CN1438930A - Polishing sheet and method of manufacturing the sheet - Google Patents

Polishing sheet and method of manufacturing the sheet Download PDF

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Publication number
CN1438930A
CN1438930A CN01811995A CN01811995A CN1438930A CN 1438930 A CN1438930 A CN 1438930A CN 01811995 A CN01811995 A CN 01811995A CN 01811995 A CN01811995 A CN 01811995A CN 1438930 A CN1438930 A CN 1438930A
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CN
China
Prior art keywords
sheet
grinding
mentioned
fibre bundle
abrasive sheet
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Pending
Application number
CN01811995A
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Chinese (zh)
Inventor
多久智
泉敏裕
小林俊裕
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Nihon Micro Coating Co Ltd
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Nihon Micro Coating Co Ltd
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Application filed by Nihon Micro Coating Co Ltd filed Critical Nihon Micro Coating Co Ltd
Publication of CN1438930A publication Critical patent/CN1438930A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02Backings, e.g. foils, webs, mesh fabrics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28Resins or natural or synthetic macromolecular compounds

Abstract

A polishing sheet (10) not deforming with elapse of time in use and capable of uniformly flattening a polished surface at a high polishing rate and a method of manufacturing the sheet; the polishing sheet (10), comprising a fabric sheet (12) formed of one piece of fiber (13), a fiber bundle (13) formed of a plurality pieces of fibers bundled with each other, or a fiber bundle (13) formed of a plurality of fiber bundles each formed of the plurality pieces of fibers bundled with each other and a resin (14) for fixing the fibers or the fiber bundles (13) of the fabric sheet with each other, wherein the sheet (10) is fixed to the front surface of a lining sheet (15), and the number of satins should desirably be within the range of 3 to 15.

