CN1342998A - 用于生产半导体装置和平板显示器的设备 - Google Patents
用于生产半导体装置和平板显示器的设备 Download PDFInfo
- Publication number
- CN1342998A CN1342998A CN 01124802 CN01124802A CN1342998A CN 1342998 A CN1342998 A CN 1342998A CN 01124802 CN01124802 CN 01124802 CN 01124802 A CN01124802 A CN 01124802A CN 1342998 A CN1342998 A CN 1342998A
- Authority
- CN
- China
- Prior art keywords
- product
- robot
- semiconductor device
- equipment
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000036453A KR20010034990A (ko) | 2000-06-29 | 2000-06-29 | 반도체 및 평판디스플레이용 멀티기능을 갖춘 집적제조장치 |
KR36453/00 | 2000-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1342998A true CN1342998A (zh) | 2002-04-03 |
Family
ID=19674791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 01124802 Pending CN1342998A (zh) | 2000-06-29 | 2001-06-29 | 用于生产半导体装置和平板显示器的设备 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2002076088A (ko) |
KR (1) | KR20010034990A (ko) |
CN (1) | CN1342998A (ko) |
DE (1) | DE10130998A1 (ko) |
TW (1) | TW504737B (ko) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1306558C (zh) * | 2003-03-31 | 2007-03-21 | 精工爱普生株式会社 | 制造对象物的搬送装置和制造对象物的搬送方法 |
CN100380599C (zh) * | 2002-04-15 | 2008-04-09 | 株式会社荏原制作所 | 抛光装置及基片处理装置 |
CN100403145C (zh) * | 2005-01-31 | 2008-07-16 | 中华映管股份有限公司 | 工厂生产加工***及其操作方法 |
CN102324397A (zh) * | 2006-06-15 | 2012-01-18 | 东京毅力科创株式会社 | 衬底处理***以及衬底搬送方法 |
CN101454733B (zh) * | 2006-06-06 | 2012-08-08 | Abb研究有限公司 | 用于操作循环生产机械与装载或卸载机械协同工作的改进方法和*** |
CN102642162A (zh) * | 2012-05-08 | 2012-08-22 | 广东新海岸机械有限公司 | 玻璃双边磨削抛光设备 |
CN107357137A (zh) * | 2011-08-30 | 2017-11-17 | 株式会社尼康 | 曝光方法、制造方法和基板处理方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011018731A (ja) * | 2009-07-08 | 2011-01-27 | Rayresearch Corp | ウェハ分岐搬送装置 |
KR101439168B1 (ko) * | 2012-09-19 | 2014-09-12 | 우범제 | 웨이퍼 상에 잔존하는 공정가스를 제거하는 웨이퍼 퍼징 카세트를 갖춘 웨이퍼 처리장치 |
KR101458626B1 (ko) * | 2012-11-01 | 2014-11-11 | 우범제 | 웨이퍼 퍼징 카세트 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980075658A (ko) * | 1997-03-31 | 1998-11-16 | 윤종용 | 포토리소그래피 공정설비의 웨이퍼 이송시스템 및 웨이퍼 이송방법 |
JP3884170B2 (ja) * | 1998-06-18 | 2007-02-21 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP3576831B2 (ja) * | 1998-09-18 | 2004-10-13 | 東京エレクトロン株式会社 | 処理装置 |
JP2000138276A (ja) * | 1998-10-30 | 2000-05-16 | Tokyo Electron Ltd | 基板処理装置 |
-
2000
- 2000-06-29 KR KR1020000036453A patent/KR20010034990A/ko not_active Application Discontinuation
-
2001
- 2001-06-27 DE DE2001130998 patent/DE10130998A1/de not_active Withdrawn
- 2001-06-28 TW TW90115850A patent/TW504737B/zh not_active IP Right Cessation
- 2001-06-28 JP JP2001195958A patent/JP2002076088A/ja active Pending
- 2001-06-29 CN CN 01124802 patent/CN1342998A/zh active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100380599C (zh) * | 2002-04-15 | 2008-04-09 | 株式会社荏原制作所 | 抛光装置及基片处理装置 |
US7850817B2 (en) | 2002-04-15 | 2010-12-14 | Ebara Corporation | Polishing device and substrate processing device |
CN1306558C (zh) * | 2003-03-31 | 2007-03-21 | 精工爱普生株式会社 | 制造对象物的搬送装置和制造对象物的搬送方法 |
CN100403145C (zh) * | 2005-01-31 | 2008-07-16 | 中华映管股份有限公司 | 工厂生产加工***及其操作方法 |
CN101454733B (zh) * | 2006-06-06 | 2012-08-08 | Abb研究有限公司 | 用于操作循环生产机械与装载或卸载机械协同工作的改进方法和*** |
CN102324397A (zh) * | 2006-06-15 | 2012-01-18 | 东京毅力科创株式会社 | 衬底处理***以及衬底搬送方法 |
US8702370B2 (en) | 2006-06-15 | 2014-04-22 | Tokyo Electron Limited | Substrate transfer method for performing processes including photolithography sequence |
CN102324397B (zh) * | 2006-06-15 | 2015-01-07 | 东京毅力科创株式会社 | 衬底处理***以及衬底搬送方法 |
CN107357137A (zh) * | 2011-08-30 | 2017-11-17 | 株式会社尼康 | 曝光方法、制造方法和基板处理方法 |
CN102642162A (zh) * | 2012-05-08 | 2012-08-22 | 广东新海岸机械有限公司 | 玻璃双边磨削抛光设备 |
Also Published As
Publication number | Publication date |
---|---|
DE10130998A1 (de) | 2002-03-14 |
KR20010034990A (ko) | 2001-05-07 |
JP2002076088A (ja) | 2002-03-15 |
TW504737B (en) | 2002-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |