CN1314308C - Electronic device and its screening element - Google Patents
Electronic device and its screening element Download PDFInfo
- Publication number
- CN1314308C CN1314308C CNB2004100019273A CN200410001927A CN1314308C CN 1314308 C CN1314308 C CN 1314308C CN B2004100019273 A CNB2004100019273 A CN B2004100019273A CN 200410001927 A CN200410001927 A CN 200410001927A CN 1314308 C CN1314308 C CN 1314308C
- Authority
- CN
- China
- Prior art keywords
- housing
- shadowing elements
- electronic installation
- electronic component
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012216 screening Methods 0.000 title 1
- 238000009434 installation Methods 0.000 claims description 37
- 230000005855 radiation Effects 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000000047 product Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 208000032365 Electromagnetic interference Diseases 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000035876 healing Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Abstract
The present invention provides an electronic device and a shielding component thereof, wherein the electric device comprises a casing and a contact part, wherein the casing is used for shielding an electronic component, the contact part is arranged in the casing and contacts the electronic component. In addition, the present invention also provides an electronic device which comprises a circuit board, a casing and a contact part, wherein at least one electronic component is fixed to the circuit board, the casing is used for shielding the electronic component and the contact part is arranged in the casing and contacts the electronic element.
Description
Technical field
The present invention is about a kind of shadowing elements, and particularly a kind of have the heat transmission contact site, and is used for the shadowing elements of electronic installation.
Background technology
General electronic installation, big city produces electromagnetic radiation; Be difficult to avoid between the radiation of different electronic installations interact, this kind phenomenon claim for Electromagnetic Interference (Electromagneticinterference, EMI).This interference can influence other electronic installation, the operate as normal of high sensitivity electronic installation particularly, and what have also can damage the healthy of people.
Electromagnetic wave is with radiation and conduct two kinds of forms and occur, and when frequency electromagnetic wave when 10MHz is following mostly is the form of conduction greatly, the electromagnetic wave of upper frequency then mostly is the form of radiation.For preventing electromagnetic effusion and interference, the container of product and lead be covering of high electromagnetism conductive material in addition.Need be with the thick shadowing elements of healing to the electromagnetic wave of low frequency more, and to the electromagnetic wave of high frequency more relative use thin shadowing elements.
As shown in Figure 1, be to reduce the interference of electromagnetism, existing electronic installation 1 on electronic component 11, be provided with an electric conducting material made cover cover body 12, and be provided with pin 121 with chimeric with circuit board 13, with holding electronic device 11 in wherein.This covers the accumulation that cover body 12 can be eliminated static, and can absorb electromagnetic field, and then reaches electromagnetic wave shielding, prevents the function of Electromagnetic Interference.
Because the development of electronic product has more and more compact trend at present, yet along with the increase of element heating amount and dwindling of volume, heat generation density also thereby fast promotes.Especially in having the electronic product of electromagnetic wave shielding, element radiating is difficult for, if effective radiating mode can't be provided, then can badly influence the performance and the reliability of electronic product, even shorten its useful life.
But if directly heat dissipation element is fixed on the electronic component, design the cover body that covers of large-size again,, thus, cover the required volume of cover body and will become greatly, and then increased production cost to cover the entire circuit plate.
Other has prior art to mention directly the cover body that covers in the electronic installation is dug a hole, with ccontaining heat dissipation element on electronic component, to reach heat radiation simultaneously and to prevent the effect of Electromagnetic Interference.But because heat dissipation element utilizes viscose glue and electronic installation bonding, not only radiating effect is relatively poor, and if when the chip quality has problem in the future, maintenance is difficult for, even must scrap the entire circuit plate.
Because the problems referred to above, the inventor urgently thinks a kind of heat dissipation element and shadowing elements of can solving and is difficult for the problem integrated, to reach direct heat radiation and to prevent the electronic installation and the shadowing elements thereof of Electromagnetic Interference.
Summary of the invention
Because above-mentioned problem, purpose of the present invention provides a kind of electronic installation and shadowing elements thereof that can reach heat radiation simultaneously and prevent Electromagnetic Interference.
For reaching above-mentioned purpose, the technical characterictic that the present invention adopts is as follows:
A kind of electronic installation and shadowing elements thereof comprise:
One housing and electronic component, this housing is used to cover electronic component; It is characterized in that:
This housing is provided with a contact site, and this contact site and this housing are one-body molded, and contact site directly contacts with described electronic component, constitutes a kind of tool heat radiation and covers the electronic installation that combines.
Comprise a circuit board, a housing, reach a contact site according to electronic installation of the present invention.Wherein, circuit board is provided with an electronic component at least, and housing is surrounded on around the electronic component, and housing is provided with the heat radiation contact site that contacts with electronic component.
In addition, comprise a circuit board, a housing, a contact site, reach a base according to electronic installation of the present invention.Wherein, circuit board has an electronic component at least, and housing is surrounded on around the electronic component, and housing more comprises a first side wall, and base more comprises one second sidewall, and the first side wall is around second sidewall, and fastens with second sidewall.
From the above, electronic installation of the present invention and shadowing elements thereof, utilize the shadowing elements can the electronic component on the circuit board is wherein ccontaining, not only has the function that prevents Electromagnetic Interference in the prior art, shadowing elements of the present invention has more a contact site, can directly contact with electronic component, make whole shadowing elements so that become heat conductor, help electronic element radiating, therefore do not need to install again a heat dissipation element, make the volume of shadowing elements to diminish,, more simplified manufacture course of products so not only can save production cost.
Description of drawings
The electronic installation schematic diagram of Fig. 1 prior art;
Fig. 2 is a shadowing elements schematic diagram of the present invention;
Fig. 3 is the decomposing schematic representation of an electronic installation of the present invention; And
Fig. 4 is the decomposing schematic representation of another electronic installation of the present invention.
Symbol description among the figure:
1 electronic installation
11 electronic components
12 cover cover body
121 pins
13 circuit boards
2 shadowing elements
21 housings
211 the first side walls
212 junction surfaces
22 contact sites
3 circuit boards
31 electronic components
32 jacks
4 bases
41 second sidewalls
Embodiment
For making content of the present invention easier to understand,, preferred embodiment of the present invention is described hereinafter with reference to relevant drawings.
At first, will specify the shadowing elements of preferred embodiment of the present invention according to Fig. 2 and Fig. 3.
As Fig. 2 and shown in Figure 3, the shadowing elements 2 of preferred embodiment of the present invention comprises a housing 21 and a contact site 22.Housing 21 is used to cover an electronic component 31, electronic component 31 such as chip or heat generation ceramic component etc.Housing 21 more comprises a first side wall 211, and the first side wall 211 is located on around the electronic component 31, and housing 21 is arranged on the circuit board 3, and circuit board 3 is a printed circuit board (PCB).
One side and the housing 21 of the first side wall 211 are connected, and the first side wall 211 is located on around the housing 21.And the opposite side of the first side wall 211 has at least one junction surface 212.In present embodiment, junction surface 212 is a protrusion piece, and it is incorporated into the usefulness of circuit board 3 for shadowing elements 2.
Please refer to shown in Figure 3ly, the jack 32 on the circuit board 3 can be inserted in junction surface 212, utilizes plug-in part technology (DIP) so that shadowing elements 2 is combined on the circuit board 3.In addition, shadowing elements 2 also can utilize surface adhering technology (SMT), after the formation weld pad stamps tin cream on the circuit board 3, shadowing elements 2 is placed on the tin cream, passes through the high temperature reflow again, is fixed on the circuit board 3 with scolding tin protruding piece.
At this, what deserves to be mentioned is that the housing 21 of shadowing elements 2 can cooperate actual demand, form rectangle or other polygon, and housing 21 and the first side wall 211 are formed in one.
Below, specify a preferred embodiment of electronic installation of the present invention again with Fig. 3.
As shown in Figure 3, electronic installation of the present invention comprises a circuit board 3, a housing 21 and a contact site 22.Wherein circuit board 3 is provided with an electronic component 31 and plural jack 32 at least.And electronic installation is a motherboard or a computer, and circuit board 3 is a printed circuit board (PCB), has at least one electronic component 31 on it, for example chip or heat generation ceramic component etc.
Then referring again to Fig. 3, in present embodiment, contact site 22 is formed on the housing 21 with impact style, and contact site 22 visual actual needs, is formed at an epirelief part or a recessed portion on the housing 21.And contact site 22 is following concavity among Fig. 3.The height of the recessed degree of depth of contact site 22 or last convexity, all visual height of desiring to cover electronic component 31, the degree of depth with the control punching press forms suitable contact site 22 and contacts with electronic component 31.And being fixed in shadowing elements 2 on the circuit board 3, its contact site 22 directly contacts with electronic component 31, to dispel the heat.
Below another preferred embodiment of electronic installation of the present invention will be described with Fig. 4.
As shown in Figure 4, another preferred embodiment of electronic installation of the present invention comprises a housing 21, a contact site 22, a circuit board 3 and base 4.Housing 21 covers electronic component 31.Housing 21 more comprises a first side wall 211, and the first side wall 211 is located on around the electronic component 31.One side of the first side wall 211 has a junction surface 212 at least.In the present embodiment, junction surface 212 comprises a plurality of wave fasteners that distribute along the first side wall 211.
In addition, in present embodiment, base 4 is for being fixed in the framework of circuit board 3, and it also has the function of the Electromagnetic Interference of preventing.Housing 21 is fastened on second sidewall 41 of base 4 with junction surface 212.And the first side wall 211 is around second sidewall 41, and fastens with second sidewall 41.That is except utilizing plug-in unit and surface adhering technology, junction surface 212 also can utilize the wave fastener, carries out buckle with base 4 to combine.
In sum, electronic installation provided by the present invention and shadowing elements thereof, utilize the shadowing elements can the electronic component on the circuit board is wherein ccontaining, not only has the function that prevents Electromagnetic Interference in the prior art, shadowing elements has more a contact site, can directly contact with electronic component, make whole shadowing elements so that become heat conductor, help electronic element radiating, therefore do not need to install again a heat dissipation element, make the volume of shadowing elements to diminish,, more simplified manufacture course of products so not only can save production cost.And shadowing elements utilizes plug-in unit, the sticking dress in surface or the mode of buckle is mounted on the circuit board, contact with electronic component, so the maintenance for electronic component in the future is quite convenient, only need take off shadowing elements gets final product, can be as in the prior art, because heat dissipation element is bonded on the electronic component, and easy-maintaining not, even cause scrapping of monoblock circuit board.In addition, also,, more promoted the effect that prevents Electromagnetic Interference so be difficult for leaking out electromagnetic wave because shadowing elements is formed in one.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the described claim scope its equivalent modifications of carrying out or change.
Claims (10)
1. electronic installation and shadowing elements thereof comprise:
One housing and electronic component, this housing is used to cover electronic component; It is characterized in that:
This housing is provided with a contact site, and this contact site and this housing are one-body molded, and contact site directly contacts with described electronic component, constitutes a kind of tool heat radiation and covers the electronic installation that combines.
2. electronic installation as claimed in claim 1 and shadowing elements thereof, wherein this housing more comprises a first side wall, and this first side wall is located on around this electronic component, and this housing is arranged on the circuit board.
3. electronic installation as claimed in claim 1 and shadowing elements thereof, wherein this contact site is an epirelief part of this housing.
4. electronic installation as claimed in claim 1 and shadowing elements thereof, wherein this contact site is a recessed portion of this housing.
5. electronic installation as claimed in claim 2 and shadowing elements thereof, wherein this housing and this first side wall are one-body molded.
6. electronic installation as claimed in claim 2 and shadowing elements thereof, wherein one of this first side wall side has at least one junction surface.
7. electronic installation as claimed in claim 6 and shadowing elements thereof, wherein this junction surface is a protrusion piece, this protrusion piece is incorporated into this circuit board.
8. electronic installation as claimed in claim 6 and shadowing elements thereof, wherein this circuit board is fixed in by scolding tin in this junction surface.
9. electronic installation as claimed in claim 6 and shadowing elements thereof, wherein this shadowing elements more comprises a base.
10. electronic installation as claimed in claim 9 and shadowing elements thereof, wherein this junction surface comprises a plurality of wave fasteners that distribute along this first side wall, this base more comprises one second sidewall, and this first side wall is around this second sidewall, and fastens with this second sidewall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100019273A CN1314308C (en) | 2004-01-16 | 2004-01-16 | Electronic device and its screening element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100019273A CN1314308C (en) | 2004-01-16 | 2004-01-16 | Electronic device and its screening element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1642401A CN1642401A (en) | 2005-07-20 |
| CN1314308C true CN1314308C (en) | 2007-05-02 |
Family
ID=34867218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100019273A Expired - Lifetime CN1314308C (en) | 2004-01-16 | 2004-01-16 | Electronic device and its screening element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1314308C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI533793B (en) * | 2013-10-25 | 2016-05-11 | 緯創資通股份有限公司 | Electronic device and electromagnetic wave shielding module thereof |
| CN105940775A (en) * | 2014-09-10 | 2016-09-14 | 华为技术有限公司 | Heat-dissipation shielding structure and communication product |
| CN105592677B (en) * | 2014-11-14 | 2019-09-20 | 奇鋐科技股份有限公司 | The masking structure of the anti-electromagnetic interference of electronic component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2485920Y (en) * | 2001-06-25 | 2002-04-10 | 倚天资讯股份有限公司 | Shielding device for reducing interference to circuit board |
| CN1442033A (en) * | 2000-04-21 | 2003-09-10 | 电子设备屏蔽公司 | EMI and RFI shielding for printed circuit boards |
-
2004
- 2004-01-16 CN CNB2004100019273A patent/CN1314308C/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1442033A (en) * | 2000-04-21 | 2003-09-10 | 电子设备屏蔽公司 | EMI and RFI shielding for printed circuit boards |
| CN2485920Y (en) * | 2001-06-25 | 2002-04-10 | 倚天资讯股份有限公司 | Shielding device for reducing interference to circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1642401A (en) | 2005-07-20 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070502 |