CN1292493A - 用于热电偶型温度计的已标定的等温组件 - Google Patents
用于热电偶型温度计的已标定的等温组件 Download PDFInfo
- Publication number
- CN1292493A CN1292493A CN00128861XA CN00128861A CN1292493A CN 1292493 A CN1292493 A CN 1292493A CN 00128861X A CN00128861X A CN 00128861XA CN 00128861 A CN00128861 A CN 00128861A CN 1292493 A CN1292493 A CN 1292493A
- Authority
- CN
- China
- Prior art keywords
- temperature
- isothermal assembly
- isothermal
- demarcated
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K15/00—Testing or calibrating of thermometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/10—Arrangements for compensating for auxiliary variables, e.g. length of lead
- G01K7/12—Arrangements with respect to the cold junction, e.g. preventing influence of temperature of surrounding air
- G01K7/13—Circuits for cold-junction compensation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
提供一种用于热电偶型温度计的已标定的等温组件,可以免除在仪表装配后的标定工序。在特殊的印刷电路板上制成小型等温块,其包括有足够热容量和优良热传导性的厚金属板。温度传感器固定在印刷电路板上的热电偶基准结点以便探测基准结点的温度。已标定的等温组件还包括一个用于温度传感器的电流源,和保存有温度传感器标定数据的存储器。
Description
本发明总的来讲涉及热电偶型温度计,具体来说涉及提供一种用于热电偶型温度计的已标定的等温组件的方法和装置。
如现有技术中众所周知的那样,热电偶是由在两点连结的两种不同金属导体组成,由于热电效应,能够在两个连结点间产生电压。不同类型的金属连结到一起产生不同的热电效应,所以多年来,市场上提供不同类型的热电偶用于测量不同的温度范围。热电偶的电压与温度的关系是非线性的,各种不同类型的热电偶都有准确的电压温度对应表。取得该表是通过将两个连结点之一作为基准点并将其置于冰槽中保证基准点温度处于冰点,同时测量另一连结点在某温度范围的电压。常用的热电偶类型有J型(铁-康铜),K型(镍铬-镍铝)和T型(铜-康铜)。这些热电偶设置一自由端用作温度测量的测量结点,一正极端连接到测量仪表形成基准结点。
热电偶型温度计是置入热电偶的数字电子仪表。这类仪表通常可以选择热电偶的类型,包括测量热电偶电压的电路。传统的热电偶型温度计还包括显示装置,比如液晶显示器(LCD),其读出的温度用数字表示。
供热电偶***仪表的界面对***是很关键的,因为它是热电偶的基准结点。美国专利No.4,718,777叙述了一种有足够大热容量和高热传导性的高铝陶瓷构成的等温单元,可用来保持安装在等温单元内的热电偶接头副***仪表位置的两导电接头端子片的温度稳定和完全相同。具有近似线性的温度等效电压的温度传感器安装在等温单元的两接头端片之间,测量等温单元的温度并对基准结点出现的误差在输出读数上给以补偿。这个功能的实现是通过仪表控制器从检查表上查找相应于基准结点测得温度的误差消除电压,再将其从热电偶产生的电压中减去。
过去,标定基准结点的方法是将热电偶置于温度恒定在某温度的保温槽如室温,除电子温度计外还设置有水银温度计。在水银温度计稳定后,标定人员会在观察电子温度计显示的同时,通过调整电位计来调节温度传感器的偏压电流,使显示值与水银温度计的读数一致。因为通常由一种温度敏感晶体管构成的温度传感器,在某温度测量范围具有近似线性的温度等效电压特性,因此在一定的电压-温度范围,传感器的工作特性是线性的。其线性关系可以在检查表上得到。这样就可以只一个温度上进行标定。也就是说,由于温度敏感晶体管的基极-发射极结的温度等效电压是近似线性的,并由制造商规定了特定的线性误差,可认为一旦对热电偶温度范围内任一稳定的温度进行了标定,就已认为对全部温度标定了基准结点。
现有技术的标定方法的缺点是标定时间长和单调枯燥,而且必须在仪表最后装配完成后才能进行。都要分别对每个仪表进行标定,所以在制造过程中标定时间是累加的,导致制作过程缓慢耗时和劳动强度大。
另外的缺点是,即使出自同一厂家,温度传感器的误差每台各不相同,测试仪表的误差特性可能还不如传感器制造商公布的传感器误差特性。
需要提供一种等温的热电偶界面组件和基准结点,其可在安装到仪表之前进行标定,以便避免在仪表装配后进行枯燥耗时的标定,并可以不需要进行温度标定而现场更换界面组件。为了同时进行多个等温界面组件标定,希望该组件的实际尺寸能够尽可能小,同时还要能提供足够的热容量和高的热传导性。
按照本发明,提供了一种安装有已标定的等温界面组件的热电偶型温度计。该组件提供了热电偶的基准结点,并使装配温度计不需要后续耗费时间的温度标定步骤。已标定的等温组件还可以不经温度标定而进行现场更换。
等温组件由安装了小型等温单元的特殊印刷电路板构成的基板组成。等温单元包括厚金属板,例如铜或铝板,有足够的热容量和高的热传导性。一对导电端子片并置于印刷电路板比较薄的绝缘层表面上,用来与热电偶的插片摩擦接合。适合使用具有线性温度等效电压特性的双极晶体管的温度传感器固定在印刷电路板表面两导电端子片之间。固定在基板上的还有保存有温度传感器标定数据的存储装置。所保存的标定数据涉及温度敏感晶体管的电压-温度特征曲线上一点或多点的数值和曲线的斜率,使得在工作状态下所测得的传感器电压能够直接转换成基准结点的温度。用于温度传感器的电流源最好也固定在基板上。
因为电子器件不能投入冰槽进行标定,按照优选的实施例,标定是在热空气柱中进行的,且多个部件可以同时放入其中,将已知温度的空气流过该组件,使该组件达到所希望的温度。在优选的实施例中,相关的控制器测量在两个温度下的温度敏感晶体管的基极-发射极结间的电压,将有关这些温度和电压值的数据作为标定数据储存在前面提到的存储装置中。作为另一种选择,如果温度敏感晶体管的特性曲线斜率已知或生产商规定了误差很小的斜率时,则只需要测量一点的温度,该数据与斜率的数据可作为标定数据储存起来。但这另一种选择通常意味着需要价格更高的传感器晶体管。无论在哪种情况下,然后,该标定数据可以将传感器的动态工作范围内的任何传感器电压直接地转换为基准结点温度。
在已标定的等温组件安装于仪表后,且仪表在工作时,温度传感器会在仪表规定的工作范围探测该组件的温度。当进行温度测量时温度计内的处理电路读出温度敏感晶体管的输出电压并从存储装置得到标定数据,以便确定出基准结点的温度。一旦知道了基准结点的温度,热电偶的测量结点的温度便能够使用传统的技术来确定。然后,将所测得的温度作为读数显示在显示器上。
本发明的一个目的是提供一种新颖的用于热电偶型温度计的已标定的等温组件。
本发明的另一个目的是提供一种用于热电偶型温度计的已标定的等温组件,可在组装温度计或更换等温组件后免除进行标定步骤。
本发明还有一个目的是提供一种用于热电偶型温度计的小型等温单元。
通过参考附图阅读本说明书后,将使本领域的普通技术人员清楚了解本发明的其它目的,特征和优点。
图1是协助了解本发明的已标定的等温组件的示意图;
图2是温度敏感晶体管的实例性线性温度等效电压的曲线图;
图3是根据本发明具代表性的安装有已标定的等温组件的热电偶型温度计的简图;
图4示出根据本发明已标定的等温组件;和
图5示出等温组件带有热电偶在***位置的局部截面。
参考图1,该图所示是用于热电偶型温度计的已标定的等温组件10的示意图,以便协助了解本发明。热电偶12和伏特计(VM)14在结点16和18联结。热电偶12包括联结于热电偶自由端的测量结点24的由不同金属A和B制成的金属线20和22。金属A和B由热电偶的类型确定。将伏特计14分别连接到结点16和18的导线26和28适宜用铜(Cu)制造。
如现有技术中众所周知的那样,只要结点16和18保持在相同的温度下,这是等温的定义,铜线-A和铜线-B连结点处产生的电压串联且彼此反相。其效果是跨结点16和18的电压VR如同其由处于基准结点温度下的导线A和B的结点产生的电压,因此这两个结点16和18成为热电偶12实际上的基准结点。一旦知道实际基准结点16-18的温度,便可利用传统的技术,如使用检查表或代替检查表的曲线拟合计算,就可以确定热电偶类型已知的结点24的温度T。
位于等温组件10上的结点16和18之间有温度敏感晶体管30,其可适宜地采用市场上可买到的型号2N3904。如将可以看到的那样,按照优选的实施例,可以使用比较便宜的元件进行标定。
在等温组件10上最好也可包括为温度敏感晶体管30提供工作偏流的电流源32和储存标定数据的存储器34。电流源32可以是许多传统的电流源这的任何一种。在优选的实施例中,电流源是一种能够从市场上购买到的精密电阻芯片,其可在预先确定的基准电压VREF下工作,在优选的实施例中,该基准电压是+1.23伏。其与用于温度计的模拟-数字转换器的基准电压相同。因为不同的电流源工作特性上有差异,它们产生的电流可能彼此间有稍许不同,电流源32最好设置于等温组件10上,以保证在温度计工作时总是能提供相同强度的电流给晶体管30。如果电流源32是高精度的电流源,不同电流源的的精度误差很小,这种电流源可以放置在等温组件之外。
存储器34可合适地为可电子改写的只读存储器,如CMOSAT25010 EAROM。一旦完成标定,像下面将讨论的那样,等温组件10为一个完整的单元,其包括热电偶的基准结、带有自己电流源32的温度敏感晶体管30和保存有与等温组件10有关的标定数据的存储器34。这使等温组件10在安装到仪表之前就可以进行标定,这样的话,其可以用作替换件或放到另一个温度计上而无须进行再次标定。
图2示出了温度敏感晶体管30的基极-发射极极电压(Vbe)的电压-温度特性曲线的实例。如前所述,由于晶体管30采用了比较便宜的元件,不同晶体管的线性特性曲线的斜率可能彼此稍许不同。因此,按照本发明的优选的实施例,等温组件10的标定可以通过测量两个不同温度下的温度敏感晶体管的Vbe或图2所示的线性特征曲线的两点P1和P2得到曲线斜率来进行。
在图2所示的实例中,首先使整个等温组件10达到第一个预先确定的温度,比如35℃,并测量Vbe。假设在35℃时,在P1点第一个Vbe测量值是573.6毫伏。接下来,使整个等温组件10达到第二个预先确定的温度,在本实例中为15℃,在15℃时,在P2点的Vbe测量值是617.6毫伏。现在P1和P2点的标定数据已经知道,可以轻易地求出连接这两点直线的斜率为-2.2毫伏/℃。在中间温度下,如在23℃时,则电压值将是600毫伏。从这个例子可以看出点P1和P2的电压和温度值可作为标定数据储存在存储器中,或已知一个点和直线斜率也可作为标定数据储存在存储器中。在优选的实施例中,储存的标定值是在已知中间温度如23℃测得的电压Vbe和直线的斜率,如前例中的-2.2毫伏/℃。由此标定数据,有温度敏感晶体管30在其动态工作范围产生的任何电压可以快速的直接转换成基准结点的温度。
应当在此指出,作为另外可供选择的实施例,如果使用的温度敏感晶体管的线性电压-温度Vbe曲线已知或由生产商以一定程度的可靠性规定,可以通过在一预先确定的温度如23℃下测量Vbe,而确定在已知线性的特征曲线上的一个点的数据,并将其与已知的斜率信息作为标定数据存入存储器34。
