CN1330221C - Structure of signal transferring - Google Patents
Structure of signal transferring Download PDFInfo
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- CN1330221C CN1330221C CNB2003101026180A CN200310102618A CN1330221C CN 1330221 C CN1330221 C CN 1330221C CN B2003101026180 A CNB2003101026180 A CN B2003101026180A CN 200310102618 A CN200310102618 A CN 200310102618A CN 1330221 C CN1330221 C CN 1330221C
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- 230000008054 signal transmission Effects 0.000 claims abstract description 48
- 230000005540 biological transmission Effects 0.000 claims abstract description 10
- 239000004020 conductor Substances 0.000 claims description 103
- 230000000694 effects Effects 0.000 abstract description 9
- 238000013461 design Methods 0.000 abstract description 8
- 230000003071 parasitic effect Effects 0.000 abstract description 8
- 230000008878 coupling Effects 0.000 abstract description 6
- 238000010168 coupling process Methods 0.000 abstract description 6
- 238000005859 coupling reaction Methods 0.000 abstract description 6
- 230000001939 inductive effect Effects 0.000 abstract description 6
- 206010028400 Mutagenic effect Diseases 0.000 description 4
- 231100000243 mutagenic effect Toxicity 0.000 description 4
- 230000003505 mutagenic effect Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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Abstract
The present invention relates to a signal transmission structure which is at least provided with a reference plane surface and two signal conducting wires, wherein the reference plane surface has a non-reference area, while the two signal conducting wires are respectively provided with a bulge part; the two bulge parts correspond to the position of the non-reference area and are respectively projected out of the edges relatively far away from the signal conducting wires. When signals are transferred on the signal conducting wires, a parasitic capacitance effect generated by the two bulge parts and the reference plane surface is used for improving the phenomenon of the mismatch of characteristic impedance of the signal conducting wires. Moreover, when the two signal conducting wires perform transmission with a high speed or high frequency, and the signals cross the non-reference plane surface, the phenomena of near-end crosstalk and far-end crosstalk resulting from the other signal conducting wire can be improved by the design of the two bulge parts. Moreover, inductive coupling generated between the two signal conducting wires can be reduced so as to maintain the integrity of the signals.
Description
Technical field
The present invention is relevant for a kind of signal transmission structure, and particularly relevant for a kind of signal conductor unmatched signal transmission structure of the caused impedance of a non-reference zone of passing through that improves.
Background technology
On large-sized print circuit board and base plate for packaging, be used to be electrically connected the signal conductor between two element or two end points, its live width all need be consistent, so that electronic signal is when transmitting between signal conductor, the characteristic impedance of signal conductor (characteristic impedance) can remain unchanged, especially at a high speed and the signal transmission of high frequency, more need to utilize good impedance matching (impedancematching) design between the two-end-point, be used to reduce the reflection that impedance does not match and caused, insertion loss (insertion loss) when promptly reducing the signal transmission, and the return loss (returnloss) when improving the signal transmission relatively is to avoid influencing the quality that signal transmits.
Please refer to Figure 1A and 1B, it represents conventional binary signal lead the pass through schematic top plan view and the schematic side view of a non-reference zone respectively.Signal transmission structure 110 comprises reference planes 120 and binary signal lead 130,140 at least.Reference planes 120 for example are power plane (power plane) or ground plane (ground plane), and the live width unanimity of binary signal lead 130,140.It should be noted that conventional line design, reference planes 120 can form a plurality of through holes or perforate because of boring or interplanar cutting, thereby form a non-reference zone 122, for example are a non-reference zone opening.Therefore, when signal transmits respectively, can in this non-reference zone 122 of passing through, cause the mutagenic effect of high impedance on signal conductor 130,140, make the unmatched situation of impedance of signal conductor 130,140 increase.In addition, binary signal lead 130,140 also will become big because of the non-reference zone 122 of passing through makes inductive couplings between the two thereupon, and make the phenomenon of near-end crosstalk (near-end crosstalk) and far-end crosstalk (far-endcrosstalk) become more serious, thereby cause signal can't be correctly and intactly by an endpoint transfers of signal conductor 130,140 to another end points.
