CN1342998A - 用于生产半导体装置和平板显示器的设备 - Google Patents

用于生产半导体装置和平板显示器的设备 Download PDF

Info

Publication number
CN1342998A
CN1342998A CN 01124802 CN01124802A CN1342998A CN 1342998 A CN1342998 A CN 1342998A CN 01124802 CN01124802 CN 01124802 CN 01124802 A CN01124802 A CN 01124802A CN 1342998 A CN1342998 A CN 1342998A
Authority
CN
China
Prior art keywords
product
robot
semiconductor device
equipment
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 01124802
Other languages
English (en)
Chinese (zh)
Inventor
韩占烈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DMS Co Ltd
Original Assignee
DMS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DMS Co Ltd filed Critical DMS Co Ltd
Publication of CN1342998A publication Critical patent/CN1342998A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN 01124802 2000-06-29 2001-06-29 用于生产半导体装置和平板显示器的设备 Pending CN1342998A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020000036453A KR20010034990A (ko) 2000-06-29 2000-06-29 반도체 및 평판디스플레이용 멀티기능을 갖춘 집적제조장치
KR36453/00 2000-06-29

Publications (1)

Publication Number Publication Date
CN1342998A true CN1342998A (zh) 2002-04-03

Family

ID=19674791

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 01124802 Pending CN1342998A (zh) 2000-06-29 2001-06-29 用于生产半导体装置和平板显示器的设备

Country Status (5)

Country Link
JP (1) JP2002076088A (ko)
KR (1) KR20010034990A (ko)
CN (1) CN1342998A (ko)
DE (1) DE10130998A1 (ko)
TW (1) TW504737B (ko)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1306558C (zh) * 2003-03-31 2007-03-21 精工爱普生株式会社 制造对象物的搬送装置和制造对象物的搬送方法
CN100380599C (zh) * 2002-04-15 2008-04-09 株式会社荏原制作所 抛光装置及基片处理装置
CN100403145C (zh) * 2005-01-31 2008-07-16 中华映管股份有限公司 工厂生产加工***及其操作方法
CN102324397A (zh) * 2006-06-15 2012-01-18 东京毅力科创株式会社 衬底处理***以及衬底搬送方法
CN101454733B (zh) * 2006-06-06 2012-08-08 Abb研究有限公司 用于操作循环生产机械与装载或卸载机械协同工作的改进方法和***
CN102642162A (zh) * 2012-05-08 2012-08-22 广东新海岸机械有限公司 玻璃双边磨削抛光设备
CN107357137A (zh) * 2011-08-30 2017-11-17 株式会社尼康 曝光方法、制造方法和基板处理方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011018731A (ja) * 2009-07-08 2011-01-27 Rayresearch Corp ウェハ分岐搬送装置
KR101439168B1 (ko) * 2012-09-19 2014-09-12 우범제 웨이퍼 상에 잔존하는 공정가스를 제거하는 웨이퍼 퍼징 카세트를 갖춘 웨이퍼 처리장치
KR101458626B1 (ko) * 2012-11-01 2014-11-11 우범제 웨이퍼 퍼징 카세트

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980075658A (ko) * 1997-03-31 1998-11-16 윤종용 포토리소그래피 공정설비의 웨이퍼 이송시스템 및 웨이퍼 이송방법
JP3884170B2 (ja) * 1998-06-18 2007-02-21 大日本スクリーン製造株式会社 基板処理装置
JP3576831B2 (ja) * 1998-09-18 2004-10-13 東京エレクトロン株式会社 処理装置
JP2000138276A (ja) * 1998-10-30 2000-05-16 Tokyo Electron Ltd 基板処理装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100380599C (zh) * 2002-04-15 2008-04-09 株式会社荏原制作所 抛光装置及基片处理装置
US7850817B2 (en) 2002-04-15 2010-12-14 Ebara Corporation Polishing device and substrate processing device
CN1306558C (zh) * 2003-03-31 2007-03-21 精工爱普生株式会社 制造对象物的搬送装置和制造对象物的搬送方法
CN100403145C (zh) * 2005-01-31 2008-07-16 中华映管股份有限公司 工厂生产加工***及其操作方法
CN101454733B (zh) * 2006-06-06 2012-08-08 Abb研究有限公司 用于操作循环生产机械与装载或卸载机械协同工作的改进方法和***
CN102324397A (zh) * 2006-06-15 2012-01-18 东京毅力科创株式会社 衬底处理***以及衬底搬送方法
US8702370B2 (en) 2006-06-15 2014-04-22 Tokyo Electron Limited Substrate transfer method for performing processes including photolithography sequence
CN102324397B (zh) * 2006-06-15 2015-01-07 东京毅力科创株式会社 衬底处理***以及衬底搬送方法
CN107357137A (zh) * 2011-08-30 2017-11-17 株式会社尼康 曝光方法、制造方法和基板处理方法
CN102642162A (zh) * 2012-05-08 2012-08-22 广东新海岸机械有限公司 玻璃双边磨削抛光设备

Also Published As

Publication number Publication date
DE10130998A1 (de) 2002-03-14
KR20010034990A (ko) 2001-05-07
JP2002076088A (ja) 2002-03-15
TW504737B (en) 2002-10-01

Similar Documents

Publication Publication Date Title
CN1342998A (zh) 用于生产半导体装置和平板显示器的设备
JP4767641B2 (ja) 基板処理装置および基板搬送方法
CN101767718B (zh) 传送一个或多个基板于工艺模块之间或装卸站之间的方法
US7880859B2 (en) Substrate processing system and substrate processing method
CN101835922B (zh) 用于制造工件的方法和装置
JPH07122622A (ja) 製造システムおよび製造方法
CN101767719A (zh) 基板的处理***、传输***和传输方法以及横向移动室
US6328768B1 (en) Semiconductor device manufacturing line
US20130079913A1 (en) Methods and systems for semiconductor fabrication with local processing management
TWI388026B (zh) 處理基板之裝置和方法
CN1321448C (zh) 基板处理装置和基板处理方法
JPH0950948A (ja) 半導体製造装置の障害対処システム
CN100349787C (zh) 库存传输***
KR20010092646A (ko) 생산관리방법 및 ｔｆｔ 기판의 제조방법
TW201117312A (en) Processing apparatus
KR100317000B1 (ko) 스토커-기지 이동 시스템
KR100934769B1 (ko) 기판 이송 시스템
CN1770387A (zh) 制造过程中实时批次发送***及其方法
KR101055195B1 (ko) 액정표시장치의 제조장치
US20220210871A1 (en) Heater array and apparatus for processing a substrate including an heater array
JPH07281171A (ja) カラーフィルタ製造装置
CN1244137C (zh) 流程卡情况下半导体设备的污染控制方法
US20080279674A1 (en) Operative method of a manufacturing system
CN115354292A (zh) 基于ropn技术的薄膜沉积设备的控制方法
KR20090128291A (ko) 기판 반송 장치 및 그것을 갖는 기판 처리 시스템

Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication