CN1421920A - Substrate for setting passive module - Google Patents
Substrate for setting passive module Download PDFInfo
- Publication number
- CN1421920A CN1421920A CN 01139815 CN01139815A CN1421920A CN 1421920 A CN1421920 A CN 1421920A CN 01139815 CN01139815 CN 01139815 CN 01139815 A CN01139815 A CN 01139815A CN 1421920 A CN1421920 A CN 1421920A
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- CN
- China
- Prior art keywords
- weld pad
- substrate
- substrate according
- passive block
- welding
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The substrate for setting passive module includes one core layer with formed chip connecting area and wire forming area around the chip connecting area and with coated soldering inhibitor layer to isolating the wire electrically and hermetically; soldering pads with central slot and extending beyond the soldering inhibitor layer. The central slot in the soldering pad is for painting soldering paste to solder the passive module, and can produce cohesive force on the soldering paste to position to passive module and the downward pulling force to the soldering paste to prevent forming vertical soldering paste column.
Description
Technical field
The present invention relates to a kind of substrate that is used for semiconductor package part, refer to especially a kind ofly semiconductor package part substrate on it is set simultaneously for chip and passive block.
Background technology
Electronic product gradually needs to be integrated with as passive blocks such as electric capacity, resistance or inductance on semiconductor package part (Semicoductor Package) under the trend of high function and high speed, with the electrical and function of lifting or stable electronic product.Yet, be accompanied by the demand of compactization of electronic product, can be on the substrate that is coated in the semiconductor package part for the area of passive block setting with reducing.Thereby, how enough passive blocks to be set on the limited area, and the unlikely configuration (Routability) that influences on the substrate of while is into the big problem that the semiconductor industry need solve with the demand in the cooperation product design.
And, passive block generally is electrically connected to substrate by coating on the substrate in order to the welding agent (Solder Paste) on the weld pad (Solder Pad) that the passive block welding is provided, and the means of welding generally then adopt the mode of melt back welding (Reflow Soldering).When the melt back welding is carried out, the be heated capillary variation that produced of welding agent tends to make the volume passive block generation component of microminiaturization (Passive Float) phenomenon of floating gradually, in case passive block occurrence positions skew, in extremely limited space, satisfy easily contact and cause problem of short-circuit to contiguous assembly or bonding wire; And be the to set up a monument generation of (Tombstone) phenomenon of another passive block normal problem that takes place in the reflow operation, when holding up in case passive block is subjected to the drawing of welding agent, passive block promptly can't form the relation that electrically connects fully and cause the manufactured goods electrical quality undesirable with weld pad.
At the displacement (Shifting) of above-mentioned passive block and the problem of setting up a monument, United States Patent (USP) 5,311, No. 405 cases " in order to the location with connect method and the device of putting surperficial gluing assembly] (Method and Apparatus for Aligning and Attaching a Surface MountComponent) promptly propose a solution.The prior art utilizes two relative weld pads that two terminations of passive block are put on this two relative weld pad, each weld pad be by an ellipse diagram shape portion and one and the pyramid portion that is connected with of this ellipse portion constituted, and the tip of the pyramid portion of this two weld pad is toward each other, because the formation of this pyramid portion, when the melt back weld job carries out, soldering paste is coated in the oval portion of each weld pad, the both ends of passive block connect place on this welding agent after, welding agent can be from oval portion streamer to pyramid portion, at this moment, flowing of welding agent promptly produces the drawing gravitation of this passive block of correcting, make the long axis of passive block roughly be fallen within center line, and make passive block when the reflow operation is carried out, not have the anxiety of off normal by this two weld pads central point.
