CN1508857A - Method for manufacturing electronic device and electronic device - Google Patents
Method for manufacturing electronic device and electronic device Download PDFInfo
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- CN1508857A CN1508857A CNA2003101201885A CN200310120188A CN1508857A CN 1508857 A CN1508857 A CN 1508857A CN A2003101201885 A CNA2003101201885 A CN A2003101201885A CN 200310120188 A CN200310120188 A CN 200310120188A CN 1508857 A CN1508857 A CN 1508857A
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Provided is a method for producing an electronic component which prevents the corrosion caused by the exposure of the cut surface of a metal component and the falling-off of a solder plating in a solder welding part and eliminates such a trouble that the unnecessary part of a metal component is protruded to the outside of the electronic component being a product, and the electronic component excellent in performance. During a process for the mold-clamping molding of the electronic component 20, the mold clamping force for closing a mold 10 comprising a lower mold 10A and an upper mold 10B is used to cut off each metal component 3 in the mold 10, if required, a part of the metal component 3 is deformed into a prescribed shape, the cut surface or the part, where solder plating is peeled off, of each metal component 3 arranged in the mold 20 in a prescribed form at a prescribed position is coated with a molding resin material 22, and each metal component 3 is sealed in the electronic component 20.
Description
Technical field
The present invention relates to by all or part of of metal partss such as metallic circuit metal connection end assembling metal is encapsulated in the manufacture method and the electronic device of the electronic device that constitutes in the resin.
Background technology
As the various metal partss of manufacture method handlebar that encapsulated metal parts such as a plurality of metallic circuit metal connection ends assembling metals make as individual component and by be provided in assigned position in the metal die by hand, then by these metal partss of injected plastic resin-encapsulated and the method for global formation.
But in the manufacture method of such electronic device, the number that is provided in the metal parts in the metal die with individuality increases, and, the trouble that becomes of the work that sets in the metal die, equipping position is usually incorrect.
So, in recent years, by use the connecting portion formed by metal fine whole connect a plurality of metal partss and make the terminal of required form and this 1 terminal is provided in the pair of metal mould of being made up of lower mold and upper mold solve the problems referred to above that cause because of component count more.
Under the situation of using such terminal manufacturing electronic device, in operation by means of the processing and forming of resin-encapsulated metal parts, by means of being provided in the connecting portion that cutting punch on the above-mentioned upper mold cuts off the above-mentioned a plurality of metal partss of connection be provided in the terminal on the above-mentioned lower mold, make each metal parts separate.
Also have, also can in other operation, carry out last cut-out separation after the processing and forming according to the shape or the purposes of above-mentioned terminal to above-mentioned a plurality of metal partss.
[patent documentation 1]
Te Kaiping 7-108543 communique
(problem that invention will solve)
But, according to said method, the section that is cut the metal parts of drift cut-out is keeping exposed state, perhaps, under the situation of the scolding tin weld part that cuts off metal parts, the scolding tin that is welded in above-mentioned scolding tin weld part might come off because of the punching press of above-mentioned cutting punch.So may have such problem: the part that the section of exposure or scolding tin have come off becomes and corrodes easily.
Also have, if in the final cutting that metal parts is separated from terminal, although unwanted as electronic device then, the connecting portion that is connecting terminal and this metal parts also can be kept to stretch out the outer state of this electronic device, might hinder the installation of this electronic device.
Also have, the adjacent outer lead end that sets etc. is cut off under the situation of separating from above-mentioned connecting portion, the scolding tin that comes off might be connected across between the adjacent terminals, becomes the reason that produces short circuit.
Also have, as mentioned above, poor because of the wettability of scolding tin, the weld part that scolding tin has come off has such problem, and promptly the conduction bonding strength of this electronic device is poor.
Summary of the invention
So, the objective of the invention is to: provide the exposure of the section that can prevent to come from metal parts or burn into that the scolding tin on the scolding tin weld part comes off can eliminate manufacture method and the good electronic device of performance quality that unwanted part because of metal parts reaches the electronic device of the trouble of bringing as the outside of the electronic device of product simultaneously.
(means of dealing with problems)
In order to achieve the above object, the manufacture method of electronic device of the present invention is characterized in that: in the matched moulds operation when having used the pair of metal mould of being made up of lower mold and upper mold to carry out the matched moulds moulding, be encapsulated in terminal that a plurality of metal partss in the electronic device connect as one and aiming at and be provided in the pair of metal mould of forming by lower mold and upper mold making by the connecting portion of forming by metal material, when carrying out matched moulds, cut off above-mentioned connecting portion above-mentioned each metal parts is separated by means of the cutting punch that is provided on the above-mentioned upper mold with the cutting position correspondence of above-mentioned connecting portion, simultaneously with the above-mentioned cutting punch above-mentioned metal parts that further pushing is separated, and make a part of deformation established practice setting shape of this each metal parts as required or this each metal parts is moved on the equipping position of the regulation in the above-mentioned metal die, then, moulding resin is injected cavity in the above-mentioned metal die, coat the section of the above-mentioned metal parts that is positioned at above-mentioned cavity by means of above-mentioned moulding resin, simultaneously each metal parts is encapsulated in this electronic device.
Also have, it is characterized in that: with the further above-mentioned metal parts that separated by above-mentioned cutting punch of pushing of above-mentioned cutting punch, and this each metal parts is moved on the equipping position of the regulation in the above-mentioned metal die, then, moulding resin is injected cavity in the above-mentioned metal die, coat the section of the above-mentioned metal parts that is positioned at above-mentioned cavity by means of above-mentioned moulding resin, simultaneously each metal parts is encapsulated in this electronic device.
Also have, it is characterized in that on the cutting position of above-mentioned connecting portion, forming grooving, and its feature is that also the cutting position of above-mentioned connecting portion is provided within the overall dimension of this electronic device.
Manufacture method according to electronic device of the present invention, by connecting the component count that a plurality of metal partss can reduce the metal parts of handling when setting on the assigned position in metal die, also have, because of the size of handled parts (metal unit) becomes big, aim at or place that operation can become not only easily but also rapid.
Also have, mold clamping force when utilization is carried out matched moulds to the pair of metal mould of being made up of lower mold and upper mold can make connecting portion cut off to separate simply, thereby makes the conduction that above-mentioned connecting portion causes passed through between above-mentioned each electronic device connect and insulate.
Also have, by pushing formalize shape or this metal parts is moved on the equipping position of the regulation in the above-mentioned metal die of a part of deformation established practice that can make this metal parts where necessary simply with above-mentioned cutting punch when the matched moulds.
Then, in the operation of matched moulds moulding, can be coated with the regulation shape and be provided in the section of each metal parts on the assigned position in the metal die or coat the part that scolding tin has come off by means of being injected into moulding resin in the above-mentioned metal die, be encapsulated in each metal parts in the resin reliably, simultaneously, can eliminate reason for corrosion.
Also have, make it possible to carry out separating based on the cut-out of above-mentioned cutting punch with a little mold clamping force by on cutting position, forming grooving.
Also have, reach outside this electronic device as product by making above-mentioned cutting position be provided within the overall dimension of this electronic device and in the operation of matched moulds moulding, above-mentioned connecting portion being cut off the section that can prevent above-mentioned connecting portion reliably.
Also have, electronic device of the present invention is characterized in that: in the matched moulds operation when having used the pair of metal mould of being made up of lower mold and upper mold to carry out the matched moulds moulding, by with being provided in that cutting punch cutting on the above-mentioned metal die is formed at the cutting position that makes the connecting portion that a plurality of metal partss connect and separated, can be as required by with the further pushing and make its part packed by means of the moulding resin in the cavity that when carrying out above-mentioned matched moulds moulding, is injected into above-mentioned metal die of above-mentioned cutting punch by the metal parts of deformation established practice setting shape, simultaneously, the section that is caused by cutting punch that is positioned at the above-mentioned metal parts of above-mentioned cavity is coated by above-mentioned moulding resin.
Also have, the metal parts that is further moved to above-mentioned cutting punch on the equipping position of the regulation in above-mentioned metal die is packed by means of the moulding resin in the cavity that is injected into above-mentioned metal die when the above-mentioned matched moulds moulding, simultaneously, the section that is caused by cutting punch that is positioned at the above-mentioned metal parts of above-mentioned cavity is coated by above-mentioned moulding resin.
According to electronic device of the present invention, the section of each metal parts is coated by means of the moulding resin that is injected in the above-mentioned metal die, therefore, does not have the problem of corrosion, becomes conduction and connects stable electronic device.Each metal parts is encapsulated on the position of regulation reliably, and the section of metal parts can not reach the outside such as terminals formation face etc. yet, and therefore, operation becomes easy.