然而,按照所选实施例,采用上面所叙述的两点标定测定方法,可免除那种需要采用经选择的元件或昂贵的元件。
图3示意地示出具代表性的热电偶型温度计50,该温度计50有图1中所叙述的已标定的等温组件。该温度计50还包括处理电路54,数字键盘56,和显示器58。处理电路54可包括传统数字伏特计的处理电路,还适宜地包括模拟-数字转换器和微处理器。处理电路54还可包括传统的检查表或含有曲线拟合算法的固件,以便确定待用于温度计的各种类型热电偶测量出的温度。数字键盘56允许使用者选择热电偶的类型,温度***,工作模式,和测试指令。显示器58可适合地用液晶显示器(LCD),以便用字母和数字字符显示测出的温度。
等温组件10包括一对导电端子片60和62,在其间安装有温度敏感晶体管30。图3中示出了带有插头68的典型的热电偶66,该插头68具有一对插片70和72就位插在等温组件10上,以便协帮了解热电偶66和温度计50的关系。端子片60和62分别连接热电偶的插片70和72形成如图1所叙述的基准结点16-18,那样便完成热电偶66的连接,使测量结点74的温度可由温度计50测出。等温组件最关键的地方在于保证端子片60和62,以及温度敏感晶体管30都处于相同的温度,正如本领域中众所周知的那样,这是基准结点。
工作时,处理电路54从等温组件10获得基极-发射板结电压Vbe值,并利用该值来确定基准结点的温度,该温度还用来依照传统的检查表或数学计算,最后确定已知的热电偶类型在测量结点74的温度T。温度T的测量值在显示器58上显示。
图4更详细地显示等温组件10。等温单元80作为等温组件的基板,并在特殊的印刷电路板上制成。其包括顶部绝缘层82和底部绝缘层84,以及有很好热传导性能的金属板86,如铜或铝板。绝缘层82和84的厚度比较薄,例如只有0.254到0.381毫米(0.010到0.015英寸),而金属板86则比较厚,例如有1.016到3.175毫米(0.040到0.125英寸),使之有足够的热容量和良好的热传导性。一对端子片60和62并置于等温单元80的顶不绝缘层82的表面上,用来与图3所示的热电偶插头68的插片70和72摩擦接合。温度敏感晶体管30固定在等温单元80的顶层82的表面端子片60和62之间。由于金属板86有优良的热传导特性和大的热容量,端子片60和62保持在相同的温度上。同样温度敏感晶体管30也保持在与端子片60和62相同的温度上,如前所述,形成了实际的热电偶的基准结点。在顶层82表面最好也还固定有电流源32和前面叙述的保存标定数据的存储器34。出于保持图面清晰的原因,所有的电路敷设和将电子元件之间彼此相互连接及连接到温度计50的其它电路的电气接头都没有显示。从上面所述可以断定,制作非常小型的等温单元可以不需要采用大的陶瓷块来提供所需的热容量。
用热塑材料经模压而成的外壳90固定在顶绝缘层82的表面上,为端子片60和62以及温度敏感晶体管30提供部分遮盖,因此有助于在等温单元的上方保持稳定的环境温度。外壳90可以与温度计50的部分外壳进行整体模压,以便给热电偶66提供一个***区。一对缝口92和94用以分别接纳热电偶插头的插片70和72。一对弹簧夹96和98各有一自由端,当没有热电偶***时与端子片60和62接触,当有热电偶***时与插片70和72摩擦接合。这种结构帮助等温组件保持热完整性,当热电偶***时有助于快速稳定插片70和72以及等温单元80的温度。这些元件的相互关系可以从图5的等温组件的部分截面图看出,插片70与端子片60接触,并由弹簧夹96的张紧力保持固定就位。
如前所述,存储器34保存温度敏感晶体管30的标定数据,如前所讨论的,等温组件10的标定可通过使该组件达到第一预先确定的温度,例如为35℃。由于该组件良好的热传导性,导电的端子片60和62、温度敏感晶体管30均迅速达到相同的温度。测量该温度下的Vbe值。然后,使等温组件达到第二个已知温度,例如为15℃。一旦该组件稳定在新的温度下,便测量温度敏感晶体管30的第二个Vbe值。
由于如等温单元80这样的电子组件不能放入冰槽中进行标定,依照优选的实施例,标定是采用热空气柱来进行的,许多这种组件可以同时置于热空气柱内,已知温度的空气流过该组件使组件达到希望的温度。本发明的等温单元是使用从市场上购买得到的Saunders& Associates 4220A测试室和2255控制器进行标定的。该装置允许在同一时件内标定多达36个等温单元。等温单元固定在一个鼓状物上,当鼓状物转动,电子控制器能够依次与每个等温单元接触。在加温和测量电压的时候,容纳等温单元的热空气柱与外部空气温度密闭隔绝。一旦温度对任何已知的温度受控空气稳定之后,该装置的控制部分器读出每个温度敏感晶体管30的输出电压Vbe。如图2所示,获得的标定数据存储在对应于每一个温度敏感晶体管30的相应的存储器34。使用这种从市场上购买得到设备进行的整个标定程序是完全自动的,并对36个等温单元进行两点测定程序以提供储存标定数据,只需要大约25分钟,而花费的大部分时间是用以等待稳定温度的。
如前面所提到,标定数据可以是单一电压Vbe和已知基极-发射极结的线性特征电压曲线的斜率的形式或是在两点处获得的电压和温度,使得可由温度计的处理电路来重建线性特征曲线。再者,如前所述,在优选的实施例中使用对应于已知中间温度的电压Vbe和从测量两个点确定的斜率作为标定数据。
一旦已标定的等温组件安装在仪器上,仪器就可以操作,温度敏感晶体管30在仪器规定的工作温度范围内探测等温组件10的温度。当已安装热电偶66并进行温度测量,处理电路54测量晶体管30的新电压Vbe值,利用存储在存储器34内的标定数据来确定等温单元的温度,也就是实际基准结点的温度。一旦推导出这个数据,在热电偶66的尖端部74测量的确切温度可以用传统的方式确定。
如上所述,可以断定配置有小型的已标定的等温组件热电偶型温度计可以使待组装温度计可以免除后续的、费时的温度标定工序。另外,如果温度计是双测温仪表,一个等温单元就可以制成接纳两个热电偶插头,从而保持基准结点处于同一温度。
我们已经示出和叙述了本发明的优选的实施例,本领域的普通技术人员将了解到可以对本发明的以更宽方面做出多样的变化和改进而不背离本发明的精神。因此可以设想所附权利要求书将覆盖所有落入本发明的范围内的变化和改进。
Claims (12)
1.一用于热电偶型温度计的已标定的等温组件,其包括,
一具有高热传导性能的基板;
一对位于所述基板的电触点并形成热电偶的实际基准结点;
一固定在所述基板靠近所述电触点对的温度传感器;和
一固定在所述基板的存储器,所述存储器保存所述温度传感器的标定数据。
2.如权利要求所述1的已标定的等温组件,其特征在于:其还包括一用于安装在所述基板上的所述温度传感器的电流源。
3.如权利要求所述1的已标定的等温组件,其特征在于:其还包括固定在所述基板上的、延伸在所述一对电触点上方的外壳。
4.如权利要求1所述的已标定的等温组件,其特征在于:所述基板由金属板构成,所述金属板上具有绝缘层,使所述一对电触点与所述金属板相互绝缘,因而形成了等温单元。
5.如权利要求4所述的已标定的等温组件,其特征在于:所述金属板由铜材制成。
6.如权利要求4所述的已标定的等温组件,其特征在于:所述金属板的厚度至少为1.016毫米。
7.如权利要求1所述的已标定的等温组件,其特征在于:所述标定数据为与至少一个预先确定温度相对应的至少一个传感器电压值。
8.一小型的等温组件,其包括,
一金属板,于其上至少有一层形成特殊的印刷电路板的绝缘层;
一对导电端子片并置于所述至少一层绝缘层的表面;
一温度传感器放置在所述表面上靠近所述导电端子片的位置;
一存储器放置在所述至少一层绝缘层的表面上,所述存储器保存有所述温度传感器的标定数据。
9.如权利要求8所述的小型的等温组件,其特征在于:所述金属板的厚度至少为1.016毫米。
10.如权利要求8所述的小型的等温组件,其特征在于:所述金属板由铜材制成。
11.如权利要求8所述的小型的等温组件,其特征在于:其还包括:一固定在所述表面的外壳,所述外壳至少部分遮盖所述导电端子片和所述温度传感器。
12.如权利要求11所述的小型的等温组件,其特征在于:在所述外壳上安装一对弹簧夹,所述一对弹簧夹各有一自由端分别放置在靠近相应的所述导电端子片的位置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/404,921 US6293700B1 (en) | 1999-09-24 | 1999-09-24 | Calibrated isothermal assembly for a thermocouple thermometer |
US09/404,921 | 1999-09-24 | ||
US09/404921 | 1999-09-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1292493A true CN1292493A (zh) | 2001-04-25 |
CN1192223C CN1192223C (zh) | 2005-03-09 |
Family
ID=23601580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB00128861XA Expired - Lifetime CN1192223C (zh) | 1999-09-24 | 2000-09-23 | 用于热电偶型温度计的已标定的等温组件 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6293700B1 (zh) |
EP (1) | EP1087217B2 (zh) |
JP (1) | JP2001116630A (zh) |
KR (1) | KR100400651B1 (zh) |
CN (1) | CN1192223C (zh) |
DE (1) | DE60041310D1 (zh) |
TW (1) | TW495606B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102252770A (zh) * | 2011-04-29 | 2011-11-23 | 中冶赛迪工程技术股份有限公司 | 一种测温补偿方法及修正型高精度温度计 |
US8900888B2 (en) | 2009-05-29 | 2014-12-02 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip |
CN105987774A (zh) * | 2015-03-18 | 2016-10-05 | 恩德莱斯+豪瑟尔韦泽尔有限商业两合公司 | 热电偶线测试电路 |
CN110476044A (zh) * | 2017-04-03 | 2019-11-19 | 夏普株式会社 | 电子设备 |
Families Citing this family (367)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002036326A1 (en) * | 2000-11-06 | 2002-05-10 | Buja Frederick J | Method and apparatus for controlling a mold melt-flow process using temperature sensors |
US6694181B2 (en) * | 2001-02-12 | 2004-02-17 | Scimed Life Systems, Inc. | Methods and devices for detecting vulnerable plaque |
US6501384B2 (en) * | 2001-04-12 | 2002-12-31 | Solar Wide Industrial Ltd. | Electronic candy and oil thermometer |
US20040247015A1 (en) * | 2003-03-19 | 2004-12-09 | Wojan Scott A. | Beverage and food temperature notification device |
EP1642103A1 (en) * | 2003-06-27 | 2006-04-05 | Koninklijke Philips Electronics N.V. | Method and arrangement for temperature calibration |
GB2405476B (en) * | 2003-08-27 | 2006-07-19 | Gen Electric | Method, system and apparatus for measuring temperature with cold junction compensation |
US6948846B2 (en) * | 2003-10-23 | 2005-09-27 | Eaton Corporation | Test apparatus for power circuits of an electrical distribution device |
US20100245090A1 (en) * | 2004-05-19 | 2010-09-30 | Bed-Check Corporation | Patient thermal monitoring system |
US20050257822A1 (en) * | 2004-05-19 | 2005-11-24 | Bed-Check Corporation | Silk-screen thermocouple |
US7617988B2 (en) * | 2004-07-09 | 2009-11-17 | International Controls And Measurement Corp. | Intrusion barrier and thermal insulator for thermostat |
US7234864B2 (en) * | 2004-09-30 | 2007-06-26 | Rockwell Automation Technologies, Inc. | Measurement of multi-channel cold junction temperature |
US7828773B2 (en) | 2005-07-11 | 2010-11-09 | Covidien Ag | Safety reset key and needle assembly |
US7905857B2 (en) | 2005-07-11 | 2011-03-15 | Covidien Ag | Needle assembly including obturator with safety reset |
US7850650B2 (en) | 2005-07-11 | 2010-12-14 | Covidien Ag | Needle safety shield with reset |
US7585166B2 (en) * | 2005-05-02 | 2009-09-08 | Buja Frederick J | System for monitoring temperature and pressure during a molding process |
US20060276772A1 (en) * | 2005-06-06 | 2006-12-07 | Sherwood Services Ag | Bayonet release of safety shield for needle tip |
US20060276747A1 (en) * | 2005-06-06 | 2006-12-07 | Sherwood Services Ag | Needle assembly with removable depth stop |
US7731692B2 (en) | 2005-07-11 | 2010-06-08 | Covidien Ag | Device for shielding a sharp tip of a cannula and method of using the same |
US20070100253A1 (en) * | 2005-11-03 | 2007-05-03 | Sherwood Services Ag | Electronic thermometer with sensor location |
US7654735B2 (en) * | 2005-11-03 | 2010-02-02 | Covidien Ag | Electronic thermometer |
US7316507B2 (en) * | 2005-11-03 | 2008-01-08 | Covidien Ag | Electronic thermometer with flex circuit location |
US8790256B2 (en) * | 2006-08-14 | 2014-07-29 | Frederick J. Buja | System and method employing a thermocouple junction for monitoring of physiological parameters |
US7749170B2 (en) | 2007-05-22 | 2010-07-06 | Tyco Healthcare Group Lp | Multiple configurable electronic thermometer |
EP3474283A1 (en) | 2007-05-30 | 2019-04-24 | Ascensia Diabetes Care Holdings AG | Method and system for managing health data |
TWI381154B (zh) * | 2007-07-13 | 2013-01-01 | Hon Hai Prec Ind Co Ltd | 熱電偶溫度採集系統及方法 |
US20090052498A1 (en) * | 2007-08-24 | 2009-02-26 | Asm America, Inc. | Thermocouple |
US8702306B2 (en) * | 2007-09-21 | 2014-04-22 | Siemens Industry, Inc. | Systems, devices, and/or methods for managing a thermocouple module |
US8357104B2 (en) | 2007-11-01 | 2013-01-22 | Coviden Lp | Active stylet safety shield |
US8496377B2 (en) | 2007-12-31 | 2013-07-30 | Covidien Lp | Thermometer having molded probe component |
US10378106B2 (en) | 2008-11-14 | 2019-08-13 | Asm Ip Holding B.V. | Method of forming insulation film by modified PEALD |
US8262287B2 (en) | 2008-12-08 | 2012-09-11 | Asm America, Inc. | Thermocouple |
US9394608B2 (en) | 2009-04-06 | 2016-07-19 | Asm America, Inc. | Semiconductor processing reactor and components thereof |
US8382370B2 (en) | 2009-05-06 | 2013-02-26 | Asm America, Inc. | Thermocouple assembly with guarded thermocouple junction |
US9297705B2 (en) * | 2009-05-06 | 2016-03-29 | Asm America, Inc. | Smart temperature measuring device |
WO2010151592A1 (en) | 2009-06-23 | 2010-12-29 | Bayer Healthcare Llc | System and apparatus for determining temperatures in a fluid analyte system |
US8802201B2 (en) | 2009-08-14 | 2014-08-12 | Asm America, Inc. | Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species |
DE202009011860U1 (de) * | 2009-09-02 | 2010-03-04 | Türk & Hillinger GmbH | Hochtemperaturstecker |
CN101718599B (zh) * | 2009-12-23 | 2012-07-11 | 北京航空航天大学 | 刀具-工件自然热电偶标定方法及其装置 |
US8986205B2 (en) | 2010-05-14 | 2015-03-24 | Frederick J. Buja | Sensor for measurement of temperature and pressure for a cyclic process |
US8411442B2 (en) * | 2010-09-09 | 2013-04-02 | Texas Instruments Incorporated | Vias in substrate between IC seat and peripheral thermal cage |
US20120236904A1 (en) * | 2011-03-14 | 2012-09-20 | Brian Mark Burmaster | Direct thermocouple measurement without a reference junction |
US9312155B2 (en) | 2011-06-06 | 2016-04-12 | Asm Japan K.K. | High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules |
US10364496B2 (en) | 2011-06-27 | 2019-07-30 | Asm Ip Holding B.V. | Dual section module having shared and unshared mass flow controllers |
US10854498B2 (en) | 2011-07-15 | 2020-12-01 | Asm Ip Holding B.V. | Wafer-supporting device and method for producing same |
US20130023129A1 (en) | 2011-07-20 | 2013-01-24 | Asm America, Inc. | Pressure transmitter for a semiconductor processing environment |
US9017481B1 (en) | 2011-10-28 | 2015-04-28 | Asm America, Inc. | Process feed management for semiconductor substrate processing |
US9659799B2 (en) | 2012-08-28 | 2017-05-23 | Asm Ip Holding B.V. | Systems and methods for dynamic semiconductor process scheduling |
US10714315B2 (en) | 2012-10-12 | 2020-07-14 | Asm Ip Holdings B.V. | Semiconductor reaction chamber showerhead |
US20160376700A1 (en) | 2013-02-01 | 2016-12-29 | Asm Ip Holding B.V. | System for treatment of deposition reactor |
US9589770B2 (en) | 2013-03-08 | 2017-03-07 | Asm Ip Holding B.V. | Method and systems for in-situ formation of intermediate reactive species |
USD702188S1 (en) | 2013-03-08 | 2014-04-08 | Asm Ip Holding B.V. | Thermocouple |
US9484191B2 (en) | 2013-03-08 | 2016-11-01 | Asm Ip Holding B.V. | Pulsed remote plasma method and system |
US9240412B2 (en) | 2013-09-27 | 2016-01-19 | Asm Ip Holding B.V. | Semiconductor structure and device and methods of forming same using selective epitaxial process |
US9958168B2 (en) * | 2014-01-28 | 2018-05-01 | Illinois Tool Works Inc. | Cooking exhaust hood ventilation system and related methods |
US10683571B2 (en) | 2014-02-25 | 2020-06-16 | Asm Ip Holding B.V. | Gas supply manifold and method of supplying gases to chamber using same |
US10167557B2 (en) | 2014-03-18 | 2019-01-01 | Asm Ip Holding B.V. | Gas distribution system, reactor including the system, and methods of using the same |
US11015245B2 (en) | 2014-03-19 | 2021-05-25 | Asm Ip Holding B.V. | Gas-phase reactor and system having exhaust plenum and components thereof |
US10858737B2 (en) | 2014-07-28 | 2020-12-08 | Asm Ip Holding B.V. | Showerhead assembly and components thereof |
JP2016033973A (ja) * | 2014-07-31 | 2016-03-10 | アイシン・エィ・ダブリュ株式会社 | 電力変換装置の制御基板 |
US9890456B2 (en) | 2014-08-21 | 2018-02-13 | Asm Ip Holding B.V. | Method and system for in situ formation of gas-phase compounds |
US9657845B2 (en) | 2014-10-07 | 2017-05-23 | Asm Ip Holding B.V. | Variable conductance gas distribution apparatus and method |
US10941490B2 (en) | 2014-10-07 | 2021-03-09 | Asm Ip Holding B.V. | Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same |
KR102263121B1 (ko) | 2014-12-22 | 2021-06-09 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자 및 그 제조 방법 |
US10529542B2 (en) | 2015-03-11 | 2020-01-07 | Asm Ip Holdings B.V. | Cross-flow reactor and method |
US10276355B2 (en) | 2015-03-12 | 2019-04-30 | Asm Ip Holding B.V. | Multi-zone reactor, system including the reactor, and method of using the same |
US10458018B2 (en) | 2015-06-26 | 2019-10-29 | Asm Ip Holding B.V. | Structures including metal carbide material, devices including the structures, and methods of forming same |
US10600673B2 (en) | 2015-07-07 | 2020-03-24 | Asm Ip Holding B.V. | Magnetic susceptor to baseplate seal |
US9960072B2 (en) | 2015-09-29 | 2018-05-01 | Asm Ip Holding B.V. | Variable adjustment for precise matching of multiple chamber cavity housings |
US10211308B2 (en) | 2015-10-21 | 2019-02-19 | Asm Ip Holding B.V. | NbMC layers |
FR3043200B1 (fr) * | 2015-10-22 | 2017-12-22 | Valeo Systemes De Controle Moteur | Capteur de temperature pour vehicule automobile comprenant un thermocouple et son procede de fabrication |
US10322384B2 (en) | 2015-11-09 | 2019-06-18 | Asm Ip Holding B.V. | Counter flow mixer for process chamber |
US10123460B2 (en) * | 2015-11-13 | 2018-11-06 | Covidien LLP | System and method for thermal management of electronic devices |
US11139308B2 (en) | 2015-12-29 | 2021-10-05 | Asm Ip Holding B.V. | Atomic layer deposition of III-V compounds to form V-NAND devices |
US10529554B2 (en) | 2016-02-19 | 2020-01-07 | Asm Ip Holding B.V. | Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches |
US10468251B2 (en) | 2016-02-19 | 2019-11-05 | Asm Ip Holding B.V. | Method for forming spacers using silicon nitride film for spacer-defined multiple patterning |
US10501866B2 (en) | 2016-03-09 | 2019-12-10 | Asm Ip Holding B.V. | Gas distribution apparatus for improved film uniformity in an epitaxial system |
US10343920B2 (en) | 2016-03-18 | 2019-07-09 | Asm Ip Holding B.V. | Aligned carbon nanotubes |
US9892913B2 (en) | 2016-03-24 | 2018-02-13 | Asm Ip Holding B.V. | Radial and thickness control via biased multi-port injection settings |
US10190213B2 (en) | 2016-04-21 | 2019-01-29 | Asm Ip Holding B.V. | Deposition of metal borides |
US10865475B2 (en) | 2016-04-21 | 2020-12-15 | Asm Ip Holding B.V. | Deposition of metal borides and silicides |
US10367080B2 (en) | 2016-05-02 | 2019-07-30 | Asm Ip Holding B.V. | Method of forming a germanium oxynitride film |
US10032628B2 (en) | 2016-05-02 | 2018-07-24 | Asm Ip Holding B.V. | Source/drain performance through conformal solid state doping |
KR102592471B1 (ko) | 2016-05-17 | 2023-10-20 | 에이에스엠 아이피 홀딩 비.브이. | 금속 배선 형성 방법 및 이를 이용한 반도체 장치의 제조 방법 |
US11453943B2 (en) | 2016-05-25 | 2022-09-27 | Asm Ip Holding B.V. | Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor |
US10388509B2 (en) | 2016-06-28 | 2019-08-20 | Asm Ip Holding B.V. | Formation of epitaxial layers via dislocation filtering |
US10612137B2 (en) | 2016-07-08 | 2020-04-07 | Asm Ip Holdings B.V. | Organic reactants for atomic layer deposition |
US9859151B1 (en) | 2016-07-08 | 2018-01-02 | Asm Ip Holding B.V. | Selective film deposition method to form air gaps |
US10714385B2 (en) | 2016-07-19 | 2020-07-14 | Asm Ip Holding B.V. | Selective deposition of tungsten |
KR102354490B1 (ko) | 2016-07-27 | 2022-01-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 |
US9812320B1 (en) | 2016-07-28 | 2017-11-07 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US10395919B2 (en) | 2016-07-28 | 2019-08-27 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US9887082B1 (en) | 2016-07-28 | 2018-02-06 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
KR102532607B1 (ko) | 2016-07-28 | 2023-05-15 | 에이에스엠 아이피 홀딩 비.브이. | 기판 가공 장치 및 그 동작 방법 |
KR102613349B1 (ko) | 2016-08-25 | 2023-12-14 | 에이에스엠 아이피 홀딩 비.브이. | 배기 장치 및 이를 이용한 기판 가공 장치와 박막 제조 방법 |
US10410943B2 (en) | 2016-10-13 | 2019-09-10 | Asm Ip Holding B.V. | Method for passivating a surface of a semiconductor and related systems |
US10643826B2 (en) | 2016-10-26 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for thermally calibrating reaction chambers |
US11532757B2 (en) | 2016-10-27 | 2022-12-20 | Asm Ip Holding B.V. | Deposition of charge trapping layers |
US10435790B2 (en) | 2016-11-01 | 2019-10-08 | Asm Ip Holding B.V. | Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap |
US10229833B2 (en) | 2016-11-01 | 2019-03-12 | Asm Ip Holding B.V. | Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10643904B2 (en) | 2016-11-01 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for forming a semiconductor device and related semiconductor device structures |
US10714350B2 (en) | 2016-11-01 | 2020-07-14 | ASM IP Holdings, B.V. | Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10134757B2 (en) | 2016-11-07 | 2018-11-20 | Asm Ip Holding B.V. | Method of processing a substrate and a device manufactured by using the method |
KR102546317B1 (ko) | 2016-11-15 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | 기체 공급 유닛 및 이를 포함하는 기판 처리 장치 |
US10340135B2 (en) | 2016-11-28 | 2019-07-02 | Asm Ip Holding B.V. | Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride |
KR20180068582A (ko) | 2016-12-14 | 2018-06-22 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US11447861B2 (en) | 2016-12-15 | 2022-09-20 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
US11581186B2 (en) | 2016-12-15 | 2023-02-14 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus |
KR20180070971A (ko) | 2016-12-19 | 2018-06-27 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US10269558B2 (en) | 2016-12-22 | 2019-04-23 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US10867788B2 (en) | 2016-12-28 | 2020-12-15 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US11390950B2 (en) | 2017-01-10 | 2022-07-19 | Asm Ip Holding B.V. | Reactor system and method to reduce residue buildup during a film deposition process |
US10655221B2 (en) | 2017-02-09 | 2020-05-19 | Asm Ip Holding B.V. | Method for depositing oxide film by thermal ALD and PEALD |
US10468261B2 (en) | 2017-02-15 | 2019-11-05 | Asm Ip Holding B.V. | Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures |
US10283353B2 (en) | 2017-03-29 | 2019-05-07 | Asm Ip Holding B.V. | Method of reforming insulating film deposited on substrate with recess pattern |
US10529563B2 (en) | 2017-03-29 | 2020-01-07 | Asm Ip Holdings B.V. | Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures |
KR102457289B1 (ko) | 2017-04-25 | 2022-10-21 | 에이에스엠 아이피 홀딩 비.브이. | 박막 증착 방법 및 반도체 장치의 제조 방법 |
US10446393B2 (en) | 2017-05-08 | 2019-10-15 | Asm Ip Holding B.V. | Methods for forming silicon-containing epitaxial layers and related semiconductor device structures |
US10770286B2 (en) | 2017-05-08 | 2020-09-08 | Asm Ip Holdings B.V. | Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures |
US10892156B2 (en) | 2017-05-08 | 2021-01-12 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film on a substrate and related semiconductor device structures |
US10504742B2 (en) | 2017-05-31 | 2019-12-10 | Asm Ip Holding B.V. | Method of atomic layer etching using hydrogen plasma |
US10886123B2 (en) | 2017-06-02 | 2021-01-05 | Asm Ip Holding B.V. | Methods for forming low temperature semiconductor layers and related semiconductor device structures |
US12040200B2 (en) | 2017-06-20 | 2024-07-16 | Asm Ip Holding B.V. | Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus |
US10476288B2 (en) | 2017-06-23 | 2019-11-12 | Dell Products L.P. | Power storage adapter for peak shift operation with a portable information handling system |
US10978896B2 (en) | 2017-06-23 | 2021-04-13 | Dell Products L.P. | High efficiency power storage adapter |
US10381844B2 (en) | 2017-06-23 | 2019-08-13 | Dell Products L.P. | Sourcing power from a battery or AC-DC converter of a power storage adapter |
US10452102B2 (en) | 2017-06-23 | 2019-10-22 | Dell Products L.P. | Power delivery contract establishment in a power storage adapter |