Description

Abrasive sheet and manufacture method thereof
Technical field
The present invention relates to require the grinding object of apparent height flatness to carry out abradant abrasive sheet and manufacture method thereof, especially relate to and be suitable for abrasive sheet and the manufacture method thereof that the chemistry mechanicalness is ground semiconductor wafer, liquid crystal glass base, rigid disk substrate, magnetic head substrate etc.
Background technology
Semiconductor wafer, liquid crystal glass base, rigid disk substrate, magnetic head etc. require the grinding of the grinding object of apparent height flatness, use the chemistry mechanicalness to grind (CPM) method.
The CMP method is to grind with the lapping liquid that contains with the composition that grinds object surface chemically reactive, carry out chemical etching or grinding object surface generation complex compound or oxide grinding the object surface, and with containing the Ginding process that the free abrasive that is immersed in the lapping liquid carries out the mechanicalness grinding, adopt the CPM method, can carry out very trickle grinding, have the advantage that can make the apparent height planarization.
For example, in the field of semiconductor device, because the high capacity of device, multilayer wired technology is very important.This multilayer wired specification requirement substrate has the flatness of height.This is because substrate is uneven can to produce step, can produce the unfavorable condition that makes the distribution broken string that is formed on this step, the cause of the distribution design performance that can not get stipulating.Therefore, in order to make the wafer that is formed with wiring graph and dielectric film smooth, adopt above-mentioned CMP method.
Utilize this CMP method to make semiconductor wafer smooth, be will contain be formed on the wafer surface film (for example, silicon oxide film) composition of chemically reactive (for example, calcium hydroxide aqueous solution) alkaline lapping liquid is supplied with on the polishing pad that is attached on the Rotating Plates, simultaneously wafer is ground by being pressed on this polishing pad (for example, with reference to the spy open flat 8-3540 communique, the spy opens flat 10-88111 communique).
In the past, as the employed polishing pad of this planarization, be to use many minute apertures are arranged on the surface the polishing pad that plays the foam substrate (for example, foaming polyurethane liner, production number are: IC-1000, Rodel company), be fixed on polishing pad (for example, opening clear 55-90263 communique) on the elastic sheet materials such as sheet material of rubber system with the sheet fabric that ceramic fibre is made with reference to the spy.This may be because following cause: play the polishing pad of foam substrate, in process of lapping, the free abrasive that minute aperture kept on surface flexibly acts on the surface of grinding object, can make grinding object apparent height smooth; On the polishing pad of fixing fabric on the flexure strip, because fabric is fixed on the elastic sheet material, so in grinding, the free abrasive that the gap between the fiber of formation fabric keeps flexibly acts on and grinds the object surface, can make grinding object apparent height ground smooth.
But, the polishing pad that plays the foam substrate of this prior art will make two or more resin compounds bubble at least and form the foam piece, this being played the thin slice that the foam piece is cut into specific thickness makes again, be difficult to make the foaminess of whole block inside even, therefore, exist the minute aperture quantity of the unit are of making each polishing pad behind the product and the problem that elasticity produces deviation.
Use the above-mentioned this polishing pad that plays the foam substrate in the past, passing along with service time, pad surfaces can be partly or is is all worn and torn and cause the surface portion distortion of polishing pad, not only can not evenly grind grinding the object surface equably, and abrasive particle and lapping rejects can be stayed in the minute aperture of pad surfaces, stop up minute aperture, reduce grinding rate (amount of grinding in the unit interval).Therefore, for planarization and the hole plug problem that solves pad surfaces, current is the dressing tool of using sand plate that hard particles such as diamond have been fixed and so on, pad surfaces is repaired at every turn, this dressing operation exists not only time-consuming and time, and repair the back hard particles such as diamond that come off from dressing tool attached to pad surfaces, these hard particles can grind the problem that forms unnecessary scratch on the object surface.
In addition, use prior art as described above fabric is fixed on polishing pad on the flexure strip time, passing along with service time, the fabric fibre of pad surfaces can move, make the surface portion distortion of polishing pad, not only can not evenly grind, be difficult to remain on the pad surfaces problem that grinding rate is descended but also exist free abrasive grinding the object surface.
Therefore, the object of the present invention is to provide As time goes on a kind ofly and indeformable, can make with high grinding rate and grind object surface evenly smooth abrasive sheet and manufacture method thereof and the Ginding process that uses this abrasive sheet.
Summary of the invention
The abrasive sheet of the present invention that achieves the above object is to constitute by piece of cloth with securing resin between the fiber of this piece of cloth or the fibre bundle, and wherein piece of cloth is that the fibre bundle that fibre bundle that gets up by 1 fiber or with the plurality of fibers constriction or the further constriction of fibre bundle that multi beam is formed by the plurality of fibers constriction become constitutes.Preferably, abrasive sheet of the present invention is fixed on the surface of the substrate sheet that is made of plastics, fabric, nonwoven, a foam etc. with known resinoid bonds such as ammonia ester system, polyester system, third rare systems.
