CN1459839A - 测定引线接合器上的矢量距离的方法及装置 - Google Patents
测定引线接合器上的矢量距离的方法及装置 Download PDFInfo
- Publication number
- CN1459839A CN1459839A CN03107306A CN03107306A CN1459839A CN 1459839 A CN1459839 A CN 1459839A CN 03107306 A CN03107306 A CN 03107306A CN 03107306 A CN03107306 A CN 03107306A CN 1459839 A CN1459839 A CN 1459839A
- Authority
- CN
- China
- Prior art keywords
- optical fiber
- capillary
- glass optical
- light
- identification system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000013598 vector Substances 0.000 title claims description 19
- 238000000034 method Methods 0.000 title claims description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title 1
- 230000003287 optical effect Effects 0.000 claims abstract description 35
- 239000013307 optical fiber Substances 0.000 claims description 48
- 239000011521 glass Substances 0.000 claims description 45
- 239000000835 fiber Substances 0.000 claims description 10
- 239000003365 glass fiber Substances 0.000 abstract 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000011514 reflex Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01066—Dysprosium [Dy]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Optical Couplings Of Light Guides (AREA)
- Wire Bonding (AREA)
Abstract
为了测定引线接合器的毛细管(5)的尖端与图像识别***之间的矢量距离D,被施加光线的玻璃光纤(10)被用作一个参考点,同时也作为一个传感器。一方面,通过作为参考点的玻璃光纤(10)可以确定图像识别***光轴(8)的位置。另一方面,通过作为传感器的玻璃光纤(10)可以确定毛细管(5)尖端的位置。这时接合头所处的位置就是使在毛细管(5)尖端形成的引线球(17)反射回玻璃光纤(10)的光强最大的位置。
Description
技术领域:
本发明涉及一种用于测定引线接合器的毛细管(capillary)和其图像识别***之间的矢量距离的方法,以及引线接合器中用于此目的的装置。
背景技术:
引线接合器是一种用于在装配之后将半导体芯片在基片上进行布线的自动机器。引线接合器上具有毛细管,它被夹在一个角(horn)的尖端上。这个毛细管用于将引线固定到半导体芯片上的一个连接点上,并且固定到基片上的一个连接点上,同时引导两个连接点之间的布线。为了让毛细管能接触到连接点上正确的位置,在连接之前要通过图像识别***测定这两个连接点的位置。但是,在操作的过程中存在一个问题,那就是毛细管和图像识别***的光轴之间的距离会由于热效应而发生不可预知的变化。因此,这一距离需要连续不断的再校准。
发明内容:
本发明的目的是提供一种测量***,通过它可以简单并且可靠地测量毛细管和图像识别***光轴之间的距离。
这一指定的任务可以通过权利要求1和3的技术特征来解决。
依照本发明,为了测定引线接合器的毛细管和图像识别***的光轴之间的矢量距离D,需要用到一个有入射光的玻璃光纤,它既作为参考点同时也作为传感器。一方面,作为参考点的玻璃光纤的端点可以测定图像识别***的光轴的位置。另一方面,作为传感器的玻璃光纤的端点可以测定毛细管尖端的位置,确定在接合头的什么位置上毛细管尖端上形成的引线球反射到玻璃光纤中的光线强度最大。测定矢量距离D包含以下步骤:
-在毛细管的尖端形成一个引线球;
-移动接合头使毛细管移至玻璃光纤的一个端点的上方,光线由光源射入到光纤的另一个端点,以测定接合头所处的第一个坐标点,在该位置使得引线球反射回光纤中的光强最大;
-移动接合头,以使光纤的一个端点移动到图像识别***的观测区内,并测定接合头所处的第二个坐标点,在该位置使得图像识别***的光轴穿过玻璃光纤的中心;
-测定第一、第二坐标点之间的矢量距离D。
附图说明:
下面通过附图详细、具体说明本发明的实施例,附图并不是按照规定比例绘制的。
如图所示:
图1:具有毛细管、图像识别***和用于测定毛细管与图像识别***的光轴之间的矢量距离的装置的引线接合器的接合头的平面视图,以及
图2:该装置的截面图。
具体实施方式:
图1表示了引线接合器的接合头1的平面视图。接合头1包含了一个可以在水平轴上旋转的摇杆2。摇杆2上连有一个角4,超声波换能器3可以向其施加超声波。在角4的尖端夹着一个毛细管5。毛细管5用于将引线固定到半导体芯片上的连接点上,并固定到基片上指定的连接点上,同时引导两个连接点之间的布线。接合头1可以使毛细管5在由x和y两个坐标轴确定的平面6上移动,而摇杆2可以使毛细管在垂直于平面6的方向上移动。另外,引线接合器还包含一个图像识别***,它的观测区对着平面6,用于测量半导体芯片上的连接点以及基片上的连接点的位置。该图像识别***包含一个摄像头7及图像分析***。该图像识别***具有一个垂直于平面6的光轴8。在所示实施例中,摄像头7固定到接合头1上,其观测区直接对着平面6。在此例中,图像识别***的光轴8与摄像头7的光轴相一致。但是,还可能需要用到如透镜、平面镜及棱镜等其它光学元件。这些元件将用于引导光线的路径和/或可以改变图像识别***观测区的大小。
例如,接合头1在一个预先抽成真空的空气轴承上滑动,此空气轴承设置在滑动板9上。由EP 317 787已知这种能通过两个电磁驱动器在x或y方向上可移动的接合头1。由EP 1 098 356已知这种具有线性的、可旋转的驱动器使毛细管5在平面6上移动的其它接合头1。但是还已知通过x-y表来移动接合头1。接合头1在平面6中的位置可以通过测量***以已知的方法得到,例如通过光学测量***。
对本发明的说明基于笛卡尔xy坐标系。为了使毛细管5可以始终位于各个连接点正确的位置上,首先通过图像识别***确定接合头1坐标(x1,y1),使得在这一坐标点上图像识别***的光轴8穿过连接点上的毛细管5所希望的作用点。通过加上一个矢量D=(dx,dy),由坐标(x1,y1)得到了接合头所处的另一个坐标(x2,y2),使得毛细管5的尖端压紧到所希望的作用点,其中的矢量D是指毛细管5的尖端与图像识别***光轴8之间的矢量距离:
(x2,y2)=(x1,y1)+(dx,dy)。
在生产过程中,矢量D会发生不可预料的变化。因此,重复再校准矢量距离D是必要的。由于毛细管5位于图像识别***观测区之外,毛细管5尖端的位置不能直接由图像识别***确定。因此,本发明提供了一种用于测定矢量D=(dx,dy)的装置,它包含光导玻璃光纤10,通过该光纤可以测定图像识别***光轴8的坐标(xA,yA)及毛细管5尖端的坐标(xC,yC)。
图2表示了该装置的截面图。这一装置基本上包含了以下元件:玻璃光纤10,光源11,光线分离器12和光接收机13。玻璃光纤10可以双向传导光线。光源11发射的光线通过一个光学***馈入到玻璃光纤10的一个端点15中,该光学***至少包含一个透镜14。这样来设置玻璃光纤10,使得从光纤的另一个端点16射出的光线与平面6呈直角。毛细管5尖端的引线形成一个被称作露空球(free air ball)的球17,当毛细管移动到玻璃光纤10上方的时候,引线球17会将玻璃光纤10射出的光线部分反射回玻璃光纤10。位于光源11和玻璃光纤的端点15之间的光线分离器12用于在空间上将反射回的光线和光源11的发射光线分离开,这样,通过光接收机13就可以测量由引线球17反射到玻璃光纤10中的光强。光线的方向通过图中的箭头来表示。该装置的光学效率在当光线分离器12透射50%的入射光,反射50%的入射光的时候达到最大。当光源11发射的光强及光接收机的灵敏度足够大的时候,光线分离器12可以采用一个设置成45度角的普通玻璃板。众所周知,玻璃板透射光和反射光光强的比值大约在4%左右。因此,与使用50∶50的光线分离器相比,使用普通的玻璃板时光学效率将会下降6.5倍。为了提高测量***的效率,光源11最好经过调制,或者间歇性的发送脉冲,此时光接收机13要与之同步。
在本例中玻璃光纤10使用的是单模光纤,其纤芯的直径只有大约4.5μm。由于引线球17的表面是球形的,当引线球的中心移动到玻璃光纤10的正上方的时候,反射到玻璃光纤10中的光线最强。由于这个原因,在测量过程中,应尽可能地将引线头17移近玻璃光纤10。最好是玻璃光纤10的端点16与滑动板9的表面一齐移动。
可以通过以下步骤测定矢量D=(dx,dy):
1.在毛细管5的尖端形成引线球17。
2.接合头1将毛细管5移动到玻璃光纤10的上方。在这一过程中,可以连续测量接合头1的坐标(x,y)及反射光的光强I(x,y),并存储测量结果。然后,通过光强分布I(x,y)确定接合头1所处的坐标位置(xC,yC),在这一坐标点上反射光的光强最大。
3.移动接合头1,直至玻璃光纤10移动到图像识别***的观测区内。在摄像头7提供的图像中,玻璃光纤10的纤芯显示为一个圆形的区域,它明显地区别于包围着纤芯的玻璃光纤其余部分。通过摄像头7提供的图像来确定接合头1所处的坐标位置(xA,yA)。在这一坐标点上,图像识别***的光轴8穿过玻璃光纤10纤芯的中心。
4.这时可以通过下式计算矢量D:
D=(dx,dy)=(xC,yC)-(xA,yA)
即dx=xC-xA及dy=yC-yA。
步骤2中(xC,yC)坐标值的测定例如通过以下方法进行:接合头1以预先设定的步长Δx和Δy扫描玻璃光纤10,其中每移动一个步长,就可以测得接合头1所在位置的坐标值及光接收机13的输出信号I,由此,通过确定测量值为最大的位置就可以确定坐标(xC,yC)。
在步骤3中测定坐标值(xA,yA)最好是在光源11没有向玻璃光纤10施加光线的情况下完成,即此时光源11是关闭的。
建议应该对距离D定期进行校准。所以,测量***最好固定安装在引线接合器上。
以上介绍了对于接合头的新的校准过程,接合头通过两个排列在x和y方向上的驱动器可以在xy平面上移动。对于旋转的接合头,可以通过类似的方法完成校准过程。对于旋转的接合头,需要使用不同于笛卡尔坐标x和y的其他坐标系,因此矢量D的计算就有所不同了。
本例中描述的装置由普通的纤维光学元件组成:玻璃光纤10,光线分离器12,透镜14。全光纤光学解决方案也是可行的,其中玻璃光纤和光纤分离器为单光纤光学元件。对于光源11,例如可以在光纤光学元件处连接一个所谓的引线二极管(pigtail diode),可以省略掉透镜14。
Claims (4)
1.引线接合器,具有用于测定引线接合器的毛细管(5)的尖端与引线接合器的图像识别***的光轴(8)之间的矢量距离的装置,该装置包含:玻璃光纤(10),向玻璃光纤(10)施加光线的光源(11),光线分离器(12)和光接收机(13),光线分离器(12)位于光源(11)和玻璃光纤(10)的第一个端点(15)之间,用于在空间上使馈入到玻璃光纤(10)中的光线与从玻璃光纤(10)射出的光线相分离,其中,玻璃光纤(10)的第二个端点(16)一方面作为确定图像识别***的光轴(8)位置的参考点,另一方面用于测定毛细管(5)尖端的位置。
