CN1482523A - Microflute evaporating and cooling method and apparatus using same - Google Patents
Microflute evaporating and cooling method and apparatus using same Download PDFInfo
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- CN1482523A CN1482523A CNA021306257A CN02130625A CN1482523A CN 1482523 A CN1482523 A CN 1482523A CN A021306257 A CNA021306257 A CN A021306257A CN 02130625 A CN02130625 A CN 02130625A CN 1482523 A CN1482523 A CN 1482523A
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Abstract
A microflute group heat-sink cooling method characterized by that, a plurality of microflutes are arranged at the radiating region near the external surface of the heater forming a microflute group, the liquid actuating medium in the microflutes can form high-intensity evaporation at the heated region for removing heat produced by the heater, thus cooling the heater through evaporation. The advantages of the invention are no power consumption, small heat dissipation area, high heat dissipation flow density and high intensity of heat.
Description
Technical field:
The present invention relates to a kind of radiation cooling method, particularly be applied to the evaporating and cooling method and the device thereof of computer chip.
Background technology:
At present to heater particularly the cooling of the cpu chip of computing machine mainly adopt heat radiator to carry out air cooling in conjunction with fan.This technology is smeared heat conductive silica gel (silicone grease) to reduce thermal conduction resistance by sticking on the cpu chip surface on radiating fin and the surface of contact at both, fan is placed in and utilizes the convection heat transfer principle to be lost to the computer cabinet environment by fin surface from the heat that CPU derives on the radiating fin end face to go, thereby guarantees that cpu chip is operated in the normal working temperature scope.The major defect of this technology is: there is power consumption in the running of fan, because CPU frequency is high more, it is just big more that CPU keeps the required dispersed heat of normal working temperature, thereby the power consumption of fan is just big more; Simultaneously, the required area of dissipation of fin is just big more, and this can't realize in the narrow space of computing machine, and the increase of area of dissipation can reduce fin efficiency, and the heat radiation total capacity can't significantly improve; At present, adopt the method for air cooling that cpu chip is dispelled the heat, its highest heat radiation heat flow density can only reach 20W/cm
2And show that according to the data of american semiconductor industry SIA after about 3 years, the heat generation density of high performance chips will reach 50W/cm
2Degree.Thereby conventional cooling technology can not satisfy the heat radiation requirement of high performance chips.
Summary of the invention:
The present invention solves the power consumption that existing wind-cooling heat dissipating technology exists and requires high, as to need big area of dissipation, heat-sinking capability deficiency technological deficiency, provides a kind of and does not have power consumption, area of dissipation is little, the heat radiation heat flow density is high and big microflute group evaporating and cooling method and the device thereof of heat radiation total capacity.
Technical scheme of the present invention is such: a kind of high-performance microflute group evaporating and cooling method, directly at position that the heater outside surface need dispel the heat or be close on the Heat Conduction Material of heater heat dissipation region many micro-channel are set, form the microflute group, the size of described micro-channel is fit to form capillary force, be drawn in the micro-channel with liquid working substance described micro-channel limit, liquid working substance in the described micro-channel forms high-intensity evaporation in heat affected zone and takes away the heat that heater produces with this, thereby makes heater evaporative cooling.
The width of above-mentioned micro-channel and the degree of depth are in the 0.01-1mm scope, and the spacing between the micro-channel is in the 0.01-10mm scope.
The width of above-mentioned micro-channel and the degree of depth are in the 0.01-0.6mm scope, and the spacing between the micro-channel is in the 0.01-10mm scope.
Aforesaid liquid working medium and micro-channel all are arranged in the confined space that vacuumizes.
A kind of realize said method special-purpose member-the microflute group is heat sink, comprise a Heat Conduction Material, described Heat Conduction Material is provided with many micro-channel, the size of described micro-channel be fit to form capillary force, is drawn in the micro-channel with the liquid working substance with described micro-channel limit.
The width of above-mentioned micro-channel and the degree of depth are in the 0.01-1mm scope, and the spacing between the micro-channel is in the 0.01-10mm scope.
Above-mentioned micro-channel is vertically gathered and is arranged.
Above-mentioned micro-channel is vertically gathered and is arranged, and intersects on the micro-channel of arranging of vertically gathering to be arranged with horizontal micro-channel.
