CN1544501A - Method for removing inorganic chloride from epoxy resin - Google Patents
Method for removing inorganic chloride from epoxy resin Download PDFInfo
- Publication number
- CN1544501A CN1544501A CNA2003101064303A CN200310106430A CN1544501A CN 1544501 A CN1544501 A CN 1544501A CN A2003101064303 A CNA2003101064303 A CN A2003101064303A CN 200310106430 A CN200310106430 A CN 200310106430A CN 1544501 A CN1544501 A CN 1544501A
- Authority
- CN
- China
- Prior art keywords
- epoxy
- resins
- epoxy resin
- inorganic
- butter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 37
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 21
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 21
- 229910001504 inorganic chloride Inorganic materials 0.000 title abstract description 9
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000460 chlorine Substances 0.000 claims abstract description 15
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 15
- 239000012528 membrane Substances 0.000 claims abstract description 15
- 239000003960 organic solvent Substances 0.000 claims abstract description 10
- 239000000706 filtrate Substances 0.000 claims abstract description 9
- 239000013078 crystal Substances 0.000 claims abstract description 8
- 238000004821 distillation Methods 0.000 claims abstract description 5
- 239000004593 Epoxy Substances 0.000 claims description 38
- 229920005989 resin Polymers 0.000 claims description 38
- 239000011347 resin Substances 0.000 claims description 38
- 235000014121 butter Nutrition 0.000 claims description 18
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 8
- 239000000047 product Substances 0.000 claims description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 6
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims description 6
- 229940043265 methyl isobutyl ketone Drugs 0.000 claims description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 4
- 150000002576 ketones Chemical class 0.000 claims description 4
- 238000006298 dechlorination reaction Methods 0.000 claims description 3
- 239000012452 mother liquor Substances 0.000 claims description 3
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 2
- 239000003849 aromatic solvent Substances 0.000 claims description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 2
- 239000012982 microporous membrane Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 239000008096 xylene Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 6
- 238000000926 separation method Methods 0.000 abstract description 5
- 239000002245 particle Substances 0.000 abstract 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 150000001805 chlorine compounds Chemical class 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 abstract 1
- 238000009295 crossflow filtration Methods 0.000 abstract 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 6
- 238000005406 washing Methods 0.000 description 5
- -1 aliphatic hydroxyl compound Chemical class 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000018044 dehydration Effects 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- 238000005374 membrane filtration Methods 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- 239000011780 sodium chloride Substances 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 238000003556 assay Methods 0.000 description 2
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- MOBNLCPBAMKACS-UHFFFAOYSA-N 2-(1-chloroethyl)oxirane Chemical compound CC(Cl)C1CO1 MOBNLCPBAMKACS-UHFFFAOYSA-N 0.000 description 1
- LRWZZZWJMFNZIK-UHFFFAOYSA-N 2-chloro-3-methyloxirane Chemical group CC1OC1Cl LRWZZZWJMFNZIK-UHFFFAOYSA-N 0.000 description 1
- 241000370738 Chlorion Species 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000012296 anti-solvent Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010612 desalination reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 235000019197 fats Nutrition 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
Landscapes
- Separation Using Semi-Permeable Membranes (AREA)
Abstract
The invention relates to a method for removing inorganic chloride from epoxy resin, which is characterized by comprising the following steps: dehydrating the synthesized epoxy resin by reduced pressure distillation to separate out inorganic chloride crystal particles; adding anhydrous epoxy resin containing chloride crystal particles into an organic solvent to prepare an anhydrous solution containing 10-75% (w/w) of epoxy resin, adopting a porous inorganic membrane cross-flow filtration method to repeatedly circulate the materials through an inorganic membrane separation device under the action of a pump, collecting filtrate, and removing the organic solvent from the collected filtrate by a conventional method to obtain the dechlorinated epoxy resin. The method adopts a process of combining crystal growth of inorganic chlorine compounds with inorganic membrane separation to remove inorganic chlorine in the epoxy resin. The method has the advantages of simple operation, low cost and high separation efficiency, and the obtained epoxy resin has the inorganic chlorine content reduced to below 1ppm and can ensure safety and reliability when used as an adhesive for electronic components.
Description
(technical field)
The present invention relates to the method that a kind of Resins, epoxy takes off butter, particularly remove the method for the butter in the Resins, epoxy with membrane filtration technique.
(background technology)
Resins, epoxy is since 20th century, the forties came out, and its product type and structure, application prescription and forming method have presented diversity and handiness, and demand grows steadily.Nearly recent decades, along with the develop rapidly of electronic industry, the demand of Resins, epoxy in electronic product production also is fast rise trend.The raw material monomer that can import epoxy group(ing) in the Resins, epoxy building-up process mainly is epoxy chloropropane, methyl epichlorohydrin etc., forms by products such as organic and inorganic chloride in the reaction, and residues in the finished product Resins, epoxy.The existence of inorganic chloride (as NaCl etc.) can influence the insulating property of electronic devices and components, even can cause serious consequence.Therefore the Resins, epoxy that is used for electronic applications must the strict content of controlling butter.
