, resin sheet formed by using said curable resin composition and resin composition, and hardener for said curable resin composition and resin composition | |
| CN101046629A (en) | Solidifying resin composition and condensate thereof | |
| CN104610709A (en) | High-Tg (glass transition temperature) high-thermal-dissipation aluminum-based CCL (copper-clad plate) used for automobile engine radiator | |
| JP2022180564A (en) | Thermosetting sheet, and method of producing cured sheet | |
| CN101238760A (en) | Insulating curable composition, cured product thereof, and printed wiring board using same | |
| CN109181234A (en) | A kind of high thermal conductivity high tenacity resin combination and its application | |
| CN1693387A (en) | Liquid photosensitive welding resistant printing ink and its circuit board | |
| CN1262576C (en) | Resin composition | |
| CN111269611A (en) | Photo-curing and thermosetting composition and application thereof | |
| CN104072946A (en) | Thermosetting resin composition and printed circuit board filled with the resin composition | |
| CN1664701A (en) | Photosensitive glue for high resolution factor cylinder platemaking | |
| JP2006306007A (en) | Metal clad laminate and printed-wiring board | |
| CN1697858A (en) | Photo-curable and thermosetting resin composition | |
| CN109679402B (en) | Hole plugging ink composition special for hole plugging and filling and printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |