CN1315148C - Electrode substrate for Z-D display - Google Patents
Electrode substrate for Z-D display Download PDFInfo
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- CN1315148C CN1315148C CNB031557430A CN03155743A CN1315148C CN 1315148 C CN1315148 C CN 1315148C CN B031557430 A CNB031557430 A CN B031557430A CN 03155743 A CN03155743 A CN 03155743A CN 1315148 C CN1315148 C CN 1315148C
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Abstract
The present invention relates to an electrode substrate for plane displays, which comprises a substrate, an electrode layer, a conducting wire layer and a protective layer, wherein the electrode layer is formed on the substrate; the conducting wire layer is formed on the electrode layer, and is made of silver (larger than 99.5%), silver alloy, aluminum (larger than 99.5%), aluminum alloy, copper (larger than 99.5%), or copper alloy; the protective layer is formed on the conducting wire layer, and is made of titanium, titanium alloy, molybdenum, chromium, silicon, monox or titanium oxide.
Description
Technical field
The present invention refers in particular to a kind of electrode base board of flat-panel screens about a kind of electrode base board.
Background technology
As shown in Figure 1, the electrode base board 4 of present employed flat-panel screens has a substrate 41, an electrode layer 42 and a conductor layer 43, and electrode layer 42 is formed on the substrate 41, and conductor layer 43 is formed on the electrode layer 42.Wherein, the material of conductor layer 43 is selected from metal or its alloy of low-resistivity, and is general commonly used as silver (＞99.5%), silver alloy, aluminium (＞99.5%) or aluminium alloy etc.
In the processing procedure of flat-panel screens, it utilizes etching solution that the conductor layer in the electrode base board 4 43 is etched into the pattern of actual required conductor wire or the pattern of additional conductive line.Shown in Fig. 2 A, at first, one photoresist layer 5 is formed on the conductor layer 43 (for example silver alloy), then a light shield 6 with pattern is arranged on the photoresist layer 5, the while is also shone a ultraviolet light (UVlight), next carries out development step again, at last, utilize etching solution to carry out etching again, so that conductor layer 43 is etched into the pattern of required conductor wire, shown in Fig. 2 B.
At present, the dealer is on the preceding surface that can utilize ultraviolet light (UV light) cleaning conductor layer 43 earlier that forms photoresist layer 5, its purpose is in order to increase the tack between photoresist layer 5 and the conductor layer 43, further avoids photoresist layer 5 and conductor layer 43 peeling off phenomenon and cause the decline of assembly yield in subsequent step.
Yet the situation of oxidation (blackening) takes place in conductor layer 43 easily because of irradiating ultraviolet light, also cause simultaneously the resistance value of conductor layer 43 to raise and and photoresist layer 5 between the decline of tack.In addition, because the thickness of conductor layer 43 is about 4000～6000 , when carrying out etching step, the conductor wire shape that etches is wayward, that is conductor layer 43 is near photoresist layer 5 parts, and its etch quantity can be than the etch quantity big (shown in Fig. 2 B) of conductor layer 43 bottoms (near the part of electrode layer 42), and the situation of electron transfer (electronmigration) takes place between making bottom the adjacent conductive line easily, and then cause short circuit (arcing) and reduce the reliability of assembly.
General its employed metal conductive wire of active drive flat-panel screens (for example AM-LCD) of using mostly is the alloy of some transition metal such as manganese (Mo), chromium (Cr) or tantalum (Ta) greatly.Its thin film deposition thickness can not too thickly just can obtain pasting property of film (step-coverage) preferably when making these metal conductive wire.Yet thin metal conductive wire will cause the resistance of conductor wire to raise, and cause the RC-delay of signal to become big.Therefore, the big young pathbreaker of the two-d display panel of these transition metal mades is limited.So,, must develop the metal conductive wire processing procedure or the material that to have ultralow resistance in order to make the large scale two-d display panel.
And,, must adopt the metallic film of thicker and broad in order to obtain lower resistance from the angle of metal conductive wire processing procedure.But its shortcoming of thick metallic film forms (pinhole formation) for producing relatively poor pasting property and hole.Though, so will cause the increase of processing procedure cost again at present to use special oblique angle etching (taper etching) processing procedure to be improved.What is more, and the metallic film of broad then not only reduces aperture ratio of pixels but also increases the parasitic capacitance (parasitic capacitance) of conductor wire again.Therefore, metallic film processing procedure thicker and broad is also infeasible.
In the processing procedure of TFT-LCD (Thin Film Transistor-LCD), though utilize the chromium/aluminium/chromium or the three-layer metal structure of molybdenum/aluminium/molybdenum to be used as the material of conductor wire, to avoid producing above-mentioned problem.But, in the making of this kind conductor wire, must use two kinds of different etching solutions.At the beginning, utilize first etching solution etching upper strata chromium (molybdenum) metal earlier, then utilize the second etching solution etching aluminum interlayer metal again, utilize first etching solution etching lower floor chromium (molybdenum) metal at last again, that is must carry out three times etching step, fabrication steps complexity not only, and also increase whole cost, and be not suitable for the application on the actual industrial.
The inventor likes originally in the spirit of positive innovation, urgently to think a kind of " electrode base board of flat-panel screens " that can solve this problem because of in this.
Summary of the invention
Because above-mentioned problem, purpose of the present invention provides a kind of electrode base board with flat-panel screens of protective layer, and this protective layer can the guardwire layer and make conductor layer be difficult for oxidation, simultaneously the shape of the conductor wire that also may command etched.
Thus, for reaching above-mentioned purpose, the electrode base board according to a kind of flat-panel screens of the present invention comprises a substrate, an electrode layer, a conductor layer and a protective layer.Wherein, electrode layer is formed on the substrate; Conductor layer is formed on the electrode layer, and the material of conductor layer is silver (＞99.5%), silver alloy, aluminium (＞99.5%), aluminium alloy, copper (＞99.5%) or copper alloy; Protective layer is formed on the conductor layer, and the material of protective layer is titanium or titanium alloy.
For reaching above-mentioned purpose, the electrode base board according to a kind of flat-panel screens of the present invention comprises a substrate, an electrode layer, a conductor layer and a protective layer.Wherein, electrode layer is formed on the substrate; Conductor layer is formed on the electrode layer, and the material of conductor layer is silver (＞99.5%), silver alloy, aluminium (＞99.5%), aluminium alloy, copper (＞99.5%) or copper alloy; Protective layer is formed on the conductor layer, and the material of protective layer is molybdenum, chromium, silicon, silica or titanium oxide.
For reaching above-mentioned purpose, the electrode base board according to a kind of flat-panel screens of the present invention comprises a substrate, an electrode layer, a conductor wire pattern and a protective layer.Wherein, electrode layer is formed on the substrate; The conductor wire pattern is formed on the electrode layer, the conductor wire pattern has at least one conductor wire, the side of conductor wire and the angle of electrode layer are about 90 degree, and the material of conductor wire pattern is silver (＞99.5%), silver alloy, aluminium (＞99.5%), aluminium alloy, copper (＞99.5%) or copper alloy; Protective layer is formed on the conductor wire pattern.
Flat-panel screens comprises but is not defined as an organic electric-excitation luminescent (OrganicElectroluminescence, OEL) display, inorganic electroluminescence (Electroluminescence, EL) display, light-emitting diode (Light Emitting Diode, LED) display, LCD (Liquid Crystal Display, LCD), electricity plasma display (Plasma Display Panel, PDP), vacuum fluorescent display (Vacuum Fluorescent Display, VFD), (Field Emission Display is FED) with electrochromic display device (ECD) (Electro-chromicDisplay) etc. for field-emitter display.
From the above, the electrode base board of a kind of flat-panel screens of the present invention has a protective layer, in order to the guard electrode layer.Compared with prior art, protective layer of the present invention can avoid conductor layer to produce the situation of oxidation because of irradiating ultraviolet light, and then reduces on the conductor layer resistance value and rise, more can increase simultaneously and photoresist layer between tack.And, the present invention is the shape of conductor wire (angle as conductor wire side and electrode layer is about 90 degree) after the may command etching more, avoid taking place the situation of electron transfer, also can avoid the generation of short circuit simultaneously, further guarantee the reliability of assembly because of the conductor wire of distortion.In addition, when the material of protective layer is titanium or titanium alloy, owing to can use single etching solution, thus only need carry out the etching step of single, can while etch protection layer and electrode layer.Moreover the present invention not only processing procedure is simple, and the increase of whole cost is also not high, and is very suitable for the application on the actual industrial.
Hereinafter with reference to relevant drawings, describe electrode base board in detail according to the flat-panel screens of preferred embodiment of the present invention.
Description of drawings
Fig. 1 is a schematic diagram of known electrode base board;
Fig. 2 A and Fig. 2 B are the one group of generalized section that forms conductor wire or additional conductive line chart sample in electrode base board;
Fig. 3 is a schematic diagram of the electrode base board in the first embodiment of the invention;
Fig. 4 is a generalized section that forms conductor wire or additional conductive line chart sample among first embodiment in electrode base board;
Fig. 5 is a schematic diagram of the electrode base board in the second embodiment of the invention; And
Fig. 6 is a schematic diagram of the electrode base board in the third embodiment of the invention.
