CN1313637C - Dynamic film thickness monitoring and controlling system and method - Google Patents
Dynamic film thickness monitoring and controlling system and method Download PDFInfo
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- CN1313637C CN1313637C CNB021193495A CN02119349A CN1313637C CN 1313637 C CN1313637 C CN 1313637C CN B021193495 A CNB021193495 A CN B021193495A CN 02119349 A CN02119349 A CN 02119349A CN 1313637 C CN1313637 C CN 1313637C
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Abstract
The present invention relates to a dynamic film thickness monitoring and controlling system and a method. One or more than one cover plates are arranged between a basal plate and a film plating source and are arranged in a proper mode, and the cover plates have no gaps. A mechanical arm can control the movement of the cover plates, and a film thickness monitoring controller can monitor the thickness of the plated thin films in real time. The cover plates can be regularly moved or adjusted according to the thin film thickness monitoring values obtained by the film thickness monitoring controller, so the film thickness on the basal plate covering the cover plates can achieve a range of design purpose thickness. When the basal plate part which needs to be plated is completely covered, the film plating of the thin film is completed.
Description
Technical field
The present invention relates to the monitoring technique of the film thickness in the coating system, the supervisory system and the method for especially relevant dynamic membrane thickness.
Background technology
In recent years because the height progress of science and technology is also more and more higher for the equally distributed requirement of coating film thickness.For example be used for airplane canopy, the film of antimagnetic wave excitation is single layer oxide nesa coating such as tin indium oxide or indium zinc oxide film at present, and the precision of its requirement is not high, but along with the progress of science and technology, must improve future is accurate multilayer optical film.
See also shown in Figure 1, be an example in the known coating system, the light source assembly 1 (calling light source in the following text) that comprises optical monitoring, optical monitoring test piece 2 (calling the optics test piece in the following text), optical monitoring detector 3 (calling detector in the following text), form 4, substrate 8, the quartz crystal monitoring wafer that form 5, form 6, substrate put tool 7, will plate and put tool 9 (calling quartz wafer in the following text) and evaporation source 10; Wherein the light travel path includes ray 11, radioparent 12 and reflected ray 13; The Coating Materials of evaporation source 10 evaporations can be attached on substrate 8 surfaces, also can be attached on the surface of optics test piece 2, quartz wafer 9 simultaneously; By the difference of the transmissivity of detector 3 detecting optics test pieces 2 and or the difference of reflectivity, or, can monitor the thickness of plated film by the difference of quartz wafer 9 concussion frequencies; Optics test piece 2, quartz wafer 9 are positioned over substrate and put tool 7 middle places.General plated film monitoring can be an optical monitoring, also can be the quartz wafer monitoring, also can the both have; The optical monitoring device comprises that light source, detector and optics test piece form.In order to make film thickness distribution even, substrate is put tool 7 can do rotation (as shown in Figure 2) to the mid-line of this system, also can do planet shape rotation (as shown in Figure 3).When doing the rotation of planet shape, substrate is put tool 7 except mid-line is rotated, but also rotation.Adjust film thickness monitoring test piece (optics test piece and or quartz wafer) or substrate and put the height of tool, make the thickness of film thickness monitoring test piece become certain ratio with the thickness of substrate, can be in process of plating the thickness of film that immediately monitoring plates.It is not extra high optical thin film design that above-mentioned film coating method requires for thickness error applicable to some, as anti-reflective film, and highly reflecting films and various common spectro-film.But require very high optical thin film design for thickness error, the narrow pass filter sheet used of optical-fibre communications for example, its total film number is about 100 layers, and the tolerance error of each layer is about 0.003% film design, and its suitability is unusual difficulty still.If substrate size is very big in addition, for example the 2-3 meter then must have a very large vacuum system if use above-mentioned film coating method, has any problem on making.
United States Patent (USP) the 5th, 156, No. 727, disclose shield that a kind of utilization can change shape and control the design of film thickness, it ties up to the Hou that plated film is finished, and at the thickness of coating system film that externally measured substrate plates, and changes the shield shape according to measuring result and revises the continuous coating film thickness of Hou and distribute.This kind finished Hou in plated film and changed the mode that the shield shape is revised the continuous coating film thickness distribution of Hou again, can't in coating process, carry out correct correction immediately, for some designs than for the higher optical thin film of complexity or accuracy requirement, some difficulty still on making.
Summary of the invention
For improving present coating technique, make it can reach the minimum optical thin film design of coating film thickness error, and propose the present invention.
Main purpose of the present invention utilizes single-point or multiple spot to monitor simultaneously in that a dynamic membrane thickness monitoring system and method is provided, and the supervisory system that relatively moves, and cooperating suitable shield control, accurately carries out the monitoring of film thickness distribution and thickness effectively to reach.
Another object of the present invention is at the film coating method that a tool dynamic membrane thickness monitoring is provided, utilize single-point or multiple spot to monitor simultaneously, and the supervisory system that relatively moves, cooperate suitable shield control again, accurately carry out the monitoring of film thickness distribution and thickness effectively to reach, to obtain best membrane quality.
For achieving the above object, the invention provides a kind of dynamic membrane thickness monitoring system, to be formed by a shield, coating source and a film thickness monitoring device, described shield places between substrate and the coating source, and the film thickness monitoring device places the appropriate location; Utilize the thickness of film thickness monitoring device film that immediately monitoring plates, and, make shield cover the zone of thickness arrival design objective thickness on the substrate according to the mobile gradually shield of film thickness monitoring value that the film thickness monitoring device is obtained.
Wherein the film thickness monitoring device comprises a quartz wafer, and quartz wafer is incorporated into below, shield end.
Wherein be provided with another shield between substrate and the coating source, have one between another shield and the shield at interval, another shield combines another quartz wafer with shield opposed end below.Wherein the film thickness monitoring device comprises a light source and a detector or optical fiber; Light source places the form outside of plated film vacuum system, and the light that makes light source is injected outward on the transparency carrier in the vacuum system by form; Detector or optical fiber are incorporated into shield end below, and detector or optical fiber front end be in conjunction with a small tubes, and utilize detectors measure to penetrate the transmissivity of substrate and film light; Or utilize the usefulness of optic fibre guide light as detecting.Wherein the film thickness monitoring device comprises another detector or optical fiber, and detector or optical fiber place the form outside, and utilizes the reflectivity of another detector detecting substrate reflection ray or utilize the usefulness of another optic fibre guide light as detecting.
Wherein the film thickness monitoring device comprises a light source and a detector or optical fiber;
Light source and detector or optical fiber place the form outside of plated film vacuum system, and the light that makes light source injected outward on the transparency carrier in the vacuum system by form, and utilizes detector to measure the reflectivity of substrate reflection ray or utilize the usefulness of optic fibre guide light as detecting.
Wherein the film thickness monitoring device comprises another detector or optical fiber, and another detector or optical fiber place the form outside, and utilizes another detector measurement to penetrate the transmissivity of substrate and film light, or utilizes the usefulness of another optic fibre guide light as detecting.
Wherein the film thickness monitoring device comprises two optical fiber, and the shield lower end is in conjunction with an optical fiber; Relative position in the opposite side of substrate is established another optical fiber, and the end of two optical fiber becomes configuration relatively; And make the light of monitoring usefulness enter another optical fiber by an optical fiber wherein, come the thickness of monitoring film.
Wherein two optical fiber can be socketed on optical fiber end respectively in tubule.
Wherein the aperture of the structure of shield, shape such as photographic camera can be by the outer substrate that covers toward in.
Wherein coating source is hollow ring or non-hollow crucible or sputter target.
Wherein hollow ring or non-hollow crucible or sputter target and another hollow ring or non-hollow crucible or sputter target place on the pedestal, and via the rotation of controlling pedestal, can select different Coating Materials.
Wherein substrate be hollow the garden cylindricality or can be near the garden cylindricality facing to the rotation of its tunnel shaft, shield, coating source place the vacancy of substrate inboard; Coating source places pedestal top; The film thickness monitoring device comprises a light source and a detector or optical fiber; Light source places pedestal opposite side below, and detector or optical fiber place the position relative with light source, the outside, substrate vacancy.
Wherein substrate be hollow the garden cylindricality or can be near the garden cylindricality facing to the rotation of its tunnel shaft, shield, coating source place the outside in substrate vacancy; Coating source places pedestal top; The film thickness monitoring device comprises a light source and a detector or optical fiber; Light source places pedestal opposite side below, and detector or optical fiber place the position relative with light source, vacancy of substrate inboard.
Wherein pedestal is incorporated on the slide rail; The pedestal top is in conjunction with at least one coating source.
Wherein shield by the plate of at least two long strip shapes near or part stack institute mutually and form.
Wherein an end of plate is provided with the volume hole with socket one spool.
Wherein plate is smooth-going linking to each other in adjacent.
The invention provides a kind of dynamic membrane thickness monitoring method, tie up to and arrange one or more shield between substrate and the coating source; Thickness with film thickness monitoring device film that immediately monitoring is plated; According to the mobile gradually shield of film thickness monitoring value that the film thickness monitoring device is obtained, make shield cover the zone of thickness arrival design objective thickness on the substrate.
One of them above shield approximately becomes to be arranged in parallel, and near or part stack mutually, seamless between the shield.
Described dynamic membrane thickness monitoring method is to utilize mechanical arm or clamping device to control moving of shield.
Wherein the film thickness monitoring device comprises quartz wafer.
Wherein the film thickness monitoring device comprises light source and detector.
Wherein the film thickness monitoring device comprises light source and optical fiber.
The invention provides a kind of film coating method of tool dynamic membrane thickness monitoring, tie up to and arrange one or more shield between substrate and the coating source; Make coating source distribute Coating Materials substrate is carried out plated film; Thickness with film thickness monitoring device film that immediately monitoring is plated; According to the mobile gradually shield of film thickness monitoring value that the film thickness monitoring device is obtained, make shield cover the zone that thickness on the substrate arrives design objective thickness, promptly finish the plated film of this layer film.
Wherein can make substrate in carrying out plated film is rotation, that move or immobilized.
Wherein coating source is one or more or a plurality of different types of combinations.
Wherein can make coating source in carrying out plated film is immobilized or mobile or rotation.
The present invention breaks through the system and method for known film thickness monitoring, and the tool effect is promoted.
Description of drawings
Fig. 1 is known coating system synoptic diagram.
Fig. 2 puts tool rotation synoptic diagram for the substrate of known coating system.
Fig. 3 puts tool planet shape rotation synoptic diagram for the substrate of known coating system.
Fig. 4 is the first embodiment of the invention synoptic diagram.
Fig. 5 is the second embodiment of the invention synoptic diagram.
Fig. 6 is the third embodiment of the invention synoptic diagram.
Fig. 7 is the fourth embodiment of the invention synoptic diagram.
Fig. 8 is the fifth embodiment of the invention synoptic diagram.
Fig. 9 is the sixth embodiment of the invention synoptic diagram.
Figure 10 is the seventh embodiment of the invention synoptic diagram.
Figure 11 is the eighth embodiment of the invention synoptic diagram.
Figure 12 is the ninth embodiment of the invention diagrammatic cross-section.
Figure 13 is a ninth embodiment of the invention other direction diagrammatic cross-section.
Figure 14 is the tenth embodiment of the invention synoptic diagram.
Figure 15 is a shield embodiment synoptic diagram of the present invention.
Figure 16 is the embodiment synoptic diagram of shield combination of the present invention.
Figure 17 is the adjustment embodiment synoptic diagram of shield of the present invention.
Embodiment
The monitoring principle of thickness of the present invention is described as follows.If different positions on substrate in theory, each unit surface all is provided with one group of plated film monitoring device, and have one to design shield device cleverly again, in certain position coating process on the substrate, its thicknesses of layers has shield to hide when arriving design objective.When each position of substrate was all covered by shield by the time, each position thicknesses of layers of this substrate was the target film layer thickness of design, need not need rotary plate to make film thickness distribution even by known as described above coating system.But shield system design difficulty so not only, and also be a quite thing of difficulty at the so many optical monitoring devices of different substrate position installings.General in addition vacuum coating system all is fixed on thin-film material in the system with the coating source that physical method or chemical process change into gas.If but fill part utilize vacuum Bu Rust steel flexible pipe; and suitable in addition protection; or with this gas ionization and utilize the flow direction of high-intensity magnetic field control ionized gas; and suitable external drive; then the position of coating source and Coating Materials molecule mobile direction can be done tridimensional moving or rotation.The relevant geometric position of right Hou proper arrangement substrate and coating source makes film thickness distribution regional for gradually thick or gradually thin to another by a zone.Right Hou is arranged one or more shield, and shield is begun to hide by the zone of thickness.And install in the one or more coating process instant film thickness monitoring device in the shield appropriate positions near, and the arrangement of shield and shape are to be decided by actual film thickness distribution and coating system.Here so-called film thickness monitoring can be quartz wafer monitoring, optics list wavelength monitor, the monitoring of optics multi-wavelength or the long monitoring of optics all-wave.In coating process, arrive target thickness once detect thickness, promptly directly the zone of this thickness arrival target thickness is covered with shield, the moving film thickness monitoring system is to next zone simultaneously, so until whole base plate is all covered, this layer film is that plated film is finished.The method of plated film is unqualified, can be to have ion auxiliary or do not have auxiliary electron beam gun plated film of ion and a hot resistance plated film, the cathodic arc ion plating film, arc coating deposition, physical vapor plated film modes such as anode coating film also can be that thermochemistry steam plated film (ThermalCVD) organometallic chemical vapor plated film (MOCVD) and electricity slurry are strengthened chemical evapn plated film chemical evapn plated films such as (PECVD).Substrate can be rotation, that move or immobilized.Coating source can be one or more or a plurality of different types of combinations, coating source can be an immobilized or mobile in addition, or complies with the design of different coating systems, except moving toward certain specific direction, can also move or rotate up and down, to obtain best membrane quality.Example is dragged in fact by first of dynamic membrane thickness monitoring of the present invention system, as shown in Figure 4, lies in substrate 20 belows and establishes a shield 22, and shield 22 ends are below in conjunction with a quartz wafer 23.Clear among the figure in order to represent, with the film 21 thickness exaggeration expression that is plated on the substrate 20; Wherein arrow 24 is represented average plated film speed, and the length of arrow 24 is represented the speed of plated film speed, and evaporation source does not have picture in the drawings.
Present embodiment system is positioned over suitable seat, shield 22 belows with quartz wafer 23.Can be before plated film, when not placed shield 22 with computer simulation calculating or physical measurement, the relative thickness of film 21 is plated in each place on the substrate 20.Right Hou is when actual plated film, shield 22 is moved toward the slower side (as the left side of Fig. 4) of plated film speed, and by the thickness of the quartz wafer 23 monitoring films that plate 21, when for example the thickness of ordering as A arrives the thickness that requires, shield 22 promptly covers the A point to moving to left, and makes it no longer contact the Coating Materials of evaporation.Because it is poor to have predicted between A, B, the C each point before shield 22 covers the relative thickness of the film that plates 21, so can know the Hou that arrives the thickness that requires at the A point in advance, B point also will plate the how thick thickness that could arrive requirement.When quartz wafer 23 is covering the continuation detecting of A point position, when the coating film thickness value that obtains to increase again be equivalent to the B point to plate again one-tenth-value thickness 1/10 the time, promptly moving shield 22 toward the left side covers the B point, if obtain the coating film thickness value that increases again still too hour, with can be toward the mobile shield 22 in the right slightly to increase plated film speed.So shield 22 covers substrate 20 when substrate 20 film that plates 21 reaches desired thickness, can finish the plated film operation of substrate 20.In the present embodiment, substrate complying with the design of different vacuum coating system can be move or immobilized; Coating source can be one or more or a plurality of different types of combinations, and coating source also is to comply with the design of different vacuum coating system in addition, can be immobilized or does tridimensionally to move or rotate, to obtain the best membrane quality that plated.
Some coating source for example has magnetic field rotation ion direction removing the cathodic arc ion plating film of macroparticle in addition, or the anode coating film that is produced by a large amount of electricity slurries etc., though have many good qualities, the stability of its film thickness distribution is not easy control.Second embodiment of the invention is in order to address the above problem, and as shown in Figure 5, the other side that lies in Fig. 4 shield 22 is added a shield 25 and a quartz wafer 26.So via quartz wafer 23 and quartz wafer 26 as can be known in the plated film speed of this two position, right Hou is controlled the interval d of this two position via mobile shield 22 and shield 25, with the thickness of the film that plated 21 on the control basal plate 20.If this supervisory system is to be used for the continuous coating system, because quartz wafer can lose accuracy when plated film is too thick, so can add that mobilizable cover plate, lid or net are to prolong the serviceable bife of quartz wafer at quartz wafer.In the present embodiment, substrate complying with the design of different vacuum coating system can be move or immobilized; Coating source also is to comply with the design of different vacuum coating system, can be immobilized or does tridimensionally to move or rotate, to obtain the best membrane quality that plated.
If plating is the higher optical thin film of precision, the invention provides the supervisory system of the 3rd embodiment, as shown in Figure 6, lie in substrate 30 belows and be provided with shield 32: detector 33 penetrates the light of substrate 30 and film 31 in order to measurement, and detector 34 is in order to measure the light of substrate 30 reflections; The length of arrow 37 is represented the speed of plated film speed, and evaporation source does not have picture in the drawings.The light source 36 of present embodiment supervisory system is being outside the isolated vacuum system with form 38.The light that makes light source 36 is injected transparency carrier 30 in the vacuum system to carry out optical monitoring by form 38 is outer, does not need to establish in addition the optics test piece.Detector 34 also outside vacuum system, detector 33 then in vacuum system, be incorporated into shield 32 below; In order to protect detector 33 not to be plated to; in conjunction with a small tubes 35,, then enter the interior Coating Materials of pipe at detector 33 front ends by the mouth of pipe if small tubes 35 is enough thin enough long; great majority can be attached to the inwalls of small tubes 35, and non-cohesive at detector 33 the surface and influence the detecting effect.Detector 33 is placed in the vacuum system no doubt more convenient, but the shortcoming of its light focusing is arranged, if the practical situation permission also can be placed on detector 33 vacuum system outside as shown in Figure 1, then having an X-rayed light can be mapped on the detector via form.The aforesaid detector available fiber replaces the usefulness of directing light as detecting.In the present embodiment, substrate complying with the design of different vacuum coating system can be move or immobilized; Coating source can be one or more or a plurality of different types of combinations, and coating source also is to comply with the design of different vacuum coating system in addition, can be immobilized or does tridimensionally to move or rotate, to obtain the best membrane quality that plated.
See also shown in Figure 7, fourth embodiment of the invention is applicable to the continuous coating system, system is placed on the optical monitoring device and the isolated position of coating source, wherein the light that penetrates of light source 41 arrives detectors 47 through form 42, substrate 43, film 44, form 46, and another part light is reflected and arrives detector 40; Shield 45 and moves back with the Hou of advancing of connecting rod 48 control shields 43 between coating source and substrate 43, with division board 49 as isolating Coating Materials to avoid polluting the usefulness of optical monitoring device.The substrate 43 of present embodiment is moving of not stopping, because being do not stop past, substrate 43 moves right, when the optical monitoring device detect film can be when too thick via connecting rod 48 with shield 45 toward moving to left, otherwise then toward moving to right, so can make substrate obtain correct film 44 thickness.In the present embodiment, substrate moves; Coating source can be one or more or a plurality of different types of combinations, and coating source is to comply with the design of different vacuum coating system in addition, can be immobilized or does tridimensionally to move or rotate, to obtain the best membrane quality that plated.
But the supervisory system that the invention described above the 4th embodiment discloses has individual shortcoming, as shown in Figure 7, when film 44 finishes at position D plated film, could detect its thickness but will move to E place, position, there is individual lag time the centre, if monitoring position is moved on to the place ahead of shield 45, as shown in Figure 8, fifth embodiment of the invention has disclosed, light source 41, form 42, form 46, detector 47 are positioned at the place ahead of shield 45, just do not have this shortcoming, but so arrange relatively difficulty.In the present embodiment, substrate moves; Coating source can be one or more or a plurality of different types of combinations, and coating source is to comply with the design of different vacuum coating system in addition, can be immobilized or does tridimensionally to move or rotate, to obtain the best membrane quality that plated.
If when a coating system needed a lot of optical monitoring devices, then each optical monitoring device all needed a form, especially when substrate was not simple shape, arranging so many forms was the thing of part trouble.Can replace the instrument of form when light output, input this moment with optical fiber.As shown in Figure 9, sixth embodiment of the invention lies in shield 55 lower ends in conjunction with an optical fiber 57, and the end of establishing another optical fiber 51, two optical fiber in the relative position of substrate 53 opposite sides becomes configuration relatively; The light of monitoring usefulness enters another optical fiber by an optical fiber wherein, thickness that can monitoring film 54.Optical fiber 51, optical fiber 57 can be socketed on respectively in tubule 52 and tubule 56, not be plated to protection optical fiber; The mean direction and the size of arrow 58 expression plated film molecules among other figure.In the present embodiment, substrate complying with the design of different vacuum coating system can be move or immobilized; Coating source can be one or more or a plurality of different types of combinations, and coating source also is to comply with the design of different vacuum coating system in addition, can be immobilized or does tridimensionally to move or rotate, to obtain the best membrane quality that plated.
For the necessary directly monitoring substrate of the very high plated film design of precision requirement, so can make substrate carry out plated film in the rotation mode.If the relation of arrangement substrate and coating source makes the substrate outer rim film of rotation thicker, then can arrange the aperture of its shape of a shield such as photographic camera, so can use this shield, the shield of this aperture shape dwindles opening the substrate of this part is covered when thickness that thickness arrive to require, and the mobile optical monitoring is to not hiding worn-out part, so all covered up to substrate, then this layer is that plated film is finished.
See also shown in Figure 10ly, seventh embodiment of the invention is detector 71, the form 72 that comprises light source 70, reflection ray, and the film 73 that plate and structure, shape such as camera aperture can be by the outer shields 74 that covers the aperture type of substrate 73 toward in.In order to make film thickness any time all very even, the present invention advises using the cyclic coating source.This kind ring-type coating source can be a hollow, also can be non-hollow.As shown in figure 10, the crucible of usefulness is the electron beam gun of hollow, and the electronics that the electronic emitter 80 of electron beam gun shoots out is got to a hollow ring crucible 77.Can electronics be scanned hereinto on the idle loop shape crucible with magnetic field control, and distribute to obtain preferable film thickness with very fast velocity sweeping.Because multilayer optical film must use two kinds of materials at least, another one hollow ring crucible 75 all places on the pedestal 76 with hollow ring crucible 77 among the figure, via the rotation of control pedestal 76, can select different Coating Materials.Because coating source shown in Figure 10 is the electron beam gun of crucible hollow, the monitoring light by light source 70 penetrates can pass through hollow ring crucible 77, arrives detector 79 through form 78.And this light can also arrive detector 71 by substrate 73 reflections.Dwindle the substrate 73 that covers which zone when detect the shield 74 that is about to the aperture type when thickness arrives the thickness that requires by optical monitoring, the assembly light source 70 of mobile optical monitor, detector 71 and detector 79, to monitor the another one zone of no show required thickness still, till the shield 74 of this aperture type covers whole base plate.
In the seventh embodiment of the present invention shown in Figure 10, substrate 73 might be thinner in the middle of the substrate 73 under the situation without any shield in addition, and the next door is thicker, and also thicker next door is thinner in the middle of the possibility; If middle thin next door is thicker and variation in thickness is not too big or too little, then can uses aforesaid method, or can variation in thickness can be accepted with the fixed shield.If the centre is thicker, the next door is thinner in addition, then can with fixing shield change thickness distribution make in the middle of thin next door thicker, and variation in thickness can be asymptotic, right Hou is carried out plated film with aforesaid method again.Also can design an active covering plate in addition is to cover substrate outward by the centre, and so then substrate is put the tool middle portion active covering plate need be installed.
See also shown in Figure 11, other three kinds of coating sources that eighth embodiment of the invention is used, wherein (a) is hollow sputtering target 81,82; (b) be non-hollow sputtering target 83,84:(c) be non-hollow electron beam gun crucible 85,86.The advantage of hollow coating source be for can measure the monitoring light that penetrates and reflect simultaneously, but obtains difficult.