In addition, please also refer to Figure 1A and 2, wherein Fig. 2 represents pass through the respectively schematic diagram that concerns of the frequency of a complete reference plane (shown in solid line R) and a non-reference zone (shown in solid line T) and characteristic impedance of a conventional signal conductor, when operating frequency heals when high, under same operating frequency, the pass through characteristic impedance of non-reference zone 122 of signal conductor 130,140 will be risen the more, thereby produce the unmatched situation of impedance.Hence one can see that, when in case signal conductor 130,140 passed through non-complete reference plane 120, rising along with frequency, it is big that the characteristic impedance of signal conductor 130,140 also becomes thereupon, and also will become greatly with the resistance value difference of original design, thereby the situation that makes impedance not match to occur on the signal conductor 130,140 will become even more serious.
Summary of the invention
In view of this, purpose of the present invention is providing a kind of signal transmission structure exactly, is used to improve signal conductor and passes through the unmatched phenomenon of the caused impedance of a non-reference zone.
Another object of the present invention provides a kind of signal transmission structure, is used to improve signal conductor phenomenon at caused near-end crosstalk of another signal conductor and far-end crosstalk when passing through a non-reference zone, to keep the integrality of signal.
For reaching above-mentioned purpose of the present invention, the present invention proposes a kind of signal transmission structure, is applicable to a wiring board, and this signal transmission structure comprises reference planes, one first signal conductor and a secondary signal lead at least.Reference planes have a non-reference zone, and first signal conductor is disposed at a side of reference planes, and first signal conductor has at least one first ledge, and it is corresponding to the position of non-reference zone, and protrude in the lateral margin of first signal conductor.In addition, the secondary signal conductor configurations is in the same side of reference planes, and signal conductor has at least one second ledge, it is corresponding to the position of non-reference zone, and protrude in the lateral margin of secondary signal lead, wherein first ledge and second ledge protrude in respectively first signal conductor relative with the secondary signal lead away from lateral margin.
For reaching above-mentioned purpose of the present invention, the present invention proposes a kind of signal transmission structure, is applicable to a wiring board, and this signal transmission structure comprises reference planes, one first signal conductor and a secondary signal lead at least.Reference planes have a non-reference zone, and first signal conductor is disposed at a side of reference planes, and first signal conductor has at least one ledge, and it is corresponding to the position of non-reference zone, and protrude in the lateral margin of first signal conductor.In addition, the secondary signal conductor configurations is in the same side of reference planes, and the secondary signal lead is positioned at relatively the side away from first signal conductor of this ledge.
Described according to the first embodiment of the present invention, above-mentioned reference planes are power plane or ground plane, and reference planes and first, second signal conductor copline not, and copline for example between first signal conductor and the secondary signal lead, and both equal tops by non-reference zone.In addition, the first local ledge for example extends to the top outside the non-reference zone, and the second local ledge for example extends to the top outside the non-reference zone.In addition, described according to the second embodiment of the present invention, for example non-copline between above-mentioned reference planes and first, second signal conductor, and the secondary signal lead and first signal conductor copline for example, and the secondary signal lead top by non-reference zone.
Based on above-mentioned, the present invention is because of adopting the signal transmission structure of outstanding design, and this ledge correspondence is positioned on the position of non-reference zone, and protrudes in the lateral margin of signal conductor.When signal transmits on signal conductor, the parasitic capacitance effect that can utilize this ledge and reference planes to be produced, the unmatched phenomenon of caused characteristic impedance when improving signal and passing through non-reference planes.In addition, the binary signal lead is at a high speed or during high-frequency transmission, also can utilize protuberance to assign to improve signal phenomenon at caused near-end crosstalk of another signal conductor and far-end crosstalk when passing through non-reference planes, to keep the integrality of signal.
Description of drawings
For above-mentioned and other purposes of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail as follows:
Figure 1A and 1B represent conventional binary signal lead the pass through schematic top plan view and the schematic side view of a non-reference zone respectively.
Fig. 2 represents pass through the respectively schematic diagram that concerns of the frequency of a complete reference plane and a non-reference zone and characteristic impedance of a conventional signal conductor.