As piece of cloth, the cloth sheet that uses crowfoot satin technology to be made into.When establishing number of satins big, the surface roughness of not only grinding object is little, and the grinding rate height.It is more satisfactory in 1~15 scope that satin is knitted number, and the scope 3~15 is then better.
As the fiber that constitutes piece of cloth, being not limited to the grinding purposes, generally is to adopt the fiber that is formed by widely used known fibrous material, in order to make the surperficial viscotoughness that grinds object little, improve grinding rate, using rugosity is the following fiber of 0.1 Denier.The more suitable rugosity that is to use is the following polyester fiber of 0.1 Denier.
As with the fixing resin of usefulness between the fiber of piece of cloth or the fibre bundle, use known resins such as ammonia ester system, polyester system, third rare system, the comparatively ideal ammonia ester that is to use is a resin.Resin concentration in the resin liquation is more suitable is scope 0.1%~30%.Resin solution be with above-mentioned resin dissolves water contain alcohol or the water-based solvent of organic solvent in and form.
The abrasive sheet of the invention described above is to make above-mentioned fabrics sheet impregnation resin solution, makes the piece of cloth that contains above-mentioned resin solution dry and make then.
The grinding of grinding object is at the polishing pad of being made by abrasive sheet of the present invention or grinds band and grind between the object surface and clip lapping liquid, makes polishing pad or grinds band and grind object and relatively move and grind.As lapping liquid, more suitable being to use contains and grinds the lapping liquid that the object surface produces the composition of chemical reaction, carries out the chemistry mechanicalness and grinds.Here, lapping liquid contain abrasive particle can be random.
Description of drawings
Fig. 1 (a) is the profile of abrasive sheet of the present invention, and Fig. 1 (b) is the scanning electron microscope photo on abrasive sheet of the present invention surface.
Fig. 2 is the side view of the abradant lapping device of Rotating Plates formula.
Fig. 3 is the side view of the abradant lapping device of rotation hair style.
Fig. 4 is the side view of the abradant lapping device of belt-type.
Fig. 5 is the side view of the abradant lapping device of drum-type.
Fig. 6 is the side view of the abradant lapping device of belt.
The specific embodiment
<abrasive sheet〉as shown in Figure 1, abrasive sheet 10 of the present invention is piece of cloth 12 that the fibre bundle 13 that the fibre bundle 13 that gets up by 1 fiber 13 or with the plurality of fibers constriction or the further constriction of fibre bundle that multi beam is got up by the plurality of fibers constriction become is constituted and the resin of fixing between the fiber of this piece of cloth 12 or the fibre bundle 13 14 is constituted.More suitable is as shown in the figure, and in order to prevent laterally to move in the process of lapping, abrasive sheet 10 usefulness ammonia esters of the present invention are that resin, polyester are that known binding agents 16 such as resin, propylene resin are fixed on the surface of substrate slice 15.As substrate slice 15, can use have high-tensile, sheet material that plastic materials such as polyester that drug resistance is good, polypropylene, polyethylene terephthalate are made, piece of cloth, non-woven fabric plate, foaming (gathering) ammonia ester etc. play that foam constitutes plays the foam sheet material.
As piece of cloth 12, use the sheet that fiber or fibre bundle 13 are made into crowfoot satin technology.Here, if number of satins is established for a short time, then grinding rate is little, and the surface roughness of the grinding object after the grinding is big.In addition, when number of satins was established greatly, grinding rate was big, and the surface roughness of the grinding object after the grinding is little, but if number of satins is excessive, then abrasive sheet is yielding, thus number of satins be preferably in below 15, then better in 3~15 scope.In illustrated embodiment, number of satins is 5.
As the fiber 13 that constitutes piece of cloth 12, the fiber of one or more that use is selected from natural fibers such as synthetic fibers, carbon fibre, silk, wool, silk floss, fiber crops such as nylon, polyester, propylene, vinylon, polyvinyl chloride, polyethylene, vinylidene, polyurethane, ripple Rec Le Er, artificial silk, Pori's nosik, steel ammonium fiber, amyl acetate, three amyl acetates, Promix, the surface roughness of grinding object is little, grinding rate is high in order to make, the use rugosity is the fiber below 0.1 Denier.The comparatively ideal rugosity that is to use is the following polyester fiber of 0.1 Denier.
The solution that the resin solution of piece of cloth 12 impregnations has the known resin with (gathering) ammonia ester system, polyester system to be dissolved in the water, the resin concentration in the resin solution is in 0.1%~30% scope.Comparatively ideal being to use (gathering) ammonia ester resin solution, fixing between the fiber of piece of cloth 12 or the fibre bundle 13 with (gathering) ammonia ester resin 14.
<manufacture method〉abrasive sheet of the present invention 10 shown in Figure 1 is to make like this, even piece of cloth 12 impregnation resin solutions make piece of cloth 12 dryings that contain this resin solution, with resin 14 with fixing between the fiber of this piece of cloth 12 or the fibre bundle 13.Comparatively ideal is to be fixed in binding agent 16 on the surface of substrate slice 15.Here, resin solution can or immerse in the resin solution groove with injection method, makes piece of cloth 12 impregnations.In addition, fixing on the surface of substrate slice 15 of the present invention, fix with binding agent 16 as described above, but after also the piece of cloth 12 that contains resin solution can being pressed on the surface of substrate slice 15, make its drying again and fix.Here, also available known two sides adhesive tape (not shown) replaces binding agent 16, abrasive sheet is fixed on the surface of substrate slice 15.