Description of drawings
Fig. 1 is the vertical view of terminal.
Fig. 2 is the front view of terminal.
Fig. 3 (a) is the key diagram that the expression cutting punch has just been run into the state behind the independent terminals, (b) is that the cut-out of representing just to finish independent terminals separates and the key diagram of the state of pushing after moving.
Fig. 4 is the key diagram of the example of a part of deformation (rotation) that makes metal parts that caused by cutting punch of expression.
Fig. 5 is the key position cutaway view of state of matched moulds that has been illustrated in beginning in the matched moulds moulding.
Fig. 6 is the key position cutaway view of finishing the state behind the matched moulds that is illustrated in the matched moulds moulding.
Fig. 7 is the vertical view of electronic device.
Fig. 8 is the key position cutaway view of electronic device.
Symbol description among the figure:
1: terminal; 2: connecting portion; 2A: grooving; 3: metal parts; 4: the keyhole of location usefulness; 5: housing; 6: metallic circuit; 6A: circuit face; 6B: wall; 6C: following curved terminals; 7: independent terminals; 10: metal die; 10A: lower mold; 10B: upper mold; 11: cavity; 12: independent terminals storage portion; 13: following curved terminals storage portion; 14: cutting punch; 20: electronic device; 20A: an outer ancient piece of jade, round, flat and with a hole in its centre; 21: the metal connection end; 22: shaping resin material.
Embodiment
Following according to Fig. 1 to Fig. 8 to the manufacture method of electronic device of the present invention and thus the execution mode of the electronic device of manufacture method manufacturing describe.Also have Fig. 2, Fig. 5 of expression key position section, the cutaway view that Fig. 6, Fig. 8 are based on line of cut shown in Figure 1 respectively.
The terminal 1 that a plurality of metal partss 3 that at first are ready to use 2 of the connecting portions of being made up of metal material to be loaded into this electronic device 20 fuse.By connecting the component count that a plurality of metal partss 3 can reduce handled metal parts 3 when setting on the assigned position in metal die, also have, because of the size of handled parts (terminal that refers to 1 here) increases, the placement operation of the lower mold 10A of later described metal die 10 can become not only easily but also be rapid.
In the present embodiment, shown in the vertical view of Fig. 1, above-mentioned terminal 1 has the housing 5 of essentially rectangular shape of the keyhole 4 that is formed with location usefulness, is to fuse as the metallic circuit 6 of metal parts 3 by 2 connecting portions 2 being made up of metal material handle in this housing 5 to form.In addition, 2 independent terminals 7 as metal parts 3 are connected on the above-mentioned metallic circuit 6 by connecting portion 2.
Specifically, above-mentioned metallic circuit 6 has the circuit face 6A of essentially rectangular shape and is connected to the wall 6B that extend vertically downward on each limit of 1 group in opposite directions of circuit face 6A thus, is used for above-mentioned connecting portion 2 per 1 each limit that is connected other 1 group in opposite directions respectively that are connected with the housing 5 of above-mentioned terminal 1.Be connected be formed with on each limit of above-mentioned connecting portion 2 be formed downward protrusion 2 down curved terminals 6C, be formed with above-mentioned independent terminals 7 by connecting portion 2 simultaneously.Also have, above-mentioned independent terminals 7 have like that shown in the front view of the vertical view of Fig. 1 and Fig. 2 and are formed protruding upward 1 of L word shape roughly and go up curved terminals 7A.Then, being formed on above-mentioned curved terminals 6C down on same one side of this metallic circuit 6 and last curved terminals 7A is constituted as the part of outer ancient piece of jade, round, flat and with a hole in its centre 20A that integral body is connected the electronic device 20 of each metal parts 3 on this terminal 1 is housed.And, curved terminals 7A and coating scolding tin on the surface of curved terminals 6C down above-mentioned.
Also have,, on the cutting position of above-mentioned connecting portion 2, be formed with the roughly grooving 2A of V word shape in order to be easy to cut off.In the present embodiment, above-mentioned grooving 2A is formed at the upper and lower surface of connecting portion 2, but also can only form (with reference to Fig. 3 (a)) on single surface.