Yet method and structure that the passive block that the 5th, 311, No. 405 United States Patent (USP) proposed is welded on the substrate still have some shortcomings and demand improvement urgently.At first, owing to be positioned at the place, both ends and the palpus ovalisation shape of passive block for two weld pads of passive block welding, the more existing single weld pad person of area that two weld pads are occupied on the substrate is big, so can have influence on the layout (Routability) of substrate upper conductor, and be unfavorable for the miniaturization of substrate; Moreover, the tip of the pyramid portion of two weld pads is at a distance of very near, often easily passive block is glutinous place on the welding agent after, the welding agent that overflows two pyramid portions can touch, make two weld pads that should separate because of the overflow of welding agent in succession, then cause the generation of short circuit, but for avoiding the welding agent overflow to cause the problem generation that two weld pads are electrically connected, often must enlarge the distance between two weld pads, so be, the area of the occupied substrate of this two weld pad will be increased, and the degree of difficulty of order wiring improve or even must increase substrate; Simultaneously, passive block is to be located on the substrate with the welding agent weldering that is coated with on the two relative weld pads, when the coating weight of the welding agent on two weld pads is unequal, cause passive block in the reflow operation is carried out, to be subjected to welding agent most probably and bestow unequal drawing gravitation, and the generation of the phenomenon that easily causes setting up a monument; In addition, the shape and the formation of the employed weld pad of this United States Patent (USP), can't use existing equipment and technology to form this kind weld pad, and equipment and technology that the palpus otherwise designed is suitable for, and the existing stencilling (stencile) in order to the coating welding agent also can't be suitable for, thereby the use of these two kinds of opposite soldering pads can cause making the complicated of the raising of cost and technology.
Summary of the invention
The object of the present invention is to provide a kind of substrate for setting passive module that passive block when welding produce the skew or the phenomenon of setting up a monument of avoiding.
Another object of the present invention is to provide a kind of influences the lead layout or increases under the situation of usable floor area the substrate for setting passive module of the generation off normal or the phenomenon of setting up a monument in the time of still effectively avoiding the passive block welding unlikely.
A further object of the present invention is to provide a kind of and utilizes the welding that existing device and technology finishes passive block and can effectively avoid passive block to produce the substrate for setting passive module of the off normal or the phenomenon of setting up a monument when welding.
For reaching above-mentioned purpose of the present invention, substrate for setting passive module provided by the invention comprises: a sandwich layer, and formation one connects the chip connecting area of putting and for chip and is located on the lead formation district that lays for a plurality of conductive traces outside this chip connecting area on this sandwich layer; One compress forms the welding flux layer of distinguishing of refusing in this lead, so that this conductive trace and extraneous airtight isolation; The weld pad that this refuses welding flux layer is gone up and is exposed outside at least one this lead formation district that is located at, for a passive block mat welding agent and welding, at least the central part of this weld pad offers a center grooved, when coating on this weld pad at welding agent, the surface tension that the formation of this center grooved can make welding agent is concentrated and is produced poly-gravitation in one, the anxiety of not having off normal or setting up a monument thereby this passive block of drawing is positioned the center grooved of weld pad towards this center grooved.
This weld pad can also this center grooved be that at least one pair of the rib shape that is symmetrically formed fluting is formed by this fluting with further raising welding agent the interior poly-gravitation that influence was produced is offered at the center towards the edge of weld pad except that can offering a center grooved.The shape of this center grooved does not have specific limited, circular or squarely all is suitable for, and its size does not also have particular restriction, only otherwise influencing being electrically conducted of passive block and weld pad gets final product; In addition, center grooved must be identical with the groove footpath of rib shape fluting, also can decide on actual needs greater than the groove footpath of rib shape fluting.
Weld pad on the substrate of the present invention is able to existing equipment and technology is finished, than prior art, the low and better simply advantage of technology of cost is arranged, and can effectively avoid the generation of the off normal of passive block and the phenomenon of setting up a monument, the also unlikely laying that influences conductive trace on the substrate is so can effectively solve the problems that the failure welding of passive block and substrate exists.
Description of drawings
Below in conjunction with drawings and Examples the present invention is carried out in detail:
Fig. 1 is the front view of the substrate of first embodiment of the invention;
Fig. 2 is the cutaway view of Fig. 1 along the 2-2 line;
Fig. 3 connects the generalized section of putting a passive block after laying welding agent on the weld pad shown in Figure 2;
Fig. 4 is the generalized section of the variation that produced when the reflow operation is carried out of the welding agent of diagrammatic sketch 3;
Fig. 5 is the front view of the substrate of second embodiment of the invention;
Fig. 6 is the front view of the substrate of third embodiment of the invention;
Fig. 7 is the front view of the substrate of fourth embodiment of the invention;
Fig. 8 is the front view of the substrate of fifth embodiment of the invention; And
Fig. 9 is the front view of the substrate of sixth embodiment of the invention.
Symbol description among the figure:
1 substrate
10 sandwich layers
100 chip connecting areas
101 leads form the district
11 refuse welding flux layer
12,52,62,72,82,92 weld pads
120,520,620,720,820,920 flutings
The S welding agent
The P passive block
Embodiment
With reference to Fig. 1,2, the substrate 1 of first embodiment of the invention comprises a sandwich layer 10, forming one on the surface of this sandwich layer 10 connects the chip connecting area of putting 100 and for chip and is located on lead this chip connecting area 100 outside and forms and distinguish 101, it is usefulness for a plurality of conductive traces (Conductive Traces) laying that is formed through etch processes or printing (print) mode by Copper Foil that this lead forms district 101, the chip that makes with mat is electrically connected to this substrate 1, because the formation and the laying (Routing) of this conductive trace are prior art, so do not give icon and detailed description at this.
Form to be laid with in the district 101 at the lead of this sandwich layer 10 and refuse solder flux (Solder Mask) floor 11, form conductive trace (not icon) and extraneous airtight isolation in the district 101 with this lead that will be laid in of mat.Form in the district 101 and be formed with at least one weld pad 12 at this lead, these weld pad 12 parts expose outside this and refuse welding flux layer 11, electrically connect with it for passive block, and make passive block and substrate 1 formation electrical connection; This weld pad 12 to be forming as the metal of copper, and the mode of its formation is prior art, so other does not give unnecessary details for literary composition at this.
This weld pad 12 is exposing outside on the position of refusing welding flux layer 11 and is offering a fluting 120 that is right-angled intersection, make this weld pad 12 produce a recess in fluting 120 formation place, and this crossover sites that is the fluting 120 of right-angled intersection is positioned at the centre of this weld pad 12, is constituted towards weld pad 12 and the peripheral rib shape fluting that extends the four road balanced configurations that set out by the center and make this fluting 120 can be considered by the center grooved of offering in the centre of weld pad 12 and with this center grooved.
Refer again to Fig. 3, after fluting 120 forms, when welding passive block P, must coating one existing welding agent (Solder Paste) S on weld pad 12 of elder generation.After welding agent S coating is finished, the melt back soldering of promptly using always, at this moment, welding agent S is heated promptly and produces as shown in Figure 4 variation, because weld pad 12 has recessed fluting 120, be subjected to the capillary effect of welding agent S, the welding agent S that is positioned on this fluting 120 promptly can make welding agent 5 produce the drawing gravitation of one downward (Downward) and poly-(Convergent) to lower recess, the generation of this drawing gravitation just forms one passive block P is positioned effect on the fluting 120 of weld pad 12, and make the anxiety of passive block P no off normal in the reflow operation and unlikely touching to contiguous other assembly or bonding wire, simultaneously, this drawing gravitation can be effectively draws passive block P under evenly and is bonded on the welding agent S, so do not have the generation of the phenomenon of setting up a monument.
Thereby, weld pad on the clear substrate of the present invention as can be known is able to existing equipment and technology is finished, than the aforesaid the 5th, 311, No. 405 United States Patent (USP)s have the low and better simply advantage of technology of cost, and can effectively avoid the generation of the off normal of passive block and the phenomenon of setting up a monument, the also unlikely laying that influences conductive trace on the substrate is so can effectively solve the problems that the failure welding of passive block and substrate exists.
In addition, the alleged substrate of notice the present invention is that generally be formed with a plurality of conductive traces on a sandwich layer connects the structure of putting usefulness for semiconductor device and/or electronic building brick to general reference, that is, be used in the substrate of semiconductor package part (Semiconductor Package) or general alleged printed circuit board (PCB) (printed Circuit Board) all be included in; And the number of plies that constitutes this substrate is also unrestricted, and lamina or multi-layer sheet all are suitable for.
