CN1320584C - Inorganic granuler contaniing composition and transporting film containing it and plasma display manufacture - Google Patents
Inorganic granuler contaniing composition and transporting film containing it and plasma display manufacture Download PDFInfo
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- CN1320584C CN1320584C CNB2004100070744A CN200410007074A CN1320584C CN 1320584 C CN1320584 C CN 1320584C CN B2004100070744 A CNB2004100070744 A CN B2004100070744A CN 200410007074 A CN200410007074 A CN 200410007074A CN 1320584 C CN1320584 C CN 1320584C
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- filmogen
- inorganic particle
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61G—TRANSPORT, PERSONAL CONVEYANCES, OR ACCOMMODATION SPECIALLY ADAPTED FOR PATIENTS OR DISABLED PERSONS; OPERATING TABLES OR CHAIRS; CHAIRS FOR DENTISTRY; FUNERAL DEVICES
- A61G17/00—Coffins; Funeral wrappings; Funeral urns
- A61G17/04—Fittings for coffins
- A61G17/045—Rack for flowers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61G—TRANSPORT, PERSONAL CONVEYANCES, OR ACCOMMODATION SPECIALLY ADAPTED FOR PATIENTS OR DISABLED PERSONS; OPERATING TABLES OR CHAIRS; CHAIRS FOR DENTISTRY; FUNERAL DEVICES
- A61G17/00—Coffins; Funeral wrappings; Funeral urns
- A61G17/007—Coffins; Funeral wrappings; Funeral urns characterised by the construction material used, e.g. biodegradable material; Use of several materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2217/00—Gas-filled discharge tubes
- H01J2217/38—Cold-cathode tubes
- H01J2217/49—Display panels, e.g. not making use of alternating current
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- Life Sciences & Earth Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
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- Engineering & Computer Science (AREA)
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- Gas-Filled Discharge Tubes (AREA)
Abstract
An inorganic particle-containing composition comprising: (A) inorganic particles; (B) a binder resin; and (C) a compound represented by the following formula (I): wherein R1 represents a group represented by -CO-A, wherein A represents an alkyl group having 5-20 carbon atoms or an alkenyl group having 5-20 carbon atoms, and n is an integer of 2-20. A transfer film and a plasma display panel production process using the composition are also described.
Description
Technical field
The present invention relates to contain inorganic particle composition, comprise the production method of the transport membrane and the plasma display panel of said composition.
Background technology
In recent years, plasma scope has caused extensive concern as tabular fluorescence display.Fig. 1 is the schematic diagram that AC plasma display panel (following sometimes it is abbreviated as " PDP ") section configuration is shown.In Fig. 1, the mutual opposed glass baseplate of 1 and 2 expressions, 3 expression barrier ribs.Glass baseplate 1, glass baseplate 2 and barrier rib 3 are separated into a plurality of unit.4 expressions are fixed on the transparency electrode on the glass baseplate 1; 5 are expressed as the resistance that reduces transparency electrode 4 and are formed on bus electrode on the transparency electrode 4; 6 expressions are fixed on the addressing electrode on the glass baseplate 2; 7 expressions are contained in the fluorescent material in the unit; 8 expressions are formed on glass baseplate 1 lip-deep dielectric layer, are used for covering transparent electrode 4 and bus electrode 5; 9 expressions are formed on glass baseplate 2 lip-deep dielectric layers, are used to cover addressing electrode 6; The diaphragm that 10 expressions are for example made by magnesium oxide.Moreover, in color PDP,, filter (red, green or blue) or black matix can be set between glass baseplate and dielectric layer in order to obtain the image of high-contrast.
Production method as these PDP dielectrics, barrier rib, electrode, fluorescent material, filter or black stripe (black matix), can suitably use photoetching process, on base material, form the resin bed that contains photosensitive inorganic particle, shine this film with ultraviolet ray by photomask, with the film development that obtains, on base material, hold back pattern, and then cure pattern.
In theory, above-mentioned photoetching process is aspect the pattern precision, and is particularly very excellent in the method for using transport membrane, can form to have the excellent thickness evenness and the pattern of surface uniformity.But the filmogen layer that contains the composition formation that contains inorganic particle of acrylic resin by coating on basement membrane does not have sufficient elasticity, and its animal migration is also not high enough.
In order to address these problems, people make in research always contains plasticizer, dispersant etc. in the filmogen layer.But these organic materials may be stayed in the pattern after curing, and cause dyeing and other problem.Specifically, under the situation that forms sintered glass material such as dielectric layer, the problem of appearance is that the light transmittance of the sintered glass material that obtains is easy to reduce.
Developed the present invention in this case.
Summary of the invention
First purpose of the present invention provides a kind of composition that contains inorganic particle that can suitably form the DPD component parts (as: barrier rib, electrode, resistor, dielectric layer, phosphor, filter, black matix) with excellent surface smoothness.
Second purpose of the present invention provides a kind of composition that contains inorganic particle that can form the sintered glass material (as: dielectric layer of forming PDP) with high transmission rate.
The 3rd purpose of the present invention provides and a kind ofly can form the composition that contains inorganic particle that its filmogen layer has the transport membrane of excellent resilience.
The 4th purpose of the present invention provides and a kind ofly can form the composition that contains inorganic particle that its filmogen layer has the transport membrane of excellent animal migration (with the heat adhesiveness of base material).
The 5th purpose of the present invention provides a kind of transport membrane that can effectively form the PDP component parts with excellent surface smoothness.
The 6th purpose of the present invention provides the transport membrane that a kind of its filmogen layer has excellent resilience.
The 7th purpose of the present invention provides the transport membrane that a kind of its filmogen layer has excellent animal migration (with the heat adhesiveness of base material).
The 8th purpose of the present invention provides a kind of PDP production method that can effectively form the PDP component parts with excellent surface smoothness.
The 9th purpose of the present invention provides and a kind ofly can effectively form the PDP production method that its component parts has the PDP of very high setting accuracy.
The of the present invention ten purpose provides a kind of PDP production method that can effectively form the very big dielectric layer of thickness.
The 11 purpose of the present invention provides a kind of PDP production method that can effectively form the required dielectric layer of large size panel.
The 12 purpose of the present invention provides the production method of a kind of PDP of the dielectric layer with thickness evenness excellence.
The 13 purpose of the present invention provides the production method of a kind of PDP of the dielectric layer with surface smoothness excellence.
The composition that contains inorganic particle of the present invention comprises: (A) inorganic particle; (B) resin glue; (C) compound of representing with following formula (I) (below this compound being called " specific compound "):
Wherein, R
1Expression is by-group that CO-A represents, and wherein, the thiazolinyl that A represents to have the alkyl of 5-20 carbon atom or has 5-20 carbon atom, n are the integers of 2-20.
The composition that contains inorganic particle of the present invention can be the composition (below said composition being called " composition that contains inorganic particle of radiativity sensitivity ") that also comprises (D) radiativity sensitive ingredients.
Transport membrane of the present invention comprises the filmogen layer that obtains with the above-mentioned composition that contains inorganic particle.
First kind of production method of the present invention (below be referred to as " PDP production method (1) ") comprises the steps: the filmogen layer that obtains with the composition that contains inorganic particle of the present invention is moved on the substrate surface, the filmogen layer of migration is cured, on base material, form dielectric layer.
Second kind of production method of the present invention (below be referred to as " PDP production method (2) ") comprises the steps: the filmogen layer that obtains with the composition that contains inorganic particle of the present invention is moved on the substrate surface; On the filmogen layer of migration, form etchant resist; With the etchant resist exposure, form the sub-image of resist pattern; Etchant resist is developed, form the resist pattern; Be etched into membrane layers, form patterned layer corresponding to the resist pattern; Patterned layer is cured, form the component parts that is selected from barrier rib, electrode, resistor, dielectric layer, phosphor, filter and black matix.
The third production method of the present invention (below be referred to as " PDP production method (3) ") comprises the steps: to form etchant resist and the laminated film of the filmogen layer that obtains with the composition that contains inorganic particle of the present invention on basement membrane; To be formed on epilamellar laminated film moves on the substrate surface; To constitute the etchant resist exposure of laminated film, form the sub-image of resist pattern; Etchant resist is developed, form the resist pattern; Be etched into membrane layers, form patterned layer corresponding to the resist pattern; Patterned layer is cured, form the component parts that is selected from barrier rib, electrode, resistor, dielectric layer, phosphor, filter and black matix.
The 4th kind of production method of the present invention (below be referred to as " PDP production method (4) ") comprises the steps: the filmogen layer that obtains with the composition that contains inorganic particle of the present invention is moved on the substrate surface; With the exposure of filmogen layer, form the sub-image of pattern; The filmogen layer is developed, form patterned layer; Patterned layer is cured, form the component parts that is selected from barrier rib, electrode, resistor, dielectric layer, phosphor, filter and black matix.
The accompanying drawing summary
Fig. 1 is the schematic diagram that the AC plasma display panel section configuration is shown.
Fig. 2 A is the schematic sectional view that transport membrane of the present invention is shown; Fig. 2 B is the schematic diagram that the layer composition of transport membrane is shown.
Fig. 3 is the schematic sectional view (migration step, etchant resist form step and step of exposure) that is illustrated in an example of barrier rib formation step in the production method of the present invention.
Fig. 4 is the schematic sectional view (development step, etching step and baking step) that is illustrated in an example of barrier rib formation step in the production method of the present invention.
In the accompanying drawings:
1: glass baseplate
2: glass baseplate
3: barrier rib
4: transparency electrode
5: bus electrode
6: addressing electrode
7: fluorescent material
8: dielectric layer
9: dielectric layer
10: protective layer
F1: basement membrane
F2: filmogen layer
F3: coverlay
11: glass baseplate
12: electrode
13: dielectric layer
20: transport membrane
21: the filmogen layer
22: basement membrane
25: the barrier rib patterned layer
25A: material layer reserve part
25B: material layer is removed part
31: etchant resist
35: the resist pattern
35A: resist reserve part
35B: resist is removed part
40: barrier rib
50: panel material
M: exposed mask
MA: light transmission part
MB: shading light part
Embodiment
The composition that contains inorganic particle of the present invention (following can abbreviate " composition " as) is described in detail in detail below.
Composition of the present invention comprises inorganic particle, resin glue and the specific compound as essential component.
Inorganic particle
The inorganic material that constitutes the inorganic particle in the present composition is not particularly limited, and can suitably select according to the purposes (kind of PDP component parts) of the agglomerated material that is formed by said composition.
It is 350-700 ℃ that the example that is used to form the inorganic particle that contains in the composition of " dielectric layer " or " barrier rib " that constitute PDP has softening point, is preferably 400-620 ℃ glass powder.When the softening point of glass powder is lower than 350 ℃, in the baking step of the filmogen layer of making by said composition, organic substance such as resin glue also do not decompose fully and the stage glass powder removed with regard to fusion, thereby partial organic substances matter is stayed in the dielectric layer that will form.As a result, dielectric layer is easy to dyeing, and its light transmittance will reduce.On the other hand, when the softening point of glass powder is higher than 700 ℃, because glass powder must cure being higher than under 700 ℃ the temperature, so glass baseplate is easily deformable.
The object lesson of the glass powder that is suitable for comprises: the mixture (PbO-B of (1) lead oxide, boron oxide and silica
2O
3-SiO
2), the mixture (ZnO-B of (2) zinc oxide, boron oxide and silica
2O
3-SiO
2), the mixture (PbO-B of (3) lead oxide, boron oxide, silica and aluminium oxide
2O
3-SiO
2-Al
2O
3) and the mixture (PbO-ZnO-B of (4) lead oxide, zinc oxide, boron oxide and silica
2O
3-SiO
2).
These glass powders can be contained in the composition of the component parts (as electrode, resistor, phosphor, filter and black matix) that is used to form non-dielectric layer and barrier rib.In order to obtain these panel materials, in containing the composition of inorganic particle, based on the glass dust content of inorganic particle total weight 90wt% or lower normally, preferred 50-90wt%.
The example that is used to form the inorganic particle that contains in the composition of " electrode " that constitute PDP has the metallic particles that comprises Ag, Au, Al, Ni, Ag-Pd alloy, Cu, Cr etc.
These metallic particles can be contained in the composition that is used to form dielectric layer together with glass powder.In forming the composition of dielectric layer, based on the metallic particles content of inorganic particle total weight 10wt% or lower normally, preferred 0.1-5wt%.
The example that is used to form the inorganic particle that contains in the composition of " resistor " that constitute PDP has the RuO of comprising
2Deng particle.
The example that is used to form the inorganic particle that contains in the composition of " phosphor " that constitute PDP has the particle that comprises following material: red fluorescence material (as: Y
2O
3: Eu
3+, Y
2SiO
5: Eu
3+, Y
3Al
5O
12: Eu
3+, YVO
4: Eu
3+, (Y, Gd) BO
3: Eu
3+And Zn
3(PO
4)
2: Mn), green fluorescent material (as: Zn
2SiO
4: Mn, BaAl
12O
19: Mn, BaMgAl
14O
23: Mn, LaPO
4: (Ce, Tb) and Y
3(Al, Ga)
5O
12: Tb), blue fluorescent material (as: Y
2SiO
5: Ce, BaMgAl
10O
17: Eu
2+, BaMgAl
14O
23: Eu
2+, (Ca, Sr, Ba)
10(PO
4)
2Cl
2: Eu
2+(Zn, Cd) S:Ag) etc.
The example that is used to form the inorganic particle that contains in the composition of " filter " that constitute PDP has the particle that comprises following material: red material (as: Fe
2O
3And Pb
3O
4), green material (as: Cr
2O
3), blue material (as: 2 (Al
2Na2Si
3O
10) Na
2S
4) etc.
The example that is used to form the inorganic particle that contains in the composition of " black matix " that constitute PDP has the particle that comprises Mn, Fe, Cr etc.
Resin glue
The resin glue of the formation present composition is acrylic resin preferably.
When containing acrylic resin as resin glue, the filmogen layer of formation and base material have excellent (heat) caking property.Therefore, when composition of the present invention being coated on the basement membrane when producing transport membrane, the filmogen layer of the transport membrane that obtains has excellent animal migration (with the heat adhesiveness of base material).
The acrylic resin that constitutes the present composition be selected from have suitable caking property, the inorganic particle that can bond, by curing filmogen (400-620 ℃) by complete oxidation and (being total to) polymer of removing.
Acrylic acid comprises by the homopolymers of (methyl) acrylate compounds of following general formula (II) expression, by the copolymer of two or more (methyl) acrylate compounds of following general formula (II) expression, by (methyl) acrylate compounds of following general formula (II) expression and the copolymer of copolymerisable monomer.
Wherein, R
2Expression hydrogen atom or methyl; R
3Expression unit price organic group.