Like this, make it possible to carry out separating by on cutting position, forming grooving 2A based on the cut-out of above-mentioned cutting punch with a little mold clamping force.
Also have, above-mentioned cutting position is configured to make it to be positioned within the overall dimension of this electronic device 20, promptly is positioned at metal die 10, and forms above-mentioned grooving 2A on this cutting position.In the present embodiment, as shown in Figure 1, at the connecting portion that above-mentioned each independent terminals are linked to each other with metallic circuit and make on metallic circuit and the connecting portion that housing links to each other 1 place totally 4 place's cutting positions are respectively arranged.
Then, with the keyhole 4 that is formed on the location usefulness on the above-mentioned housing 5 this terminal 1 is being aimed on the above-mentioned lower mold 10A that is provided in the pair of metal mould of being made up of lower mold 10A and upper mold 10B 10.At this moment, in the present embodiment, in being formed on the back operation, inject on above-mentioned lower mold 10A also form the cavity 11 of resin molding material the above-mentioned independent terminals 7 in location make the circuit face 6A of the end face of curved terminals 7A the above-mentioned independent terminals 7 that separated above-mentioned and above-mentioned metallic circuit 6 becomes the conplane independent terminals storage portion 12 that is formed the abaculus shape and location above-mentioned under the following curved terminals storage portion 13 of curved terminals 6C.
Also have and be aligned cutting punch 14 is provided on the above-mentioned upper mold 10B in 4 place's cutting position correspondences of the above-mentioned connecting portion 2 of the terminal 1 of lower mold 10A.The amount of advancing by leaps and bounds of this cutting punch 14 can be done various adjustings according to the deflection that bumping of this cutting punch 14 connects the position.
As described later, under the situation of the cutting punch 14 that above-mentioned independent terminals 7 are cut from above-mentioned metallic circuit 6 in the present embodiment, also have the above-mentioned independent terminals 7 of pushing and make it vertically the only effect of the pushing bolt of mobile ormal weight.Thus, the total size size about equally with the thickness of slab of the height dimension of above-mentioned curved terminals 7A and above-mentioned metallic circuit 6 is measured in the propelling below above-mentioned upper mold 10B of above-mentioned cutting punch 14.
Then, when using the pair of metal mould of forming by lower mold 10A and upper mold 10B 10 to carry out matched moulds, clamp above-mentioned terminal 1 and push with upper mold 10B and lower mold 10A.In this pushing operation, protrude the cutting punch 14 that forms and cut off above-mentioned connecting portion 2 by means of with the cutting position correspondence of the following above-mentioned connecting portion 2 of above-mentioned upper mold 10B, metal parts 3 is separated.By utilizing mold clamping force can cut off connecting portion 2 simply like this, and make the conduction that above-mentioned connecting portion 2 caused of passing through of 20 of above-mentioned each electronic devices connect insulation.
Also have, shown in Fig. 3 (a), in the present embodiment, the leading section of above-mentioned cutting punch 14 is bumped near the above-mentioned cutting position of receiving in the above-mentioned independent terminals 7, simultaneously, make above-mentioned upper mold 10B below bump the top of going up curved terminals 7A of receiving above-mentioned independent terminals 7, push then, make it vertically only to move the amount of regulation, thus, the independent terminals 7 that cut away being moved like that shown in Fig. 3 (b) is configured in the above-mentioned independent terminals storage portion 12.
Also have, also can be as required by push a part of deformation established practice setting shape that makes metal parts 3 with above-mentioned cutting punch 14.Above-mentioned deformation is meant that the front end that makes this cut-out portion as shown in Figure 4 is the center situation of rotoflector downwards with hithermost base end part.Like this, utilize near the of cutting position of above-mentioned cutting punch 14 and upper mold 10B pushing metal parts 3 can make it to be positioned in the cavity 11 that is formed on the above-mentioned metal die 10.Fig. 5 has represented to begin the key position cutaway view of state of the matched moulds of electronic device 20 moulding.Fig. 6 is the be through with key position cutaway view of the state behind the matched moulds of expression.
Like this, at each metal parts 3 of disjunction and make it after shape with regulation is provided on the assigned position in the metal die 10, shaping resin materials such as plastics 22 are injected in the cavity 11 of metal die 10, and with shaping resin material 22 above-mentioned metal parts 3 is encapsulated in this electronic device, make such, desired electronic device 20 shown in the key position cutaway view of the vertical view of Fig. 7 and Fig. 8.