US10928880B2 (en) | 2017-06-23 | 2021-02-23 | Dell Products L.P. | Power storage adapter for communicating battery data with a portable information handling system |
US10389154B2 (en) | 2017-06-23 | 2019-08-20 | Dell Products L.P. | Power storage adapter using a high efficiency charging method |
US11306395B2 (en) | 2017-06-28 | 2022-04-19 | Asm Ip Holding B.V. | Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus |
US10685834B2 (en) | 2017-07-05 | 2020-06-16 | Asm Ip Holdings B.V. | Methods for forming a silicon germanium tin layer and related semiconductor device structures |
KR20190009245A (ko) | 2017-07-18 | 2019-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자 구조물 형성 방법 및 관련된 반도체 소자 구조물 |
US10541333B2 (en) | 2017-07-19 | 2020-01-21 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US11374112B2 (en) | 2017-07-19 | 2022-06-28 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US11018002B2 (en) | 2017-07-19 | 2021-05-25 | Asm Ip Holding B.V. | Method for selectively depositing a Group IV semiconductor and related semiconductor device structures |
US10590535B2 (en) | 2017-07-26 | 2020-03-17 | Asm Ip Holdings B.V. | Chemical treatment, deposition and/or infiltration apparatus and method for using the same |
US10605530B2 (en) | 2017-07-26 | 2020-03-31 | Asm Ip Holding B.V. | Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace |
US10312055B2 (en) | 2017-07-26 | 2019-06-04 | Asm Ip Holding B.V. | Method of depositing film by PEALD using negative bias |
US10692741B2 (en) | 2017-08-08 | 2020-06-23 | Asm Ip Holdings B.V. | Radiation shield |
US10770336B2 (en) | 2017-08-08 | 2020-09-08 | Asm Ip Holding B.V. | Substrate lift mechanism and reactor including same |
US11139191B2 (en) | 2017-08-09 | 2021-10-05 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US10249524B2 (en) | 2017-08-09 | 2019-04-02 | Asm Ip Holding B.V. | Cassette holder assembly for a substrate cassette and holding member for use in such assembly |
US11769682B2 (en) | 2017-08-09 | 2023-09-26 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US10608443B2 (en) | 2017-08-15 | 2020-03-31 | Dell Products L.P. | Battery management using battery temperature distribution |
USD900036S1 (en) | 2017-08-24 | 2020-10-27 | Asm Ip Holding B.V. | Heater electrical connector and adapter |
US10642333B2 (en) | 2017-08-24 | 2020-05-05 | Dell Products L.P. | Power storage adapter for efficient supply of power of multiple portable information handling systems |
US11830730B2 (en) | 2017-08-29 | 2023-11-28 | Asm Ip Holding B.V. | Layer forming method and apparatus |
KR102491945B1 (ko) | 2017-08-30 | 2023-01-26 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US11056344B2 (en) | 2017-08-30 | 2021-07-06 | Asm Ip Holding B.V. | Layer forming method |
US11295980B2 (en) | 2017-08-30 | 2022-04-05 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
KR102401446B1 (ko) | 2017-08-31 | 2022-05-24 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US10673271B2 (en) | 2017-09-01 | 2020-06-02 | Dell Products L.P. | Efficient charging of multiple portable information handling systems based on learned charging characteristics |
US10620679B2 (en) | 2017-09-01 | 2020-04-14 | Dell Products L.P. | Prioritizing supplying electrical power by a power storage adapter to connected devices |
US10404105B2 (en) | 2017-09-14 | 2019-09-03 | Dell Products L.P. | Power storage adapter for wireless power transmission |
US10714797B2 (en) | 2017-09-18 | 2020-07-14 | Dell Products L.P. | Multilayer thermal laminate with aerogel for battery cell enclosures |
US11513928B2 (en) | 2017-09-18 | 2022-11-29 | Dell Products L.P. | Power storage adapter with power cable validation |
US10607895B2 (en) | 2017-09-18 | 2020-03-31 | Asm Ip Holdings B.V. | Method for forming a semiconductor device structure comprising a gate fill metal |
KR102630301B1 (ko) | 2017-09-21 | 2024-01-29 | 에이에스엠 아이피 홀딩 비.브이. | 침투성 재료의 순차 침투 합성 방법 처리 및 이를 이용하여 형성된 구조물 및 장치 |
US10844484B2 (en) | 2017-09-22 | 2020-11-24 | Asm Ip Holding B.V. | Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US10488906B2 (en) | 2017-09-26 | 2019-11-26 | Dell Products L.P. | Power delivery based on temperature and other factors in a power storage adapter |
US10658205B2 (en) | 2017-09-28 | 2020-05-19 | Asm Ip Holdings B.V. | Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber |
US10403504B2 (en) | 2017-10-05 | 2019-09-03 | Asm Ip Holding B.V. | Method for selectively depositing a metallic film on a substrate |
US10319588B2 (en) | 2017-10-10 | 2019-06-11 | Asm Ip Holding B.V. | Method for depositing a metal chalcogenide on a substrate by cyclical deposition |
US10923344B2 (en) | 2017-10-30 | 2021-02-16 | Asm Ip Holding B.V. | Methods for forming a semiconductor structure and related semiconductor structures |
US10278279B1 (en) * | 2017-10-30 | 2019-04-30 | Dell Products L.P. | Transformer thermal radiator for power field effect transistors |
US10910262B2 (en) | 2017-11-16 | 2021-02-02 | Asm Ip Holding B.V. | Method of selectively depositing a capping layer structure on a semiconductor device structure |