If substrate is the garden cylindricality of hollow or near garden cylindricality or its part, then can use the design of ninth embodiment of the invention, the person make substrate 90 facing to its tunnel shaft rotation, and different coating sources 92,93,94 places on the pedestal 95 as shown in Figure 12 and Figure 13.This pedestal 95 can slide (as shown in figure 13) on slide rail 96.One not Rust steel flexible pipe 97 extend to the vacuum system outside, its other end connects monitoring light source 98 and pedestal 95, with by supply with in the pipe the required water of coating system.Shield 91 is between substrate 90 and coating source 92,93,94.And monitoring light source 98 places place, pedestal 95 belows.The substrate 90 that this monitoring light passes rotation arrives detector (or optical fiber) 99, and when detector 99 was measured film thickness arrival design objective thickness, whole pedestal 95 was together with shield 91, coating source 92,93,94 and the monitoring light source 98 be moved to the left together, this moment detector 99 also to and then be moved to the left.Move the Far Left of Figure 13 up to whole pedestal, be about to this layer film plated film and finish.
See also shown in Figure 14, the design of tenth embodiment of the invention is a garden cylindricality that aforementioned the 9th embodiment is carried or carry out film thickness monitoring near the outside surface of garden cylindrical substrate 90, and wherein substrate 90 is facing to its tunnel shaft rotation, shield 91, coating source 92,93,94 place substrate 90 outsides; Coating source 92,93,94 places on the pedestal 95; The film thickness monitoring device comprises a light source 98 and a detector or optical fiber 99; Light source 98 places pedestal 95 opposite sides, and detector or optical fiber 99 place the inboard position relative with light source 98 of substrate 90.
The present invention advise one the most general, the method that foregoing various film thickness monitoring modes are actually used in coating system is as follows:
Between substrate and coating source, arrange a group or more long strip shape shield, these shields approximately become to be arranged in parallel, these parallel long strip shape shields must be close to closely or overlap in case Coating Materials pass crack between shield and the shield, and are plating to substrate; Utilize mechanical arm or clamping device to control moving of these long strip shape shields, the shield and the substrate that move will keep equidistant as far as possible; Utilize the combination of aforesaid a kind of film thickness monitoring mode or more than one film thickness monitoring mode again, move this long strip shape shield gradually, cover the zone that thickness arrives design objective thickness, this moment substrate can be move or immobilized; When the substrate portion that needs plated film is covered entirely, promptly finish the plated film of this layer film.
Consult shown in Figure 15ly, when substrate 61 is curved surface, can use the shield 62 that matches with curve form; Shield 62 is abutted against together by plate 621 slices of most long strip shapes to be formed.One end of most plates 621 is provided with volume hole 622 with socket one spool 63, the shape of shield 62 can be socketed on thus spool 63 plate 621 quantity and decide, and turning plate is to the shape of the other side with adjustment shield 62.And coating source 64 can be done tridimensional moving or rotation.
Person shown in Figure 16 utilizes the embodiment of two groups of shields, 65,66 combinations for the present invention.The present invention suggestion when the shape of substrate 67 than complexity or coating source 68 when the molecular amounts of the radiation of all directions is more irregular, can be with two shields in conjunction with two groups of film thickness monitoring modes, wherein one group of film thickness monitoring is the quartz wafer monitoring, and another group film thickness monitoring is optical monitoring or quartz wafer monitoring.Coating source 68 also can be done tridimensional moving or rotation.
The plate that is arranged in parallel of aforementioned shield is all rectangle in addition, and as Figure 15, person shown in Figure 16 so may produce thickness error at the place, sideline of adjacent shield.Because the film thickness distribution is progressive basically, so change the shape of shield into Figure 17 (b) by Figure 17 (a), make the adjacent of each plate be smooth-going linking to each other, so can be reduced in the film error of adjacent plate junction.Same is progressive because film thickness distributes, so it also is progressive that the Hou of advancing of long strip shape shield is moved back, so can arrange an elastica is passed these long strip shape shields, and film thickness monitoring and mechanical arm only are set in the position of key, shown in Figure 17 (b), as long as mechanical arm is set at A, B, C, D point.And needn't each shield all to a monitoring device and mechanical arm should be arranged.
So-called large substrate in front such as planar substrates or garden cylinder substrate also can change large-scale substrate into and put tool, and put a lot of little substrates of arrangement on the tool at this large substrate, cooperate this large substrate to put tool simultaneously and arrange some suitable film thickness monitoring test pieces.When if substrate need be heated, then can only use optical monitoring,, then can put some quartz wafers monitoring of the suitable position arrangement of tool at substrate if when substrate need not heated, and the high frequency of this quartz wafer monitoring can pass through wireless radio transmission, passes to the supervisory circuit of quartz wafer monitoring.And the power supply of quartz wafer can be locked in the vacuum-tight box, because so be difficult to add water cooling, so need could use at the substrate of not heating.A large amount of even in this way little glasses lens platedly also can use the continous way plated film, this is helpful to mass production.
The above record only for utilizing the technology of the present invention in objective embodiment, anyly is familiar with modification, the variation that this skill person uses the present invention to do, and all belongs to the claim that the present invention advocates, and is not limited to
Embodiment discloses.
