CN1299226A - Capacitor type microphone insulation ring and its fixation method - Google Patents

Capacitor type microphone insulation ring and its fixation method Download PDF

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Publication number
CN1299226A
CN1299226A CN00121134A CN00121134A CN1299226A CN 1299226 A CN1299226 A CN 1299226A CN 00121134 A CN00121134 A CN 00121134A CN 00121134 A CN00121134 A CN 00121134A CN 1299226 A CN1299226 A CN 1299226A
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CN
China
Prior art keywords
ring
diaphragm
base ring
dead ring
dead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN00121134A
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Chinese (zh)
Inventor
金钟圭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WONI COMMUNICATIONS CO Ltd
Original Assignee
WONI COMMUNICATIONS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WONI COMMUNICATIONS CO Ltd filed Critical WONI COMMUNICATIONS CO Ltd
Publication of CN1299226A publication Critical patent/CN1299226A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

The present invention relates to an insulation ring capable of making a shell, an integrated base ring and a diaphragm be insulated electrically, and the fixing method thereof. The present invention relates to an insulation ring for a condenser microphone, wherein the insulation ring inside of a condenser microphone is made of insulating material and surrounds the circumference of the base ring so as to make the shell, an integrated base ring and a diaphragm be insulated electrically. A housing with a sound wave inlet hold is provided with sequentially stacked a spacer, a diaphragm, a base ring, a field effect transistor and a printed circuit board. The gate circuit of the field effect transistor, the special molded part of the printed circuit board and the base ring are connected with each other by link connection, while the source electrode and the drain electrode of the field effect transistor and the circuit are connected respectively to the special molded part arranged on the opposite sides of the printed circuit board. Thus, the present invention can effectively isolated the housing, the integrated base ring and the diaphragm, and can simplify the process of fixing the insulation ring to the integrated base ring and the diaphragm.

Description

The dead ring of Electret Condencer Microphone and fixing means thereof
The present invention relates to a kind of dead ring of Electret Condencer Microphone, more particularly, relate to a kind of Electret Condencer Microphone dead ring and fixing means thereof, wherein this ring is placed in the electric capacity variable of sound wave generation is transformed in the Electret Condencer Microphone of the signal of telecommunication, housing and integrated base ring and diaphragm are insulated on circuit, therefore make this Electret Condencer Microphone of manufacturing become easy.
Shown in Fig. 1 and 2, traditional Electret Condencer Microphone contains: its both sides be printed as the ad hoc type shape printed circuit board (PCB) 101, the voltage quantities that causes by the electric capacity variable be transformed into the field-effect transistor (FET) 102 of the signal of telecommunication, base ring 103 that field-effect transistor 102 and diaphragm 104 are coupled together, the packing ring 105 that separates by the diaphragm 104 of the sound wave exciting of input, housing 106 and diaphragm 104, and the housing 106 that is drilled with acoustic duct hand-hole 107.
By the special type part of making on printed circuit board (PCB) 101 end faces the gate circuit of diaphragm 104 and base ring 103 and field-effect transistor 102 is coupled together on circuit; And by making the special type part on printed circuit board (PCB) 101 bottom surfaces, the source electrode of housing 106 and field-effect transistor 102 is coupled together on circuit.Certainly, diaphragm 104 and base ring 103 insulate on circuit.
About this point, shown in Fig. 1 and 2, before the packing ring 105 of packing into, in housing 106, installed insulating barrier 108,118, other element of packing into then.Yet, in this case, owing to insulating barrier 108,118 not only is difficult to accurately assemble with housing 106, and assembling a lot of times of needs, its shortcoming is the manufacturing time of having spun out Electret Condencer Microphone.
The purpose of this invention is to provide a kind of Electret Condencer Microphone dead ring and fixing means thereof, it can not only effectively make housing and integrated base ring and diaphragm isolated, but also simplified dead ring is fixed on technology on the circumference of integrated base ring and diaphragm.
In order to reach above-mentioned purpose of the present invention, a kind of Electret Condencer Microphone dead ring is provided, the dead ring that wherein is placed in the Electret Condencer Microphone is by on the circumference insulating material manufacturing and that be enclosed in base ring, so that the housing at this place and integrated base ring and diaphragm insulate on circuit, be drilled with in the housing of acoustic duct hand-hole and sequentially be stacked with: packing ring, diaphragm, base ring, field-effect transistor (field-effect transistor) and printed circuit board (PCB), the door (circuit) of field-effect transistor is connected on circuit with the special type part and the base ring of printed circuit board (PCB) simultaneously, and the source electrode of field-effect transistor and drain electrode are connected on circuit with the special type part of making in the relative both sides of printed circuit board (PCB) respectively.
Best is that the vertical thickness of dead ring is the 75-85% of integrated base ring and diaphragm thickness.Dead ring is made by contractile material under predetermined temperature, and is fixed on the central authorities of integrated base ring and diaphragm.
The method of fixed capacity formula microphone dead ring is: after integrated base ring and diaphragm being inserted in the dead ring with predetermined diameter, the heating dead ring makes its contraction, so that dead ring is fixed on the circumference of integrated base ring and diaphragm, and kept between housing and the base ring and the insulation between housing and the diaphragm.
Best is that dead ring only is fixed on the middle body of the 75-85% of the circumferential thickness that is equivalent to integrated base ring and diaphragm.
Herein, dead ring is made by contractile material when 70 °-90 ℃ of the predetermined temperatures.
According to Electret Condencer Microphone dead ring of the present invention, can not only separate housing and integrated base ring and diaphragm effectively, but also simplified dead ring is fixed on technology on the circumference of integrated base ring and diaphragm.
Further describe the present invention below in conjunction with accompanying drawing.
Fig. 1 is the cutaway view of the Electret Condencer Microphone example of expression prior art;
Fig. 2 is the cutaway view of another example of Electret Condencer Microphone of expression prior art;
Fig. 3 is the exploded perspective view according to Electret Condencer Microphone of the present invention;
Fig. 4 is the cutaway view according to Electret Condencer Microphone of the present invention;
Fig. 5 a and 5b are respectively vertical view and the front views that is applied to according to the printed circuit board (PCB) in the Electret Condencer Microphone of the present invention; And
Fig. 6 is the end view of showing according to the critical piece of Electret Condencer Microphone of the present invention.
Preferred embodiment with reference to graphic extension in the accompanying drawings comes more detailed description the present invention.
Shown in Fig. 3 and 4, at first, the bottom surface of the housing 50 of acoustic duct hand-hole 51 is arranged is what to open wide fully to the centre drill on its top among the present invention.In other words, housing 50 is columniform, and packing ring 40, diaphragm 30, base ring 20 are arranged within it, and on have a field-effect transistor 13 printed circuit board (PCB) 10 sequentially stack subsequently.In other words, be provided with the ring washer 40 that insulating material is made at the inner top of housing 50, order has stacked diaphragm 30 (integrated diaphragm 30), base ring 20 and dead ring 60 then.
Interconnect communicatively on diaphragm 30 and base ring 20 circuit, and on the circumference of integrated diaphragm 30 and base ring 20, be fixed with dead ring 60 made of insulating material.Particularly, dead ring 60 is made by contractile material when predetermined temperature (70 °-90 ℃), and diameter originally is greater than the diameter of integrated diaphragm 30 and base ring 20.But after integrated diaphragm 30 and base ring 20 were put into dead ring 60, by giving dead ring 60 heating, dead ring 60 just was fixed on the middle body of integrated diaphragm 30 and base ring 20 circumference when it shrinks.
In this case, be fixed on the insulating barrier 60 of the circumferential center of integrated diaphragm 30 and base ring 20, as shown in Figure 4, be fixed on the middle body of the circumferential thickness 75-85% that is equivalent to integrated base ring and diaphragm, so that the special type of base ring 20 and printed circuit board (PCB) 10 part accurately contact, and housing 50 and integrated diaphragm 30 and base ring 20 are insulated.
Secondly, the printed circuit board (PCB) 10 with field-effect transistor 13 is contained in the housing 50, and the inside bending in bottom of last housing 50 is with retaining washer 40, diaphragm 30, base ring 20 and printed circuit board (PCB) 10.
Fig. 5 a is the vertical view of printed circuit board (PCB) 10, is formed with the special type part Pg of preset width on the circumference of circuit board 10, and it is connected on circuit with the gate circuit of field-effect transistor 13 and the base ring 20 of covering.At the center of printed circuit board (PCB) 10 and be drilled with vertical through hole 11 and 12 on the circumference of its center certain distance, hole 11 and 12 are passed in the source electrode of field-effect transistor 13 and drain electrode.
Fig. 5 b is the front view of printed circuit board (PCB) 10, is formed with special type part Pd in the central authorities of circuit board 10, and it is connected on circuit with through hole 11, and has made special type part Ps on the circumference of circuit board 10, and it is connected on circuit with through hole 12 and housing 50.
Secondly, will the effect of this kind of the present invention structure be described.
The sound wave that diaphragm 30 imports along with the acoustic duct hand-hole 51 by housing 50 and vibrating, sound wave causes the variation of distance between diaphragm 30 and the housing 50, so the capacitance between diaphragm 30 and the housing 50 is changed.
Therefore, along with the variation of sound wave, the voltage of base ring 20 is input to the gate circuit of field-effect transistor 13, changes according to sound wave and is exaggerated so flow to the electric current of drain electrode from the source electrode of field-effect transistor 13.
Therefore, this microphone converts the sound wave that imports from acoustic duct hand-hole 51 signal of telecommunication to and amplifies this signal of telecommunication.
When describing a certain preferred embodiment of the present invention in detail with reference to certain preferred embodiment, the technical staff understands when not departing from as the present invention that claim defined of appendix spirit and target, can carry out multiple change on form therein and the details.