KR102443047B1 (ko) | 2017-11-16 | 2022-09-14 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 방법 및 그에 의해 제조된 장치 |
US11022879B2 (en) | 2017-11-24 | 2021-06-01 | Asm Ip Holding B.V. | Method of forming an enhanced unexposed photoresist layer |
WO2019103613A1 (en) | 2017-11-27 | 2019-05-31 | Asm Ip Holding B.V. | A storage device for storing wafer cassettes for use with a batch furnace |
KR102633318B1 (ko) | 2017-11-27 | 2024-02-05 | 에이에스엠 아이피 홀딩 비.브이. | 청정 소형 구역을 포함한 장치 |
US10290508B1 (en) | 2017-12-05 | 2019-05-14 | Asm Ip Holding B.V. | Method for forming vertical spacers for spacer-defined patterning |
US10872771B2 (en) | 2018-01-16 | 2020-12-22 | Asm Ip Holding B. V. | Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures |
CN111630203A (zh) | 2018-01-19 | 2020-09-04 | Asm Ip私人控股有限公司 | 通过等离子体辅助沉积来沉积间隙填充层的方法 |
TWI799494B (zh) | 2018-01-19 | 2023-04-21 | 荷蘭商Asm 智慧財產控股公司 | 沈積方法 |
USD903477S1 (en) | 2018-01-24 | 2020-12-01 | Asm Ip Holdings B.V. | Metal clamp |
US11018047B2 (en) | 2018-01-25 | 2021-05-25 | Asm Ip Holding B.V. | Hybrid lift pin |
US10535516B2 (en) | 2018-02-01 | 2020-01-14 | Asm Ip Holdings B.V. | Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures |
USD880437S1 (en) | 2018-02-01 | 2020-04-07 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
US11081345B2 (en) | 2018-02-06 | 2021-08-03 | Asm Ip Holding B.V. | Method of post-deposition treatment for silicon oxide film |
WO2019158960A1 (en) | 2018-02-14 | 2019-08-22 | Asm Ip Holding B.V. | A method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US10896820B2 (en) | 2018-02-14 | 2021-01-19 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US10731249B2 (en) | 2018-02-15 | 2020-08-04 | Asm Ip Holding B.V. | Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus |
KR102636427B1 (ko) | 2018-02-20 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 및 장치 |
US10658181B2 (en) | 2018-02-20 | 2020-05-19 | Asm Ip Holding B.V. | Method of spacer-defined direct patterning in semiconductor fabrication |
US10975470B2 (en) | 2018-02-23 | 2021-04-13 | Asm Ip Holding B.V. | Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment |
US11473195B2 (en) | 2018-03-01 | 2022-10-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus and a method for processing a substrate |
US11629406B2 (en) | 2018-03-09 | 2023-04-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate |
US11114283B2 (en) | 2018-03-16 | 2021-09-07 | Asm Ip Holding B.V. | Reactor, system including the reactor, and methods of manufacturing and using same |
KR102646467B1 (ko) | 2018-03-27 | 2024-03-11 | 에이에스엠 아이피 홀딩 비.브이. | 기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조 |
US11230766B2 (en) | 2018-03-29 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US10510536B2 (en) | 2018-03-29 | 2019-12-17 | Asm Ip Holding B.V. | Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber |
US11088002B2 (en) | 2018-03-29 | 2021-08-10 | Asm Ip Holding B.V. | Substrate rack and a substrate processing system and method |
KR102501472B1 (ko) | 2018-03-30 | 2023-02-20 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 |
US12025484B2 (en) | 2018-05-08 | 2024-07-02 | Asm Ip Holding B.V. | Thin film forming method |
KR20190128558A (ko) | 2018-05-08 | 2019-11-18 | 에이에스엠 아이피 홀딩 비.브이. | 기판 상에 산화물 막을 주기적 증착 공정에 의해 증착하기 위한 방법 및 관련 소자 구조 |
TW202349473A (zh) | 2018-05-11 | 2023-12-16 | 荷蘭商Asm Ip私人控股有限公司 | 用於基板上形成摻雜金屬碳化物薄膜之方法及相關半導體元件結構 |
KR102596988B1 (ko) | 2018-05-28 | 2023-10-31 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 및 그에 의해 제조된 장치 |
US11270899B2 (en) | 2018-06-04 | 2022-03-08 | Asm Ip Holding B.V. | Wafer handling chamber with moisture reduction |
US11718913B2 (en) | 2018-06-04 | 2023-08-08 | Asm Ip Holding B.V. | Gas distribution system and reactor system including same |
US11286562B2 (en) | 2018-06-08 | 2022-03-29 | Asm Ip Holding B.V. | Gas-phase chemical reactor and method of using same |
US10797133B2 (en) | 2018-06-21 | 2020-10-06 | Asm Ip Holding B.V. | Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures |
KR102568797B1 (ko) | 2018-06-21 | 2023-08-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 시스템 |
TW202405221A (zh) | 2018-06-27 | 2024-02-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於形成含金屬材料及包含含金屬材料的膜及結構之循環沉積方法 |
TW202409324A (zh) | 2018-06-27 | 2024-03-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於形成含金屬材料之循環沉積製程 |
TWI751420B (zh) | 2018-06-29 | 2022-01-01 | 荷蘭商Asm知識產權私人控股有限公司 | 薄膜沉積方法 |
US10612136B2 (en) | 2018-06-29 | 2020-04-07 | ASM IP Holding, B.V. | Temperature-controlled flange and reactor system including same |
US10388513B1 (en) | 2018-07-03 | 2019-08-20 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10755922B2 (en) | 2018-07-03 | 2020-08-25 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10767789B2 (en) | 2018-07-16 | 2020-09-08 | Asm Ip Holding B.V. | Diaphragm valves, valve components, and methods for forming valve components |
US10483099B1 (en) | 2018-07-26 | 2019-11-19 | Asm Ip Holding B.V. | Method for forming thermally stable organosilicon polymer film |
US11053591B2 (en) | 2018-08-06 | 2021-07-06 | Asm Ip Holding B.V. | Multi-port gas injection system and reactor system including same |
