CN1317596A - Self-catalytic plating Ni-Sn-P alloy solution and its plated layer - Google Patents
Self-catalytic plating Ni-Sn-P alloy solution and its plated layer Download PDFInfo
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- CN1317596A CN1317596A CN 00111007 CN00111007A CN1317596A CN 1317596 A CN1317596 A CN 1317596A CN 00111007 CN00111007 CN 00111007 CN 00111007 A CN00111007 A CN 00111007A CN 1317596 A CN1317596 A CN 1317596A
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- alloy solution
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- acid
- catalytic plating
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Abstract
A self-catalytic plating liquid of Ni-Sn-P alloy contains primary salt, composite stabilizer, composite complexing agent, composite promoter, buffer and other assistants, and features 4-6 of pH value, 5-30 microns/h of deposition speed and 6-14 MTO of service life. Its plated layer contains Ni (85-89%), Sn (2-4%) and P (9-11%) and features 15 microns of thickness, 1000 HV of hardness, 4-6% of ductility and excelelnt anticorrosion performance.
Description
The present invention is a kind of self-catalytic plating Ni-Sn-P alloy solution and coating thereof, and it belongs to electroless plating.It comprises main salt, reductive agent, stablizer, complexing agent, buffer reagent, promotor, wetting agent and deionized water.
Autocatalytic nickel, coating deposit to form in nickel salt aqueous solution does not need direct current, easy to operate; Can be in difform metal or non-metal material surface deposition; The fine and close porosity of coating is low; Corrosion-resistant, wear-resisting.Non magnetic; And has a good decoration effect.Be used widely in industry such as electronic industry, automotive industry, space flight and aviation, petrochemical compleies.Therefore, anticorrosion industry since the century always, the heat subject of scholar expert's research.And the development good stability, the fast plating bath of sedimentation velocity and high anti-corrosion, high abrasion, dense non-porous, good decorative property and thin coating are the directions that people make great efforts always.
A kind of solution and method of chemical plating of corrosion resisting amorphous phosphorus-nickel alloy are disclosed in Chinese patent CN1040398A; Its purpose is a kind of chemical plating technology of research, makes plating bath have long work-ing life and rational sedimentation velocity, can obtain high corrosion resistance coating again; Its formation is:
NiSO
4.6H
2O 0.10～0.13moL/L
NaH
2PO
2.H
2O 0.26～0.33moL/L
C
4H
9O
7+C
4H
7O
4N 0.16～0.26moL/L
NaAt 0.10～0.18moL/L
G
2H
25SO
4Na 20～30PPm
KTO
3 1～2PPm
H
2The O surplus
Its weak point is that the plating bath sedimentation velocity is slow, work-ing life is shorter, and coating poor ductility, porosity height so erosion resistance are not good enough.
The objective of the invention is to avoid above-mentioned weak point of the prior art and provide that a kind of sedimentation velocity is fast, the bath composition of long service life, and the coating that makes formation of deposits becomes, and ductility is good, porosity is low, microhardness is high, corrosion potential is lower, good decorating effect, the ideal ternary alloy chemical plating of excellent corrosion resistance.
Can reaching of purpose of the present invention by following measure:
An ideal coating depends on the reasonable plating bath of a kind of compatibility, and the successful part of plating bath of the present invention is to adopt the one package stabilizer system, compound complex agent system, and the promotor that adapts with it.Plating bath of the present invention is made of following component:
NiSO
4.6H
2O 0.04～0.23moL/L
NaH
2PO
2.H
2O 0.19～0.98moL/L
SnCI
4.3H
2O 0.03～0.18moL/L
Pd
++ 0～8PPm
Cd
++ 0～6PPm
Compound hydroxycarboxylic acid complexing agent 0.02～0.1moL/L
CH
3COONa 0.24～0.97moL/L
Tensio-active agent 10～35PPm
Water surplus.
Purpose of the present invention can also reach by following measure: the compound hydroxycarboxylic acid complexing agent that self-catalytic plating Ni-Sn-P alloy solution of the present invention adopted can by
-hydroxy-propionic acid;
-hydroxy dibasic acid;
-one dyhydrobutanedioic acid or its sodium salt; Beta-hydroxy-β-carboxyl pentanedioic acid or its potassium sodium double salt are composited.
The preferred compositing range of a compound hydroxycarboxylic acid complexing agent is provided below:
C
3H
6O
3 0.12～1moL/L
C
4H
6O
4 0.002～0.2moL/L
Na
3C6H50＞
.2H
2O 0.05～0.30moL/L
KNa
4H
4O
6.4H
2O 0.017～0.18moL/L
During self-catalytic plating Ni-Sn-P alloy solution of the present invention is formed
-amino acid promotor can be that in glycine, L-Ala, leucine, light propylhomoserin, L-glutamic acid, the Methionin one or more are compound.
Provide below one by
The preferred promotor scope that-amino acid is composited:
Glycine 0.001moL/L
L-Ala 0.005moL/L
Light propylhomoserin 0.001moL/L
The promotor of nickel-tin-phosphorus alloy plating liquid of the present invention also can be only a kind of with the light propylhomoserin.