Claims (9)

1. the dead ring of an Electret Condencer Microphone, insert in the said microphone, be drilled with on it in housing of acoustic duct hand-hole and sequentially stacked packing ring, diaphragm, base ring, field-effect transistor (FET) and printed circuit board (PCB), the gate circuit of said field-effect transistor is connected on circuit with the special type part and the said base ring of said printed circuit board (PCB) simultaneously, and the source electrode of said field-effect transistor and drain electrode partly are connected with the special type of being located at the relative both sides of said printed circuit board (PCB) respectively on circuit;
It is characterized in that the said dead ring of being made by insulating material is enclosed on the circumference of base ring, so that housing and integrated base ring and diaphragm insulate on circuit.
2. dead ring as claimed in claim 1 is characterized in that: the vertical thickness of this dead ring is the 75-85% of the thickness of said integrated base ring and diaphragm.
3. dead ring as claimed in claim 1 is characterized in that: said dead ring is fixed on the central authorities of said integrated base ring and diaphragm.
4. dead ring as claimed in claim 1 is characterized in that: said dead ring is made by contractile material under predetermined temperature.
5. the method for a fixed capacity formula microphone dead ring keeps between housing and the base ring and the insulation between housing and the diaphragm, and said method comprises:
Said integrated base ring and diaphragm are put into the said dead ring with predetermined diameter; And
The heating of said dead ring and it is shunk, so that it is fixed on the circumference of said integrated base ring and diaphragm.
6. the method for fixed insulation ring as claimed in claim 5, said method comprise the middle body that only said dead ring is fixed on the 75-85% circumferential thickness that is equivalent to said integrated base ring and diaphragm.
7. the method for fixed insulation ring as claimed in claim 5, wherein said dead ring is made by contractile material under predetermined temperature.
8. the method for fixed insulation ring as claimed in claim 5, wherein said dead ring during by 70 °-90 ℃ of temperature contractile material make.
9. the method for fixed insulation ring as claimed in claim 7, wherein said dead ring during by 70 °-90 ℃ of temperature contractile material make.
CN00121134A 1999-12-09 2000-07-27 Capacitor type microphone insulation ring and its fixation method Pending CN1299226A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR19990056164 1999-12-09
KR1019990056164A KR20000012516A (en) 1999-12-09 1999-12-09 Insulation ring and its fixed methods of condenser microphone

Publications (1)

Publication Number Publication Date
CN1299226A true CN1299226A (en) 2001-06-13

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ID=19624557

Family Applications (1)

Application Number Title Priority Date Filing Date
CN00121134A Pending CN1299226A (en) 1999-12-09 2000-07-27 Capacitor type microphone insulation ring and its fixation method

Country Status (4)

Country Link
EP (1) EP1107643A2 (en)
JP (1) JP2001186594A (en)
KR (1) KR20000012516A (en)
CN (1) CN1299226A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010081347A1 (en) * 2009-01-19 2010-07-22 歌尔声学股份有限公司 Insulating plate for a condenser microphone and a condenser microphone for using the insulating plate
CN102118674A (en) * 2010-01-05 2011-07-06 歌尔声学股份有限公司 MEMS microphone and encapsulation method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100508915B1 (en) * 2002-10-10 2005-08-19 송기영 structure and manufacturing methode of condenser microphone
KR20050049181A (en) * 2003-11-21 2005-05-25 주식회사 비에스이 Smd possible directional condenser microphone

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010081347A1 (en) * 2009-01-19 2010-07-22 歌尔声学股份有限公司 Insulating plate for a condenser microphone and a condenser microphone for using the insulating plate
CN102118674A (en) * 2010-01-05 2011-07-06 歌尔声学股份有限公司 MEMS microphone and encapsulation method thereof
CN102118674B (en) * 2010-01-05 2016-02-10 歌尔声学股份有限公司 A kind of MEMS microphone and method for packing thereof

Also Published As

Publication number Publication date
EP1107643A2 (en) 2001-06-13
KR20000012516A (en) 2000-03-06
JP2001186594A (en) 2001-07-06

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