CN1476954A - Production method of soldering tin ball for BGA and its equipment - Google Patents
Production method of soldering tin ball for BGA and its equipment Download PDFInfo
- Publication number
- CN1476954A CN1476954A CNA031396399A CN03139639A CN1476954A CN 1476954 A CN1476954 A CN 1476954A CN A031396399 A CNA031396399 A CN A031396399A CN 03139639 A CN03139639 A CN 03139639A CN 1476954 A CN1476954 A CN 1476954A
- Authority
- CN
- China
- Prior art keywords
- liquid
- flinger
- tin
- constant temperature
- ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 72
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000005476 soldering Methods 0.000 title 1
- 238000002844 melting Methods 0.000 claims abstract description 14
- 230000008018 melting Effects 0.000 claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 238000010079 rubber tapping Methods 0.000 claims abstract description 3
- 239000007788 liquid Substances 0.000 claims description 46
- 239000012530 fluid Substances 0.000 claims description 17
- 238000001816 cooling Methods 0.000 claims description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 6
- 238000007493 shaping process Methods 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 5
- 239000008158 vegetable oil Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 3
- 235000011187 glycerol Nutrition 0.000 claims description 3
- 235000015112 vegetable and seed oil Nutrition 0.000 claims description 3
- 238000011534 incubation Methods 0.000 claims description 2
- 238000012216 screening Methods 0.000 abstract description 4
- 238000001035 drying Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 235000019580 granularity Nutrition 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB031396399A CN100493818C (en) | 2003-06-30 | 2003-06-30 | Production method of soldering tin ball for BGA and its equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB031396399A CN100493818C (en) | 2003-06-30 | 2003-06-30 | Production method of soldering tin ball for BGA and its equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1476954A true CN1476954A (en) | 2004-02-25 |
CN100493818C CN100493818C (en) | 2009-06-03 |
Family
ID=34155043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031396399A Expired - Lifetime CN100493818C (en) | 2003-06-30 | 2003-06-30 | Production method of soldering tin ball for BGA and its equipment |
Country Status (1)
Country | Link |
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CN (1) | CN100493818C (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1309529C (en) * | 2004-12-08 | 2007-04-11 | 云南锡业集团有限责任公司研究设计院 | One-step molding technology and device for spherical soldering tin |
CN100417489C (en) * | 2005-10-13 | 2008-09-10 | 河南科技大学 | Wire cutting type processing equipment and method for high sealing use brazed ball |
CN100431747C (en) * | 2005-10-27 | 2008-11-12 | 徐振武 | Preparation method of leadless soldering ball |
CN102151837A (en) * | 2011-01-15 | 2011-08-17 | 云南锡业微电子材料有限公司 | BGA solder ball forming continuous feeder |
CN103157962A (en) * | 2013-03-27 | 2013-06-19 | 云南锡业锡材有限公司 | Preparation method of slant-rolling tin ball |
CN103252500A (en) * | 2013-01-09 | 2013-08-21 | 深圳市创智材料科技有限公司 | Tin ball production method and equipment for semiconductor packaging |
CN105328171A (en) * | 2015-11-20 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Feeder of BGA solder |
CN105598421A (en) * | 2016-03-03 | 2016-05-25 | 浙江乔兴建设集团湖州智能科技有限公司 | BGA (ball grid array) solder ball former |
CN106141196A (en) * | 2015-04-20 | 2016-11-23 | 上海亚尔光源有限公司 | A kind of tin ball particle and its preparation method and application |
CN107708328A (en) * | 2017-06-27 | 2018-02-16 | 安徽华东光电技术研究所 | Improve the chip adequately grounded welding method with radiating |
CN109434123A (en) * | 2018-10-26 | 2019-03-08 | 锡矿山闪星锑业有限责任公司 | A kind of device and method preparing antimony pearl |
CN113560587A (en) * | 2021-08-12 | 2021-10-29 | 广州海普电子材料科技有限公司 | BGA tin ball smelting and rapid forming method |
CN113617738A (en) * | 2021-08-12 | 2021-11-09 | 广州海普电子材料科技有限公司 | BGA tin ball multifunctional cleaning equipment |
-
2003
- 2003-06-30 CN CNB031396399A patent/CN100493818C/en not_active Expired - Lifetime
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1309529C (en) * | 2004-12-08 | 2007-04-11 | 云南锡业集团有限责任公司研究设计院 | One-step molding technology and device for spherical soldering tin |
CN100417489C (en) * | 2005-10-13 | 2008-09-10 | 河南科技大学 | Wire cutting type processing equipment and method for high sealing use brazed ball |
CN100431747C (en) * | 2005-10-27 | 2008-11-12 | 徐振武 | Preparation method of leadless soldering ball |
CN102151837A (en) * | 2011-01-15 | 2011-08-17 | 云南锡业微电子材料有限公司 | BGA solder ball forming continuous feeder |
CN103252500A (en) * | 2013-01-09 | 2013-08-21 | 深圳市创智材料科技有限公司 | Tin ball production method and equipment for semiconductor packaging |
CN103157962B (en) * | 2013-03-27 | 2015-04-08 | 云南锡业锡材有限公司 | Preparation method of slant-rolling tin ball |
CN103157962A (en) * | 2013-03-27 | 2013-06-19 | 云南锡业锡材有限公司 | Preparation method of slant-rolling tin ball |
CN106141196A (en) * | 2015-04-20 | 2016-11-23 | 上海亚尔光源有限公司 | A kind of tin ball particle and its preparation method and application |
CN105328171A (en) * | 2015-11-20 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Feeder of BGA solder |
CN105598421A (en) * | 2016-03-03 | 2016-05-25 | 浙江乔兴建设集团湖州智能科技有限公司 | BGA (ball grid array) solder ball former |
CN107708328A (en) * | 2017-06-27 | 2018-02-16 | 安徽华东光电技术研究所 | Improve the chip adequately grounded welding method with radiating |
CN109434123A (en) * | 2018-10-26 | 2019-03-08 | 锡矿山闪星锑业有限责任公司 | A kind of device and method preparing antimony pearl |
CN109434123B (en) * | 2018-10-26 | 2022-03-22 | 锡矿山闪星锑业有限责任公司 | Device and method for preparing antimony beads |
CN113560587A (en) * | 2021-08-12 | 2021-10-29 | 广州海普电子材料科技有限公司 | BGA tin ball smelting and rapid forming method |
CN113617738A (en) * | 2021-08-12 | 2021-11-09 | 广州海普电子材料科技有限公司 | BGA tin ball multifunctional cleaning equipment |
Also Published As
Publication number | Publication date |
---|---|
CN100493818C (en) | 2009-06-03 |
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Legal Events
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C06 | Publication | ||
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20040225 Assignee: Guangzhou Solderwell Enterprise Co.,Ltd. Assignor: TETONG ELECTRONIC MATERIAL Co. Contract record no.: 2010440000437 Denomination of invention: Production method of soldering tin ball for BGA and its equipment Granted publication date: 20090603 License type: Exclusive License Record date: 20100422 |
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C56 | Change in the name or address of the patentee |
Owner name: GUANGZHOU TETONG ELECTRONIC MATERIAL CO., LTD. Free format text: FORMER NAME: TETONG ELECTRONIC MATERIAL CO., LTD., GUANGZHOU CITY |
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CP03 | Change of name, title or address |
Address after: 510663, science and Technology Industrial Development Zone, Guangzhou, Guangdong Province, No. two, No. 58, Cloud Road, South City, Guangzhou Patentee after: Guangzhou super copper electronic material Co.,Ltd. Address before: Lingshan Road, Guangdong Industrial Park, 510660 Eton city of Guangzhou province Dongpu Pearl Village building three Patentee before: TETONG ELECTRONIC MATERIAL Co. |
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EM01 | Change of recordation of patent licensing contract |
Change date: 20150216 Contract record no.: 2010440000437 Assignor after: Guangzhou super copper electronic material Co.,Ltd. Assignor before: TETONG ELECTRONIC MATERIAL Co. Change date: 20150216 Contract record no.: 2010440000437 Assignee after: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Assignee before: Guangzhou Solderwell Enterprise Co.,Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Production method of soldering tin ball for BGA and its equipment Effective date of registration: 20150215 Granted publication date: 20090603 Pledgee: China Minsheng Banking Corp Guangzhou branch Pledgor: Guangzhou super copper electronic material Co.,Ltd. Registration number: 2015440000003 |
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C56 | Change in the name or address of the patentee | ||
CP02 | Change in the address of a patent holder |
Address after: 510663, Guangzhou hi tech Industrial Development Zone, Guangzhou, Guangdong Province, science, South Road, No. five, No. 11, R & D center, 302 Patentee after: Guangzhou super copper electronic material Co.,Ltd. Address before: 510663, science and Technology Industrial Development Zone, Guangzhou, Guangdong Province, No. two, No. 58, Cloud Road, South City, Guangzhou Patentee before: Guangzhou super copper electronic material Co.,Ltd. |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20170607 Granted publication date: 20090603 Pledgee: China Minsheng Banking Corp Guangzhou branch Pledgor: Guangzhou super copper electronic material Co.,Ltd. Registration number: 2015440000003 |
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EC01 | Cancellation of recordation of patent licensing contract | ||
EC01 | Cancellation of recordation of patent licensing contract |
Assignee: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Assignor: Guangzhou super copper electronic material Co.,Ltd. Contract record no.: 2010440000437 Date of cancellation: 20170619 |
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EM01 | Change of recordation of patent licensing contract | ||
EM01 | Change of recordation of patent licensing contract |
Change date: 20170616 Contract record no.: 2010440000437 Assignee after: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Assignee before: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Production method of soldering tin ball for BGA and its equipment Effective date of registration: 20170621 Granted publication date: 20090603 Pledgee: China Minsheng Banking Corp Guangzhou branch Pledgor: Chen Minghan|Guangzhou super copper electronic material Co.,Ltd.|GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Registration number: 2017440000035 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20200429 Granted publication date: 20090603 Pledgee: China Minsheng Banking Corp Guangzhou branch Pledgor: Guangzhou super copper electronic material Co.,Ltd. Registration number: 2017440000035 |
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Granted publication date: 20090603 |
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