CN1333279C - 用于光互连模块的硅载体 - Google Patents
用于光互连模块的硅载体 Download PDFInfo
- Publication number
- CN1333279C CN1333279C CNB2004100909434A CN200410090943A CN1333279C CN 1333279 C CN1333279 C CN 1333279C CN B2004100909434 A CNB2004100909434 A CN B2004100909434A CN 200410090943 A CN200410090943 A CN 200410090943A CN 1333279 C CN1333279 C CN 1333279C
- Authority
- CN
- China
- Prior art keywords
- light
- integrated circuit
- interconnecting modules
- silicon carrier
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
- Optical Integrated Circuits (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/738,064 | 2003-12-17 | ||
US10/738,064 US7058247B2 (en) | 2003-12-17 | 2003-12-17 | Silicon carrier for optical interconnect modules |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1629671A CN1629671A (zh) | 2005-06-22 |
CN1333279C true CN1333279C (zh) | 2007-08-22 |
Family
ID=34677309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100909434A Active CN1333279C (zh) | 2003-12-17 | 2004-11-10 | 用于光互连模块的硅载体 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7058247B2 (zh) |
JP (1) | JP4019395B2 (zh) |
KR (1) | KR100633837B1 (zh) |
CN (1) | CN1333279C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9335500B2 (en) | 2012-01-31 | 2016-05-10 | Hewlett Packard Enterprise Development Lp | Hybrid electro-optical package for an opto-electronic engine |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7557433B2 (en) | 2004-10-25 | 2009-07-07 | Mccain Joseph H | Microelectronic device with integrated energy source |
US7181099B2 (en) * | 2004-02-26 | 2007-02-20 | Optical Communication Products, Inc. | Fiber optic module packaging architecture for integrated circuit and optical subassembly integration |
US20060007969A1 (en) * | 2004-03-31 | 2006-01-12 | Barnett Brandon C | Short pulse optical interconnect |
TWI317030B (en) | 2006-10-04 | 2009-11-11 | Ind Tech Res Inst | An optical interconnection module |
US8110899B2 (en) * | 2006-12-20 | 2012-02-07 | Intel Corporation | Method for incorporating existing silicon die into 3D integrated stack |
US8231284B2 (en) * | 2007-03-26 | 2012-07-31 | International Business Machines Corporation | Ultra-high bandwidth, multiple-channel full-duplex, single-chip CMOS optical transceiver |
US20080268396A1 (en) * | 2007-04-26 | 2008-10-30 | Duncan Stewart | Active control of time-varying spatial temperature distribution |
US8143719B2 (en) * | 2007-06-07 | 2012-03-27 | United Test And Assembly Center Ltd. | Vented die and package |
US7750459B2 (en) * | 2008-02-01 | 2010-07-06 | International Business Machines Corporation | Integrated module for data processing system |
US7486847B1 (en) | 2008-03-31 | 2009-02-03 | International Business Machines Corporation | Chip carrier package with optical vias |
US8110415B2 (en) * | 2008-04-03 | 2012-02-07 | International Business Machines Corporation | Silicon based microchannel cooling and electrical package |
US8877616B2 (en) | 2008-09-08 | 2014-11-04 | Luxtera, Inc. | Method and system for monolithic integration of photonics and electronics in CMOS processes |
US8559824B2 (en) * | 2008-09-30 | 2013-10-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Parallel optical transceiver module having a balanced laser driver arrangement |
US8290008B2 (en) * | 2009-08-20 | 2012-10-16 | International Business Machines Corporation | Silicon carrier optoelectronic packaging |
US9052477B2 (en) | 2009-10-29 | 2015-06-09 | Sumitomo Electric Industries, Ltd. | Optical transceiver with inner fiber set within tray securing thermal path from electronic device to housing |
JP2012252135A (ja) * | 2011-06-02 | 2012-12-20 | Sumitomo Electric Ind Ltd | 光通信装置 |
CA2719927C (en) | 2010-11-05 | 2014-04-29 | Ibm Canada Limited - Ibm Canada Limitee | Laser ashing of polyimide for semiconductor manufacturing |
US8687971B2 (en) * | 2011-01-31 | 2014-04-01 | Telefonaktiebolaget Lm Ericsson (Publ) | System, laser-on-CMOS chip, and method for setting a wavelength to be used by the laser-on-CMOS chip |
US20130230272A1 (en) * | 2012-03-01 | 2013-09-05 | Oracle International Corporation | Chip assembly configuration with densely packed optical interconnects |
US9052880B2 (en) * | 2012-04-18 | 2015-06-09 | International Business Machines Corporation | Multi-level interconnect apparatus |
US9874688B2 (en) | 2012-04-26 | 2018-01-23 | Acacia Communications, Inc. | Co-packaging photonic integrated circuits and application specific integrated circuits |