Object lesson by (methyl) acrylate compounds of general formula (II) expression comprises:
(methyl) alkyl acrylate is as (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) propyl acrylate, (methyl) isopropyl acrylate, (methyl) butyl acrylate, (methyl) isobutyl acrylate, (methyl) tert-butyl acrylate, (methyl) acrylic acid pentyl ester, (methyl) acrylic acid n-pentyl ester, (methyl) acrylic acid isopentyl ester, (methyl) Hexyl 2-propenoate, (methyl) acrylic acid heptyl ester, (methyl) 2-ethyl hexyl acrylate, (methyl) Isooctyl acrylate monomer, (methyl) 2-EHA, (methyl) acrylic acid ester in the ninth of the ten Heavenly Stems, (methyl) decyl acrylate, (methyl) isodecyl acrylate, (methyl) acrylic acid 11 esters, (methyl) dodecyl acrylate, (methyl) lauryl acrylate, (methyl) octadecyl acrylate and the different octadecyl ester of (methyl) acrylic acid;
(methyl) hydroxyalkyl acrylate is as (methyl) hydroxy-ethyl acrylate, (methyl) acrylic acid 2-hydroxypropyl acrylate, (methyl) acrylic acid 3-hydroxypropyl acrylate, (methyl) acrylic acid 2-hydroxy butyl ester, (methyl) acrylic acid 3-hydroxy butyl ester and (methyl) acrylic acid 4-hydroxy butyl ester;
(methyl) acrylic acid benzene oxyalkyl ester is as (methyl) phenoxyethyl acrylate and (methyl) acrylic acid 2-hydroxyl-3-benzene oxygen propyl ester;
(methyl) alkyl acrylate oxyalkyl ester is as (methyl) acrylic acid 2-methoxy ethyl ester, (methyl) acrylic acid 2-ethoxy ethyl ester, (methyl) acrylic acid 2-third 2-ethoxyethyl acetate, (methyl) acrylic acid 2-fourth 2-ethoxyethyl acetate and (methyl) acrylic acid 2-methoxy butyl ester;
Ployalkylene glycol (methyl) acrylate is as polyethyleneglycol (methyl) acrylate, ethoxydiglycol (methyl) acrylate, methoxy poly (ethylene glycol) (methyl) acrylate, phenoxy group polyethylene glycol (methyl) acrylate, Nonylphenoxy polyethylene glycol (methyl) acrylate, polypropylene glycol (methyl) acrylate, methoxyl group polypropylene glycol (methyl) acrylate, ethyoxyl polypropylene glycol (methyl) acrylate and Nonylphenoxy polypropylene glycol (methyl) acrylate;
(methyl) acrylic acid cycloalkanes ester is as (methyl) cyclohexyl acrylate, (methyl) acrylic acid 4-butyl cyclohexyl, (methyl) acrylic acid two pentamethylene esters, (methyl) acrylic acid two cyclopentene esters, (methyl) acrylic acid bicyclopentadiene ester, (methyl) acrylic acid norbornene ester, (methyl) isobornyl acrylate and (methyl) acrylic acid three ring esters in the last of the ten Heavenly stems; With
(methyl) benzyl acrylate and (methyl) tetrahydrofurfuryl acrylate.
Wherein preferred R
3Expression contains (methyl) acrylate compounds by general formula (II) expression of the group of alkyl or oxyalkylene.Particularly preferred (methyl) acrylate compounds is (methyl) butyl acrylate, (methyl) EHA, (methyl) lauryl acrylate, (methyl) isodecyl acrylate and (methyl) acrylic acid 2-ethoxy ethyl ester.
Be not particularly limited for other copolymerisable monomer, so long as can get final product with the copolymerization of (methyl) acrylate compounds.The example of other copolymerisable monomer comprises that unsaturated carboxylic acid is as (methyl) acrylic acid, vinyl benzoic acid, maleic acid and vinyl benzene dioctyl phthalate; The compound such as vinyl benzene methyl ether, vinyl glycidyl ether, styrene, AMS, butadiene and the isoprene that contain the free redical polymerization of vinyl.
Derived from by the ratio of comonomer in the acrylic resin that constitutes the present composition of (methyl) acrylate compounds of general formula (II) expression 70wt% or bigger normally, preferred 90wt% or bigger.
The object lesson of preferred acrylic resin comprises polymethyl methacrylate, polybutyl methacrylate and methyl methacrylate-butyl methacrylate copolymer.
When forming the component parts of PDP with following photoetching process, need alkali molten during as membrane layers with etching, preferably contain carboxylic monomer as above-mentioned other copolymerisable monomer (comonomer).The object lesson of carboxylic monomer comprises acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid, mesaconic acid, cinnamic acid, list (2-(methyl) acryloyl group oxygen ethyl) succinate and ω-carboxyl-polycaprolactone list (methyl) acrylate.Wherein, special preferable methyl acrylic acid.
The object lesson of preferred alkali soluble resins comprises:
Alkyl methacrylate is as methyl methacrylate, EMA, propyl methacrylate, isopropyl methacrylate, butyl methacrylate, isobutyl methacrylate, the metering system tert-butyl acrylate, the methacrylic acid pentyl ester, the methacrylic acid n-pentyl ester, the metering system isoamyl valerate, hexyl methacrylate, the metering system heptyl heptylate, 2-Propenoic acid, 2-methyl-, octyl ester, EHMA, ethylhexyl methacrylate, nonyl methacrylate, decyl-octyl methacrylate, isodecyl methacrylate, methacrylic acid 11 esters, the metering system dodecyl gallate, lauryl methacrylate, the different octadecyl ester of octadecyl methacrylate and methacrylic acid;
Hydroxyalkyl methacrylate is as hydroxyethyl methacrylate, methacrylic acid 2-hydroxypropyl acrylate, methacrylic acid 3-hydroxypropyl acrylate, methacrylic acid 2-hydroxy butyl ester, methacrylic acid 3-hydroxy butyl ester and methacrylic acid 4-hydroxy butyl ester;
Methacrylic acid benzene oxyalkyl ester is as methacrylic acid ethyl phenoxy and methacrylic acid 2-hydroxyl-3-benzene oxygen propyl ester;
Methacrylic acid alkane oxyalkyl ester is as methacrylic acid 2-methoxy ethyl ester, 2-ethoxyethyl methacrylate, methacrylic acid 2-third 2-ethoxyethyl acetate, methacrylic acid 2-fourth 2-ethoxyethyl acetate and methacrylic acid 2-methoxy butyl ester;
The ployalkylene glycol methacrylate is as polyethylene glycol monomethacrylate, ethoxydiglycol methacrylate, methoxy polyethylene glycol methacrylate-styrene polymer, phenoxy group polyethylene glycol methacrylate-styrene polymer, Nonylphenoxy polyethylene glycol methacrylate-styrene polymer, polypropylene glycol methacrylate, methoxyl group polypropylene glycol methacrylate, ethyoxyl polypropylene glycol methacrylate and Nonylphenoxy polypropylene glycol methacrylate;
Methacrylic acid cycloalkanes ester is as cyclohexyl methacrylate, methacrylic acid 4-butyl cyclohexyl, methacrylic acid two pentamethylene esters, methacrylic acid two cyclopentene esters, methacrylic acid bicyclopentadiene ester, methacrylic acid norbornene ester, isobornyl methacrylate and methacrylic acid three ring esters in the last of the ten Heavenly stems; With
Benzyl methacrylate and tetrahydrofurfuryl methacrylate.
The molecular weight of the acrylic resin of the formation present composition is 4000-300000 preferably, more preferably 10000-200000, this molecular weight are the weight average molecular weight (below abbreviate " weight average molecular weight " as) that is reduced into polystyrene with gel permeation chromatography (below be called " GPC ").