Tensio-active agent during self-catalytic plating Ni-Sn-P alloy solution of the present invention is formed mainly plays wetting action, and anion surfactant is better, available C
12H
25SO
4Na.
Self-catalytic plating Ni-Sn-P alloy solution of the present invention can reach following technical indicator:
PH 4～6
Sedimentation velocity (μ m/h) 5～30
Work-ing life (MTO) 6～14
The chemical plating that utilizes self-catalytic plating Ni-Sn-P alloy solution deposition of the present invention to form has following technical characterictic:
A coating chemical ingredients: (wt%)
Ni 85～89
Sn 2～4
P 9～11
B porosity (15 μ m) does not have
C microhardness (HV) 950～1000
D ductility (%) 4～6
E concentrated nitric acid discoloration test (min) 12～30
The f neutral salt will be tested (20wm) 960～150 hours
G corrosion potential (3.5%NaCI)-244.56～-500wV
The h wholesomeness meets national hygiene standard for drinking water
The present invention is further described below in conjunction with embodiment
Table 1 embodiment 1～5 prescription
Table II 1～5 coating performance index
The present invention has the following advantages compared to existing technology:
1. bath stability is good, deposition velocity is fast;
2. coating ductility is good, hardness is high;
3. the coating porosity is low, corrosion potential is low, excellent corrosion resistance;
4. it is really good to decorate.
5. can be widely used in electronic apparatus, Aero-Space, petrochemical industry, machine-building, transportation pipe line, running water The plating corrosion-resistanting decoration of feed-line pipe fitting; Also can be used for electromagnetic wave shielding.
Claims (10)
1, a kind of self-catalytic plating Ni-Sn-P alloy solution comprises main salt, reductive agent, stablizer, complexing agent, buffer reagent, promotor, wetting agent; It is characterized in that constituting by following component:
NiSO
4.6H
2O 0.04～0.23moL/L
NaH
2PO
2.H
2O 0.19～0.98moL/L
SnCI
4.3H
2O 0.03～0.18moL/L
Pb 0～8PPM
Cd 0～6PPM
Compound hydroxycarboxylic acid complexing agent 0.02～0.1moL/L
CH
3COONa 0.24～0.97moL/L
Tensio-active agent 10～35PPm
Water surplus
2, according to the autocatalysis nickel-Xi-phosphor bath of claim 1, it is characterized in that described compound hydroxycarboxylic acid complexing agent by
-hydroxy-propionic acid;
-hydroxy-butanedioic acid
-dyhydrobutanedioic acid or its sodium salt; Beta-hydroxy-β-carboxyl pentanedioic acid or its potassium, sodium double salt are composited.
3, according to the self-catalytic plating Ni-Sn-P alloy solution of claim 1 and claim 2; A preferred compositing range that it is characterized in that described compound hydroxycarboxylic acid complexing agent is:
C
3H
6O
3 0.12～1moL/L
C
4H
6O
4 0.002～0.20moL/L
Na
3C
6H
5O
72H
2O?0.05～0.30moL/L
KNaC
4H
4O
64H
2O 0.017～0.18moL/L
4, according to the self-catalytic plating Ni-Sn-P alloy solution of claim 1, it is characterized in that described it
-amino acid promotor can be that in glycine, L-Ala, leucine, light propylhomoserin, L-glutamic acid, the Methionin one or more are compound.
5, according to the self-catalytic plating Ni-Sn-P alloy solution of claim 1 and claim 4; It is characterized in that described it
-amino acid promotor is composited by glycine, L-Ala, light propylhomoserin, and its preferred compositing range is:
Glycine 0.001moL/L
L-Ala 0.005moL/L
Light propylhomoserin 0.001moL/L
6, according to the self-catalytic plating Ni-Sn-P alloy solution of claim 1, it is characterized in that described it
-amino acid promotor is the light propylhomoserin.
7,, it is characterized in that preferably anion surfactant of described tensio-active agent according to the self-catalytic plating Ni-Sn-P alloy solution of claim 1.
8, according to the self-catalytic plating Ni-Sn-P alloy solution of claim 1 and claim 8; It is characterized in that described tensio-active agent is C
12H
25～SO
4Na.