<Ginding process〉grinding of grinding object is at the polishing pad that is formed by abrasive sheet 10 of the present invention shown in Figure 1 or grinds band and clip lapping liquid with grinding between the object surface, makes polishing pad or grinds band and the grinding object relatively moves and grinds.
Below, the representative lapping mode of implementing Ginding process of the present invention is done simple declaration.
1. the Rotating Plates formula is ground
The Rotating Plates formula is ground as shown in Figure 2, the polishing pad 10 that is made of abrasive sheet of the present invention is sticked on the dull and stereotyped D, and semiconductor wafer etc. is ground object 11 inhale on suction nozzle H, the limit is fed to lapping liquid by nozzle N on the surface of the polishing pad 10 on the dull and stereotyped D dull and stereotyped D and suction nozzle H respectively to arrow direction revolution, limit, the grinding object 11 that suction nozzle H is held is pressed on the polishing pad 10 on the dull and stereotyped D and grinds.
2. the rotation hair style is ground
The rotation hair style is ground as shown in Figure 3, with maintaining body S such as frameworks grinding objects 11 such as liquid-crystalline glasses plate are remained on the dull and stereotyped D, the limit is fed to lapping liquid on the surface of this grinding object 11 by nozzle N, the limit compresses the swivel head H that the polishing pad of being made by abrasive sheet of the present invention 10 is installed, and makes swivel head H carry out horizontal hunting on the surface of grinding object 11.
3. belt-type grinds
Belt-type grinds as shown in Figure 4, grinding objects 11 such as semiconductor wafer are held by suction nozzle H, make suction nozzle H rotation, make the belt like polishing pad 10 that constitutes by abrasive sheet of the present invention to direction of arrow traveling simultaneously, lapping liquid is fed on the surface of polishing pad 10 with nozzle N, the grinding object 11 that suction nozzle H is held is pressed on the polishing pad 10, and the platen P that this polishing pad is fixed with elastomeric material (not shown) from the teeth outwards goes up traveling.
4. drum-type is ground
Drum-type is ground as shown in Figure 5, grinding objects 11 such as semiconductor wafer are held by suction nozzle H, make suction nozzle H to the rotating while of the direction of arrow, the cylinder C that is pasted with the polishing pad 10 that is formed by abrasive sheet of the present invention around making turns round to the direction of arrow, by nozzle N lapping liquid is fed on the surface that sticks on the polishing pad 10 around the cylinder C, compresses the grinding object 11 that suction nozzle H held and grind.
5. belt is ground
Belt is ground as shown in Figure 6, grinding objects 11 such as semiconductor wafer are held by suction nozzle H, the limit makes suction nozzle H turn round to the direction of arrow, the limit is fed to lapping liquid to grind by nozzle N and is with on 10, this grinding band is that the abrasive sheet of being sent to the direction of arrow by donor rollers R1 of the present invention constitutes, the grinding object 11 that suction nozzle H is held is pressed on the grinding that is positioned on the platen P and is with and grinds on 10, the surface of this platen P is fixed with elastomeric material (not shown), grinds and is with 10 to be batched on the takers-in chi 2 successively.At this, grind with 10 send, batch action and can carry out continuously, also can will grind object 11 be pressed on grind with 10 surface on the time make this send, batch action interruptedly to carry out intermittence.
<lapping liquid〉among the present invention, lapping liquid can use the free abrasive formula to grind used known lapping liquid, but preferably use the lapping liquid that contains with the composition that grinds object surface chemically reactive.This is because as mentioned above, when adopting the CMP method, have the cause that can make the smooth advantage of grinding object apparent height.When with the CMP method metal and glass being ground, lapping liquid can use the solution that contains acid solution and contain oxidant, the solution that contains chelating agent, or contains the lapping liquid of alkaline solutions such as aqua calcis, sodium hydroxide solution.
As the abrasive particle that is dispersed in the lapping liquid, can use known abrasive particles such as silica, cerium oxide, aluminium, zirconium, diamond.
Here, when adopting the CMP method, use the abrasive particle can be random.When use contains the lapping liquid of abrasive particle, compare with the occasion of the polishing pad that has used the foam substrate, grinding rate is big.Use when not containing the lapping liquid of abrasive particle, can obtain and use the equal grinding rate of occasion of the polishing pad of foam substrate.
<embodiment 1 〉
The polyester fiber constriction that is 0.06 Denier with 70 rugosity gets up to form fibre bundle, and then the fibre bundle that 12 these fibre bundle constrictions get up are formed is as parallel, press the piece of cloth that " number of satins 8 " is formed by weaving, make it contain under water the dissolving in the resin solution of ammonia ester resin (10% concentration), and make the piece of cloth drying that contains this resin solution, with the propylene resin binding agent it is bonded and fixed on the surface of polyethylene terephthalate (PET) sheet material, make abrasive sheet of the present invention, this abrasive sheet severing is processed into the polishing pad of embodiment 1.
<embodiment 2 〉