Fig. 5-the 9th is in order to the difference variation of formed weld pad on the substrate of explanation the present invention second to six embodiment.As shown in Figure 5, the fluting 520 of weld pad 52 only is formed at the centre of weld pad 52, is rectangle in the accompanying drawing, if but circle is also suitable.The fluting 62 that is illustrated in figure 6 as weld pad 62 is single groove of a strip, but still passes through the central point of this weld pad 62.As shown in Figure 7, the fluting of this weld pad 72 720 is with roughly the same shown in aforementioned first embodiment, and it is that diagonal along weld pad 72 forms that difference is in this fluting 720, and in the centre intersection of weld pad 72.As shown in Figure 8, the fluting 820 of this weld pad 82 is a cross, but its end does not extend to and refuses solder flux 81 part that contacts.At last, as shown in Figure 9, in the groove footpath of the fluting 920 of weld pad 92 centre greater than fluting 920 from the stretch out groove footpath at position of centre.
The above only is specific embodiments of the invention, and other is any not to deviate from the equivalence of being done under spirit of the present invention and the technology and change or modify, and all should still be included within the protection range of this patent.
Claims (8)
1. substrate for setting passive module comprises:
One sandwich layer is formed with one and connects the chip connecting area of putting for chip on the surface thereof, and one is located on the outer lead of laying for a plurality of conductive traces of this chip connecting area and forms the district;
One is laid in the welding flux layer of refusing that this lead forms the district; And
At least one weld pad that is formed in this lead formation district, this weld pad exposes outside this and refuses welding flux layer and wherein entreat the position to form a center grooved to being less than.
2. substrate according to claim 1 is characterized in that: also offering at least one pair of on this weld pad is the rib shape fluting that extend towards weld pad edge symmetry at the center with this center grooved.
3. substrate according to claim 2 is characterized in that: the groove of this rib shape fluting directly is same as the groove footpath of this center grooved.
4. substrate according to claim 2 is characterized in that: the groove footpath of this rib shape fluting is less than the groove footpath of this center grooved.
5. substrate according to claim 1 is characterized in that: this center grooved is rectangular-shaped.
6. substrate according to claim 1 is characterized in that: this center grooved is a toroidal.
7. substrate according to claim 1 is characterized in that: this weld pad is to weld with it at the welding agent that a passive block mat is coated on this weld pad.
8. substrate according to claim 7 is characterized in that: the weld pad of this weld pad and passive block welds with the melt back solder technology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01139815 CN1216418C (en) | 2001-11-29 | 2001-11-29 | Substrate for setting passive module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01139815 CN1216418C (en) | 2001-11-29 | 2001-11-29 | Substrate for setting passive module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1421920A true CN1421920A (en) | 2003-06-04 |
| CN1216418C CN1216418C (en) | 2005-08-24 |
Family
ID=4675433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01139815 Expired - Fee Related CN1216418C (en) | 2001-11-29 | 2001-11-29 | Substrate for setting passive module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1216418C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103199076A (en) * | 2012-01-04 | 2013-07-10 | 矽品精密工业股份有限公司 | Package structure and method for fabricating the same |
| CN104144563A (en) * | 2014-06-30 | 2014-11-12 | 广东美的集团芜湖制冷设备有限公司 | Bonding pad structure of SMT component, installation method and circuit board |
| CN114361730A (en) * | 2021-12-28 | 2022-04-15 | 湖南海博瑞德电智控制技术有限公司 | Busbar for battery cell module, battery cell module and manufacturing method of battery cell module |
-
2001
- 2001-11-29 CN CN 01139815 patent/CN1216418C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103199076A (en) * | 2012-01-04 | 2013-07-10 | 矽品精密工业股份有限公司 | Package structure and method for fabricating the same |
| TWI453881B (en) * | 2012-01-04 | 2014-09-21 | 矽品精密工業股份有限公司 | Package structure and method of forming same |
| CN104144563A (en) * | 2014-06-30 | 2014-11-12 | 广东美的集团芜湖制冷设备有限公司 | Bonding pad structure of SMT component, installation method and circuit board |
| CN114361730A (en) * | 2021-12-28 | 2022-04-15 | 湖南海博瑞德电智控制技术有限公司 | Busbar for battery cell module, battery cell module and manufacturing method of battery cell module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1216418C (en) | 2005-08-24 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050824 Termination date: 20091229 |