CN103383480B (zh) * | 2012-05-04 | 2016-09-14 | 鸿富锦精密工业(深圳)有限公司 | 光纤耦合连接器及其制造方法 |
CN104303441B (zh) | 2012-05-31 | 2017-08-08 | 富士通株式会社 | 光发送接收装置以及光输出值控制方法 |
US9036952B2 (en) * | 2012-07-25 | 2015-05-19 | International Business Machines Corporation | Electro-optical assembly for silicon photonic chip and electro-optical carrier |
US9541718B2 (en) | 2013-03-29 | 2017-01-10 | Photonics Electronics Technology Research Association | Photoelectric hybrid device and method for manufacturing same |
TW201441689A (zh) * | 2013-04-23 | 2014-11-01 | Hon Hai Prec Ind Co Ltd | 光通訊裝置 |
US9250403B2 (en) * | 2013-04-26 | 2016-02-02 | Oracle International Corporation | Hybrid-integrated photonic chip package with an interposer |
US9413140B2 (en) * | 2013-12-19 | 2016-08-09 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor arrangement and formation thereof |
DE202014103217U1 (de) * | 2014-07-13 | 2014-09-29 | Christian Stroetmann | Integrierter Halbleiterbaustein, der mindestens drei unabhängige integrierte Systemkomponenten besitzt |
US9543463B2 (en) | 2014-10-27 | 2017-01-10 | International Business Machines Corporation | Signal distribution in integrated circuit using optical through silicon via |
US10852492B1 (en) | 2014-10-29 | 2020-12-01 | Acacia Communications, Inc. | Techniques to combine two integrated photonic substrates |
SG11201703131WA (en) | 2014-10-29 | 2017-05-30 | Acacia Communications Inc | Optoelectronic ball grid array package with fiber |
CN106571871A (zh) * | 2015-10-13 | 2017-04-19 | 华为技术有限公司 | 一种光通信模块,及载板 |
CN105372773B (zh) * | 2015-12-25 | 2017-06-30 | 华进半导体封装先导技术研发中心有限公司 | 透镜载板、透镜载板制备方法和光功率监测模块 |
US10025033B2 (en) | 2016-03-01 | 2018-07-17 | Advanced Semiconductor Engineering, Inc. | Optical fiber structure, optical communication apparatus and manufacturing process for manufacturing the same |
US10241264B2 (en) | 2016-07-01 | 2019-03-26 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages |
US10025047B1 (en) * | 2017-04-14 | 2018-07-17 | Google Llc | Integration of silicon photonics IC for high data rate |
FR3066615B1 (fr) | 2017-05-17 | 2019-11-15 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Puce photonique a structure de collimation integree |
EP3503316B1 (en) * | 2017-12-20 | 2023-08-30 | Finisar Corporation | An integrated optical transceiver |
US11756943B2 (en) | 2017-12-29 | 2023-09-12 | Intel Corporation | Microelectronic assemblies |
WO2019152990A1 (en) | 2018-02-05 | 2019-08-08 | Samtec Inc. | Optical interposer |
US10775576B2 (en) * | 2018-03-01 | 2020-09-15 | Ayar Labs, Inc. | Thermal management system for multi-chip-module and associated methods |
FR3082354B1 (fr) * | 2018-06-08 | 2020-07-17 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Puce photonique traversee par un via |
US10916507B2 (en) | 2018-12-04 | 2021-02-09 | International Business Machines Corporation | Multiple chip carrier for bridge assembly |
US11561352B2 (en) * | 2020-04-01 | 2023-01-24 | Mellanox Technologies, Ltd. | High density optical I/O inside a data center switch using multi-core fibers |
US11630274B2 (en) | 2020-04-01 | 2023-04-18 | Mellanox Technologies, Ltd. | High-density optical communications using multi-core fiber |
US11378765B2 (en) | 2020-05-25 | 2022-07-05 | Mellanox Technologies, Ltd. | Intra data center and inter data center links using dual-wavelength multimode/singlemode multi-core fiber |
US11303379B1 (en) | 2020-11-05 | 2022-04-12 | Mellanox Technologies, Ltd. | Communication between data centers using a multi-core fiber |
JP2022115723A (ja) * | 2021-01-28 | 2022-08-09 | アイオーコア株式会社 | 光電気モジュール |
CN113917631B (zh) * | 2021-10-20 | 2024-03-01 | 东莞立讯技术有限公司 | 共封装集成光电模块及共封装光电交换芯片结构 |
CN115166913B (zh) * | 2022-06-29 | 2024-05-10 | 中国科学院西安光学精密机械研究所 | 一种基于微环的波分复用共封装光互连架构 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07193535A (ja) * | 1993-11-09 | 1995-07-28 | Hewlett Packard Co <Hp> | オプトエレクトロニク装置 |
US6495382B2 (en) * | 1999-11-01 | 2002-12-17 | Hughes Electronics Corporation | Application-specific optoelectronic integrated circuit |
CN1423754A (zh) * | 1999-11-11 | 2003-06-11 | 英特尔公司 | 用于光学互连多个计算单元的总线配置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3833311A1 (de) | 1988-09-30 | 1990-04-19 | Siemens Ag | Optoelektronische sende- und empfangsvorrichtung |
DE3834335A1 (de) | 1988-10-08 | 1990-04-12 | Telefunken Systemtechnik | Halbleiterschaltung |
US5386137A (en) | 1990-04-20 | 1995-01-31 | Australian & Overseas Telecommunications Corp. Ltd. | Electro-optic device |
US5600130A (en) | 1994-06-17 | 1997-02-04 | The Regents Of The University Of Colorado | Two-dimensional optoelectronic array module |
US6097748A (en) | 1998-05-18 | 2000-08-01 | Motorola, Inc. | Vertical cavity surface emitting laser semiconductor chip with integrated drivers and photodetectors and method of fabrication |
US6222202B1 (en) | 1998-10-06 | 2001-04-24 | Agilent Technologies, Inc. | System and method for the monolithic integration of a light emitting device and a photodetector for low bias voltage operation |
AU7104900A (en) | 1999-09-03 | 2001-04-10 | Teraconnect, Inc. | Method for integration of integrated circuit devices |
JP2002357748A (ja) | 2001-03-30 | 2002-12-13 | Kyocera Corp | 光路変換反射体及びその実装構造並びに光モジュール |
US6739760B2 (en) * | 2001-09-17 | 2004-05-25 | Stratos International, Inc. | Parallel fiber optics communications module |
US6861341B2 (en) * | 2002-02-22 | 2005-03-01 | Xerox Corporation | Systems and methods for integration of heterogeneous circuit devices |
-
2003
- 2003-12-17 US US10/738,064 patent/US7058247B2/en not_active Expired - Lifetime
-
2004
- 2004-11-10 CN CNB2004100909434A patent/CN1333279C/zh active Active
- 2004-11-16 KR KR1020040093391A patent/KR100633837B1/ko not_active IP Right Cessation
- 2004-12-17 JP JP2004365320A patent/JP4019395B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07193535A (ja) * | 1993-11-09 | 1995-07-28 | Hewlett Packard Co <Hp> | オプトエレクトロニク装置 |
US5513021A (en) * | 1993-11-09 | 1996-04-30 | Hewlett-Packard Company | Optical detectors and sources with merged holographic optical elements suitable for optoelectronic interconnects |
US6495382B2 (en) * | 1999-11-01 | 2002-12-17 | Hughes Electronics Corporation | Application-specific optoelectronic integrated circuit |
CN1423754A (zh) * | 1999-11-11 | 2003-06-11 | 英特尔公司 | 用于光学互连多个计算单元的总线配置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9335500B2 (en) | 2012-01-31 | 2016-05-10 | Hewlett Packard Enterprise Development Lp | Hybrid electro-optical package for an opto-electronic engine |
TWI559041B (zh) * | 2012-01-31 | 2016-11-21 | 惠普研發公司 | 用於光電引擎之混合式電光封裝 |
Also Published As
Publication number | Publication date |
---|---|
JP2005182033A (ja) | 2005-07-07 |
US7058247B2 (en) | 2006-06-06 |
CN1629671A (zh) | 2005-06-22 |
JP4019395B2 (ja) | 2007-12-12 |
US20050135732A1 (en) | 2005-06-23 |
KR20050061289A (ko) | 2005-06-22 |
KR100633837B1 (ko) | 2006-10-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1333279C (zh) | 用于光互连模块的硅载体 | |
US6955481B2 (en) | Method and apparatus for providing parallel optoelectronic communication with an electronic device | |
US9488791B2 (en) | Optoelectronic module | |
US6752539B2 (en) | Apparatus and system for providing optical bus interprocessor interconnection | |
US7084496B2 (en) | Method and apparatus for providing optoelectronic communication with an electronic device | |
US6635866B2 (en) | Multi-functional fiber optic coupler | |
EP1723456B1 (en) | System and method for the fabrication of an electro-optical module | |
US8285087B2 (en) | Optical interconnection system using optical printed circuit board having one-unit optical waveguide integrated therein | |
US8705906B2 (en) | Photoelectric conversion module | |
US8000564B2 (en) | Photoelectric conversion module for direct optical interconnection and method of manufacturing the same | |
US9647762B2 (en) | Integrated parallel optical transceiver | |
KR100734906B1 (ko) | 연성 광 pcb를 이용한 광연결 장치 | |
US8940563B2 (en) | Method for manufacturing optoelectronic module | |
CN104395796A (zh) | 光波导 | |
US6922496B2 (en) | Integrated VCSELs on ASIC module using flexible electrical connections | |
US20050205957A1 (en) | Integrated VCSELs on traditional VLSI packaging | |
US20030038297A1 (en) | Apparatus,system, and method for transmission of information between microelectronic devices | |
Doany et al. | Chip-to-chip board-level optical data buses | |
CN101523264A (zh) | 光电变换装置 | |
Kash et al. | 24-channel optical transceiver module for waveguide-on-card interconnects | |
CN115079351A (zh) | 一种光模块 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171107 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171107 Address after: American New York Patentee after: Core USA second LLC Address before: American New York Patentee before: International Business Machines Corp. |