The vertically densely covered arrangement of above-mentioned micro-channel, intersection is arranged with horizontal micro-channel on the micro-channel of arranging of vertically gathering, and described one or more micro-channel horizontal or that vertically arrange are communicated with closed circuit.
A kind of evaporation-cooled device that adopts said method, comprise an evaporator, described evaporator is to be perfused with liquid working substance in the seal that vacuumizes and its, heating surface in the described evaporator is carved and is furnished with many micro-channel, form the microflute group, the size of described micro-channel is fit to form capillary force, is drawn in the micro-channel with the liquid working substance with described micro-channel limit.
Described heating surface is the appearance heating face of heater.
The outside surface of described heating surface is by heat conductive silica gel and the adhesion mutually of heater outside surface.
The width of above-mentioned micro-channel and the degree of depth are in the 0.01-1mm scope, and the spacing between the micro-channel is in the 0.01-10mm scope.
Also be provided with condensation front in the described evaporator, the arranged outside of described condensation front has fan.
Described condensation front is the flexure type condensation front.
Be provided with circulation line in the described evaporator, described circulation line links to each other with outside heat abstractor.
Technique effect: the present invention is by being provided with many micro-channel that can produce capillary force on the position that need dispel the heat at the heater outside surface or the Heat Conduction Material of being close to the heater heat dissipation region, capillary force is drawn into liquid working substance in the micro-channel, thereby the heat that heater produces was taken away in the high strength evaporation after the liquid working substance of heat affected zone was heated in the micro-channel, made the heater cooling.Be that the present invention is that the mode that liquid state by liquid working substance directly is evaporated to this phase transformation of gaseous state is cooled off, rather than convection heat transfer cooling, saved to strengthening normal electric fan that adopts of convection heat transfer cooling and relevant heat radiation cooling-part, realized the heat radiation cooling of no power consumption.Domestic and international research shows, overall characteristic that flows and conduct heat in the microchannel and the result in the large scale passage have a great difference, the evaporation of working medium has high intensity in the micro-channel, belongs to the extraordinary phenomenon of the heat and mass under the yardstick between microvoid, is a kind of high performance cooling heat dissipation mode.This high efficiency cooling heat dissipation can make the evaporation surface size little to very little heater for example the computer chip size be complementary, the theoretical limit of its phase transformation heat of evaporation current density goes out about two orders of magnitude than the high heat flux of present high performance chips is taller, and the heat radiation total capacity improves greatly.Thereby adopt the present invention fundamentally to solve at present and the from now on very little heater heat dissipation problem of high-performance cpu chip especially, and reduce and the working temperature of control high performance chips, guarantee and improve the serviceability of high performance chips.
The capillary force that the width of micro-channel and the degree of depth produce in the micro-channel in the 0.01-1mm scope time is strong, has the ability of stronger adsorptive liquid working medium.
Liquid working substance and micro-channel all are arranged in the confined space that vacuumizes can reduce evaporating temperature greatly, when improving the heat radiation cooling effectiveness, can prevent that heater is overheated, and this mode is suitable for the computer chip that temperature can not be too high.
The adsorbable more liquid working substance of transversely arranged micro-channel is set to heat affected zone, makes the liquid working substance that evaporates obtain replenishing in time, thereby improve cooling effectiveness.
A micro-channel horizontal or that vertically arrange is communicated with closed circuit and can directly the cooled liquid working substance of circulation be sent into the heat affected zone, makes the liquid working substance that evaporates obtain replenishing in time, also helps to improve cooling effectiveness.
Description of drawings:
Fig. 1 is the heat sink structural representation of microflute group of the present invention.
Fig. 2 is a kind of microflute group of the present invention arrangement mode synoptic diagram.
Fig. 3 is the another kind of microflute group of a present invention arrangement mode synoptic diagram.
Fig. 4 is a kind of embodiment that adopts the evaporation-cooled device of the inventive method;
Fig. 5 is another embodiment that adopts the evaporation-cooled device of the inventive method.