Claims (30)
1. a dynamic membrane thickness monitoring system is made up of a shield, coating source and a film thickness monitoring device, it is characterized in that described shield places between substrate and the coating source, and the film thickness monitoring device places the appropriate location; Utilize the thickness of film thickness monitoring device film that immediately monitoring plates, and, make shield cover the zone of thickness arrival design objective thickness on the substrate according to the mobile gradually shield of film thickness monitoring value that the film thickness monitoring device is obtained.
2. dynamic membrane thickness monitoring as claimed in claim 1 system is characterized in that wherein the film thickness monitoring device comprises a quartz wafer, and quartz wafer is incorporated into below, shield end.
3. dynamic membrane thickness monitoring as claimed in claim 2 system is characterized in that, wherein is provided with another shield between substrate and the coating source, has one between another shield and the shield at interval, combines another quartz wafer below another shield and the shield opposed end.
4. dynamic membrane thickness monitoring as claimed in claim 1 system is characterized in that wherein the film thickness monitoring device comprises a light source and a detector or optical fiber; Light source places the form outside of plated film vacuum system, and the light that makes light source is injected outward on the transparency carrier in the vacuum system by form; Detector or optical fiber are incorporated into shield end below, and detector or optical fiber front end be in conjunction with a small tubes, and utilize detectors measure to penetrate the transmissivity of substrate and film light; Or utilize the usefulness of optic fibre guide light as detecting.
5. dynamic membrane thickness monitoring as claimed in claim 4 system, it is characterized in that, wherein the film thickness monitoring device comprises another detector or optical fiber, detector or optical fiber place the form outside, and utilize the reflectivity of another detector detecting substrate reflection ray or utilize the usefulness of another optic fibre guide light as detecting.
6. dynamic membrane thickness monitoring as claimed in claim 1 system is characterized in that wherein the film thickness monitoring device comprises a light source and a detector or optical fiber; Light source and detector or optical fiber place the form outside of plated film vacuum system, and the light that makes light source injected outward on the transparency carrier in the vacuum system by form, and utilizes detector to measure the reflectivity of substrate reflection ray or utilize the usefulness of optic fibre guide light as detecting.
7. dynamic membrane thickness monitoring as claimed in claim 6 system, it is characterized in that, wherein the film thickness monitoring device comprises another detector or optical fiber, another detector or optical fiber place the form outside, and utilize another detector measurement to penetrate the transmissivity of substrate and film light, or utilize the usefulness of another optic fibre guide light as detecting.
8. dynamic membrane thickness monitoring as claimed in claim 1 system is characterized in that wherein the film thickness monitoring device comprises two optical fiber, and the shield lower end is in conjunction with an optical fiber; Relative position in the opposite side of substrate is established another optical fiber, and the end of two optical fiber becomes configuration relatively; And make the light of monitoring usefulness enter another optical fiber by an optical fiber wherein, come the thickness of monitoring film.
9. dynamic membrane thickness monitoring as claimed in claim 8 system is characterized in that wherein two optical fiber are socketed on optical fiber end respectively in tubule.
10. dynamic membrane thickness monitoring as claimed in claim 6 system is characterized in that wherein shield has structure, the shape of camera aperture formula, and it is by the outer substrate that covers toward in.
11. dynamic membrane thickness monitoring as claimed in claim 7 system is characterized in that, wherein shield have the camera aperture formula structure, shape, it is by the outer substrate that covers toward in.
12. dynamic membrane thickness monitoring as claimed in claim 10 system is characterized in that wherein coating source is hollow ring or non-hollow crucible or sputter target.
13. dynamic membrane thickness monitoring as claimed in claim 12 system, it is characterized in that, wherein hollow ring or non-hollow crucible or sputter target and another hollow ring or non-hollow crucible or sputter target place on the pedestal, and via the rotation of controlling pedestal, can select different Coating Materials.
14. dynamic membrane thickness monitoring as claimed in claim 1 system is characterized in that, wherein substrate be hollow the garden cylindricality or can be near the garden cylindricality facing to its tunnel shaft rotation, shield, coating source place the vacancy of substrate inboard; Coating source places pedestal top; The film thickness monitoring device comprises a light source and a detector or optical fiber; Light source places pedestal opposite side below, and detector or optical fiber place the position relative with light source, the outside in substrate vacancy.
15. dynamic membrane thickness monitoring as claimed in claim 1 system is characterized in that, wherein substrate be hollow the garden cylindricality or can be near the garden cylindricality facing to its tunnel shaft rotation, shield, coating source place the outside in substrate vacancy; Coating source places pedestal top; The film thickness monitoring device comprises a light source and a detector or optical fiber; Light source places pedestal opposite side below, and detector or optical fiber place the position relative with light source, vacancy of substrate inboard.
16. dynamic membrane thickness monitoring as claimed in claim 14 system is characterized in that wherein pedestal is incorporated on the slide rail; The pedestal top is in conjunction with at least one coating source.
17. dynamic membrane thickness monitoring as claimed in claim 15 system is characterized in that wherein pedestal is incorporated on the slide rail; The pedestal top is in conjunction with at least one coating source.
