CN1524402A

CN1524402A - Shield for high-frequency transmitter/receiver systems of electronic devices, especially of devices for wireless telecommunication

Info

Publication number: CN1524402A
Application number: CNA028069188A
Authority: CN
Inventors: v; V·德特林; G·布施
Original assignee: Siemens AG
Current assignee: Siemens AG
Priority date: 2001-03-22
Filing date: 2002-03-21
Publication date: 2004-08-25
Also published as: EP1371145A2; US20050003789A1; WO2002078201A2; WO2002078201A3

Abstract

The invention relates to a shield for high-frequency transmitter/receiver systems of electronic devices, especially of devices for wireless telecommunication. In order to reduce the space requirements of such a high-frequency transmitter/receiver system (2') on a circuit support element (1') of an electronic device, a first partial circuit (20') of the high-frequency transmitter/receiver system (2') and a second partial circuit (21') of the high-frequency transmitter/receiver system (2') are disposed in a single shield chamber (32) in a substantially separate especially locally/partially separate manner. The shield chamber (32) is linked with a grounded area (10') on the support element (1') via an electroconducting connection (320) and the connecting element (320) is interposed between the two partial circuits (20', 21') on the support element (1') in such a way that the twp partial circuits (20', 21') on the support element (1') in such a way that the two partial (20', 21') do not interfere with each other functionally.

Description

The shielding of the high-frequency emission/receiving system of electronic equipment, especially Wireless Telecom Equipment

The electronic equipment that is used for radio communication, for example abide by the cordless telephone of DECT (digital European cordless telecommunications) standard or abide by mobile wireless portable equipment of GSM (mobile expert group or global system for mobile communications) standard or the like, they also have high-frequency emission/receiving system except being used for the low frequency base band is carried out the circuit of signal processing.In the manufacturing step of a large amount of processing and mounting technology, these circuit or device are arranged on a carrier element usually, are on the so-called printed circuit board (PCB).Recently in the miniaturization process of electronic equipment, adopt film, to substitute described printed circuit board (PCB) as carrier element morely.

The prior art is shown in Figure 1.Wherein:

Fig. 1 has illustrated the structure that is positioned at a high-frequency emission/receiving system on the carrier element that comprises two shielded enclosures with the perspective schematic diagram.

Carrier element 1 shown in Figure 1 has a ground plane 10, has arranged at this ground plane A high-frequency emission/receiving system 2, this device 2 and the gold that is arranged in equally on the carrier element 1 Belonging to silk antenna 3 is connected. High-frequency emission/receiving system 2 has two

sub-circuits

20,21, Namely first electronic circuit 20 with emission power amplifier 200 for example and one have example Such as second electronic circuit 21 of oscillator 210 and synthesizer 211, this two sub-circuits is at certain sky Between may be in the mutual interference of high-frequency region phase when arranging, but its function separately is not allow to be done Disturb. Equally also need to avoid the impact of environment and interference on every side. This situation is in Fig. 1 Represent briefly by arrow. The double-head arrow of horizontal and vertical has represented from electronic circuit 20 With 21 that set out and act on the electromagnetic field of

electronic circuit

20 and 21. Thisly spatially show The arrow that goes out has represented 20 pairs of second electronic circuits 21 of first electronic circuit and reciprocal crosstalking now Resemble. What remaining arrow represented is balanced balanced current to have occurred in carrier element 1 and screened room. In other words, this equipment must satisfy the requirement of inside and outside electromagnetic compatibility (EMV).

In order to realize this point, be positioned at high-frequency emission/receiving system 2 on the carrier element 1

Electronic circuit

20,21 is so sealed by at least two screened rooms 30,31, so that each Electronic circuit is shielded fully, also namely is the high frequency sealing to a certain extent. At this, first screen Cover chamber 30 and be used as the individual screen of first electronic circuit 20, and 31 quilts in secondary shielding chamber Be used as the shielding of second electronic circuit 21. According to the prior art,

electronic circuit

20,21 it Between be provided with two coherent, as to be used for stoping interference effect dividing walls.

The present invention based on task be that the high-frequency emission/receiving system that is positioned at for shielding on the circuit carrier element of electronic equipment, especially Wireless Telecom Equipment reduces the position requirement.

This task solves by the feature of claim 1.

Idea behind the present invention is, on the circuit carrier element of described electronic equipment, under single shielded enclosure, especially on position/space, substantially arrange first electronic circuit of described high-frequency emission/receiving system and second electronic circuit of described high-frequency emission/receiving system with being spaced from each other; Described shielded enclosure links to each other with ground plane on being positioned at described carrier element by the Connection Element of a conduction; And described Connection Element is disposed between described two electronic circuits on the described carrier element, makes described two electronic circuits not disturb mutually on its function.

Owing on the circuit carrier element, saved the position, so electronic equipment that can be littler for example with high-frequency emission/receiving system than present realization for the secondary shielding chamber.For the electronic equipment that is used for radio communication, this means that this equipment for example can be integrated among the clock and watch.

Preferred improvement project is provided by dependent claims.

Tell about embodiments of the invention from Fig. 1 by Fig. 2 and 3 below.Wherein:

Fig. 2 illustrates with Perspective Principles from Fig. 1 and is positioned at one and has single screened room The structure of the high-frequency emission/receiving system on the carrier element.

Fig. 3 show Fig. 2 along hatching A ... the sectional view of A '.

Fig. 2 has described a carrier element 1 ' with ground plane 10 ' from Fig. 1, has arranged high-frequency emission/receiving system 2 ' on this ground plane, and this device 2 ' is connected with the wire antenna 3 ' that is disposed in equally on the carrier element 1 '.High-frequency emission/receiving system 2 ' includes two electronic circuits 20 ', 21 ', promptly first electronic circuit 20 ' with emission power amplifier 200 ' for example and one have such as second electronic circuit 21 ' of oscillator 210 ' and synthesizer 211 ', these two electronic circuits in certain space/also may be during location arrangements in the mutual interference of high-frequency region phase, but its function separately be do not allow disturbed.Equally also to avoid the influence of environment and interference on every side.This situation is also represented by arrow in Fig. 2 briefly.Vertical double-head arrow has been represented from electromagnetic field electronic circuit 20 ' and 21 ' and that act on electronic circuit 20 ' and 21 '.This arrow that spatially illustrates has represented that first electronic circuit 20 ' is to second electronic circuit 21 ' and reciprocal crosstalk phenomenon.What remaining arrow was represented among Fig. 3 is balanced balanced current to have occurred in carrier element 1 ' and shielded enclosure.In other words, this equipment also must satisfy the requirement of inside and outside electromagnetic compatibility (EMV).

In order to realize this point, different with scheme shown in Figure 1 is, the electronic circuit 20 ', 21 ' that is positioned at the high-frequency emission/receiving system 2 ' on the carrier element 1 ' is so sealed by single shielded enclosure 32, making that each electronic circuit is shielded fully, also promptly is the high frequency sealing to a certain extent.Since two electronic circuits 20 ', 21 ' all fully conductively-closed chamber 32 seal, promptly do not resemble the prior art of Fig. 1 between electronic circuit 20 ', 21 ' yet and have the dividing wall that links up, and described shielded enclosure 32 has stoped mutual interference effect-especially above-mentioned the crosstalking between the electronic circuit 20 ', 21 ', so, must improve shielded enclosure 32 further and/or optimize the layout that is positioned at the electronic circuit under the shielded enclosure further, make described interference effect can not occur or suppress this interference effect at least fully.

For this reason, Fig. 2 links to each other with the Connection Element 320 of a conduction with the shielded enclosure 32 shown in 3, this Connection Element 320 is a device, a spring preferably, or a domeshape, use the structure made from shielded enclosure 32 identical materials (being preferably packfong).At offside, this Connection Element 320 is connected with ground plane 10 ' on the carrier element 1 '.Cover plate from shielded enclosure 32 forms a kind of conduction connection to ground plane 10 ' thus.Emission power amplifier 200 ' the needed electric current is derived by this connection (tap).The electric current of emission power amplifier 200 ' separates by this connection and oscillator 210 ' and synthesizer 211 '.

For this reason, Connection Element 320 so is arranged between the interactional electronic circuit of on the carrier element 1 ' two 20 ', 21 ', makes these two electronic circuits 20 ', 21 ' its function that is independent of each other mutually.By this layout, identical shielding action when utilizing Connection Element 320 can realize adopting at least one divider wall basically with prior art.Thereby Connection Element 320 is two electronic circuits 20 ', 21 ' has formed a kind of imaginary divider wall, its prerequisite is, described two electronic circuits basically, especially on the carrier element 1 ' that is arranged under the shielded enclosure 320 with being spaced from each other on space/position.

In other words, although described imaginary divider wall is arranged, electronic circuit 20 ', 21 ' also should be preferably direct neighbor not, also promptly do not arrange abreast-as Fig. 3 briefly shown in.

Claims

1. the shielding of the high-frequency emission/receiving system of electronic equipment, especially Wireless Telecom Equipment has following feature:

(a) on the circuit carrier element (1 ') of described electronic equipment, under single shielded enclosure (32), especially on position/space, substantially arrange first electronic circuit (20 ') of described high-frequency emission/receiving system (2 ') and second electronic circuit (21 ') of described high-frequency emission/receiving system (2 ') with being spaced from each other

(b) described shielded enclosure (32) links to each other with ground plane (10 ') on being positioned at described carrier element (1 ') by the Connection Element (320) of a conduction,

(c) described Connection Element (320) is disposed between described two electronic circuits (20 ', 21 ') on the described carrier element (1 '), makes described two electronic circuits (20 ', 21 ') not disturb mutually on its function.

2. by the shielding of claim 1, wherein said Connection Element (320) is an electronic device that can be mounted to together with the device of described electronic circuit (20 ', 21 ') on the described carrier element (1 ').

3. by the shielding of claim 1, wherein said Connection Element (320) is a spring.

4. by the shielding of claim 1, wherein said Connection Element (320) is the structure of a domeshape.

5. by the shielding of claim 1 or 4, wherein said Connection Element (320) and described shielded enclosure (32) are made by identical materials.

6. by the shielding of claim 5, wherein said material is low resistive.

7. by the shielding of claim 5 or 6, wherein said material is a packfong.