Embodiment:
Embodiment 1: the many rectangle micro-channel 2 of delineation on sheet metal or other Heat Conduction Materials, form the microflute group, and it is heat sink that this heat exchange structure that has the microflute group is called the microflute group, sees Fig. 1.Micro-channel 2 is vertically gathered and is arranged among Fig. 1.The micro-channel 2 conduit width and the conduit degree of depth and are the rectangle micro-channel in the scope of 0.01-1mm.Spacing between the micro-channel is in the 0.01-10mm scope, 2 pairs of multiple working medium of the micro-channel of this scope such as absolute ethyl alcohol or distilled water all have the sucking action of capillary force, more optimally, the width of micro-channel and the degree of depth are in the 0.01-0.6mm scope, and the spacing between the micro-channel is in the 0.01-10mm scope.After sheet metal and heater are closely pasted by heat conductive silica gel (silicone grease), the heat that heater produces is transmitted on the sheet metal, the sheet metal heating, simultaneously, capillary force is drawn onto liquid working substance in the micro-channel 2 on the sheet metal, liquid working substance evaporates in the heat affected zone of micro-channel 2 takes away a large amount of heats, thereby realizes the heat radiation cooling to heater.Heater can be chip or other heaters.The inventive method is particularly useful for computer chip, particularly place in the device that vacuumizes micro-channel is heat sink, can reduce evaporating temperature greatly, be suitable for the requirement of computer chip to temperature, and the raising evaporation capacity, the theoretical limit of its phase transformation heat of evaporation current density goes out about two orders of magnitude than the high heat flux of present high performance chips is taller.Thereby employing the inventive method can fundamentally solve the present heat dissipation problem of high-performance cpu chip from now on that reaches, the working temperature of reduction and control high performance chips, the serviceability of assurance and raising high performance chips.
Embodiment 2: directly delineate many micro-channel 2 at the outside surface of chip or other heaters, form the microflute group, it is heat sink that the part that is carved with micro-channel of heaters such as chip becomes the microflute group.The size of the micro-channel of present embodiment makes micro-channel have capillary force with embodiment 1 equally, evaporates the heat that heaters such as taking away chip produces thereby liquid working substance is drawn onto micro-channel 2 interior heat affected zone.
Embodiment 3: see Fig. 2: the micro-channel 2 that present embodiment microflute group is heat sink is vertically gathered and is arranged, and intersects on the micro-channel 2 of arranging of vertically gathering to be arranged with horizontal micro-channel 2 '.Transversely arranged micro-channel 2 ' the adsorbable more liquid working substance is set to the heat affected zone, makes the liquid working substance that evaporates obtain replenishing in time, thereby improve cooling effectiveness.The groove width 0.2mm of present embodiment micro-channel 2, groove depth 0.5mm, separation 0.2mm, laterally groove width 0.4mm, groove depth 0.8mm, the separation 5mm of micro-channel 2 '.
Embodiment 4, see Fig. 3.Present embodiment has the micro-channel 2 of vertically gathering and arranging, and intersects on the micro-channel 2 of arranging of vertically gathering to be arranged with 2 ', one horizontal micro-channel 2 ' of horizontal micro-channel and closed circuit 2 " be communicated with, a micro-channel 2 also can getting vertical arrangement is communicated with closed circuit.A micro-channel horizontal or that vertically arrange is communicated with closed circuit and can directly the cooled liquid working substance of circulation be sent into the heat affected zone, makes the liquid working substance that evaporates obtain replenishing in time, also helps to improve cooling effectiveness.
Embodiment 5: see Fig. 4, Fig. 4 is the structural representation that desk-top computer cpu chip 1 utilizes the evaporation-cooled device of the inventive method.It comprises an evaporator 3 bodies, evaporator 3 is perfused with liquid working substance 6 in the seal that vacuumizes and its, heating surface in the evaporator 3 is carved and is furnished with many micro-channel 2, form the microflute group, the size of described micro-channel 2 is fit to form capillary force, is drawn in the micro-channel with the liquid working substance with described micro-channel limit.Micro-channel 2 spacings, conduit width and the conduit degree of depth are preferable in the scope of 0.01-1mm.The outside surface of present embodiment evaporator 3 heating surfaces is close together by heat conductive silica gel (silicone grease) and chip 1 outside surface.Also be provided with condensation front 4 in the evaporator 3, condensation front 4 is the flexure type condensation front, and the arranged outside of condensation front 4 has fan 5.Liquid working substance in the evaporator 3 such as absolute ethyl alcohol or distilled water have the higher latent heat of vaporization, under the effect of capillary force, liquid working substance is inhaled in the heat affected zone by micro-channel 2 and forms high-intensity evaporation and take away the heat that cpu chip 1 produces with this, steam cools off, condenses by external fan 5 on the intrinsic flexure type condensation front 4 with the area that condenses more greatly of evaporator 3, liquid working substance 6 after condensing falls into evaporator 3 intrinsic liquid pools again along the wall that condenses, and forms circulation.