The preferably per 100 weight portion inorganic particles of the ratio of resin glue in the present composition use 5-80 weight portion, more preferably 10-50 weight portion.When the ratio of resin glue is too low, can not guarantee resin glue bonding and fixed inorganic particle.On the contrary, when ratio was too big, baking step needed for a long time, and perhaps the agglomerated material of Xing Chenging (as dielectric layer) may not have full intensity or thickness.
Specific compound
The additive that the dispersant effect is arranged again as existing plasticizer effect with specific compound.The present composition that contains specific compound demonstrates excellent planar smoothness.Even when the transport membrane that obtains is bent, the surface of filmogen layer also is trickle be full of cracks, and transport membrane has excellent flexibility, is easy to reel.In addition, because specific compound is easy to by heating and decomposition and removing, so can not dye by curing the panel material that the filmogen layer obtains, particularly the light transmittance of dielectric layer can not descend.
In the formula (I) of expression specific compound, R
1Expression is by-group that CO-A represents, and wherein, the thiazolinyl that A represents to have the alkyl of 5-20 carbon atom or has 5-20 carbon atom, n are the integers of 2-20.
The alkyl or alkenyl that A represents has 5-20 carbon atom, preferably has 9-18 carbon atom.When carbon number was less than 5, the function of additive can not fully show.When more than 20 the time, the solubility of additive in solvent that constitutes the composition that contains inorganic particle may descend, and will can not get better elastic.
The object lesson of alkyl comprises n-pentyl, n-hexyl, n-heptyl, n-octyl, n-nonyl, positive decyl, n-undecane base, dodecyl, n-pentadecane base, n-hexadecyl, n-heptadecane base, n-octadecane base, NSC 77136 base and n-eicosane base.
The object lesson of thiazolinyl comprises 2-pentenyl, 2-hexenyl, 2-heptenyl, 2-octenyl, 2-decene base, 10-hendecene base, 9-octadecylene base and 9-octadecylene base.
Wherein preferred n-octyl, dodecyl, n-octadecane base and 9-octadecylene base, preferred especially 9-octadecylene base.
In formula (I), R
1Expression is by-group that CO-A represents; N is the integer of 2-20.
The object lesson of specific compound comprises diglycerol monolaurate, diglycerol monostearate, diglycerol monoleate and diglycerol list caprylate.Wherein, preferred especially diglycerol monoleate.
The preferably per 100 weight portion inorganic particles of the ratio of specific compound in the present composition use 0.1-20 weight portion, more preferably 0.5-10 weight portion.When the ratio of specific compound is too low, can not substantially improve the surface smoothness and the elasticity of the filmogen layer that forms with the composition that obtains.On the contrary, when ratio was too big, the filmogen layer caking property (viscosity) that forms with the composition that obtains was too high, thereby made the handling property variation of the transport membrane that comprises the filmogen layer.
The radiativity sensitive ingredients
The composition that contains inorganic particle of the present invention can be the composition that contains inorganic particle that contains the radiativity sensitivity of radiativity sensitive ingredients.The preferred example of radiativity sensitive ingredients comprises the bond of (a) multifunctional monomer and radiation polymerization initator and (b) melamine resin and can form the bond of sour light acid producing agent during with radiation exposure.For bond (a), the bond of especially preferably multi-functional (methyl) acrylate and radiation polymerization initator.
The object lesson that constitutes multi-functional (methyl) acrylate of radiativity sensitive ingredients comprises two (methyl) acrylate of alkylene glycol such as ethylene glycol and propylene glycol; Two (methyl) acrylate of ployalkylene glycol such as polyethylene glycol and polypropylene glycol; The hydroxylated polymer in two ends is as two (methyl) acrylate of two terminal hydroxy group polybutadiene, two terminal hydroxy group polyisoprene and two terminal hydroxy group polycaprolactones; Price is 3 or bigger polyalcohol such as glycerine, 1,2, poly-(methyl) acrylate of 4-butantriol, trimethylolalkane, tetra methylol alkane, pentaerythrite and dipentaerythritol; Cyclitol is as 1,4-cyclohexanediol and 1, poly-(methyl) acrylate of 4-Benzenediol; And oligomeric (methyl) acrylate such as polyester (methyl) acrylate, epoxy (methyl) acrylate, urethane (methyl) acrylate, alkyd resins (methyl) acrylate, silicone resin (methyl) acrylate and spirane resin (methyl) acrylate.These multi-functional (methyl) acrylate can use separately, also can two or more be used in combination.
The object lesson that constitutes the radiation polymerization initator of radiativity sensitive ingredients comprises carbonyls such as benzil, benzoin, Benzophenone, camphorquinone, 2-hydroxy-2-methyl-1-phenyl third-1-ketone, 1-hydroxycyclohexylphenylketone, 2,2-dimethoxy-2-phenyl acetophenone, 2-methyl-[4 '-(methyl sulfo-) phenyl]-2-morpholino-1-acetone and 2-benzyl-2-dimethylamino-1 (4-morpholino phenyl)-Ding-1-ketone; Azo-compound or triazo-compound such as azo isobutyronitrile and 4-phenylazide formaldehyde; Organosulfur compound such as sulfydryl disulphide; Organic peroxide such as benzoyl peroxide, di-tert-butyl peroxide, tert-butyl hydroperoxide, cumene hydroperoxide and to the methane hydroperoxides; Haloform is as 1,3-two (trichloromethyl)-5-(2 '-chlorphenyl)-1,3,5-triazines and 2-[2-(2-furyl (furanyl)) vinyl]-4,6-two (trichloromethyl)-1,3,5-triazines; With imidazole dimer as 2,2 '-two (2-chlorphenyls)-4,5,4 ', 5 '-tetraphenyl-1,2 '-diimidazole.These radiation polymerization initators can use separately, also can two or more be used in combination.
Solvent
Composition of the present invention all contains solvent usually.Preferred solvent is with inorganic particle good affinity to be arranged, and resin glue is had fine solubility, can make the composition that obtains have suitable viscosity, is easy to evaporate and remove when heating.
The object lesson of solvent comprises ketone such as diethyl ketone, methyl butyl ketone, two acetone and cyclohexanone; Alcohol is as n-amyl alcohol, 4-methyl-2-amylalcohol, cyclohexanol and diacetone alcohol; Ether alcohol is as glycol monomethyl methyl ether, ethylene glycol monomethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether and propylene glycol list ethylether; Unsaturated aliphatic monocarboxylic acid Arrcostab such as n-butyl acetate and pentyl acetate; Lactate such as ethyl lactate and n-butyl lactate; And ether ester such as methylcellosolve acetate, ethyl cellosolve acetate, propylene glycol monomethyl ether and 3-ethoxyl ethyl propionate.These solvents can use separately, also can two or more be used in combination.
Remain on angle in the preferable range from the viscosity that makes composition, the preferably per 100 weight portion inorganic particles of the ratio of solvent in the present composition use 40 weight portions or still less, more preferably 5-30 weight portion.
Except that above-mentioned essential component, composition of the present invention can also contain the various additives as optional components, as tackifier, surface tension controlling agent, stabilizer and defoamer.
As an example of the composition that contains inorganic particle, the preferred example that is used to form the composition of dielectric layer comprises the composition that contains following component:
The mixture as inorganic particle of 100 weight portions (glass powder), this mixture comprise the lead oxide of 50-80wt%, the boron oxide of 5-30wt%, the zinc oxide of 0-20wt%, the aluminium oxide of 0-10wt% and the silica of 0-10wt%;
The butyl methacrylate as resin glue of 10-30 weight portion/methacrylic acid 2-Octyl Nitrite/hydroxy propyl methacrylate copolymer;
0.1-10 two glyceryl oleates as specific compound of weight portion; With
The propylene glycol monomethyl ether and/or the 3-ethoxyl ethyl propionate as solvent of 5-30 weight portion.