Fig. 3 A and 3B represent a kind of signal transmission structure of first embodiment of the invention respectively, and it is applicable to the schematic top plan view of a wiring board and the generalized section of I-I line.
Fig. 4 and 5 represents the present invention's a kind of signal transmission structure of two preferred embodiments in addition respectively, and it is applicable to the schematic top plan view of a wiring board.
Fig. 6 represents a kind of signal transmission structure of the another preferred embodiment of the present invention, and it is applicable to the schematic top plan view of a wiring board.
Fig. 7 A and 7B represent a kind of signal transmission structure of second embodiment of the invention respectively, and it is applicable to the schematic top plan view of a wiring board and the generalized section of II-II line.
Accompanying drawing indicates explanation
110: signal transmission structure
120: reference planes
122: non-reference zone
130,140: signal conductor
210: signal transmission structure
220: reference planes
222: non-reference zone
230,240: signal conductor
232,242: ledge
232a, 242a: left ledge
232b, 242b: right ledge
310: signal transmission structure
320: reference planes
322: non-reference zone
330,340: signal conductor
332: ledge
A1, A2: area
D: distance
Embodiment
First embodiment
Please refer to Fig. 3 A and 3B, it represents a kind of signal transmission structure of first embodiment of the invention respectively, and it is applicable to the schematic top plan view of a wiring board and the generalized section of I-I line.Signal transmission structure 210 is applicable to a wiring board, for example is a printed circuit board (PCB) or a base plate for packaging, and signal transmission structure 210 has reference planes 220 and binary signal lead 230,240 at least.Wherein, binary signal lead 230,240 is positioned at the same side of reference planes 220, and binary signal lead 230,240 copline for example, and both and reference planes 220 copline not.In addition, reference planes 220 for example are power plane or ground plane, and partial reference plane 220 is because of holing or cutting and cause a non-reference zone 222, for example a non-reference zone opening.In addition, binary signal lead 230,240 has a ledge 232,242 respectively, and these two ledges, 232,242 correspondences protrude in the lateral margin of binary signal lead 230,240, and lay respectively at binary signal lead 230,240 relatively away from lateral margin on.Thereby, when signal transmits on binary signal lead 230,240, utilize and widen two ledges 232,242 of design, can avoid signal in this non-reference zone 222 of passing through, to cause the mutagenic effect of high impedance.Therefore, the parasitic capacitance effect that binary signal lead 230,240 can utilize this two ledge 232,242 and reference planes 220 to be produced is improved the unmatched phenomenon of impedance of signal conductor 230,240.
Please refer to Fig. 3 A and 3B equally, binary signal lead 230,240 is when high speed or high-frequency transmission, in the time of also can utilizing two ledges 232,242 to improve signal to pass through non-reference planes 222 in the phenomenon of caused near-end crosstalk of another signal conductor and far-end crosstalk, and the inductive couplings that is produced between the reduction binary signal lead 230,240, keeping the integrality of signal, and make signal correctly and intactly by an endpoint transfers of signal conductor 230,240 to another end points.
On the impedance computation of binary signal lead 230,240, the equivalent approximate formula of characteristic impedance Z is
Wherein L is the equivalent inductance of signal conductor, and C is the equivalent capacity of signal conductor.With regard to routine techniques, the equivalent inductance L of signal conductor improves through non-reference zone 122 because of signal rows, and characteristic impedance Z is increased and the mutagenic effect of generation high impedance relatively.Yet, present embodiment is to utilize the equivalent capacity C that improves signal conductor 230,240, so that its characteristic impedance Z reduces because of parasitic capacitance effect relatively in the position of non-reference zone 222, and the characteristic impedance Z of signal conductor 230,240 is reached unanimity, with the purpose of the impedance matching that reaches signal conductor 230,240.
Two ledges 232,242 of design are widened in utilization, can improve signal conductor 230,240 pass through relative area A1, the A2 of non-reference zone 222, and promptly the equivalent capacity between signal conductor 230,240 and the reference planes 220 also can improve thereupon.Therefore, when signal is passed through two ledges 232,242 of the signal conductor 230,240 widened relatively respectively, the parasitic capacitance effect that can utilize this two ledge 232,242 and reference planes 220 to be produced is improved the unmatched phenomenon of characteristic impedance of signal conductor 230,240.