Embodiment 6: the heating surface of present embodiment evaporator 3 is the appearance heating face of chip.Promptly directly cpu chip outside surface and evaporator 3 are made of one, carve the cloth micro-channel, form the microflute group as evaporator 3 body internal heating surfaces and on its surface.Other parts of present embodiment are with embodiment 5.
Embodiment 7: see Fig. 5.Present embodiment is the structural representation that notebook computer cpu chip 1 adopts the evaporation-cooled device of the inventive method.Be provided with circulation line 7 among Fig. 5 in the evaporator 3, circulation line 7 is connected with outside heat abstractor, present embodiment is to link to each other with the notebook computer screen back side 8, the screen that utilization has big area of dissipation carries out air cooling, condenses, liquid working substance 6 after condensing flows back in evaporator 3 bodies by circulation line 7, forms circulation.The circulation line 7 of present embodiment replaces the condensation front 4 and the fan 5 of embodiment 3 or 4, and other parts are with embodiment 5 or 6.
Claims (15)
1. high-performance microflute group evaporating and cooling method, it is characterized in that directly at position that the heater outside surface need dispel the heat or be close on the Heat Conduction Material of heater heat dissipation region many micro-channel are set, form the microflute group, the size of described micro-channel is fit to form capillary force, be drawn in the micro-channel with liquid working substance described micro-channel limit, liquid working substance in the described micro-channel forms high-intensity evaporation in heat affected zone and takes away the heat that heater produces with this, thereby makes heater evaporative cooling.
2, high-performance microflute group cooling means according to claim 1 is characterized in that the width of described micro-channel and the degree of depth in the 0.01-1mm scope, and the spacing between the micro-channel is in the 0.01-10mm scope.
3. high-performance microflute group cooling means according to claim 2 is characterized in that the width of described micro-channel and the degree of depth in the 0.01-0.mm scope, and the spacing between the micro-channel is in the 0.01-10mm scope.
4, high-performance microflute group cooling means according to claim 1 and 2 is characterized in that described liquid working substance and micro-channel all are arranged in the confined space that vacuumizes.
5, a kind of special-purpose member of realizing said method is characterized in that comprising a Heat Conduction Material, and described Heat Conduction Material is provided with many micro-channel, and the size of described micro-channel is fit to form capillary force, is drawn in the micro-channel with the liquid working substance with described micro-channel limit.
6, special-purpose member according to claim 5 is characterized in that the width of described micro-channel and the degree of depth in the 0.01-1mm scope, and the spacing between the micro-channel is in the 0.01-10mm scope.
7,, it is characterized in that the vertically densely covered arrangement of described micro-channel according to claim 5 or 6 described special-purpose members.
8, according to claim 5 or 6 described special-purpose members, it is characterized in that the vertically densely covered arrangement of described micro-channel, intersection is arranged with horizontal micro-channel on the micro-channel of arranging of vertically gathering.
9, according to claim 5 or 6 described special-purpose members, it is characterized in that the vertically densely covered arrangement of described micro-channel, intersection is arranged with horizontal micro-channel on the micro-channel of arranging of vertically gathering, and described one or more micro-channel horizontal or that vertically arrange are communicated with closed circuit.
10, a kind of evaporation-cooled device that adopts said method, comprise an evaporator, described evaporator is to be perfused with liquid working substance in the seal that vacuumizes and its, heating surface in the described evaporator is carved and is furnished with many micro-channel, form the microflute group, the size of described micro-channel is fit to form capillary force, is drawn in the micro-channel with the liquid working substance with described micro-channel limit.
11, evaporation-cooled device according to claim 10 is characterized in that described heating surface is the appearance heating face of heater.
12, evaporation-cooled device according to claim 10, the outside surface that it is characterized in that described heating surface is by heat conductive silica gel and the adhesion mutually of heater outside surface.
13, evaporation-cooled device according to claim 10 is characterized in that also being provided with condensation front in the described evaporator, and the arranged outside of described condensation front has fan.
14, evaporation-cooled device according to claim 14 is characterized in that described condensation front is the flexure type condensation front.
15, evaporation-cooled device according to claim 10 is characterized in that being provided with circulation line in the described evaporator of institute, and described circulation line links to each other with outside heat abstractor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021306257A CN1313902C (en) | 2002-09-10 | 2002-09-10 | Microflute evaporating and cooling method and apparatus using same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021306257A CN1313902C (en) | 2002-09-10 | 2002-09-10 | Microflute evaporating and cooling method and apparatus using same |
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| CN1482523A true CN1482523A (en) | 2004-03-17 |
| CN1313902C CN1313902C (en) | 2007-05-02 |
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| CNB021306257A Expired - Fee Related CN1313902C (en) | 2002-09-10 | 2002-09-10 | Microflute evaporating and cooling method and apparatus using same |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007031024A1 (en) * | 2005-09-14 | 2007-03-22 | Sino-Tech Investment Holdings Limited | A high performance passive type phase transformation heat sink system and an application thereof |
| CN101814464B (en) * | 2009-02-25 | 2011-06-01 | 中国科学院工程热物理研究所 | Composite phase change integrated cooling heat dissipation method and device for micro slot group of silicon controlled thyristor device |
| CN101155495B (en) * | 2006-09-27 | 2011-12-21 | 中国科学院工程热物理研究所 | Micro-channel single phase convection and capillary groove phase inversion heat combined cooling method and device |
| CN107223004A (en) * | 2017-06-09 | 2017-09-29 | 苏州科技大学 | A kind of device and method of microchannel surface formula misting cooling augmentation of heat transfer |
| CN107830507A (en) * | 2017-11-06 | 2018-03-23 | 上海华友金裕微电子有限公司 | A kind of micro-groove group evaporation cooling device of LED |
| CN109003954A (en) * | 2018-08-17 | 2018-12-14 | 大连恒能高导科技有限公司 | Radiator |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100294317B1 (en) * | 1999-06-04 | 2001-06-15 | 이정현 | Micro-cooling system |
| CN2435777Y (en) * | 2000-07-19 | 2001-06-20 | 柯浩志 | Active heat sink |
-
2002
- 2002-09-10 CN CNB021306257A patent/CN1313902C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007031024A1 (en) * | 2005-09-14 | 2007-03-22 | Sino-Tech Investment Holdings Limited | A high performance passive type phase transformation heat sink system and an application thereof |
| CN100401508C (en) * | 2005-09-14 | 2008-07-09 | 赵耀华 | High-performance passive phase-change radiation system and its application |
| CN101155495B (en) * | 2006-09-27 | 2011-12-21 | 中国科学院工程热物理研究所 | Micro-channel single phase convection and capillary groove phase inversion heat combined cooling method and device |
| CN101814464B (en) * | 2009-02-25 | 2011-06-01 | 中国科学院工程热物理研究所 | Composite phase change integrated cooling heat dissipation method and device for micro slot group of silicon controlled thyristor device |
| CN107223004A (en) * | 2017-06-09 | 2017-09-29 | 苏州科技大学 | A kind of device and method of microchannel surface formula misting cooling augmentation of heat transfer |
| CN107830507A (en) * | 2017-11-06 | 2018-03-23 | 上海华友金裕微电子有限公司 | A kind of micro-groove group evaporation cooling device of LED |
| CN107830507B (en) * | 2017-11-06 | 2020-04-28 | 上海华友金裕微电子有限公司 | Micro-groove group evaporative cooling device for LED lamp |
| CN109003954A (en) * | 2018-08-17 | 2018-12-14 | 大连恒能高导科技有限公司 | Radiator |
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| CN1313902C (en) | 2007-05-02 |
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Owner name: DALIAN HUASHANG PHOTOELECTRIC TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: ZHAO YAOHUA Effective date: 20110412 |
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Assignee: Hunan Guangwei Energy Technology Co Ltd Assignor: Zhao Yaohua Contract record no.: 2011430000059 Denomination of invention: Microflute evaporating and cooling method and apparatus using same Granted publication date: 20070502 License type: Exclusive License Open date: 20040317 Record date: 20110503 |
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