18. dynamic membrane thickness monitoring as claimed in claim 1 system is characterized in that,
Wherein shield by the plate of at least two long strip shapes near or part stack institute mutually and form.
19. dynamic membrane thickness monitoring as claimed in claim 18 system is characterized in that,
Wherein an end of plate is provided with the volume hole with socket one spool.
20, dynamic membrane thickness monitoring as claimed in claim 18 system is characterized in that,
Wherein plate is smooth-going linking to each other in adjacent.
21. a dynamic membrane thickness monitoring method is characterized in that, ties up to and arranges one or more shield between substrate and the coating source; Thickness with film thickness monitoring device film that immediately monitoring is plated; According to the mobile gradually shield of film thickness monitoring value that the film thickness monitoring device is obtained, make shield cover the zone of thickness arrival design objective thickness on the substrate.
22. dynamic membrane thickness monitoring method as claimed in claim 21 is characterized in that, one of them above shield becomes to be arranged in parallel, and near or part stack mutually, seamless between the shield.
23. dynamic membrane thickness monitoring method as claimed in claim 21 is characterized in that,
System utilizes mechanical arm or clamping device to control moving of shield.
24. dynamic membrane thickness monitoring method as claimed in claim 21 is characterized in that,
Wherein the film thickness monitoring device comprises quartz wafer.
25. dynamic membrane thickness monitoring method as claimed in claim 21 is characterized in that,
Wherein the film thickness monitoring device comprises light source and detector.
26. dynamic membrane thickness monitoring method as claimed in claim 21 is characterized in that wherein the film thickness monitoring device comprises light source and optical fiber.
27. the film coating method of a tool dynamic membrane thickness monitoring is characterized in that,
Tie up to and arrange one or more shield between substrate and the coating source; Make coating source distribute Coating Materials substrate is carried out plated film; Thickness with film thickness monitoring device film that immediately monitoring is plated; According to the mobile gradually shield of film thickness monitoring value that the film thickness monitoring device is obtained, make shield cover the zone that thickness on the substrate arrives design objective thickness, promptly finish the plated film of this layer film.
28. dynamic membrane thickness monitoring method as claimed in claim 27 is characterized in that, wherein substrate is rotation, that move or immobilized in carrying out plated film.
29. dynamic membrane thickness monitoring method as claimed in claim 27 is characterized in that, wherein coating source is one or more or a plurality of different types of combinations.
30. dynamic membrane thickness monitoring method as claimed in claim 27 is characterized in that, wherein coating source is immobilized or mobile or rotation in carrying out plated film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021193495A CN1313637C (en) | 2002-05-13 | 2002-05-13 | Dynamic film thickness monitoring and controlling system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021193495A CN1313637C (en) | 2002-05-13 | 2002-05-13 | Dynamic film thickness monitoring and controlling system and method |
Publications (2)
| Publication Number | Publication Date |
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| CN1458297A CN1458297A (en) | 2003-11-26 |
| CN1313637C true CN1313637C (en) | 2007-05-02 |
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| CNB021193495A Expired - Fee Related CN1313637C (en) | 2002-05-13 | 2002-05-13 | Dynamic film thickness monitoring and controlling system and method |
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Cited By (1)
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|---|---|---|---|---|
| US10147654B2 (en) | 2016-10-20 | 2018-12-04 | Nxp Usa, Inc. | Package materials monitor and method therefor |
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| CN102312223A (en) * | 2010-06-30 | 2012-01-11 | 鸿富锦精密工业（深圳）有限公司 | Coating corrector plate and coating device comprising same |
| JP6471159B2 (en) * | 2014-07-02 | 2019-02-13 | 株式会社アルバック | Rotation mechanism and film thickness monitor equipped with this rotation mechanism |
| US10100410B2 (en) | 2016-08-05 | 2018-10-16 | Industrial Technology Research Institute | Film thickness monitoring system and method using the same |
| CN107557750A (en) * | 2017-08-22 | 2018-01-09 | 中国科学院长春光学精密机械与物理研究所 | Plated film real-time closed-loop control system and its control method |
| CN109442746A (en) * | 2018-08-30 | 2019-03-08 | 芜湖鸣人热能设备有限公司 | A kind of boiler that can monitor scale forming |
| CN110865594A (en) * | 2019-11-18 | 2020-03-06 | 浙江长兴昊隆电子科技有限公司 | Production monitoring method and device for high-performance metallized film |
| CN110670044B (en) * | 2019-11-27 | 2021-10-01 | 昆山国显光电有限公司 | Film formation thickness detection device, detection method and evaporation equipment |
| CN111235540B (en) * | 2020-03-18 | 2024-03-29 | 杭州朗旭新材料科技有限公司 | Magnetron sputtering equipment and magnetron sputtering method |
| CN113755806A (en) * | 2021-09-10 | 2021-12-07 | 四川旭虹光电科技有限公司 | Reflective magnetron sputtering coating thickness monitoring device, coating machine and method |
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