2.如权利要求1所述的引线接合器,其特征在于,玻璃光纤(10)和光线分离器(12)为单光纤光学元件。
3.用于测定引线接合器的毛细管(5)的尖端与引线接合器图像识别***的光轴(8)之间的矢量距离的方法,其中,毛细管(5)和图像识别***的光轴(8)可以通过接合头(1)在一个平面上一同移动,包含以下步骤:
-在毛细管(5)的尖端形成一个引线球(17);
-这样来移动接合头(1),使得毛细管(5)移动到玻璃光纤(10)的第一个端点(16)的上方,光源(11)将光线射入到玻璃光纤的第二个端点(15),以测定接合头(1)所处的第一个坐标点,在该位置使得引线球(17)反射回玻璃光纤(10)中的光强达到最大值;
-移动接合头(1),使得玻璃光纤(10)的第一个端点(16)移动到图像识别***的观测区内,并测定接合头(1)所处的第二个坐标点,在该位置使得图像识别***的光轴(8)穿过玻璃光纤(10)的中心;并且
-确定第一个坐标点和第二个坐标点之间的矢量距离D。
4.如权利要求3所述的方法,其特征在于,在测定第二点坐标时,光源是关闭的。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH20020487/02 | 2002-03-19 | ||
CH20020487/2002 | 2002-03-19 | ||
CH4872002 | 2002-03-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1459839A true CN1459839A (zh) | 2003-12-03 |
CN1291470C CN1291470C (zh) | 2006-12-20 |
Family
ID=27810656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031073069A Expired - Fee Related CN1291470C (zh) | 2002-03-19 | 2003-03-19 | 测定引线接合器上的矢量距离的方法及装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6857554B2 (zh) |
KR (1) | KR20030076285A (zh) |
CN (1) | CN1291470C (zh) |
DE (1) | DE10313141A1 (zh) |
TW (1) | TWI221648B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102760678A (zh) * | 2011-04-28 | 2012-10-31 | 北京中电科电子装备有限公司 | 一种偏置漂移主动纠正***、方法及引线键合机 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7523848B2 (en) * | 2001-07-24 | 2009-04-28 | Kulicke And Soffa Industries, Inc. | Method and apparatus for measuring the size of free air balls on a wire bonder |
KR20040089480A (ko) * | 2003-04-14 | 2004-10-21 | 에섹 트레이딩 에스에이 | 모세관과 이미지 인식 시스템 사이의 벡터 거리를결정하는 장치를 갖는 와이어 본더 및 그 방법 |
JP4530984B2 (ja) * | 2005-12-28 | 2010-08-25 | 株式会社新川 | ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法 |
CN103107111B (zh) * | 2011-11-11 | 2017-03-01 | 飞思卡尔半导体公司 | 用于监测线接合中无空气球(fab)形成的方法和装置 |
US8777086B2 (en) * | 2012-04-20 | 2014-07-15 | Asm Technology Singapore Pte. Ltd. | Image-assisted system for adjusting a bonding tool |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3840169A (en) * | 1971-01-27 | 1974-10-08 | Inforex | Automatic bonding apparatus with multiple bonding heads |
US4445633A (en) * | 1982-02-11 | 1984-05-01 | Rockwell International Corporation | Automatic bonder for forming wire interconnections of automatically controlled configuration |
JPS6362242A (ja) * | 1986-09-02 | 1988-03-18 | Toshiba Corp | ワイヤボンディング装置 |
US5037023A (en) * | 1988-11-28 | 1991-08-06 | Hitachi, Ltd. | Method and apparatus for wire bonding |
JP3101854B2 (ja) * | 1994-04-27 | 2000-10-23 | 株式会社新川 | ワイヤボンデイング装置 |