The polyester fiber constriction that is 0.06 Denier with 70 rugosity gets up to form fibre bundle, and then 12 these fibre bundle constrictions are got up to form fibre bundle, with them as warp and parallel, press the piece of cloth that " number of satins 5 " is formed by weaving, make the resin solution of its impregnation the foregoing description 1, and make the piece of cloth drying that contains this resin solution, with propylene is that the two sides adhesive tape is bonded and fixed at it on surface of PET sheet material, make abrasive sheet of the present invention, this abrasive sheet severing is processed into the polishing pad of embodiment 2.
<embodiment 3 〉
The polyester fiber constriction that is 0.06 Denier with 70 rugosity gets up to form fibre bundle, and then 12 these fibre bundle constrictions are got up to form fibre bundle, with them as warp and parallel, press the piece of cloth (plain weave) that " number of satins 1 " is formed by weaving, make the resin solution of its impregnation the foregoing description 1, and make the piece of cloth drying that contains this resin solution, with propylene is that the two sides adhesive tape is bonded and fixed at it on surface of PET sheet material, make abrasive sheet, this abrasive sheet severing is processed into the polishing pad of embodiment 3.
<embodiment 4 〉
The polyester fiber constriction that is 0.06 Denier with 70 rugosity gets up to form fibre bundle, and then 12 these fibre bundle constrictions are got up to form fibre bundle, with them as warp and parallel, press the piece of cloth that " number of satins 3 " is formed by weaving, make the resin solution of its impregnation the foregoing description 1, and make the piece of cloth drying that contains this resin solution, with propylene is that the two sides adhesive tape is bonded and fixed at it on surface of PET sheet material, make abrasive sheet, again this abrasive sheet severing is processed into the polishing pad of embodiment 4.
<comparative example 1 〉
The polyester fiber constriction that is 0.06 Denier with 70 rugosity gets up to form fibre bundle, and then 12 these fibre bundle constrictions are got up to form fibre bundle, with them as warp and parallel, press the piece of cloth that " number of satins 3 " is formed by weaving, with propylene is that the two sides adhesive tape is bonded and fixed on the surface of PET sheet material, make abrasive sheet, this abrasive sheet severing is processed into the polishing pad of comparative example 1.
<comparative example 2 〉
The polishing pad of comparative example 2 is foaming polyurethane liners (production number: IC-1000, Rodel company) of selling on the market.
<comparative example 3 〉
The polyester fiber constriction that is 1.18 Denier with 34 rugosity gets up to form fibre bundle, with it as warp and parallel, press the piece of cloth (plain weave) that " number of satins 1 " is formed by weaving, make the resin solution of its impregnation the foregoing description 1, and make the piece of cloth drying that contains this resin solution, with propylene is that the two sides adhesive tape is bonded and fixed at it on surface of PET sheet material, makes abrasive sheet, this abrasive sheet severing is processed into the liner of comparative example 3.
<grinding test 1 〉
Piece of cloth with the crowfoot satin behind the resin anchoring fiber bundle is fixed on the substrate slice surface, abrasive sheet of the present invention to such formation has carried out following test, promptly change the number of satins of piece of cloth, the viscotoughness on the grinding object surface after abrasive sheet and the grinding is tested.
This grinding test 1 is that each polishing pad with embodiment 1 (number of satins 8), embodiment 2 (number of satins 5) and embodiment 3 (number of satins 1) carries out.
As grinding object, use be to form Cu film (8000 ) from the teeth outwards by the cathode vacuum method of spray plating, go up the abrasive sheet of film forming at silicon wafer (8 inches).
This has the grinding of the wafer of Cu film, lapping liquid uses and to contain " lapping liquid (A) " the aluminium abrasive particle, chemical composition shown in the table 2 that average grain diameter is 1.0 μ m, with Rotating Plates formula lapping device (production number: Mechpol E500 shown in Figure 2, Presi company), test by the grinding condition shown in the following table 1.
Table 1 grinding condition
The grinding head rotating speed ????40rpm
Dull and stereotyped rotating speed ????40rpm
The lapping liquid quantity delivered The 250ml/ branch
Thrust ????300g/cm 2
Milling time 60 seconds
The composition of table 2 lapping liquid (grinding test 1) lapping liquid (A) (containing abrasive particle)
Quinaldinic acid 0.67 weight %
Aquae hydrogenii dioxidi 4.67 weight %
Lactic acid 1.33 weight %
Aluminium (average grain diameter 0.1 μ m) 4.00 weight %
Pure water 89.33 weight %
Grinding rate (unit: /minute), thickness with grinding in 4 probe contact determination of resistivity device (film thickness gauge) analytical unit times, surface roughness (unit: ) measure with white interfering type surface roughness measurement device (ProductName: NEW VIEW, Zygo company).
<result of the test 1 〉
The result of above-mentioned grinding test 1 shows table 3.From the result shown in the table 3 as can be known, abrasive sheet of the present invention is if number of satins is established greatly, and then grinding rate is big, and the surface roughness of the grinding object after the grinding is little.
Table 3 result of the test 1 (grinding test 1)
Number of satins Surface roughness () Grinding rate (/minute)
Embodiment 1 ????8 ????4.23 ????4027.2
Embodiment 2 ????5 ????5.80 ????2626.9
Embodiment 3 ????1 ????80.2 ????1779.6
<grinding test 2 〉