At present, Resins, epoxy goes inorganic chloride to adopt WATER-WASHING METHOD more, promptly utilize the water-soluble characteristic of butter, deionized water is added Resins, epoxy, make butter wherein be dissolved in water, separate to remove then and anhydrate, so repetitive scrubbing with separate, content of inorganic chlorine in epoxy resin is reduced gradually.This washing methods water resources consumption amount is big, efficient is low, the production cycle is long.Resins, epoxy and solvent lose with current in the sepn process, and not only yield reduces, and causes environmental pollution.And after chlorion dropped to certain degree, it was very little to continue washing effect, and the washing cost is higher, and efficient is lower, generally is difficult to reach requirement.
(summary of the invention)
It is simple to the purpose of this invention is to provide a kind of technology, the efficient height, and cost is low, and the Resins, epoxy of without sewage discharge takes off the novel method of butter.
The present invention removes that the method for butter may further comprise the steps in the Resins, epoxy: synthetic epoxy resin is removed moisture content by underpressure distillation, butter wherein is crystal fine grain and separates out, the anhydrous Resins, epoxy that will contain the muriate particulate drops into hopper, add organic solvent, be made into the anhydrous solution that contains Resins, epoxy 10%～75% (w/w), pressurize by pump, constantly circulate in the loop that the Resins, epoxy anhydrous solution is linked to be between hopper and inorganic micro-pore-film filtration device, material is passing through in the process of film device continuously, by the inorganic porous membrane cross flow filter, the liquid phase material constantly sees through fenestra from seeing through effluent and go out and be collected, until the termination of pumping to a certain degree time of recycle stock enrichment; The liquid of collecting that sees through is removed organic solvent with ordinary method, must contain the Resins, epoxy of content of inorganic chlorine less than 1ppm.After separate finishing, the Resins, epoxy mother liquor of staying the enrichment inorganic chloride in the hopper can be incorporated into and waits to take off in the synthetic epoxy resin of inorganic chlorine, participates in the dechlorination process process of next round.
Above inorganic microporous membrane can be that the aperture is ceramic membrane or the stainless steel membrane of 30nm～2000nm.
The temperature of said recycle stock is at 10 ℃～130 ℃.
Said organic solvent can be a kind of in benzene,toluene,xylene or other aromatic solvent, acetone, pimelinketone, methyl iso-butyl ketone (MIBK), other ketones solvent, also can be the mixture of above aromatic hydrocarbons and ketones solvent.
Also can add solubility promoter aliphatic hydroxyl compound in the above-mentioned solvent, as polyoxyethylene glycol etc.
Above temperature of charge and solvent species can suitably be selected according to the raw material and the type of synthetic epoxy resin.
The operating pressure of said product pump is 0.2MPa～0.5MPa.
Present method combines the crystal growth technique of inorganic chloride with the mineral membrane separating technology, utilize inorganic chloride to be insoluble to organic solvent and separate out the crystalline characteristic, utilize excellent properties such as the anti-solvent of mineral membrane, heatproof, reach the purpose that removes inorganic chlorine in the Resins, epoxy.Compare with traditional WATER-WASHING METHOD, in present method, material carries out solid-liquid separation automatically in circulating continuously, simple to operate, need not the water resources of consume valuable, cost is low, main is the separation efficiency height, and the content of inorganic chlorine can be reduced to below the 1ppm in the Resins, epoxy that obtains, far below the 10ppm content of microelectronic industry standard code, as the caking agent of electronic devices and components, can guarantee safe and reliable.
(description of drawings)
Accompanying drawing is a process flow diagram of the present invention.This block representation is mixed with anhydrous solution after the dehydration of synthesizing epoxy fat, filters through the mineral membrane tripping device, gets filtrate desalination Resins, epoxy, and the rich salt epoxy resin mother liquor that does not leach is incorporated in the synthetic epoxy resin, participates in next round and separates.
(embodiment)
Embodiment 1 E20 bisphenol A type epoxy resin solution removes inorganic chlorine
Get E20 bisphenol A type epoxy resin synthetic product solution 70Kg, sodium chloride-containing 900ppm; The underpressure distillation dehydration, along with steaming of moisture content, butter wherein is crystal fine grain and separates out; The anhydrous Resins, epoxy that will contain the muriate particulate drops into hopper, adds organic solvent toluene and methyl iso-butyl ketone (MIBK), is mixed with to contain the anhydrous solution that Resins, epoxy is 60% (w/w), and adopting membrane pore size down at 70 ℃～75 ℃ is 100nm, and membrane area is 0.1m
2The ceramic filter membrane filtration, the control pump working pressure is 0.2MPa～0.3MPa, the filtration and infiltration flow rate is 110L/ (hrm
2)～140L/ (hrm
2), the continuous circular flow 10hr of material collects filtrate.Get this filtrate, recording content of inorganic chlorine by GB4613 (Resins, epoxy and glycidyl ester inorganic chlorine assay method) is 0.4ppm.