Please refer to Fig. 4 and 5, it represents the present invention's a kind of signal transmission structure of two preferred embodiments in addition respectively, and it is applicable to the schematic top plan view of a wiring board.As shown in Figure 4, the local ledge 232,242 of binary signal lead 230,240 also can extend to the top outside the non-reference zone 222 respectively.So, utilize to improve the equivalent capacity C of two ledges 232,242 of signal conductor 230,240, so that the characteristic impedance Z of signal conductor 230,240 can reach unanimity, with the purpose of the impedance matching that reaches signal conductor 230,240.In addition, as shown in Figure 5, binary signal lead 230,240 has a ledge 232,242 respectively, and ledge 232 also comprises a left ledge 232a and a right ledge 232b, and another ledge 242 also comprises a left ledge 242a and a right ledge 242b.Wherein, left side ledge 232a, 242a are distributed in the side with respect to the bearing of trend of binary signal lead 230,240 of non-reference zone 222, and right ledge 232b, 432b are distributed in the opposite side with respect to the bearing of trend of binary signal lead 230,240 of non-reference zone 222.So, the same equivalent capacity C that utilizes two ledges 232,242 that improve signal conductor 230,240 can make the characteristic impedance Z of signal conductor 230,240 reach unanimity, with the purpose of the impedance matching that reaches signal conductor 230,240.
Moreover, please refer to Fig. 6, a kind of signal transmission structure of the another preferred embodiment of its expression the present invention, it is applicable to the schematic top plan view of a wiring board.Binary signal lead 230,240 has a ledge 232,242 respectively, and two ledges 232,242 are along with the pass through position of non-reference zone 222 of its signal conductor 230,240 is different and change the size of its area A 1, A2.For example shown in Figure 6, the pass through top of middle body of non-reference zone 222 of signal conductor 230, the top of the marginal portion of non-reference zone 222 and another signal conductor 240 is passed through.Because the high impedance that both produced variation is different, also (A1＞A2) is used for the unmatched phenomenon of impedance that non-reference zone 222 that corresponding compensation binary signal lead 230,240 passed through is produced with different because of the area A 1 of the ledge 232,242 of this binary signal lead 230,240, A2.
Second embodiment
Please refer to Fig. 7 A and 7B, it represents a kind of signal transmission structure of second embodiment of the invention respectively, and it is applicable to the schematic top plan view of a wiring board and the generalized section of II-II line.Signal transmission structure 310 is applicable to a wiring board, for example is a printed circuit board (PCB) or a base plate for packaging, and signal transmission structure 310 has reference planes 320 and binary signal lead 330,340 at least.Wherein, binary signal lead 330,340 is positioned at the same side of reference planes 320, and binary signal lead 330,340 coplines, and both and reference planes 320 copline not.In addition, reference planes 320 for example are power plane or ground plane, and partial reference plane 320 is because of holing or cutting and cause a non-reference zone 322, for example a non-reference zone opening.In addition, signal conductor 330 has a ledge 332, and this ledge 332 is corresponding to the position of non-reference zone 322, and protrudes in the lateral margin of signal conductor 330.In addition, another signal conductor 340 is disposed at the adjacent side of signal conductor 330, and signal conductor 340 is positioned at the side away from the signal conductor 330 of ledge 332 relatively, and the top by non-reference zone 322 not.Thereby, when signal transmits on signal conductor 330, can avoid signal in this non-reference zone 322 of passing through, to cause the mutagenic effect of high impedance.Therefore, signal conductor 330 can utilize this ledge 332 and the parasitic capacitance effect that reference planes 320 are produced, and improve the unmatched phenomenon of impedance of signal conductor 330.
Please refer to Fig. 7 A and 7B equally, binary signal lead 330,340 is when high speed or high-frequency transmission, the parasitic capacitance effect that also can utilize this ledge 332 and reference planes 320 to be produced, when improving signal and passing through non-reference planes 322 in the phenomenon of another signal conductor 340 caused near-end crosstalks and far-end crosstalk, and the inductive couplings between the reduction binary signal lead 330,340, keeping the integrality of signal, and make signal correctly and intactly by an endpoint transfers of signal conductor 330,340 to another end points.