Symbol description among the figure
1 electrode base board
11 substrates
12 electrode layers
13 conductor layers
13 ' conductor wire
14 protective layers
2 electrode base boards
21 substrates
22 electrode layers
23 conductor layers
24 protective layers
3 electrode base boards
31 substrates
32 electrode layers
33 conductor wire patterns
331 conductor wires
34 protective layers
4 electrode base boards
41 substrates
42 electrode layers
43 conductor layers
5 photoresist layers
6 light shields
Embodiment
As shown in Figure 3, the electrode base board 1 according to a kind of flat-panel screens of first embodiment of the invention comprises a substrate 11, an electrode layer 12, a conductor layer 13 and a protective layer 14.Wherein, electrode layer 12 is formed on the substrate 11; Conductor layer 13 is formed on the electrode layer 12; Protective layer 14 is formed on the conductor layer 13, and the material titanium or the titanium alloy of protective layer 14.
In present embodiment, substrate 11 can be a flexibility (flexible) substrate or a rigidity (rigid) substrate.Simultaneously, substrate 11 can also be plastics (plastic) substrate or a glass substrate.Wherein, flexible base, board and plastic base can be a Merlon (polycarbonate, PC) substrate, a polyester (polyester, PET) substrate, a cyclenes copolymer (cyclic olefin copolymer, COC) substrate or a crome metal compound base material one cyclenes copolymer (metallocene-basedcyclic olefin copolymer, MCOC) substrate.
In addition, as shown in Figure 3, electrode layer 12 is formed on the substrate 11.In present embodiment, electrode layer 12 utilizes sputter (sputtering) mode or ion plating (ion plating) mode is formed on the substrate 11.At this, electrode layer 12 is generally a transparent conductive metal oxide as anode and its material usually, for example tin indium oxide (ITO), aluminum zinc oxide (AZO) or indium zinc oxide (IZO) or the like.
Please refer to Fig. 3 again, the conductor layer 13 in the present embodiment is formed on the electrode layer 12, and wherein the material of conductor layer 13 can be silver (＞99.5%), silver alloy, aluminium (＞99.5%) or aluminium alloy.Because the resistance value of silver (＞99.5%), silver alloy, aluminium (＞99.5%), aluminium alloy, copper (＞99.5%) or copper alloy is low, while conductivity height so be suitable as the usefulness of lead very much.In this, the thickness of conductor layer 13 is about 4000～6000 .
In addition, please refer to Fig. 3 again, the protective layer 14 of present embodiment is formed on the conductor layer 13.In this, protective layer 14 makes conductor layer 13 can not produce the situation of oxidation when irradiating ultraviolet light in order to guardwire layer 13.Wherein, the material of protective layer 14 can be titanium or titanium alloy, because titanium and titanium alloy are reactive metal, after protective layer 14 one patterned, the conjugation grade between protective layer 14 and the IC can will come goodly than the conjugation grade between conductor layer 13 (silver alloy) itself and the IC.In addition, can form the thin and oxide layer (titanium oxide) closely of one deck on the surface of titanium, this compact oxide is the passivation material with good corrosion stability.In this, the thickness of protective layer 14 is about less than 100 .
In present embodiment, the thickness of conductor layer 13 and protective layer 14 can adjust according to actual conditions.
When on the electrode base board 1 of flat-panel screens, forming conductor wire pattern or additional conductive line chart sample, at first on protective layer 14, form a photoresist layer, then on photoresist layer, be provided with one and have the light shield of pattern, and shine a ultraviolet light simultaneously.Next, the photoresist layer that has pattern through development step with formation.At last, utilize etching solution to carry out etching.
As shown in Figure 4; in present embodiment; when the factors such as the thickness of suitably regulating and control protective layer 14 and etching parameter; the shape of formed conductor wire 13 ' after can 13 etching of pilot layer; be about 90 degree as the angle between conductor wire 13 ' and the electrode layer 12, this measure can be avoided between these conductor wire 13 ' bottoms electron transfer taking place and cause situation of short circuit.In addition, when carrying out etching step, use single etching solution etch protection layer 14 and conductor layer 13 simultaneously, that is, only need carry out an etching etch protection layer 14 and conductor layer 13 simultaneously.In addition, on electrode base board 1, also can utilize same way as to form other pattern.