Can prepare composition of the present invention with following method: above-mentioned inorganic particle, resin glue, specific compound, solvent and optional components are mediated with kneader such as roll mill, mixer or homogenizer.
So the composition of the present invention of preparation is the paste composition that its flowability is suitable for being coated with, and its viscosity is 1000-30000cp normally, preferred 3000-10000cp.
Composition of the present invention is particularly conducive to the transport membrane (transport membrane of the present invention) that will describe in detail below producing.
Composition of the present invention also helps and is used in the conventional method that is formed into membrane layers, that is, with methods such as silk screen printings composition directly is coated on the substrate surface, then with the method that is used to form the filmogen layer of coated film drying.
Transport membrane of the present invention is a composite membrane, helps being used in the step that forms the PDP component parts, particularly forms in the step of dielectric layer, has in the transport membrane by coating composition of the present invention on basement membrane, then with the dry filmogen layer that forms of coated film.
That is, transport membrane of the present invention has the basement membrane that is formed with the filmogen layer that contains inorganic particle, resin glue and specific compound on it to constitute.
Transport membrane of the present invention can be the film (lamination) that obtains with following method: the etchant resist that will describe below forming on basement membrane is coated on composition of the present invention on the etchant resist, then with the coated film drying.
In addition, transport membrane of the present invention can be the transport membrane of the corrosivity sensitivity that constitutes of the composition that contains inorganic particle with the radiativity sensitivity.
(1) composition of transport membrane
Fig. 2 A is the schematic sectional view that winding up roller transport membrane of the present invention is shown; Fig. 2 B illustrates transport membrane to form the schematic diagram of layer (detail drawing of (X) part).
Transport membrane shown in Figure 2 is the composite membrane as an example of transport membrane of the present invention, is used to form the dielectric layer that constitutes PDP.Usually, transport membrane is made of basement membrane F1, filmogen layer F2 and coverlay F3, and filmogen layer F2 is formed on the surface of basement membrane F1, can peel off, and coverlay F3 is easy to peel off on filmogen layer F2 surface.According to the performance of filmogen layer F2, can not use coverlay F3.
The basement membrane F1 that constitutes transport membrane preferably has thermal endurance and solvent resistance and rubber-like resin molding.When basement membrane F1 has elasticity, can use coating paste compositions (composition of the present invention) such as roll coater, scraper-type coating machine, thereby form the uniform filmogen layer of thickness, and store and supply the filmogen layer that forms with roller type.
The example that constitutes the resin of basement membrane F1 comprises PETG, polyester, polyethylene, polypropylene, polystyrene, polyimides, polyvinyl alcohol, polyvinyl chloride, fluorine resin such as polyvinyl fluoride, nylon and cellulose.The thickness of basement membrane F1 for example can be 20-100 μ m.
The filmogen layer F2 that constitutes transport membrane is the layer (dielectric layer) that can become sintered glass material when curing, and it contains glass powder (inorganic particle), resin glue and specific compound as necessary component.
The thickness of filmogen layer F2 can change with the content of glass powder and the kind and the size of panel, for example, can be 5-200 μ m, preferred 10-100 μ m.When thickness during less than 5 μ m, the final medium thickness that forms is too little, can not guarantee the dielectric property of being scheduled to.In general, when thickness is 10-100 μ m, can fully guarantee the medium thickness of large-scale panel requirement.
The coverlay F3 that constitutes transport membrane is the film (with the contact surface of glass baseplate) on protection filmogen layer F2 surface.Coverlay F3 is the rubber-like resin molding preferably.The example that forms the resin of coverlay F3 can be the resin of above-mentioned formation basement membrane F1.The thickness of coverlay F3 for example can be 20-100 μ m.
(2) production method of transport membrane
Can produce transport membrane of the present invention with following method: on basement membrane (F1), be formed into membrane layers (F2), (pressing sticking) coverlay (F3) is provided on filmogen layer (F2).
The example that is formed into the method for membrane layers has following method: the composition of the present invention that will contain inorganic particle, resin glue, specific compound and solvent is coated on the basement membrane, then with the coated film drying, to remove part or all of solvent.
From thickness very big (as 20 μ m or bigger) with can effectively form coated film aspect and consider with excellent thickness evenness, on basement membrane the preferred example of the method for the coating present composition comprise rubbing method with roll coater, with the rubbing method of scraper-type coating machine such as scraper, with the rubbing method of curtain coater with the rubbing method of line coating machine.
Preferably the membrane surface that is coated with the present composition on it being carried out the demoulding handles.Thereby after the migration of filmogen layer, make basement membrane be easy to peel off with the filmogen layer.
With being formed on the coated film drying of the epilamellar present composition, remove part or all of solvent, make it to become the filmogen layer that constitutes transport membrane.The drying condition of the coated film of being made by composition of the present invention comprises: temperature is 40-150 ℃, and the time is about 1-30 minute.From with the caking property of base material and on the filmogen layer suitable shape retention can aspect consider that the ratio (solvent in the filmogen layer) of dry back residual solvent is 10wt% or lower normally, preferred 0.1-5wt%.
Equally also preferably will be provided at coverlay surface on the filmogen layer of formation like this carries out the demoulding and handles.Thereby before the migration of filmogen layer, make coverlay be easy to peel off with the filmogen layer.
(3) migration of filmogen layer (using method of transport membrane)
Epilamellar filmogen layer bulk migration is to substrate surface.According to transport membrane of the present invention, shirtsleeve operation just can guarantee that the filmogen layer is formed on the glass baseplate like this.Therefore, not only can improve the formation step of (raising the efficiency) PDP component parts such as dielectric layer, and may improve the quality (for example, showing stable dielectric property in the dielectric layer) of the component parts of formation.
PDP production method (1) (formation dielectric layer)
PDP production method of the present invention (1) comprises the steps: the filmogen layer that constitutes transport membrane of the present invention is moved on the substrate surface, and the filmogen layer that moves is cured, and forms dielectric layer on substrate surface.
The example of step of filmogen layer migration that constitutes transport membrane shown in Figure 2 is as follows.
(1) transport membrane of cutting winding up roller form, its size is corresponding to the area of base material.
(2) after coverlay (F3) is peeled off from filmogen layer (F2) surface of the transport membrane of cutting, transport membrane is superimposed upon on the substrate surface, the surface of filmogen layer (F2) is contacted with base material.
(3) warm-up mill is moved on the transport membrane that is superimposed upon on the base material, press down sticking transport membrane at heating condition.
(4) basement membrane (F1) is peeled off, and from removing by press down the filmogen layer (F2) that cementation fixes on the base material at heating condition.
By aforesaid operations the filmogen layer (F2) on the basement membrane (F1) is moved on the base material.Transition condition comprises: the surface temperature of warm-up mill is 60-120 ℃, and warm-up mill pressure is 1-5kg/cm
2, the translational speed of warm-up mill is 0.2-10.0m/min.This operation (migration step) can be carried out with laminating machine.The base material preheating for example can be set at preheat temperature 40-100 ℃.
The filmogen layer (F2) of moving on the substrate surface becomes sintered inorganic material (dielectric layer) by curing.For example, baking method is that the base material that will move filmogen layer (F2) on it is placed on the method in the high-temperature atmosphere.Thereby the organic material (for example, resin glue, residual solvent, specific compound and various additive) that contains in the filmogen layer (F2) is decomposed and remove inorganic particle fusion and sintering.Sintering temperature changes with the melt temperature of base material, the component in the filmogen layer, and still, sintering temperature can for example be 300-800 ℃, preferred 400-620 ℃.