At this moment, be coated with the section that the regulation shape is provided in each metal parts 3 on the assigned position in the metal die 10, can eliminate thus and cause reason for corrosion by means of being injected into shaping resin materials 22 in the above-mentioned metal die 10.The part that above-mentioned cut-out has separated is the scolding tin weld part, even if under the situation that scolding tin has separately come off because of above-mentioned cut-out, equally also can coat to eliminate by means of above-mentioned shaping resin material and cause reason for corrosion.
Then, because of the section of each metal parts 3 is coated by means of the moulding resins that are injected in the above-mentioned metal die 10, the electronic device 20 of Xing Chenging can prevent corrosion like this, becomes to conduct electricity the stable electronic device 20 of connection.Also have, each metal parts 3 is encapsulated on the assigned position reliably, can eliminate the unnecessary portions that resembles metal parts 3 and reach outside such trouble as the electronic device 20 of product, therefore, operates and becomes easy.For example, under the situation of present embodiment, same one side above-mentioned that is formed on metallic circuit 6 curved terminals 7A and above-mentioned curved terminals 6C down and becomes the metal connection end 21 on the part of the outer wall that is provided in electronic device 20, but by in above-mentioned matched moulds forming process the above-mentioned connecting portion 2 that metal die 10 internal cutting ofves are used for being connected with above-mentioned housing 5 can prevent this connecting portion 2 reach above-mentioned metal connection end 21 near, can not hinder its conduction to connect.
Also have, the present invention is not limited to above-mentioned execution mode, can do various changes as required.
For example, for above-mentioned metal die, also can be a certain side of upper mold and lower mold as driving side.
(effect of invention)
As above illustrated, the present invention passes through to utilize right in the operation of the matched moulds moulding of electronic device Mold clamping force when the pair of metal mould that is made up of lower mold and upper mold carries out matched moulds can In metal die, to cut each metal parts, can also make as required an one of this metal parts Fractally become the regulation shape or make this metal parts move to setting of regulation in the above-mentioned metal die On the position, in the operation of this matched moulds moulding, can be coated with the regulation shape by means of moulding resin The section or the scolding tin that are provided in each metal parts on the assigned position in the metal die have come off Part. Thus, according to the manufacture method of electronic device of the present invention, except preventing reliably End take the exposure of above-mentioned section or coming off as the corrosion of reason of scolding tin, can also eliminate simultaneously and resemble this The trouble of sample, namely the section of unwanted above-mentioned connecting portion reaches as the electronic device of product Outside. The electronic device of method manufacturing becomes the good electronic device of performance quality thus.
Claims (8)
1. the manufacture method of an electronic device in the matched moulds operation when having used the pair of metal mould of being made up of lower mold and upper mold to carry out the matched moulds moulding, is characterized in that:
Be encapsulated in terminal that a plurality of metal partss in the electronic device connect as one and aiming at and be provided in the pair of metal mould of forming by lower mold and upper mold making by the connecting portion of forming by metal material, when carrying out matched moulds, cut off above-mentioned connecting portion above-mentioned each metal parts is separated by means of the cutting punch that is provided on the above-mentioned upper mold with the cutting position correspondence of above-mentioned connecting portion, simultaneously with the above-mentioned cutting punch above-mentioned metal parts that further pushing is separated, and make a part of deformation established practice setting shape of this each metal parts as required, then, moulding resin is injected cavity in the above-mentioned metal die, coat the section of the above-mentioned metal parts that is positioned at above-mentioned cavity by means of above-mentioned moulding resin, simultaneously each metal parts is encapsulated in this electronic device.
2. the manufacture method of an electronic device in the matched moulds operation when having used the pair of metal mould of being made up of lower mold and upper mold to carry out the matched moulds moulding, is characterized in that:
Be encapsulated in terminal that a plurality of metal partss in the electronic device connect as one and aiming at and be provided in the pair of metal mould of forming by lower mold and upper mold making by the connecting portion of forming by metal material, when carrying out matched moulds, cut off above-mentioned connecting portion above-mentioned each metal parts is separated by means of the cutting punch that is provided on the above-mentioned upper mold with the cutting position correspondence of above-mentioned connecting portion, simultaneously with the above-mentioned cutting punch above-mentioned metal parts that further pushing is separated, and this each metal parts is moved on the equipping position of the regulation in the above-mentioned metal die, then, shaping resin material is injected cavity in the above-mentioned metal die, coat the section of the above-mentioned metal parts that is positioned at above-mentioned cavity by means of above-mentioned shaping resin material, simultaneously each metal parts is encapsulated in this electronic device.