9, according to the self-catalytic plating Ni-Sn-P alloy solution of claim 1; It is characterized in that the plating bath of being prepared reaches following technical indicator:
PH 4～6
Sedimentation velocity (μ m/h) 5～30
Work-ing life (MTO) 6～14
10, utilize the sedimentary chemical plating of claim 1 self-catalytic plating Ni-Sn-P alloy solution, it is characterized in that:
A. coating Chemical Composition: (wt%)
Ni 85～89
Sn 2～4
P 9～11
B. crack rate (15 μ m) does not have
C. microhardness (HV) 950～1000
D. ductility (%) 4～6
T. concentrated nitric acid discoloration test (min) 12～30
E. neutral salt will be tested (20 μ m) 960～1500 hours
G. corrosion potential (3.5%NaCI)-200～-500mV
H. wholesomeness meets national hygiene standard for drinking water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001110071A CN1157497C (en) | 2000-04-12 | 2000-04-12 | Self-catalytic plating Ni-Sn-P alloy solution and its plated layer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001110071A CN1157497C (en) | 2000-04-12 | 2000-04-12 | Self-catalytic plating Ni-Sn-P alloy solution and its plated layer |
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| Publication Number | Publication Date |
|---|---|
| CN1317596A true CN1317596A (en) | 2001-10-17 |
| CN1157497C CN1157497C (en) | 2004-07-14 |
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|---|---|---|---|
| CNB001110071A Expired - Fee Related CN1157497C (en) | 2000-04-12 | 2000-04-12 | Self-catalytic plating Ni-Sn-P alloy solution and its plated layer |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101942651A (en) * | 2010-09-28 | 2011-01-12 | 蔡乐勤 | Zero-discharge chemical nickel-plating technology |
| CN103060781A (en) * | 2013-01-06 | 2013-04-24 | 四川大学 | High-tin Ni-Sn-P chemical coating layer resistant to corrosion of high-sulfur and high-carbon medium and preparation method thereof |
| CN104018142A (en) * | 2014-06-19 | 2014-09-03 | 林忠华 | Chemical-plated multifunctional nickel-tin-phosphorus alloy plating solution and plating layer thereof |
| CN104561960A (en) * | 2014-12-19 | 2015-04-29 | 浙江海洋学院 | High-stability nickel-tin-phosphorus chemical plating solution |
| CN105002481A (en) * | 2015-07-07 | 2015-10-28 | 苏州华日金菱机械有限公司 | Electroplating solution |
| CN108505024A (en) * | 2018-06-29 | 2018-09-07 | 林忠华 | Chemical plating ni-sn-aluminium-phosphorus amorphous state multifunctional alloy plating solution and its coating |
| CN111647882A (en) * | 2020-05-18 | 2020-09-11 | 中国石油天然气集团有限公司 | Chemical plating solution of Ni-Sn-P alloy plating layer and chemical plating layer |
| CN116575019A (en) * | 2023-07-13 | 2023-08-11 | 深圳市板明科技股份有限公司 | Method for electroless deposition of tin-nickel alloy on carrier-like plate |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4826735B2 (en) * | 2005-11-21 | 2011-11-30 | 三菱マテリアル株式会社 | Manufacturing method of Au-Sn alloy bump without incorporating large voids |
| CN101191205B (en) * | 2007-12-21 | 2010-05-19 | 天津大学 | High corrosion resistance nickel-tin-phosphorus alloy plating liquid |
-
2000
- 2000-04-12 CN CNB001110071A patent/CN1157497C/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101942651A (en) * | 2010-09-28 | 2011-01-12 | 蔡乐勤 | Zero-discharge chemical nickel-plating technology |
| CN101942651B (en) * | 2010-09-28 | 2012-07-25 | 蔡乐勤 | Zero-discharge chemical nickel-plating technology |
| CN103060781A (en) * | 2013-01-06 | 2013-04-24 | 四川大学 | High-tin Ni-Sn-P chemical coating layer resistant to corrosion of high-sulfur and high-carbon medium and preparation method thereof |
| CN104018142A (en) * | 2014-06-19 | 2014-09-03 | 林忠华 | Chemical-plated multifunctional nickel-tin-phosphorus alloy plating solution and plating layer thereof |
| CN104018142B (en) * | 2014-06-19 | 2016-03-30 | 林忠华 | Electroless plating nickel-tin-phosphorus alloy plating liquid |
| CN104561960A (en) * | 2014-12-19 | 2015-04-29 | 浙江海洋学院 | High-stability nickel-tin-phosphorus chemical plating solution |
| CN104561960B (en) * | 2014-12-19 | 2017-02-08 | 浙江海洋学院 | High-stability nickel-tin-phosphorus chemical plating solution |
| CN105002481A (en) * | 2015-07-07 | 2015-10-28 | 苏州华日金菱机械有限公司 | Electroplating solution |
| CN108505024A (en) * | 2018-06-29 | 2018-09-07 | 林忠华 | Chemical plating ni-sn-aluminium-phosphorus amorphous state multifunctional alloy plating solution and its coating |
| CN111647882A (en) * | 2020-05-18 | 2020-09-11 | 中国石油天然气集团有限公司 | Chemical plating solution of Ni-Sn-P alloy plating layer and chemical plating layer |
| CN116575019A (en) * | 2023-07-13 | 2023-08-11 | 深圳市板明科技股份有限公司 | Method for electroless deposition of tin-nickel alloy on carrier-like plate |
| CN116575019B (en) * | 2023-07-13 | 2023-09-12 | 深圳市板明科技股份有限公司 | Method for electroless deposition of tin-nickel alloy on carrier-like plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1157497C (en) | 2004-07-14 |
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