PDP production method (2) (forming component parts) with photoetching process
PDP production method of the present invention (2) comprises the steps: the filmogen layer that constitutes transport membrane of the present invention is moved on the base material; On the filmogen layer of migration, form etchant resist; With the etchant resist exposure, form the sub-image of resist pattern; Etchant resist is developed, form the resist pattern; Be etched into membrane layers, form patterned layer corresponding to the resist pattern; Patterned layer is cured, form the component parts that is selected from barrier rib, electrode, resistor, dielectric layer, phosphor, filter and black matix.
A kind of replacement scheme is, production method of the present invention (2) comprises the steps: to form etchant resist and the laminated film of the filmogen layer that obtains with the composition that contains inorganic particle of the present invention on basement membrane; The laminated film that forms is moved on the membrane surface on the base material; To constitute the etchant resist exposure of laminated film, form the sub-image of resist pattern; Etchant resist is developed, form the resist pattern; Be etched into membrane layers, form patterned layer corresponding to the resist pattern; Patterned layer is cured, form the component parts that is selected from barrier rib, electrode, resistor, dielectric layer, phosphor, filter and black matix.
The following describes in the method for substrate backside formation as " barrier rib " of PDP component parts.This method comprises (1) step with the migration of filmogen layer, (2) step of formation etchant resist, (3) with the etchant resist step of exposing, (4) with the etchant resist step of developing, (5) with the etched step of filmogen layer, (6) the barrier rib pattern is cured, thereby on substrate surface, form the step of barrier rib.
Fig. 3 and 4 illustrates the schematic section that a series of barrier ribs form step.In Fig. 3 and 4, it goes up the equidistant glass baseplate of arranging the electrode 12 that is used to produce plasma 11 expressions, and formation dielectric layer 13 is with coated electrode 12 on the surface of glass baseplate 11.
In the present invention, the embodiment of " the filmogen layer is moved on the base material " not only comprises moves to glass baseplate 11 lip-deep embodiments with the filmogen layer, but also comprises the filmogen layer is moved to dielectric layer 13 lip-deep embodiments.
(1) step that the filmogen layer is moved:
An example of the step of filmogen layer is moved in demonstration below.
Shown in Fig. 3 B, after the coverlay (not shown) of transport membrane is peeled off, transport membrane 20 is superimposed upon on dielectric layer 13 surfaces, the surface of film forming layer 21 is contacted with the surface of dielectric layer 13, with warm-up mill etc. by adding thermocompression bonded transport membrane 20, then basement membrane 22 is peeled off, and removed from filmogen layer 21.Therefore, shown in Fig. 3 C, filmogen layer 21 is moved, and with the surperficial tight bond of dielectric layer 13.Transition condition comprises: the surface temperature of warm-up mill is 80-140 ℃, and warm-up mill pressure is 1-5kg/cm
2, the translational speed of warm-up mill is 0.1-10.0m/min.Glass baseplate 11 preheatings for example can be set at preheat temperature 40-100 ℃.
(2) step of formation etchant resist:
In this step, shown in Fig. 3 D, on filmogen layer 21 surface of migration, form etchant resist 31.The resist that constitutes etchant resist 31 can be any resist and negative work resist of just working.
Can form etchant resist 31 with following method: with the whole bag of tricks painting erosion resistant agent that comprises silk screen print method, rolling method, spin-coating method and curtain coating rubbing method, then with the coated film drying.The baking temperature of coated film is about 60-130 ℃ usually.
Epilamellar etchant resist can be gone up formation by moving to filmogen layer 21 surface.According to this formation method, not only can reduce the formation step of etchant resist, and the resist that obtains has excellent thickness evenness.Therefore, the development of etchant resist and the etching of filmogen layer can be carried out equably, thereby make the barrier rib of formation have uniform height and shape.
The thickness of etchant resist 31 is 0.1-40 μ m normally, preferred 0.5-20 μ m.
(3) with the etchant resist step of exposing:
In this step, shown in Fig. 3 E, use such as ultraviolet ray and be formed on the surface of the etchant resist 31 on the filmogen layer 21 by exposed mask M selectivity radiation (exposure), form the sub-image of resist pattern.In the figure, MA and MB represent light transmission part and the shading light part by exposed mask M formation respectively.
Ultraviolet radiation device is not particularly limited, and can be ultraviolet lamp that uses in the photoetching process and the exposure device that is used to produce semiconductor and liquid crystal indicator.
When forming etchant resist, preferably under the situation that the basement membrane that covers on the etchant resist is not also peeled off, carry out step of exposure by migration.
(4) with the etchant resist step of developing
In this step, the etchant resist development with exposure forms resist pattern (sub-image).
As for development conditions, the type of developer solution, prescription and concentration, developing time, development temperature, developing method (as infusion process, vibration method, shower method, spray-on process and puddling), developing apparatus and other parameter can suitably be selected according to kind and other condition of etchant resist 31.
Form with this development step and shown in Fig. 4 F, to remove the resist pattern 35 (corresponding to the pattern of exposed mask M) that part 35B constitutes by resist remainder 35A and resist.
As etching mask, compare with the composition material of filmogen layer 21, must have lower dissolution velocity in etching solution by the composition material of resist remainder 35 (photocuring resist) in subsequent step (etching step) for corrosion-resisting pattern 35.
(5) with the etched step of filmogen layer
In this step,, form barrier rib patterned layer corresponding to the resist pattern with the etching of filmogen layer.
That is, shown in Fig. 4 G, be partly dissolved in corresponding to what the resist of the anticorrosive additive material 35 of filmogen layer 21 removed part 35B that the back is optionally removed in the etching solution.Fig. 4 G illustrates the state in the etching process.
When continuing etching, shown in Fig. 4 H, the predetermined portions of filmogen layer 21 is removed fully, thereby exposes dielectric layer 13.Form by material layer remainder 25A and material layer with this and to remove the barrier rib patterned layer 25 that part 25B constitutes.
As for etching condition, the type of etching solution, prescription and concentration, processing time, treatment temperature, processing method (as infusion process, vibration method, shower method, spray-on process and puddling), treatment facility and other parameter can suitably be selected according to kind and other condition of filmogen layer 21.
Select the kind of etchant resist 31 and the kind of filmogen layer 21, make be used in development step in the identical solution of developer solution can be used as etching solution, thereby can carry out development step and etching step continuously, and improve production efficiency because of the simplification step.
The resist remainder 35A that constitutes resist pattern 35 preferably progressively dissolves by etching, and is removed fully when forming barrier rib patterned layer 25 (when etching is finished).
Even after etching, have part or all of resist remainder 35A to remain, in follow-up baking step, also resist remainder 35A can be removed.
(6) step that the barrier rib patterned layer is cured:
In this step, form barrier rib by curing barrier rib patterned layer 25.Organic substance among the material layer remainder 25A is after-flame therefrom, thereby forms barrier rib.Shown in Fig. 4 I, on dielectric layer 13 surfaces, be formed with in the panel material 50 of barrier rib 40, be blocked space (removing the space that part 25B is evolved into) that rib 40 separates as the plasma working space by material layer.
Stoving temperature must be the temperature that can make the organic substance after-flame among the material layer remainder 25A, normally 400-600 ℃, cures normally 10-90 minute time.