Use the polishing pad of the foregoing description 4, comparative example 1 and comparative example 2, the wafer of the band Cu film the same with above-mentioned grinding test 1 employed wafer is ground.Grinding test 2, lapping liquid uses and to contain " lapping liquid (A) " the aluminium abrasive particle, lapping liquid composition shown in the table 2 that average grain diameter is 0.1 μ m, " lapping liquid (B) " that do not contain lapping liquid composition shown in the following table 4 of abrasive particle grinds, to grinding rate and the surface state of the grinding object after grinding investigate.This " lapping liquid (B) and lapping liquid (A) " is the same, carries out chemical reaction with Cu film (metal), contains the composition that produces complex compound on Cu film surface.Grinding rate (unit: /minute) is the same with above-mentioned grinding test 1, has measured the thickness of grinding in the unit interval with 4 probe contact determination of resistivity devices (film thickness gauge).Grinding test 2 uses the used Rotating Plates formula lapping device of above-mentioned grinding test 1, grinds by the grinding condition shown in the above-mentioned table 1.
Table 4 lapping liquid is formed (grinding test 2)
Lapping liquid (B) (not containing abrasive particle)
Quinaldinic acid 0.67 weight %
Aquae hydrogenii dioxidi 4.67 weight %
Lactic acid 1.33 weight %
Pure water 93.33 weight %
<result of the test 2 〉
Above-mentioned grinding test 2 the results are shown in table 5.From result shown in the table 5 as can be known, when using the polishing pad of the foregoing description 4, when using " lapping liquid (A) " that contains abrasive particle and using grinding rate under " lapping liquid (B) " the two kinds of situations that do not contain abrasive particle than the polishing pad that uses above-mentioned comparative example 1 and comparative example 2 greatly.In addition, state about the wafer surface that has the Cu film after grinding, the surface roughness the same good (about 3.0 s~about 4.0 s) of surface roughness when using the polishing pad of embodiment 4 during also with the polishing pad that uses above-mentioned comparative example 1 and comparative example 2, but, with above-mentioned grinding test 1 employed white interfering type surface roughness measurement device, the roughness on the almost whole surface of the band Cu film wafer after probe grinds, discovery uses the occasion of the polishing pad of embodiment 4 to compare with the occasion of the polishing pad that uses comparative example 1 and comparative example 2, and the whole surface of band Cu film wafer is evenly smooth.
Table 5 result of the test (grinding test 2) grinding rate (nm/ branch)
Embodiment 4 Comparative example 1 Comparative example 2
Lapping liquid A ??2136 ??1950 ??1300
Lapping liquid B ??1606 ??986 ??1290
<grinding test 3 〉
Use the polishing pad of the foregoing description 3 (fibre coarseness is 0.06 Denier) and comparative example 3 (fibre coarseness is 1.18 Denier), the wafer with the same band Cu film of above-mentioned grinding test 1 employed wafer is ground.Grinding test 3 uses the lapping device of the used Rotating Plates formula of above-mentioned grinding test 1, grinds with the grinding condition shown in the above-mentioned table 1.
<result of the test 3 〉
Above-mentioned grinding test 3 the results are shown in table 6.From result shown in the table 6 as can be known, if reduce fibre coarseness, then surface roughness reduces, grinding rate improves, and the available short time is ground out more smooth surface.
Table 6 result of the test (grinding test 3)
Number of satins Fibre coarseness (Denier) Surface roughness () Grinding rate (/minute)
Embodiment 3 ????1 ???0.06 ???80.2 ????1779.6
Comparative example 3 ????1 ???1.18 ???513.4 ????1680.5
Because the present invention constitutes as described above, the dimensionally stable of abrasive sheet is not easy distortion, so be not out of shape with the passing of service time, can make grinding object surface evenly smooth with high grinding rate.
In addition, adopt in the grinding of CMP method, without abrasive particle, can make that to grind the object surface evenly smooth with high grinding rate.
Claims (according to the modification of the 19th of treaty)
1. abrasive sheet, be made of piece of cloth and resin, wherein piece of cloth is that the fibre bundle that fibre bundle that gets up to form by 1 fiber or by the plurality of fibers constriction or the further constriction of fibre bundle that multi beam is got up to form by the plurality of fibers constriction form constitutes; Resin is used for and will fixes between the above-mentioned fiber of this piece of cloth or the fibre bundle, and the rugosity of above-mentioned fiber is less than 0.08 Denier, and the above-mentioned fabrics sheet is made into the crowfoot satin method, and number of satins is in 3~15 scope.
2. (deletion)
3. (deletion)
4. (deletion)
5. abrasive sheet as claimed in claim 1 is also by the fixing substrate slice of usefulness from the teeth outwards of this abrasive sheet is constituted.
6. the manufacture method of an abrasive sheet, the fibre bundle that fibre bundle that manufacturing gets up to form by 1 fiber or by the plurality of fibers constriction or the further constriction of fibre bundle that multi beam is formed by the plurality of fibers constriction get up to form constitutes piece of cloth, make this piece of cloth impregnation resin solution, make and contain the above-mentioned fabrics sheet drying that is soaked with this resin solution, with resin with the method for fixing abrasive sheet between the above-mentioned fiber of above-mentioned fabrics sheet or the fibre bundle, the rugosity of above-mentioned fiber is less than 0.08 Denier, the above-mentioned fabrics sheet is made into the crowfoot satin method, and number of satins is in 3~15 scope.
7. manufacture method as claimed in claim 6 also comprises the lip-deep operation that above-mentioned abrasive sheet is fixed on substrate slice.
8. Ginding process, between the surface of the polishing pad that constitutes by claim 1 or 5 described abrasive sheets or grinding band and grinding object, accompany lapping liquid, this lapping liquid contains the composition with the surperficial chemically reactive of above-mentioned grinding object, makes above-mentioned polishing pad or grind band to relatively move with above-mentioned grinding object and grind.

