CN1470354A - Method for cutting cross-cutting board by pulse laser - Google Patents

Abstract

The invention refers to laser processing craft. It uses pulse laser to cut mould, bores a string of overlapped holes, there remains several protrudent line, its face matches with the knife, the tip is easy to be reformed and adjusted and can avoid that the clamping force is too big or too small. In the invention, the space occupying rate 45-95%, the repeated frequency is 5-60Hz, the average power of the pulse laser is 700-1600W.

Description

Method with cutting cross-cutting board by pulse laser

Technical field: the invention belongs to the laser processing technology class, it is specifically related to inlay with pulse laser processing die cutting plate the method in cutter linear slit crack.

Background technology: die cutting plate is a product essential on the printing packaging industry, be the package paper box that to print, the tool parts that carton downcuts from the raw material paper wood, die cutting plate adopts the glued board of multilayer, plane is arranged, the semicircle cartridge type is also arranged, the cutter of cut paper is embedded in the slit that die cutting plate cuts in advance, the cutter of cut paper claims the cutter line, it has the gauge of standard, be embedded in cutter line on the die cutting plate and often be at a high speed duty in large quantity, so the cutter line quality of inlaying on die cutting plate directly influences quality, precision and the efficient of die cutting operation.Slit on the die cutting plate should be the rectangular through-hole of standard very, and its conventional method is to make by hand, not only big, the invasion that is subjected to dust and noise of labour intensity of operator, but the die cutting plate low precision of making, repeatability are low.After popularizing, laser technology just obtains the change of essence in recent years.Generally all be to use continuous laser cutting slit, the characteristics of its technology are the production efficiency height, dimensional accuracy and form accuracy are good, steady quality and good reproducibility, therefore the method with the continuous laser cutting cross-cutting board obtains very fast development, produced bigger economic benefit and social benefit, promoted the technological progress of packaging industry, made the packing of product class of China improve major step.But also come with some shortcomings with continuous laser processing, be subjected to all multifactor impacts in the laser processing procedure, tension or the phenomenon of pine may appear in the inlaying of cutter line, if there is the situation of pine may make the cutter line loosening or come off, also may occur rocking, make the crooked quality that influences of cutter line; If when cooperating tension, because the interference of many places is arranged on multi-joint plate, can make the die cutting plate warpage play distension, the lighter influences the die cutting operation quality, and weight person's die cutting plate has just been scrapped.

Summary of the invention:------uses the method for cutting cross-cutting board by pulse laser to propose this programme for the technical problem of further solution continuous laser processing die cutting plate existence is special, the change of processing method can improve the quality of die cutting plate, and what make cutter line and slit cooperates degree of tightness moderate.

By as above design, the method with pulse laser processing die cutting plate that this programme provided includes with laser instrument processes die cutting plate, and what it is characterized in that its employing is the slit that pulse type laser is processed dress cutter line on the die cutting plate, and its basic parameter is as follows:

The dutycycle of pulse laser is 45～95%;

The repetition rate of pulse laser is 5～60Hz;

The average output power of pulse laser is 700～1600W.

In this programme, the die cutting plate that it was processed can be plate, also can be the semicircle cartridge type.

Adopt this programme can embody following superiority: 1. to be actually punching continuously on die cutting plate with pulse laser processing, certain lap is arranged between each hole, remove the crest line that promptly stays many face of cylinder intersections behind the material in the hole, the enveloping surface line of these crest lines forms two planes that cooperate with the cutter line, owing to be on small size, to produce certain interference between them, in the crest line both sides very big space is arranged, make the wooden adjustment that certain elastic deformation and self-alignment are arranged at crest line place, can produce enough clamping forces and also can not make die cutting plate produce buckling deformation; The size that 2. processing of a plurality of parameter influences can be arranged in the laser technology process, as the size of the speed of pulse, pulse duty factor, the amount of feeding, laser power etc., therefore fine setting parameter as above can be sought desirable clamping force; 3. smooth on the cut surface of gained in continuous laser processing, but it is several outstanding high points with cooperating of cutter line, and the position distribution of these points is at random fully, and be many uniform crest lines with cut surface and the cutter line contact position that pulse laser processes, the stability of its cooperation than continuous laser processing will be good many; 4. it has easy operation, can boost productivity and reduce cost, and is a kind of superior technical scheme, is worth of widely use.

Description of drawings:

The schematic diagram in Fig. 1 overlapping hole that to be this programme cut with the method for cutting cross-cutting board by pulse laser.

Fig. 2 is the schematic diagram of pulse laser dutycycle data experiment situation.Wherein abscissa is a dutycycle numerical value, combines coordinate and is the wide numerical value of seam.

Fig. 3 is the schematic diagram of pulse laser repetition rate data experiment situation.Wherein abscissa is a laser frequency numerical value, combines coordinate and is the wide numerical value of seam.

Concrete embodiment: this programme is to using the improvement of continuous laser cutting die cutting plate method in the prior art.It is to adopt pulse laser to get a plurality of holes that certain lap is arranged continuously on die cutting plate, make and stayed many crest lines uniformly in the groove of cutting, these crest lines have formed two faces that contact with the cutter line, because the both sides of crest line protruding tip have very big space, therefore each tip can easily produce strain when contacting with the cutter line, can adjust automatically, avoid occurring the phenomenon of tension, owing in laser processing procedure, there are a lot of parameters can both influence the size of processing, repetition rate as pulse laser, the average output power of the duty of pulse laser pulse is when finely tuned above-mentioned parameter and just can be sought the wide size of desirable seam.

The major parameter that uses in this programme is:

The dutycycle of pulse laser is 45～95%;

The repetition rate of pulse laser is 5～60Hz;

The average output power of pulse laser is 700～1600W.

Dutycycle was defined as in the cycle of a light pulse, bright dipping time and the light pulse ratio of cycle time.In experiment, get 5 groups of data, be that dutycycle is 50,60,70,80,90%, can be observed, also increasing with its width of slit of raising of dutycycle by Fig. 2, reason is that the mean power along with the raising of dutycycle output is also improving, so the width of joint-cutting is also increasing.And the upper and lower opening variation tendency of otch is identical.Show among the figure that dutycycle is an optimum value about 70%.For pulse laser, the speed of pulse is that repetition rate also is an important parameter, the different cutting effects of value differ greatly, in experiment, also get 5 groups of data, be that repetition rate is 10,20,30,40,50Hz, by observing among Fig. 3, raising along with repetition rate, width of slit broadens gradually, and its reason is along with its mean power of raising of repetition rate is also improving, and has a notable attribute to be no matter how many values of repetition rate is, the size of joint-cutting upper and lower opening is all the same, in other words, it is wide that the change repetition rate can change seam, but can not change the feature of rectangular slits.When repetition rate for 20Hz time seam wide be about 1.5mm.In sum, can obtain comparatively desirable numerical value by adjusting each above-mentioned parameter, the clamping force that can reach the tool setting line is moderate, to improve the crudy of die cutting plate.

Claims (2)

1. method with cutting cross-cutting board by pulse laser, it includes with laser instrument and processes die cutting plate, and what it is characterized in that its adopts is the slit that pulse type laser is processed dress cutter line on the die cutting plate, and its basic parameter is as follows:

The dutycycle of pulse laser is 45～95%;

The repetition rate of pulse laser is 5～60Hz;

The average output power of pulse laser is 700～1600W.

2. according to the described processing method of claim 1, it is characterized in that the die cutting plate that it is processed can be plate, also can be the semicircle cartridge type.

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