PDP production method (3) (utilizing photolithographic preferred embodiment)
PDP production method of the present invention (3) is not limited to the method shown in Fig. 3 and Fig. 4.
The example of the formation method of other preferred PDP component parts (PDP production method (3)) is the formation method that comprises the steps (1)-(3).
(1) after forming etchant resist on the basement membrane, be coated on the composition that contains inorganic particle of the present invention on the etchant resist and be dried to laminated film, be formed into membrane layers.When forming etchant resist and filmogen layer, can use roll coater etc., thereby can on basement membrane, form laminated film with excellent thickness evenness.
(2) laminated film that is made of etchant resist and filmogen layer on the basement membrane is moved on the base material.Transition condition can be identical with the condition in above-mentioned " with the step of filmogen layer migration ".
(3) carry out and the same operation described in above-mentioned " with the etchant resist step of exposing ", " with the etchant resist step of developing ", " with the etched step of filmogen layer " and " step that the barrier rib patterned layer is cured ".In these operating process, as mentioned above, preferably make the developer solution of etchant resist identical, and " with the etchant resist step of developing " carry out continuously with " with the etched step of filmogen layer " with the etching solution of filmogen layer.
According to said method, because filmogen layer and etchant resist bulk migration are to base material, so can further improve production efficiency by simplifying step.
PDP production method (4) (forming component parts) with the responsive transport membrane of radiativity
PDP production method of the present invention (4) comprises the steps: the filmogen layer that constitutes the responsive transport membrane of radiativity of the present invention is moved on the base material; With the exposure of filmogen layer, form the sub-image of resist pattern; The filmogen layer is developed, form patterned layer; Patterned layer is cured, form the component parts that is selected from barrier rib, electrode, resistor, dielectric layer, phosphor, filter and black matix.
For example, in the method, when adopting example of barrier rib formation method, after above-mentioned " with the step of filmogen layer migration ", under the condition of " with the etchant resist step of exposing " and " with the etchant resist step of developing ", form patterned layer.On substrate surface, form barrier rib by " step that the barrier rib pattern is cured " then.
Formation method as " barrier rib " of PDP component parts is described in each step of PDP production method (1)-(4).Can form electrode, resistor, dielectric layer, phosphor, filter and the black matix that constitutes PDP according to this method.
Below with reference to embodiment in detail the present invention is described in detail.But not will be understood that the present invention only is confined to this embodiment.In embodiment and comparative example, all " parts " are " weight portion ".
Embodiment
(1) preparation glass paste composition (composition that contains inorganic particle)
Prepare the composition of the present invention that viscosity is 3400cp (measuring with Brookfield viscometer) with following method under 30rpm: with disperseing blender to mediate 100 parts the PbO-B that forms by 70wt% lead oxide, 10wt% boron oxide and 20wt% silica
2O
3-SiO
2Based mixtures (softening point is 500 ℃), 15 parts the butyl methacrylate as resin glue/methacrylic acid 2-Octyl Nitrite/(weight ratio is 30/60/10 to the hydroxy propyl methacrylate copolymer, weight average molecular weight is 150000), 5 parts of two glyceryl oleates as specific compound, 8.7 parts of propylene glycol monomethyl ether and 13.1 parts of 3-ethoxyl ethyl propionates as solvent.
(2) production of transport membrane and evaluation (elasticity and handling property)
It is (wide: 400mm with scraper-type coating machine the composition of the present invention of preparation in front (1) to be coated on the basement membrane of being made by PETG (PET) of having gone that the demoulding handles of having spouted in advance, long: 30m, thick: 38 μ m), under 80 ℃,, desolvate to remove with dry 5 minutes of the coated film that forms.Thereby forming thickness on basement membrane is the filmogen layer of 50 μ m.With the coverlay of making by PET that carried out in advance that the demoulding handles (wide: 400mm, long: 30m, thick: as 38 μ m) to stick on the filmogen layer, generate transport membrane of the present invention with composition shown in Figure 2.
The transport membrane softness that obtains is easy to reel.Moreover even when transport membrane is crooked, also can not crack (flex-crack) on the filmogen laminar surface, the filmogen layer has excellent elasticity.
Coverlay is peeled off from transport membrane, under the condition of not exerting pressure, transport membrane (laminated film of being made up of basement membrane and filmogen layer) is superimposed upon on the glass baseplate, the surface of filmogen layer is contacted with the surface of glass baseplate, then transport membrane is peeled off from the glass baseplate surface.As a result, the filmogen layer demonstrates the performance of suitable adhesive glass base material, can not cause bond damage in the filmogen layer when transport membrane can be peeled off.Therefore, transport membrane has good handling property.
(3) migration filmogen layer
After the transport membrane that obtains from front (2) peels off coverlay, transport membrane (laminated film of being made up of basement membrane and filmogen layer) is superimposed upon the glass baseplate that is used for 21 inches panels, the surface of filmogen layer is contacted with the surface of glass baseplate (bus electrode fixed surface), sticking with the heating roll-in under heating condition.Press stick spare to comprise: the surface temperature of warm-up mill is 90 ℃, and warm-up mill pressure is 2kg/cm
2, the translational speed of warm-up mill is 0.6m/min.
After adding thermocompression bonded and finishing, basement membrane is peeled off and removed at the lip-deep filmogen layer of glass baseplate from fixing (hot sticky), thereby finish the migration operation of filmogen layer.
In this migration step, when peeling off basement membrane, the filmogen layer can not cause bond damage, has enough big film-strength.In addition, the surface of the filmogen layer of migration and glass baseplate has good caking property.
(4) cure filmogen layer (formation dielectric layer)
Be placed in the stove on it as migration as described in front (3) and the glass baseplate that is formed with the filmogen layer, temperature in the stove is elevated to 620 ℃, it is cured, thereby on the surface of glass baseplate, form the water white transparency dielectric layer of making by sintered glass material.
Find that after measuring the thickness of this dielectric layer (average thickness and tolerance) is 30 μ m ± 0.4 μ m.Therefore, this dielectric layer has excellent thickness evenness.
With non-contact type thickness gauge (Ltd produces for NH-3, Ryokosha Co.) three-dimensional measurement is carried out on the dielectric layer surface that obtains, according to JIS standard (B0601) measure surface roughness (Ra, Ry, Rz).As a result, the Ra=0.08 μ m of this dielectric layer, Ry=0.56 μ m, Rz=0.28 μ m, therefore, dielectric layer has excellent surface smoothness.
In addition, the back is found after measured, and the light transmittance of the dielectric layer that so obtains is 93%.Therefore can confirm that this dielectric layer has good transparency.
The comparative example
With preparing the composition that viscosity is 3000cp (measuring with Brookfield viscometer) with the same method of embodiment under 30rpm, just the ratio with resin glue becomes 17 parts, with 4 parts of di 2-ethylhexyl azelates replacement specific compounds.With the composition production transport membrane that obtains, use with the same method of embodiment and estimate.As a result, transport membrane has better elastic and handling property.But, use with the same method of embodiment form dielectric layer and measure surface roughness (Ra, Ry find in the time of Rz), the Ra=0.65 μ m of dielectric layer, Ry=2.51 μ m, Rz=1.73 μ m, therefore, its surface smoothness is relatively poor.
Composition of the present invention has following effects.
(1) can suitably form the component parts (for example, barrier rib, electrode, resistor, dielectric layer, phosphor, filter and black matix) of the PDP with excellent surface smoothness.
(2) can suitably form sintered glass material (for example, constituting dielectric layer or the barrier rib of PDP) with high transmission rate.
(3) can generate the transport membrane that its filmogen layer has excellent resilience.
(4) can generate the transport membrane that its filmogen layer has excellent animal migration (with the thermal viscosity of base material).
Transport membrane of the present invention has following effects.
(1) can form the component parts (particularly dielectric layer) of the PDP with excellent surface smoothness effectively.
(2) its filmogen layer has excellent elasticity, and the surface of filmogen layer does not have flex-crack (crackle).
(3) have excellent flexibility, be easy to reel.
(4) its filmogen layer has suitable caking property and good handling property.
(5) its filmogen layer has excellent animal migration (with the thermal viscosity of base material).
Production method of the present invention has following effects.
(1) can form the component parts (for example, barrier rib, electrode, resistor, dielectric layer, phosphor, filter and black matix) of the PDP with excellent surface smoothness effectively.
(2) can form the PDP that its component parts has high setting accuracy effectively.
(3) can form the very big dielectric layer of thickness effectively.
(4) can form the needed dielectric layer of large-scale panel effectively.
(5) can form the PDP that it is provided with the dielectric layer with excellent thickness evenness and surface smoothness effectively.
Claims (11)
1, a kind of composition that contains inorganic particle, it comprises:
(A) inorganic particle;
(B) resin glue; With
(C) compound of representing with following formula (I):
Wherein, R
1Expression is by-group that CO-A represents, wherein, and the thiazolinyl that A represents to have the alkyl of 5-20 carbon atom or has 5-20 carbon atom.
2, the composition that contains inorganic particle according to claim 1, wherein compound (C) comprises at least a compound that is selected from diglycerol monolaurate, diglycerol monostearate, diglycerol monoleate and the diglycerol list caprylate.
3, the composition that contains inorganic particle according to claim 1, wherein resin glue (B) comprises (being total to) polymers that contains derived from the monomer of the compound of being represented by following general formula (II):
Wherein, R
2Expression hydrogen atom or methyl; And R
3Expression unit price organic group.
4, the composition that contains inorganic particle according to claim 1 also comprises (D) radiativity sensitive ingredients.
5, a kind of transport membrane, it comprises the filmogen layer that obtains with the composition that contains inorganic particle according to claim 1.
6, a kind of transport membrane, it comprises the filmogen layer that obtains with the composition that contains inorganic particle according to claim 4.
7, a kind of transport membrane, it comprises etchant resist and the laminated film of the filmogen layer that obtains with the composition that contains inorganic particle according to claim 1.
8, a kind of production method of plasma display panel, it comprises the steps: the filmogen layer that obtains with the composition that contains inorganic particle according to claim 1 is moved on the substrate surface, the filmogen layer of migration is cured, on base material, form dielectric layer.
9, a kind of production method of plasma display panel, it comprises the steps: the filmogen layer that obtains with the composition that contains inorganic particle according to claim 1 is moved on the substrate surface; On the filmogen layer of migration, form etchant resist; With the etchant resist exposure, form the sub-image of resist pattern; Etchant resist is developed, form the resist pattern; Be etched into membrane layers, form patterned layer corresponding to the resist pattern; Patterned layer is cured, form the component parts that is selected from barrier rib, electrode, resistor, dielectric layer, phosphor, filter and black matix.
10, a kind of production method of plasma display panel, it comprises the steps; The laminated film of the filmogen layer that on basement membrane, forms etchant resist and obtain with the composition that contains inorganic particle according to claim 1; To be formed on epilamellar laminated film moves on the substrate surface; To constitute the etchant resist exposure of laminated film, form the sub-image of resist pattern; Etchant resist is developed, form the resist pattern; Be etched into membrane layers, form patterned layer corresponding to the resist pattern; Patterned layer is cured, form the component parts that is selected from barrier rib, electrode, resistor, dielectric layer, phosphor, filter and black matix.
11, a kind of production method of plasma display panel, it comprises the steps: the filmogen layer that obtains with the composition that contains inorganic particle according to claim 4 is moved on the substrate surface; With the exposure of filmogen layer, form the sub-image of pattern; The filmogen layer is developed, form patterned layer; Patterned layer is cured, form the component parts that is selected from barrier rib, electrode, resistor, dielectric layer, phosphor, filter and black matix.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003052986 | 2003-02-28 | ||
| JP2003052986 | 2003-02-28 |
Publications (2)
| Publication Number | Publication Date |
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| CN1530998A CN1530998A (en) | 2004-09-22 |
| CN1320584C true CN1320584C (en) | 2007-06-06 |
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| CNB2004100070744A Expired - Fee Related CN1320584C (en) | 2003-02-28 | 2004-02-27 | Inorganic granuler contaniing composition and transporting film containing it and plasma display manufacture |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1452558A1 (en) |
| KR (1) | KR20040077526A (en) |
| CN (1) | CN1320584C (en) |
| TW (1) | TWI273624B (en) |
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| JP2005264138A (en) * | 2004-02-20 | 2005-09-29 | Jsr Corp | Glass powder-containing resin composition, transfer film and method of manufacturing plasma display panel using the same |
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| US6278008B1 (en) * | 1995-08-11 | 2001-08-21 | Daicel Chemical Industries, Ltd. | Fatty acid esters composition of a polyglycerine, and uses thereof |
| JP2001264973A (en) * | 2000-03-22 | 2001-09-28 | Jsr Corp | Inorganic particle-containing photosensitive composition and sensitive film |
| US6339118B1 (en) * | 1998-10-01 | 2002-01-15 | Jsr Corporation | Inorganic particle-containing composition, transfer film comprising the same and plasma display panel production process |
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|---|---|---|---|---|
| JPS5621829A (en) * | 1979-08-01 | 1981-02-28 | Mitsubishi Chem Ind Ltd | Manufacture of polyethylene film |
| JPS62100554A (en) * | 1985-10-29 | 1987-05-11 | Toshiba Silicone Co Ltd | Silicone emulsion composition |
| JP3229641B2 (en) * | 1992-01-28 | 2001-11-19 | 大日本印刷株式会社 | Method for forming phosphor screen of plasma display panel and phosphor slurry for plasma display panel used therefor |
| DE69811593T2 (en) * | 1997-09-02 | 2003-12-18 | Ajinomoto Kk | Thermoplastic resin composition, agent for improving heat aging resistance of a thermoplastic resin, and resin article molded therefrom |
| JP2000053444A (en) * | 1998-08-07 | 2000-02-22 | Jsr Corp | Glass paste composition, transfer film and plasma display panel |
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2004
- 2004-02-17 TW TW093103730A patent/TWI273624B/en not_active IP Right Cessation
- 2004-02-25 EP EP04004229A patent/EP1452558A1/en not_active Withdrawn
- 2004-02-27 CN CNB2004100070744A patent/CN1320584C/en not_active Expired - Fee Related
- 2004-02-27 KR KR1020040013326A patent/KR20040077526A/en not_active Application Discontinuation
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6278008B1 (en) * | 1995-08-11 | 2001-08-21 | Daicel Chemical Industries, Ltd. | Fatty acid esters composition of a polyglycerine, and uses thereof |
| US6339118B1 (en) * | 1998-10-01 | 2002-01-15 | Jsr Corporation | Inorganic particle-containing composition, transfer film comprising the same and plasma display panel production process |
| JP2001264973A (en) * | 2000-03-22 | 2001-09-28 | Jsr Corp | Inorganic particle-containing photosensitive composition and sensitive film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1530998A (en) | 2004-09-22 |
| KR20040077526A (en) | 2004-09-04 |
| TWI273624B (en) | 2007-02-11 |
| TW200423177A (en) | 2004-11-01 |
| EP1452558A1 (en) | 2004-09-01 |
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