In addition, as shown in Figure 5, a kind of electrode base board 2 of second embodiment of the invention comprises a substrate 21, an electrode layer 22, a conductor layer 23 and a protective layer 24.Wherein, electrode layer 22 is formed on the substrate 21; Conductor layer 23 is formed on the electrode layer 22, and the material of conductor layer 23 is silver (＞99.5%), silver alloy, aluminium (＞99.5%), aluminium alloy, copper (＞99.5%) or copper alloy; Protective layer 24 is formed on the conductor layer 23, and the material of protective layer 24 is molybdenum, chromium, silicon, silica or titanium oxide.
The feature of the substrate 21 in the present embodiment, electrode layer 22 and conductor layer 23 is identical with same components among the function and first embodiment, does not repeat them here.
Protective layer 24 in the present embodiment is except material is molybdenum, chromium, silicon, silica or titanium oxide, and all the protective layer 14 with first embodiment is identical with function for remaining feature, also repeats no more at this.
In addition, as shown in Figure 6, a kind of electrode base board 3 of third embodiment of the invention comprises a substrate 31, an electrode layer 32, a conductor wire pattern 33 and a protective layer 34.Wherein, electrode layer 32 is formed on the substrate 31; Conductor wire pattern 33 is formed on the electrode layer 32, conductor wire pattern 33 has at least one conductor wire 331, the angle of the side of conductor wire 331 and electrode layer 32 is about 90 degree, and the material of conductor wire pattern 33 is silver (＞99.5%), silver alloy, aluminium (＞99.5%), aluminium alloy, copper (＞99.5%) or copper alloy; Protective layer 34 is formed on the conductor wire pattern 33.
In addition, the feature of the conductor wire pattern 33 in the present embodiment is identical with conductor layer 13 among the function and first embodiment, also repeats no more at this.
In present embodiment, the material of protective layer 34 can be titanium, titanium alloy, molybdenum, chromium, silicon, silica or titanium oxide.Protective layer 34 remaining feature and function also with first embodiment in protective layer 14 identical, also repeat no more at this.
In the present invention, flat-panel screens comprises but is not defined as an organic electric-excitation luminescent (OrganicElectroluminescence, OEL) display, inorganic electroluminescence (Electroluminescence, EL) display, light-emitting diode (Light Emitting Diode, LED) display, LCD (Liquid Crystal Display, LCD), plasma display (Plasma Display Panel, PDP), vacuum fluorescent display (Vacuum Fluorescent Display, VFD), (Field Emission Display is FED) with electrochromic display device (ECD) (Electro-chromicDisplay) etc. for field-emitter display.
The electrode base board of a kind of flat-panel screens of the present invention has a protective layer, in order to the guard electrode layer.Compared to the prior art, protective layer of the present invention can avoid conductor layer to produce the situation of oxidation because of irradiating ultraviolet light, and then reduces the rising of conductor layer resistance value, more can increase simultaneously and photoresist layer between tack.And, the present invention is the shape of conductor wire (angle as conductor wire side and electrode layer is about 90 degree) after the may command etching more, avoid taking place the situation of electron transfer, also can avoid the generation of short circuit simultaneously, further guarantee the reliability of assembly because of the conductor wire of distortion.In addition, when the material of protective layer is titanium or titanium alloy, owing to can use single etching solution, thus only need carry out the etching step of single, can while etch protection layer and electrode layer.Moreover the present invention not only processing procedure is simple, and the increase of whole cost is also not high, and is very suitable for the application on the actual industrial.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be contained in described specification and the extremely sharp claimed range its equivalent modifications of carrying out or change.
Claims (12)
1. the electrode base board of a flat-panel screens is characterized in that, comprises:
One substrate;
One electrode layer, it is formed on this substrate;
One conductor layer, it is formed on this electrode layer, and the material of this conductor layer is silver, silver alloy, aluminium, aluminium alloy, copper or copper alloy; Wherein, silver is weight percentage more than or equal to 99.5% silver, and aluminium is weight percentage more than or equal to 99.5% aluminium, and copper is weight percentage more than or equal to 99.5% copper; And
One protective layer, it is formed on this conductor layer, and the material of this protective layer be selected from titanium, titanium alloy, molybdenum, chromium, silicon, silica, titanium oxide one of them.
2. the electrode base board of flat-panel screens as claimed in claim 1, wherein this substrate is a flexible base, board or a rigid substrates.
3. the electrode base board of flat-panel screens as claimed in claim 1, wherein this substrate is a plastic base or a glass substrate.
4. the electrode base board of flat-panel screens as claimed in claim 1, wherein this electrode layer is the metal oxide electrode layer of conduction.
5. the electrode base board of flat-panel screens as claimed in claim 4, wherein this electrode layer is selected from a kind of formed electrode layer of tin indium oxide, aluminum zinc oxide and indium zinc oxide at least.
6. the electrode base board of flat-panel screens as claimed in claim 1, wherein the thickness of this conductor layer is 4000-6000 , and the thickness of this protective layer is less than 100 .
7. the electrode base board of a flat-panel screens is characterized in that, comprises:
One substrate:
One electrode layer, it is formed on this substrate;
One conductor wire pattern, it is formed on this electrode layer, this conductor wire pattern has at least one conductor wire, the side of this conductor wire and the angle of this electrode layer are 90 degree, and the material of this conductor wire pattern is silver, silver alloy, aluminium, aluminium alloy, copper or copper alloy, and wherein, silver is weight percentage more than or equal to 99.5% silver, and aluminium is weight percentage more than or equal to 99.5% aluminium, and copper is weight percentage more than or equal to 99.5% copper; And
One protective layer, it is formed on this conductor wire pattern, and the material of this protective layer be selected from titanium, titanium alloy, molybdenum, chromium, silicon, silica, titanium oxide one of them.
8. the electrode base board of flat-panel screens as claimed in claim 7, wherein this substrate is a flexible base, board or a rigid substrates.
9. the electrode base board of flat-panel screens as claimed in claim 7, wherein this substrate is a plastic base or a glass substrate.
10. the electrode base board of flat-panel screens as claimed in claim 7, wherein this electrode layer is the metal oxide electrode layer of conduction.
11. the electrode base board of flat-panel screens as claimed in claim 10, wherein this electrode layer is selected from a kind of formed electrode layer of tin indium oxide, aluminum zinc oxide and indium zinc oxide at least.
12. the electrode base board of flat-panel screens as claimed in claim 7, wherein the thickness of this conductor wire pattern is 4000-6000 , and the thickness of this protective layer is less than 100 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031557430A CN1315148C (en) | 2003-09-01 | 2003-09-01 | Electrode substrate for Z-D display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031557430A CN1315148C (en) | 2003-09-01 | 2003-09-01 | Electrode substrate for Z-D display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1591756A CN1591756A (en) | 2005-03-09 |
| CN1315148C true CN1315148C (en) | 2007-05-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031557430A Expired - Fee Related CN1315148C (en) | 2003-09-01 | 2003-09-01 | Electrode substrate for Z-D display |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1315148C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100466880C (en) * | 2005-08-24 | 2009-03-04 | 铼宝科技股份有限公司 | Electrode substrate of two-dimensional display |
| CN102759863B (en) * | 2011-04-27 | 2015-12-02 | 瑞世达科技(厦门)有限公司 | Laser stepper |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6348848A (en) * | 1986-08-19 | 1988-03-01 | Matsushita Electric Ind Co Ltd | Connecting structure of semiconductor chip |
| JPH11109888A (en) * | 1997-10-03 | 1999-04-23 | Dainippon Printing Co Ltd | Laminated electrode |
| JPH11339666A (en) * | 1998-05-29 | 1999-12-10 | Sony Corp | Front substrate for ac plasma display panel and ac plasma display panel |
| JP2000228151A (en) * | 1999-02-08 | 2000-08-15 | Hitachi Ltd | Plasma display panel |
| US6353285B1 (en) * | 1998-07-30 | 2002-03-05 | Micron Technology, Inc. | Field emission display having reduced optical sensitivity and method |
-
2003
- 2003-09-01 CN CNB031557430A patent/CN1315148C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6348848A (en) * | 1986-08-19 | 1988-03-01 | Matsushita Electric Ind Co Ltd | Connecting structure of semiconductor chip |
| JPH11109888A (en) * | 1997-10-03 | 1999-04-23 | Dainippon Printing Co Ltd | Laminated electrode |
| JPH11339666A (en) * | 1998-05-29 | 1999-12-10 | Sony Corp | Front substrate for ac plasma display panel and ac plasma display panel |
| US6353285B1 (en) * | 1998-07-30 | 2002-03-05 | Micron Technology, Inc. | Field emission display having reduced optical sensitivity and method |
| JP2000228151A (en) * | 1999-02-08 | 2000-08-15 | Hitachi Ltd | Plasma display panel |
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| CN1591756A (en) | 2005-03-09 |
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Granted publication date: 20070509 Termination date: 20130901 |