By above explanation as can be known, signal transmission structure of the present invention has reference planes and binary signal lead at least, wherein reference planes have a non-reference zone (a for example non-reference zone), and the binary signal lead has a ledge respectively, and its live width is greater than the live width of signal conductor.This two ledge is corresponding to the position of non-reference zone, and protrude in respectively its signal conductor relatively away from lateral margin, and the area of these ledges can be directly proportional with the area of non-reference zone, and the area of these ledges can equate with the area of non-reference zone.When signal transmitted on signal conductor, the parasitic capacitance effect that can utilize this two ledge and reference planes to be produced was improved the unmatched phenomenon of impedance.Therefore, signal is at a high speed or during high-frequency transmission, and the unmatched phenomenon of caused impedance when this signal transmission structure can improve signal and pass through non-reference planes is with the purpose of the impedance matching that reaches the binary signal lead.
In sum, signal transmission structure of the present invention has the following advantages:
(1) the present invention utilizes the equivalent capacity of the ledge that improves signal conductor, be used to overcome the signal conductor high impedance effect that a non-reference zone produced of passing through, and the characteristic impedance of signal conductor is reached unanimity, with the purpose of the impedance matching that reaches signal conductor.
(2) the present invention utilizes the ledge that forms signal conductor, is used to reduce the inductive couplings that signal rows is produced on another signal conductor when non-reference zone.
(3) the present invention utilizes the assign to return flow path of standard electric current of the protuberance that improves signal conductor, use the inductive couplings that lowers between two signal circuits, when being used to reduce signal and passing through non-reference planes in the phenomenon of caused near-end crosstalk of another signal conductor and far-end crosstalk, to keep the integrality of signal.
(4) signal transmission structure of the present invention can be widely used on the transmission line design of large-sized print circuit board or base plate for packaging.
In sum, though the present invention with preferred embodiment openly as above, so it is not to be used to limit the present invention, any those skilled in the art, under the situation that does not break away from the spirit and scope of the present invention, can carry out various changes and modification, therefore scope of the present invention is as the criterion with the claim restricted portion that is proposed.
Claims (12)
1. a signal transmission structure is applicable to a wiring board, and this signal transmission structure comprises at least:
One reference planes have a non-reference zone;
One first signal conductor is configured in a side of these reference planes, and this first signal conductor has at least one first ledge, and it is corresponding to the position of this non-reference zone, and protrudes in the lateral margin of this first signal conductor; And
One secondary signal lead, be configured in the same side of these reference planes, and this signal conductor has at least one second ledge, it is corresponding to the position of this non-reference zone, and protrude in the lateral margin of this secondary signal lead, wherein, this first ledge and this second ledge be corresponding protrude in this first signal conductor relative with this secondary signal lead away from lateral margin, wherein, the width of this non-reference zone adds the summation of this secondary signal lead in the live width of this second protuberance office greater than the live width of this first signal conductor in this first protuberance office, and the width of this non-reference zone is on the direction vertical with the transmission direction of this first and second signal conductor.
2. signal transmission structure as claimed in claim 1, wherein, these reference planes be power plane and ground plane one of them.
3. signal transmission structure as claimed in claim 1, wherein, this first signal conductor and this secondary signal lead copline, and with these reference planes copline not.
4. signal transmission structure as claimed in claim 3, wherein, this first ledge extends to the top outside this non-reference zone.
5. signal transmission structure as claimed in claim 4, wherein, this first ledge comprises a left ledge and a right ledge, and should left side ledge be distributed in the side with respect to the bearing of trend of this first signal conductor of this non-reference zone, and should right side ledge be distributed in the opposite side with respect to the bearing of trend of this first signal conductor of this non-reference zone.
6. signal transmission structure as claimed in claim 3, wherein, this local second ledge extends to the top outside this non-reference zone.
