CN1476289A - Welding pad structure of printed circuit board - Google Patents
Welding pad structure of printed circuit board Download PDFInfo
- Publication number
- CN1476289A CN1476289A CNA021305013A CN02130501A CN1476289A CN 1476289 A CN1476289 A CN 1476289A CN A021305013 A CNA021305013 A CN A021305013A CN 02130501 A CN02130501 A CN 02130501A CN 1476289 A CN1476289 A CN 1476289A
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- layer
- micropore
- circuit board
- substrate
- printed circuit
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- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The structure includes a substrate with a circuit layout on it and an antiwelding layer on the substrate to cover preset portion of the circuit layout. Multiple microvoids are set on this antiwelding layer in order to expose wires located below the microvoid and multiple welding pad layer is also set as it has an internal layer (copper foil) and an external layer (nickel-gold) with the internal layer being sticked at sidewall of the microvoid and being electric-connected to exposed wire below the microvoid, with the external layer being sticked on the internal layer to form the welding pad.
Description
Technical field
The present invention is relevant with electronic product, particularly about a kind of welding pad structure of printed circuit board (PCB).
Background technology
In electronics process industry now, crystal grain directly loads (Direct Chip Attach, DCA) and wafer-class encapsulation (Chip Size Package, CSP) etc. technology be widely used in make printed circuit board (PCB) (Printed Circuit Board, PCB) on.Weld pad (bondingpads) can be set on printed circuit board (PCB), make when covering brilliant the loading, naked crystalline substance can be electrically conducted with circuit board.The manufacture method of weld pad is to utilize the mode of photographic process mostly, on the welding resisting layer of printed circuit board (PCB) micropore is set, with the precalculated position of exposed circuits layout.And electronickelling on the copper cash of the circuit layout that is exposed-Jin layer, make it form aforesaid weld pad.
In aforesaid photographic process processing procedure, when Negative plate paster invested substrate, the error that must have aligning produced, and in other words, the position of aforementioned micropore can produce skew with respect to the script preposition.The method that solves aforementioned micropore skew in the prior art has two: one is a welding resisting layer definition method (soldermask define method), and another is non-welding resisting layer definition method (non-solder mask definemethod).Welding resisting layer definition method is to offer the bigger micropore in aperture on welding resisting layer, but not welding resisting layer definition method is to strengthen circuit layout in the size corresponding to the copper conductor of bond pad locations.But these two kinds of methods all have shortcoming.
Fig. 1 shows a substrate 80, has a weld pad 81 with non-welding resisting layer definition method made on it.This substrate 80 is provided with predetermined circuit layout 82, and its position at weld pad 81 has the copper conductor of large-size, and a welding resisting layer 83 covers the predetermined position of this circuit layout 82.Offer micropore 84 on this welding resisting layer 83, make the precalculated position of this circuit layout 82 expose.The parcel plating that this circuit layout 82 is exposed has one nickel-Jin layer 85, to form aforesaid weld pad 81.Shown this micropore 84 skews one preset distance among the figure, therefore, weld pad 81 is positioned at a respectively side of this micropore 84.
Fig. 2 shows that one covers brilliant 90 and is installed on this substrate 80, make projection (solder bumps) 91 connect this cover brilliant 90 with the weld pad 81 of this substrate 80.We can understand very easily, if the side-play amount of micropore 84 is bigger, then the area of weld pad 81 can reduce.Therefore, this ability of covering crystalline substance 90 and this substrate 80 of projection 91 connections also reduces thereupon.So traditional autofrettage still can make the circuit board of manufacturing have higher fraction defective.
In addition, circuit layout 82 strengthens in the size that is positioned at these weld pad 81 positions, can cause the spacing of weld pad 81 to increase, and so, in area identical, covers the projection 91 that crystalline substance 90 only can have lesser amt, perhaps must strengthen and cover brilliant 90 size.
Moreover it is after 90s to cover crystalline substance in installing, and regular meetings stockpile scaling powder residue 92, not easy-clear in the micropore 84.
Circuit board with the welding resisting layer manufactured also can produce identical problem, does not describe in detail in this appearance.
Summary of the invention
Main purpose of the present invention is to provide a kind of welding pad structure of printed circuit board (PCB), and it can solve aforesaid problem.
For achieving the above object, the welding pad structure of a kind of printed circuit board (PCB) provided by the present invention includes:
One substrate has a circuit layout, is by the formed loop of a plurality of leads;
One welding resisting layer is located on this substrate, covers the predetermined portions of this circuit layout, offers at least one micropore on this welding resisting layer, be exposed so that be positioned at the lead of this micropore below, and
At least one soldering pad layer is arranged at the sidewall of this micropore, and electrically connects with the lead that is positioned at the circuit layout that this micropore below is exposed, to form aforesaid weld pad.
Wherein this soldering pad layer includes an internal layer, is attached at the sidewall of this micropore and the lead of this circuit layout, and a skin, is attached on this internal layer.
Wherein this internal layer is a copper foil layer.
Wherein this skin is one nickel-Jin layer.
Wherein this circuit layout is positioned at the side that lead that this micropore below is exposed is positioned at this micropore, makes this substrate have the below that some is positioned at this micropore and is exposed, and this soldering pad layer has a part and is attached on this substrate that is exposed.
Wherein this circuit layout is positioned at the side that lead that this micropore below is exposed is positioned at this micropore, makes this substrate have some and is positioned at the below of this micropore and is exposed, and the internal layer of this soldering pad layer has a part and is attached on this substrate that is exposed.
Wherein this welding resisting layer is made with epoxy resin.
Wherein this substrate is made with epoxy resin.
Wherein the lead of the aperture of this micropore and this circuit layout is measure-alike.
Description of drawings
Below lift a preferred embodiment, conjunction with figs., the present invention is further illustrated, wherein:
Fig. 1 is the welding spot structure on the known printed circuit board (PCB).
Fig. 2 shows that one covers the situation that crystalline substance is installed in the known printed circuit board (PCB) of Fig. 1.
Fig. 3 is the generalized section of a preferred embodiment of the present invention.
Fig. 4 is the generalized section of a preferred embodiment of the present invention, shows that one covers brilliant installing thereon.
Fig. 5 is the flow chart of manufacturing preferred embodiment of the present invention, and
Fig. 6 is the another kind of flow chart of making preferred embodiment of the present invention.
Embodiment
See also shown in Figure 3ly, the welding pad structure of the printed circuit board (PCB) that a preferred embodiment of the present invention provided includes:
One substrate 10, (multi-function epoxy resin) is manufacturing materials with multi-functional epoxy resin, which is provided with a circuit layout 20, for by the formed loop of a plurality of copper conductors, and a welding resisting layer 30, covers the predetermined portions of this circuit layout 20.This welding resisting layer 30 also is that multi-functional epoxy resin is made.Printed circuit board (PCB) of the present invention can be a single-layer printed circuit plate, also can be a multilayer board certainly.
This welding resisting layer 30 is provided with a plurality of micropores 31 on the precalculated position, to expose the predetermined portions of this circuit layout 20.Same these micropores 31 of demonstration produce skew because of the photographic process processing procedure among Fig. 3, and therefore, the part that this circuit layout 20 is exposed is positioned at a respectively side of this micropore 31.
Part (also can be positioned on this substrate 10 that is exposed below these micropores 31 sometimes) in that sidewall and this circuit layout 20 of these micropores 31 is exposed is respectively equipped with a soldering pad layer 40, and itself and this circuit layout 20 is the state of electric connection.Each soldering pad layer 40 has an internal layer 41 and a skin 42.This internal layer 41 can be a copper foil layer, be attached at the sidewall of these micropores 31 and the part that this circuit layout 20 is exposed, sometimes also can be attached at and be positioned on this substrate 10 that these micropore 31 belows are exposed (when the side-play amount of these micropores 31 excessive, when causing this substrate 10 to have some can being exposed to the below of these micropores 31), and should can be nickel-Jin layer by skin 42, be attached on this internal layer 41, so, and form aforesaid weld pad 21.