Claims (8)

1. abrasive sheet, be made of piece of cloth and resin, wherein piece of cloth is that the fibre bundle that fibre bundle that gets up to form by 1 fiber or by the plurality of fibers constriction or the further constriction of fibre bundle that multi beam is got up to form by the plurality of fibers constriction form constitutes; Resin is used for and will fixes between the above-mentioned fiber of this piece of cloth or the fibre bundle.
2. abrasive sheet as claimed in claim 1, the above-mentioned fabrics sheet is made into the crowfoot satin method, and number of satins is in 1~15 scope.
3. abrasive sheet as claimed in claim 1, the above-mentioned fabrics sheet is made into the crowfoot satin method, and number of satins is in 3~15 scope.
4. abrasive sheet as claimed in claim 1, the rugosity of above-mentioned fiber are below 0.1 Denier.
5. abrasive sheet as claimed in claim 1 is also by the fixing substrate slice of usefulness from the teeth outwards of this abrasive sheet is constituted.
6. the manufacture method of an abrasive sheet, the piece of cloth that the fibre bundle that fibre bundle that gets up to form by 1 fiber or by the plurality of fibers constriction or the further constriction of fibre bundle that multi beam is formed by the plurality of fibers constriction get up to form constitutes, make this piece of cloth impregnation resin solution, make the above-mentioned fabrics sheet drying that contains this resin solution, will fix between the above-mentioned fiber of above-mentioned fabrics sheet or the fibre bundle with resin.
7. manufacture method as claimed in claim 6 also comprises the lip-deep operation that above-mentioned abrasive sheet is fixed on substrate slice.
8. Ginding process, between the surface of the polishing pad that constitutes by each described abrasive sheet in the claim 1~5 or grinding band and grinding object, accompany lapping liquid, this lapping liquid contains the composition with the surperficial chemically reactive of above-mentioned grinding object, makes above-mentioned polishing pad or grind band to relatively move with above-mentioned grinding object and grind.
CN01811995A 2001-06-06 2001-08-06 Polishing sheet and method of manufacturing the sheet Pending CN1438930A (en)