7. signal transmission structure as claimed in claim 6, wherein, this second ledge comprises a left ledge and a right ledge, and should left side ledge be distributed in the side with respect to the bearing of trend of this secondary signal lead of this non-reference zone, and should right side ledge be distributed in the opposite side with respect to the bearing of trend of this secondary signal lead of this non-reference zone.
8. a signal transmission structure is applicable to a wiring board, and this signal transmission structure comprises at least:
One reference planes have a non-reference zone;
One first signal conductor is configured in a side of these reference planes, and this first signal conductor has at least one ledge, and it is corresponding to the position of this non-reference zone, and protrudes in the lateral margin of this first signal conductor; And
One secondary signal lead is configured in the same sides of this reference planes, and this secondary signal lead is positioned at the side away from this first signal conductor of this ledge relatively,
Wherein, the width of this non-reference zone is greater than the live width of first signal conductor in this first protuberance office, and the width of this non-reference zone is on the direction vertical with the transmission direction of this first signal conductor.
9. signal transmission structure comprises at least:
One reference planes have a non-reference zone opening; And
At least binary signal lead, wherein, described signal conductor copline and during by this non-reference zone opening, it respectively has a ledge of live width broad relatively away from a side,
Wherein, the width of this non-reference zone opening is greater than the live width of at least two these signal conductors in this protuberance office, and the width of this non-reference zone opening is on the direction vertical with the transmission direction of at least two these signal conductors.
10. signal transmission structure as claimed in claim 9, wherein, the area of this ledge is directly proportional with the area of this non-reference zone opening.
11. signal transmission structure as claimed in claim 9, wherein, the width of this ledge equates with the width of this non-reference zone opening in the transmission direction of described signal conductor.
12. signal transmission structure as claimed in claim 9, wherein, this ledge is positioned at the outside of this non-reference zone opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101026180A CN1330221C (en) | 2003-10-27 | 2003-10-27 | Structure of signal transferring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101026180A CN1330221C (en) | 2003-10-27 | 2003-10-27 | Structure of signal transferring |
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| Publication Number | Publication Date |
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| CN1541046A CN1541046A (en) | 2004-10-27 |
| CN1330221C true CN1330221C (en) | 2007-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2003101026180A Expired - Lifetime CN1330221C (en) | 2003-10-27 | 2003-10-27 | Structure of signal transferring |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3573670A (en) * | 1969-03-21 | 1971-04-06 | Ibm | High-speed impedance-compensated circuits |
| US5093639A (en) * | 1990-09-20 | 1992-03-03 | The United States Of America As Represented By The Secretary Of The Air Force | Electromagnetic stripline coupler apparatus |
| US5525953A (en) * | 1993-04-28 | 1996-06-11 | Murata Manufacturing Co., Ltd. | Multi-plate type high frequency parallel strip-line cable comprising circuit device part integratedly formed in dielectric body of the cable |
| US6489866B1 (en) * | 1999-04-26 | 2002-12-03 | Mitsubishi Denki Kabushiki Kaisha | Microwave module |
| JP2003124712A (en) * | 2001-10-17 | 2003-04-25 | Opnext Japan Inc | High frequency transmission line, and electronic component or electronic device using the same |
-
2003
- 2003-10-27 CN CNB2003101026180A patent/CN1330221C/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3573670A (en) * | 1969-03-21 | 1971-04-06 | Ibm | High-speed impedance-compensated circuits |
| US5093639A (en) * | 1990-09-20 | 1992-03-03 | The United States Of America As Represented By The Secretary Of The Air Force | Electromagnetic stripline coupler apparatus |
| US5525953A (en) * | 1993-04-28 | 1996-06-11 | Murata Manufacturing Co., Ltd. | Multi-plate type high frequency parallel strip-line cable comprising circuit device part integratedly formed in dielectric body of the cable |
| US6489866B1 (en) * | 1999-04-26 | 2002-12-03 | Mitsubishi Denki Kabushiki Kaisha | Microwave module |
| JP2003124712A (en) * | 2001-10-17 | 2003-04-25 | Opnext Japan Inc | High frequency transmission line, and electronic component or electronic device using the same |
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| Publication number | Publication date |
|---|---|
| CN1541046A (en) | 2004-10-27 |
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