The invention has the advantages that:
Even weld pad 21 provided by the present invention as long as this circuit layout 20 has some at least and is arranged in this micropore 31, so that this soldering pad layer 40 can electrically conduct with this circuit layout 20, can be finished in the position deviation precalculated position of 1 these micropores 31.So, make printed circuit board (PCB) of the present invention, the yield of processing procedure is significantly improved.
2, the position of weld pad 21 of the present invention is the position of these micropores 31, and the part that indefinite this circuit layout 20 that is positioned at these micropore 31 belows is exposed.That is the area of weld pad 21 of the present invention is relevant with the size of these micropores 31, but irrelevant with the side-play amount of these micropores 31.Therefore, when covering brilliant 70 when being installed on the substrate 10 of the present invention with one, projection 71 can engage with all areas of this soldering pad layer 40, and so, weld pad 21 of the present invention can provide firm state to link substrate 10 and cover crystalline substance 70.Moreover, also can not accumulate the residue of scaling powder in the weld pad 21.
3, weld pad 21 structures of the present invention do not need or not to add the size of large micropore 31 as increasing the size of the copper conductor of circuit layout 20 in the technology commonly used yet.The size of this copper conductor can approximately equate with this micropore 31.Therefore, the spacing of the weld pad on substrate 10 21 can be dwindled.So, this substrate 10 also can correspondingly dwindle with the size that this covers brilliant 70.
Following inventor provides two preparation methods, how to make weld pad of the present invention in order to explanation:
Method one sees also shown in Figure 5:
1, prepares substrate 10 in advance, have the predetermined portions that circuit layout 20 and welding resisting layer 30 cover this circuit layout on it.This welding resisting layer 30 offers some micropores 31, to expose the predetermined portions of this circuit layout 20.
2, with the electroless copper method one bronze medal layer 41 is set on this welding resisting layer 30, this copper layer 41 is except that the surface that is attached at this welding resisting layer 30, the sidewall and this circuit layout 20 that also are attached at these micropores 31 are positioned at the part that these micropore 31 belows are exposed, as previously mentioned, when the side-play amount of these micropores 31 was big, this copper layer 41 also can be attached at this substrate 10 and be positioned at the part that these micropore 31 belows are exposed.
3, a cover layer 50 is set and covers these micropores 31, the part that also this copper layer 41 is exposed removes afterwards.
4, remove this cover layer 50.
5, electronickelling-Jin layer 42 is on this copper layer 41.Become weld pad 21 of the present invention so at once.
Method two sees also shown in Figure 6:
1, prepares substrate 10 in advance, have the predetermined portions that circuit layout 20 and welding resisting layer 30 cover this circuit layout on it.This welding resisting layer 30 offers some micropores 31, to expose the predetermined portions of this circuit layout 20.
2, with the electroless copper method one bronze medal layer 41 is set on this welding resisting layer 30, this copper layer 41 is except that the surface that is attached at this welding resisting layer 30, the sidewall and this circuit layout 20 that also are attached at these micropores 31 are positioned at the part that these micropore 31 belows are exposed, as previously mentioned, when the side-play amount of these micropores 31 was big, this copper layer 41 also can be attached at this substrate 10 and be positioned at the part that these micropore 31 belows are exposed.
3, a cover layer 60 is set and covers these welding resisting layers 30, and will cover layers 60 corresponding to etc. the part of micropore 31 remove.
4, electronickelling-Jin layer 42 is arranged in the part that these little bundles 31 are exposed in this copper layer 41.
5, remove Zou's part that this cover layer 60 and this copper layer 41 expose.So promptly finish weld pad 21 of the present invention.
What will propose to illustrate at last be that in the first two preparation process, this nickel-Jin layer 42 can be electroplated or chemical deposition is arranged on this copper layer 41.Yet with the formed nickel of chemical deposition-Jin layer 42, its thickness is less, as must obtaining the bigger skin of thickness 42, can be on chemical nickel-Jin layer re-plating one gold medal layer, or directly use galvanoplastic that this nickel-Jin layer is set.
In addition, the welding pad structure of the printed circuit board (PCB) that provided of invention is in order to making this printed circuit board (PCB) be connected to other circuit via these weld pads 21, and its purposes is not that brilliant using covered in the installing that only is confined to described in the specification.