Embodiment 2 o-cresol formaldehyde epoxy resin solution remove inorganic chlorine
Get o-cresol formaldehyde epoxy resin synthetic product solution 70Kg, sodium chloride-containing 1200ppm; After the underpressure distillation dehydration, add organic solvent dimethylbenzene, be mixed with and contain the anhydrous solution that the epoxidation resin is 60% (w/w), adopting membrane pore size down at 75 ℃～80 ℃ is 200nm, and membrane area is 0.1m
2The ceramic filter membrane filtration, pump operated pressure is 0.2MPa～0.3MPa, the filtration and infiltration flow rate is 110L/ (hrm
2)～150L/ (hrm
2), the continuous circular flow 10hr of material collects filtrate.Get this filtrate, recording content of inorganic chlorine by GB4613 (Resins, epoxy and glycidyl ester inorganic chlorine assay method) is 0.5ppm.
From above enforcement worker example as seen, after the processing of the inventive method salt, content of inorganic chlorine in epoxy resin only is 0.4～0.5ppm, far below the 10ppm content of microelectronic industry standard code.
Claims (7)
1. Resins, epoxy takes off the method for butter, it is characterized in that may further comprise the steps: synthetic epoxy resin is dewatered by underpressure distillation, separate out butter crystal fine grain wherein; The anhydrous Resins, epoxy that will contain the muriate crystal fine grain drops into hopper, be made into the anhydrous solution that contains Resins, epoxy 10%～75% (w/w), add at pump and to depress, make the constantly circulation between hopper and inorganic micro-pore-film filtration device of Resins, epoxy anhydrous solution, cross flow filter, collect filtrate, the filtrate of collecting is removed organic solvent with ordinary method, get Resins, epoxy.
2. take off the method for butter according to the Resins, epoxy of claim 1, it is characterized in that said inorganic microporous membrane can be that the aperture is ceramic membrane or the stainless steel membrane of 30nm～2000nm.
3. take off the method for butter according to the Resins, epoxy of claim 2, the temperature that it is characterized in that said recycle stock is in 10 ℃～130 ℃ scopes.
4. take off the method for butter according to the Resins, epoxy of claim 3, it is characterized in that said organic solvent can be a kind of in benzene,toluene,xylene or other aromatic solvent, acetone, pimelinketone, methyl iso-butyl ketone (MIBK), other ketones solvent, also can be the mixture of above aromatic hydrocarbons and ketones solvent.
5. take off the method for butter according to the Resins, epoxy of claim 4, it is characterized in that also can adding solubility promoter in the above-mentioned solvent.
6. the method for taking off butter according to the Resins, epoxy of claim 1 or 2 or 3 or 4 or 5, the operating pressure that it is characterized in that said product pump is 0.2MPa～0.5MPa.
7. take off the method for butter according to the Resins, epoxy of claim 7, after it is characterized in that separating end, stay the Resins, epoxy mother liquor of the enrichment inorganic chlorine in the hopper and incorporate in the synthetic epoxy resin for the treatment of dechlorination, participate in the dechlorination process process of next round.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200310106430.3A CN1211412C (en) | 2003-11-26 | 2003-11-26 | Method for removing inorganic chloride from epoxy resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200310106430.3A CN1211412C (en) | 2003-11-26 | 2003-11-26 | Method for removing inorganic chloride from epoxy resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1544501A true CN1544501A (en) | 2004-11-10 |
| CN1211412C CN1211412C (en) | 2005-07-20 |
Family
ID=34334160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200310106430.3A Expired - Lifetime CN1211412C (en) | 2003-11-26 | 2003-11-26 | Method for removing inorganic chloride from epoxy resin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1211412C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106939086A (en) * | 2017-04-26 | 2017-07-11 | 江苏扬农锦湖化工有限公司 | A kind of purification process of aged resin |
| CN112423866A (en) * | 2018-04-30 | 2021-02-26 | 瀚森公司 | Purification of high performance epoxy resins via membrane filtration techniques |
-
2003
- 2003-11-26 CN CN200310106430.3A patent/CN1211412C/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106939086A (en) * | 2017-04-26 | 2017-07-11 | 江苏扬农锦湖化工有限公司 | A kind of purification process of aged resin |
| CN106939086B (en) * | 2017-04-26 | 2019-09-13 | 江苏扬农锦湖化工有限公司 | A kind of purification process of aged resin |
| CN112423866A (en) * | 2018-04-30 | 2021-02-26 | 瀚森公司 | Purification of high performance epoxy resins via membrane filtration techniques |
| CN112423866B (en) * | 2018-04-30 | 2023-12-22 | 西湖环氧树脂公司 | Purification of high performance epoxy resins via membrane filtration techniques |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1211412C (en) | 2005-07-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: NANJING JIUSI HIGH-TECH Co.,Ltd. Assignor: Nanjing Tech University Contract fulfillment period: 2007.7.1 to 2017.7.1 Contract record no.: 2008320000317 Denomination of invention: Method for removing inorganic chloride from epoxy resin Granted publication date: 20050720 License type: Exclusive license Record date: 20080924 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2007.7.1 TO 2017.7.1 Name of requester: NANJING JIUSI HIGH-TECH CO., LTD. Effective date: 20080924 |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20050720 |