CN1343005A - 半导体器件健合中导电胶的应用 - Google Patents

半导体器件健合中导电胶的应用 Download PDF

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CN1343005A
CN1343005A CN 00124332 CN00124332A CN1343005A CN 1343005 A CN1343005 A CN 1343005A CN 00124332 CN00124332 CN 00124332 CN 00124332 A CN00124332 A CN 00124332A CN 1343005 A CN1343005 A CN 1343005A
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base
bonding
electroconductive resin
solder joint
tube core
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陈庆丰
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BEIJING PULUO QIANGSHENG SEMICONDUCTOR Co Ltd
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BEIJING PULUO QIANGSHENG SEMICONDUCTOR Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

一直以来在半导体管芯向外部进行电气引线时,采用凸起焊点键合始终影响着制造的稳定性,凸起焊点的机械尺寸及表面形状的不均一性是不能够完全进行良好电气接触的原因。在本发明中利用导电树脂(含Ag环氧树脂)的粘性巧妙地解决了这种不均一性所产生的问题。从图4可以看出凸起焊点的不均一性得到了彻底的解决。

Description

半导体器件键合中导电胶的应用
现在手持式电子装置向薄、轻、小等方向发展，要求半导体器件更加小型化，所谓管芯尺寸封装，采用凸起焊点进行直接键合的带式自动键合(TAB)技术得到了广泛的应用。凸起焊点(Bumps)的使用，导致封装的小型化，达到了预期的效果，但不可否认，在凸起电极的形成、检查、键合及成品检查中还存在较多的实际问题。
特别是，外观检查至今还依赖人眼观察，这会影响制造的稳定性，不可避免的产生一些问题。例如采用检查具有64条引脚的产品，有15000-96000个凸起焊点的高低、间隔、粗细、表面形状等必须进行检查。特别是对凸起焊点的立体形状检查的工作量大且要求准确，除目视外至今尚无适当的方法，是最大的问题。
本发明对上述大多数的具体问题能够完全以简单而价格低廉的方法解决，以下为解决方法的说明：
一直以来采用凸起焊点键合的问题点在上面已经给与了说明，凸起焊点的机械尺寸及表面形状的不均一性是不能够完全进行良好电气接触的原因。在本发明中利用导电树脂(含Ag环氧树脂)的粘性巧妙地解决了这种不均一性产生的问题。从图4可以看出凸起焊点的不均匀性得到了彻底的解决。
为方便了解本发明内容及达成的功效，现列举具体实例(参见图5)，详细说明如下：(1)管芯被真空吸盘吸附的情形。A-管芯    B-真空吸盘；(2)附有导电树脂的基台，导电胶为含Ag环氧树脂，胶厚用丝网(Silk screen)来控制。C-导电树脂附着基台    D-导电树脂；(3)图(1)和(2)的合成，(1)的真空吸盘下降至最大位置的情形。在真空吸盘未下降至最大位置之前，下降取决于导电树脂厚度，以保证当导电树脂与凸起焊点最多接触时，管芯不至于浸入导电树脂。在规定点自动的停止下降，这在实际设备的设计和制造中有较大的优点。考虑最坏的情形，在下降至最大点以前下降压力过大，将会导致弹簧E动作，触发停止机构，停止下降，确保安全性。(4)表示具有高低不均匀的凸起焊点的管芯使用本发明粘片后的情形，高低不一的凸起焊点通过导电胶(含Ag环氧树脂)与底座电极保持良好的电气接触。
为保证相互间的良好接触，管芯A与导电树脂附着基台C可以保持相互的或独立的上下、左右运动或震动。另外底座上接触电极较大的场合，在管芯上形成的凸起电极也会较大，粘片位置精度裕量增加，这对粘片装置的设计当然有利。
本发明采用简单的方法解决了管芯凸起焊点高低不均及表面状况差别引起的健合时无法良好接触的问题，是一个具有极大实用效果和价值的发明创造。
图1在实际生产中，管芯的凸起焊点形状，如A1-A7所示，凸起焊点的高低及表面形状不能完全均匀统一；
图2管芯与底座键合的情形，A-底座、B-管芯、C-凸起焊点、D-在底座上预先形成电极。从图中可以看出，一部分凸起焊点与底座形成了良好的电气接触，而另一部分凸起焊点与底座的电极没有接触。
图3为图2的部分放大图。A-底座、B-管芯、C-凸起焊点、D-在底座上预先形成的电极、E-管芯凸起焊点与底座电极之间的空隙
图4为本发明实施的示意图A-底座、B-管芯、C-凸起焊点、D-在底座上预先形成的电极、E-导电树胶(含Ag环氧树脂)使用后凸起焊点与底座电极接触情况。
从图中可以看出，利用导电树胶的粘度，可以自然的将接触间隙填满，保持良好的电气接触。

Claims (6)

  1. 在半导体管芯向外部进行电气引线时，通常以引线键合(Wire bonding)技术为代表，对在键合中采用导电树脂(导电胶)进行辅助键合的技术，申请专利保护。1.与底座粘合的导电树脂，目视为透明物质；
  2. 2.向底座进行直接或间接连接键合时，采用导电树脂；
  3. 3.在底座上预先形成所需的连线；
  4. 4.在底座上预先形成管芯连接所需的连接点；
  5. 5.管芯上凸起焊点(Bumps)部分或大部分与预先形成的一定厚度的导电树脂接触，使导电树脂粘附在管芯的凸起焊点上；
  6. 6.上述几点的组合过程。
CN 00124332 2000-09-08 2000-09-08 半导体器件健合中导电胶的应用 Pending CN1343005A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101536172B (zh) * 2006-10-30 2012-05-30 住友电木株式会社 液体树脂组合物、具粘合剂层的半导体晶片、具粘合剂层的半导体元件、封装件及其制法
CN102593068A (zh) * 2011-01-11 2012-07-18 颀邦科技股份有限公司 斜锥状凸块结构

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101536172B (zh) * 2006-10-30 2012-05-30 住友电木株式会社 液体树脂组合物、具粘合剂层的半导体晶片、具粘合剂层的半导体元件、封装件及其制法
CN102593068A (zh) * 2011-01-11 2012-07-18 颀邦科技股份有限公司 斜锥状凸块结构
CN102593068B (zh) * 2011-01-11 2015-08-19 颀邦科技股份有限公司 斜锥状凸块结构

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Owner name: SHAOXING KEQIANG SEMICONDUCTOR CO., LTD.

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WD01 Invention patent application deemed withdrawn after publication