CN1331165C - Chip type macromolecule PTC thermistor - Google Patents
Chip type macromolecule PTC thermistor Download PDFInfo
- Publication number
- CN1331165C CN1331165C CNB03116241XA CN03116241A CN1331165C CN 1331165 C CN1331165 C CN 1331165C CN B03116241X A CNB03116241X A CN B03116241XA CN 03116241 A CN03116241 A CN 03116241A CN 1331165 C CN1331165 C CN 1331165C
- Authority
- CN
- China
- Prior art keywords
- lead
- ptc thermistor
- high molecular
- chip type
- composite sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920002521 macromolecule Polymers 0.000 title abstract 4
- 239000002131 composite material Substances 0.000 claims abstract description 20
- 229920000642 polymer Polymers 0.000 claims abstract description 12
- 239000012212 insulator Substances 0.000 claims abstract description 4
- 238000000465 moulding Methods 0.000 claims description 15
- -1 polyethylene Polymers 0.000 claims description 7
- 239000011231 conductive filler Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 12
- 230000032683 aging Effects 0.000 abstract description 5
- 230000007613 environmental effect Effects 0.000 abstract description 4
- 238000004891 communication Methods 0.000 abstract description 3
- 239000011162 core material Substances 0.000 abstract 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000007634 remodeling Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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- Thermistors And Varistors (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB03116241XA CN1331165C (en) | 2003-04-08 | 2003-04-08 | Chip type macromolecule PTC thermistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB03116241XA CN1331165C (en) | 2003-04-08 | 2003-04-08 | Chip type macromolecule PTC thermistor |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1447352A CN1447352A (en) | 2003-10-08 |
CN1331165C true CN1331165C (en) | 2007-08-08 |
Family
ID=28050518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB03116241XA Expired - Fee Related CN1331165C (en) | 2003-04-08 | 2003-04-08 | Chip type macromolecule PTC thermistor |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1331165C (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4530169B2 (en) | 2005-12-09 | 2010-08-25 | Tdk株式会社 | THERMISTOR DEVICE AND METHOD FOR MANUFACTURING THERMISTOR DEVICE |
CN109275212B (en) * | 2018-10-29 | 2021-07-13 | 华东理工大学 | Electrothermal film with PTC effect and preparation method thereof |
CN112880854A (en) * | 2021-01-13 | 2021-06-01 | 深圳市汇北川电子技术有限公司 | Use sensor that temperature detected on-vehicle power battery FPC |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0953992A1 (en) * | 1995-08-15 | 1999-11-03 | Bourns Multifuse (Hong Kong), Ltd. | Surface mount conductive polymer devices and methods for manufacturing such devices |
CN1254932A (en) * | 1998-11-19 | 2000-05-31 | 上海维安热电材料有限公司 | Low-resistance thermosensitive resistor and its making method |
-
2003
- 2003-04-08 CN CNB03116241XA patent/CN1331165C/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0953992A1 (en) * | 1995-08-15 | 1999-11-03 | Bourns Multifuse (Hong Kong), Ltd. | Surface mount conductive polymer devices and methods for manufacturing such devices |
CN1254932A (en) * | 1998-11-19 | 2000-05-31 | 上海维安热电材料有限公司 | Low-resistance thermosensitive resistor and its making method |
Also Published As
Publication number | Publication date |
---|---|
CN1447352A (en) | 2003-10-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHANGHAI CHANGYUAN WEIAN ELECTRONIC LINE PROTECTIO Free format text: FORMER NAME OR ADDRESS: WEIAN THERMOELECTRIC MATERIAL CO LTD, SHANGHAI |
|
CP03 | Change of name, title or address |
Address after: Shanghai City, Siping Road No. 710 715Z Patentee after: Shanghai Changyuan Wayon Circuit Protection Co., Ltd. Address before: Room 201, Xinqiao 401, Shanghai, Pudong Patentee before: Weian Thermoelectrical Materials Co., Ltd., Shanghai |
|
C56 | Change in the name or address of the patentee |
Owner name: SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO., L Free format text: FORMER NAME: SHANGHAI CHANGYUAN WEIAN ELECTRONIC LINE PROTECTION CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 200092, Siping Road, Shanghai, No. 710, 715-Z Patentee after: Shanghai Changyuan Wayon Circuit Protection Co., Ltd. Address before: 200092, Siping Road, Shanghai, No. 710, 715-Z Patentee before: Shanghai Changyuan Wayon Circuit Protection Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070808 Termination date: 20120408 |