Claims (9)
1, a kind of welding pad structure of printed circuit board (PCB) includes:
One substrate has a circuit layout, is by the formed loop of a plurality of leads;
One welding resisting layer is located on this substrate, covers the predetermined portions of this circuit layout, offers at least one micropore on this welding resisting layer, be exposed so that be positioned at the lead of this micropore below, and
At least one soldering pad layer is arranged at the sidewall of this micropore, and electrically connects with the lead that is positioned at the circuit layout that this micropore below is exposed, to form aforesaid weld pad.
According to the welding pad structure of the described printed circuit board (PCB) of claim 1, it is characterized in that 2, wherein this soldering pad layer includes an internal layer, be attached at the sidewall of this micropore and the lead of this circuit layout, and a skin, be attached on this internal layer.
According to the welding pad structure of the described printed circuit board (PCB) of claim 2, it is characterized in that 3, wherein this internal layer is a copper foil layer.
According to the welding pad structure of the described printed circuit board (PCB) of claim 2, it is characterized in that 4, wherein this skin is one nickel-Jin layer.
5, according to the welding pad structure of the described printed circuit board (PCB) of claim 1, it is characterized in that, wherein this circuit layout is positioned at the side that the lead that is exposed below this micropore is positioned at this micropore, make this substrate have the below that some is positioned at this micropore and be exposed, this soldering pad layer has a part and is attached on this substrate that is exposed.
6, according to the welding pad structure of the described printed circuit board (PCB) of claim 2, it is characterized in that, wherein this circuit layout is positioned at the side that the lead that is exposed below this micropore is positioned at this micropore, make this substrate have some and be positioned at the below of this micropore and be exposed, the internal layer of this soldering pad layer has a part and is attached on this substrate that is exposed.
According to the welding pad structure of the described printed circuit board (PCB) of claim 1, it is characterized in that 7, wherein this welding resisting layer is made with epoxy resin.
According to the welding pad structure of the described printed circuit board (PCB) of claim 1, it is characterized in that 8, wherein this substrate is made with epoxy resin.
According to the welding pad structure of the described printed circuit board (PCB) of claim 1, it is characterized in that 9, wherein the lead of the aperture of this micropore and this circuit layout is measure-alike.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021305013A CN1476289A (en) | 2002-08-15 | 2002-08-15 | Welding pad structure of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021305013A CN1476289A (en) | 2002-08-15 | 2002-08-15 | Welding pad structure of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1476289A true CN1476289A (en) | 2004-02-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA021305013A Pending CN1476289A (en) | 2002-08-15 | 2002-08-15 | Welding pad structure of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1476289A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008151472A1 (en) * | 2007-06-15 | 2008-12-18 | Princo Corp. | Multilayer board surface-treated configuration and the producing method thereof |
| CN102598323A (en) * | 2010-01-28 | 2012-07-18 | 旭硝子株式会社 | Substrate for mounting light emitting element, method for producing same, and light emitting device |
| US8294039B2 (en) | 2007-05-25 | 2012-10-23 | Princo Middle East Fze | Surface finish structure of multi-layer substrate and manufacturing method thereof |
| CN113498272A (en) * | 2020-03-20 | 2021-10-12 | 点序科技股份有限公司 | Design method of printed circuit board |
-
2002
- 2002-08-15 CN CNA021305013A patent/CN1476289A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8294039B2 (en) | 2007-05-25 | 2012-10-23 | Princo Middle East Fze | Surface finish structure of multi-layer substrate and manufacturing method thereof |
| WO2008151472A1 (en) * | 2007-06-15 | 2008-12-18 | Princo Corp. | Multilayer board surface-treated configuration and the producing method thereof |
| CN102598323A (en) * | 2010-01-28 | 2012-07-18 | 旭硝子株式会社 | Substrate for mounting light emitting element, method for producing same, and light emitting device |
| CN113498272A (en) * | 2020-03-20 | 2021-10-12 | 点序科技股份有限公司 | Design method of printed circuit board |
| CN113498272B (en) * | 2020-03-20 | 2022-11-22 | 点序科技股份有限公司 | Design method of printed circuit board |
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| WD01 | Invention patent application deemed withdrawn after publication |