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JP2001208559A JP2002361564A (en) 2001-06-06 2001-06-06 Polishing sheet and method of manufacturing the polishing sheet

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WO (1) WO2002100595A1 (en)

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CN101239456A (en) * 2007-02-05 2008-08-13 三芳化学工业股份有限公司 Polishing material having polishing particles and method for making the same
CN102554767A (en) * 2007-08-15 2012-07-11 罗门哈斯电子材料Cmp控股股份有限公司 Interpenetrating network for chemical mechanical polishing
CN102596506A (en) * 2009-10-14 2012-07-18 株式会社可乐丽 Polishing pad
CN107398828A (en) * 2016-05-20 2017-11-28 智胜科技股份有限公司 Base layer, polishing pad with base layer and polishing method
CN107921610A (en) * 2015-08-21 2018-04-17 奥古斯特吕格贝格有限及两合公司 Grinding tool and the method for producing the type grinding tool

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JP2005199362A (en) * 2004-01-13 2005-07-28 Yuichiro Niizaki Bristle material and polishing brush
US7517277B2 (en) * 2007-08-16 2009-04-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Layered-filament lattice for chemical mechanical polishing
AU2015379584B2 (en) * 2015-01-28 2020-07-23 Kwh Mirka Ltd A polishing pad and material and manufacturing method for such
TWI587981B (en) * 2016-09-02 2017-06-21 Mesh emery cloth with open holes

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CA2036247A1 (en) * 1990-03-29 1991-09-30 Jeffrey L. Berger Nonwoven surface finishing articles reinforced with a polymer backing layer and method of making same
JP3774302B2 (en) * 1997-09-11 2006-05-10 株式会社クラレ Polishing fabric
JPH1199479A (en) * 1997-09-30 1999-04-13 Teijin Ltd Polishing pad

Cited By (11)

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Publication number Priority date Publication date Assignee Title
CN101239456A (en) * 2007-02-05 2008-08-13 三芳化学工业股份有限公司 Polishing material having polishing particles and method for making the same
US7824249B2 (en) 2007-02-05 2010-11-02 San Fang Chemical Industry Co., Ltd. Polishing material having polishing particles and method for making the same
US8485869B2 (en) 2007-02-05 2013-07-16 San Fang Chemical Industry Co., Ltd. Polishing material having polishing particles and method for making the same
CN102554767A (en) * 2007-08-15 2012-07-11 罗门哈斯电子材料Cmp控股股份有限公司 Interpenetrating network for chemical mechanical polishing
CN102554767B (en) * 2007-08-15 2015-11-25 罗门哈斯电子材料Cmp控股股份有限公司 For the interpenetrating networks of chemically mechanical polishing
CN102596506A (en) * 2009-10-14 2012-07-18 株式会社可乐丽 Polishing pad
CN102596506B (en) * 2009-10-14 2015-02-25 株式会社可乐丽 Polishing pad
CN107921610A (en) * 2015-08-21 2018-04-17 奥古斯特吕格贝格有限及两合公司 Grinding tool and the method for producing the type grinding tool
US11273535B2 (en) 2015-08-21 2022-03-15 Pferd Milwaukee Brush Company, Inc. Abrasive tool and method for producing an abrasive tool of this kind
CN107398828A (en) * 2016-05-20 2017-11-28 智胜科技股份有限公司 Base layer, polishing pad with base layer and polishing method
CN107398828B (en) * 2016-05-20 2020-05-05 智胜科技股份有限公司 Base layer, polishing pad with base layer and polishing method

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KR20030022098A (en) 2003-03-15
EP1306162A1 (en) 2003-05-02
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TW490364B (en) 2002-06-11
JP2002361564A (en) 2002-12-18

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