3. the manufacture method of electronic device according to claim 1 is characterized in that:
On the cutting position of above-mentioned connecting portion, form grooving.
4. the manufacture method of electronic device according to claim 2 is characterized in that:
On the cutting position of above-mentioned connecting portion, form grooving.
5. the manufacture method of electronic device according to claim 1 is characterized in that:
Arbitrary cutting position of above-mentioned connecting portion all is provided within the overall dimension of this electronic device.
6. the manufacture method of electronic device according to claim 2 is characterized in that:
Arbitrary cutting position of above-mentioned connecting portion all is provided within the overall dimension of this electronic device.
7. electronic device in the matched moulds operation when having used the pair of metal mould of being made up of lower mold and upper mold to carry out the matched moulds moulding, is characterized in that:
By with being provided in that cutting punch cutting on the above-mentioned metal die is formed at the cutting position that makes the connecting portion that a plurality of metal partss connect and separated, can be as required by with the further pushing and make its part by deformation established practice setting shape of above-mentioned cutting punch, or each metal parts that is moved on the equipping position of the regulation in the above-mentioned metal die is encapsulated in this electronic device by means of the shaping resin material in the cavity that is injected into above-mentioned metal die when carrying out above-mentioned matched moulds moulding, simultaneously, the section that is caused by cutting punch that is positioned at the above-mentioned metal parts of above-mentioned cavity is coated by above-mentioned shaping resin material.
8. electronic device in the matched moulds operation when having used the pair of metal mould of being made up of lower mold and upper mold to carry out the matched moulds moulding, is characterized in that:
By with being provided in that cutting punch cutting on the above-mentioned metal die is formed at the cutting position that makes the connecting portion that a plurality of metal partss connect and each metal parts separated, that can further be pushed with above-mentioned cutting punch as required on the equipping position that be moved to the regulation in the above-mentioned metal die is encapsulated in the electronic device by means of the moulding resin in the cavity that is injected into above-mentioned metal die when carrying out above-mentioned matched moulds moulding, simultaneously, the section that is caused by cutting punch that is positioned at the above-mentioned metal parts of above-mentioned cavity is coated by above-mentioned shaping resin material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002366521A JP2004195786A (en) | 2002-12-18 | 2002-12-18 | Method for producing electronic component, and electronic component |
| JP2002366521 | 2002-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1508857A true CN1508857A (en) | 2004-06-30 |
Family
ID=32763700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2003101201885A Pending CN1508857A (en) | 2002-12-18 | 2003-12-10 | Method for manufacturing electronic device and electronic device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2004195786A (en) |
| KR (1) | KR20040054505A (en) |
| CN (1) | CN1508857A (en) |
| TW (1) | TW200503204A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101617243A (en) * | 2007-02-19 | 2009-12-30 | Nxp股份有限公司 | Sensor package |
-
2002
- 2002-12-18 JP JP2002366521A patent/JP2004195786A/en not_active Withdrawn
-
2003
- 2003-11-26 TW TW092133176A patent/TW200503204A/en unknown
- 2003-12-10 CN CNA2003101201885A patent/CN1508857A/en active Pending
- 2003-12-11 KR KR1020030090207A patent/KR20040054505A/en active IP Right Grant
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101617243A (en) * | 2007-02-19 | 2009-12-30 | Nxp股份有限公司 | Sensor package |
| CN101617243B (en) * | 2007-02-19 | 2012-08-29 | Nxp股份有限公司 | Sensor package |
| US8664946B2 (en) | 2007-02-19 | 2014-03-04 | Nxp B.V. | Sensor packages including a lead frame and moulding body and methods of manufacturing |
| US9222989B2 (en) | 2007-02-19 | 2015-12-29 | Nxp B.V. | Manufacturing methods for a sensor package including a lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004195786A (en) | 2004-07-15 |
| TW200503204A (en) | 2005-01-16 |
| KR20040054505A (en) | 2004-06-25 |
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