JP3472672B2 (ja) | 1996-12-26 | 2003-12-02 | 矢崎総業株式会社 | 端子のハウジングへの固定構造 |
JP3416091B2 (ja) | 2000-01-21 | 2003-06-16 | 株式会社新川 | ボンディング装置およびボンディング方法 |
-
2003
- 2003-03-05 TW TW092104694A patent/TWI221648B/zh active
- 2003-03-10 KR KR10-2003-0014797A patent/KR20030076285A/ko not_active Application Discontinuation
- 2003-03-17 DE DE10313141A patent/DE10313141A1/de not_active Withdrawn
- 2003-03-18 US US10/391,410 patent/US6857554B2/en not_active Expired - Fee Related
- 2003-03-19 CN CNB031073069A patent/CN1291470C/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102760678A (zh) * | 2011-04-28 | 2012-10-31 | 北京中电科电子装备有限公司 | 一种偏置漂移主动纠正***、方法及引线键合机 |
CN102760678B (zh) * | 2011-04-28 | 2014-07-16 | 北京中电科电子装备有限公司 | 一种偏置漂移主动纠正***、方法及引线键合机 |
Also Published As
Publication number | Publication date |
---|---|
TW200304685A (en) | 2003-10-01 |
US6857554B2 (en) | 2005-02-22 |
DE10313141A1 (de) | 2003-10-30 |
KR20030076285A (ko) | 2003-09-26 |
CN1291470C (zh) | 2006-12-20 |
US20030178469A1 (en) | 2003-09-25 |
TWI221648B (en) | 2004-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1068677C (zh) | 原子力显微镜 | |
US7221177B2 (en) | Probe apparatus with optical length-measuring unit and probe testing method | |
KR100516492B1 (ko) | 와이어 본딩방법 및 장치 | |
JP4128540B2 (ja) | ボンディング装置 | |
US7508513B2 (en) | Measuring apparatus and measuring method | |
US20100301101A1 (en) | Bonding apparatus and bonding stage height adjustment method for the bonding apparatus | |
US7523848B2 (en) | Method and apparatus for measuring the size of free air balls on a wire bonder | |
CN108172527A (zh) | 一种光学检测*** | |
JP2018084504A (ja) | ボンディング装置およびボンディング対象物の高さ検出方法 | |
US20040013347A1 (en) | Optical switch and adjustment method thereof | |
CN1291470C (zh) | 测定引线接合器上的矢量距离的方法及装置 | |
CN1727933A (zh) | 具有用于对准的耦合特征的光电组件 | |
CN115799146B (zh) | 一种光学对位*** | |
US7145162B2 (en) | Wire loop height measurement apparatus and method | |
US7106426B2 (en) | Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalk | |
US20060209396A1 (en) | Monitoring device | |
US5324954A (en) | Systems for adjusting and evaluating positional relationship between light-receiving element and optical fiber | |
CA2187961A1 (en) | Method and apparatus for alignment and bonding | |
JPH0980250A (ja) | 光ファイバ接続の自動位置合わせ機構 | |
CN112485272B (zh) | 半导体检测装置及检测方法 | |
US20040012784A1 (en) | Die attach process using cornercube offset tool | |
CN1551318A (zh) | 具有校准设备的引线接合器及方法 | |
CN1835199A (zh) | 蚀刻监测装置及方法 | |
JP3093073B2 (ja) | 光コネクタのコア位置測定装置 | |
CN115876439A (zh) | 一种用于moems扫描微镜的光学偏转角测试方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061220 Termination date: 20100319 |