US10883175B2 (en) | 2018-08-09 | 2021-01-05 | Asm Ip Holding B.V. | Vertical furnace for processing substrates and a liner for use therein |
US10829852B2 (en) | 2018-08-16 | 2020-11-10 | Asm Ip Holding B.V. | Gas distribution device for a wafer processing apparatus |
US11430674B2 (en) | 2018-08-22 | 2022-08-30 | Asm Ip Holding B.V. | Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US11024523B2 (en) | 2018-09-11 | 2021-06-01 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
KR20200030162A (ko) | 2018-09-11 | 2020-03-20 | 에이에스엠 아이피 홀딩 비.브이. | 박막 증착 방법 |
US11049751B2 (en) | 2018-09-14 | 2021-06-29 | Asm Ip Holding B.V. | Cassette supply system to store and handle cassettes and processing apparatus equipped therewith |
CN110970344A (zh) | 2018-10-01 | 2020-04-07 | Asm Ip控股有限公司 | 衬底保持设备、包含所述设备的***及其使用方法 |
US11232963B2 (en) | 2018-10-03 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
KR102592699B1 (ko) | 2018-10-08 | 2023-10-23 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 유닛 및 이를 포함하는 박막 증착 장치와 기판 처리 장치 |
US10847365B2 (en) | 2018-10-11 | 2020-11-24 | Asm Ip Holding B.V. | Method of forming conformal silicon carbide film by cyclic CVD |
US10811256B2 (en) | 2018-10-16 | 2020-10-20 | Asm Ip Holding B.V. | Method for etching a carbon-containing feature |
KR102546322B1 (ko) | 2018-10-19 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 및 기판 처리 방법 |
KR102605121B1 (ko) | 2018-10-19 | 2023-11-23 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 및 기판 처리 방법 |
USD948463S1 (en) | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus |
US10381219B1 (en) | 2018-10-25 | 2019-08-13 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film |
US11087997B2 (en) | 2018-10-31 | 2021-08-10 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
KR20200051105A (ko) | 2018-11-02 | 2020-05-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 유닛 및 이를 포함하는 기판 처리 장치 |
US11572620B2 (en) | 2018-11-06 | 2023-02-07 | Asm Ip Holding B.V. | Methods for selectively depositing an amorphous silicon film on a substrate |
US11031242B2 (en) | 2018-11-07 | 2021-06-08 | Asm Ip Holding B.V. | Methods for depositing a boron doped silicon germanium film |
US10847366B2 (en) | 2018-11-16 | 2020-11-24 | Asm Ip Holding B.V. | Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process |
US10818758B2 (en) | 2018-11-16 | 2020-10-27 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US10559458B1 (en) | 2018-11-26 | 2020-02-11 | Asm Ip Holding B.V. | Method of forming oxynitride film |
US12040199B2 (en) | 2018-11-28 | 2024-07-16 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
US11217444B2 (en) | 2018-11-30 | 2022-01-04 | Asm Ip Holding B.V. | Method for forming an ultraviolet radiation responsive metal oxide-containing film |
KR102636428B1 (ko) | 2018-12-04 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치를 세정하는 방법 |
US11158513B2 (en) | 2018-12-13 | 2021-10-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
JP7504584B2 (ja) | 2018-12-14 | 2024-06-24 | エーエスエム・アイピー・ホールディング・ベー・フェー | 窒化ガリウムの選択的堆積を用いてデバイス構造体を形成する方法及びそのためのシステム |
JP7036000B2 (ja) * | 2018-12-27 | 2022-03-15 | 株式会社豊田自動織機 | 電子装置 |
TWI819180B (zh) | 2019-01-17 | 2023-10-21 | 荷蘭商Asm 智慧財產控股公司 | 藉由循環沈積製程於基板上形成含過渡金屬膜之方法 |
KR20200091543A (ko) | 2019-01-22 | 2020-07-31 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
CN111524788B (zh) | 2019-02-01 | 2023-11-24 | Asm Ip私人控股有限公司 | 氧化硅的拓扑选择性膜形成的方法 |
US11482533B2 (en) | 2019-02-20 | 2022-10-25 | Asm Ip Holding B.V. | Apparatus and methods for plug fill deposition in 3-D NAND applications |
JP7509548B2 (ja) | 2019-02-20 | 2024-07-02 | エーエスエム・アイピー・ホールディング・ベー・フェー | 基材表面内に形成された凹部を充填するための周期的堆積方法および装置 |
KR102626263B1 (ko) | 2019-02-20 | 2024-01-16 | 에이에스엠 아이피 홀딩 비.브이. | 처리 단계를 포함하는 주기적 증착 방법 및 이를 위한 장치 |
JP2020136678A (ja) | 2019-02-20 | 2020-08-31 | エーエスエム・アイピー・ホールディング・ベー・フェー | 基材表面内に形成された凹部を充填するための方法および装置 |
JP2020133004A (ja) | 2019-02-22 | 2020-08-31 | エーエスエム・アイピー・ホールディング・ベー・フェー | 基材を処理するための基材処理装置および方法 |
KR20200108242A (ko) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 질화물 층을 선택적으로 증착하는 방법, 및 선택적으로 증착된 실리콘 질화물 층을 포함하는 구조체 |
KR20200108243A (ko) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | SiOC 층을 포함한 구조체 및 이의 형성 방법 |
KR20200108248A (ko) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | SiOCN 층을 포함한 구조체 및 이의 형성 방법 |
JP7120089B2 (ja) * | 2019-03-12 | 2022-08-17 | オムロン株式会社 | 組合せ機器 |
KR20200116033A (ko) | 2019-03-28 | 2020-10-08 | 에이에스엠 아이피 홀딩 비.브이. | 도어 개방기 및 이를 구비한 기판 처리 장치 |
KR20200116855A (ko) | 2019-04-01 | 2020-10-13 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 소자를 제조하는 방법 |
KR20200123380A (ko) | 2019-04-19 | 2020-10-29 | 에이에스엠 아이피 홀딩 비.브이. | 층 형성 방법 및 장치 |
KR20200125453A (ko) | 2019-04-24 | 2020-11-04 | 에이에스엠 아이피 홀딩 비.브이. | 기상 반응기 시스템 및 이를 사용하는 방법 |
KR20200130118A (ko) | 2019-05-07 | 2020-11-18 | 에이에스엠 아이피 홀딩 비.브이. | 비정질 탄소 중합체 막을 개질하는 방법 |
KR20200130121A (ko) | 2019-05-07 | 2020-11-18 | 에이에스엠 아이피 홀딩 비.브이. | 딥 튜브가 있는 화학물질 공급원 용기 |
KR20200130652A (ko) | 2019-05-10 | 2020-11-19 | 에이에스엠 아이피 홀딩 비.브이. | 표면 상에 재료를 증착하는 방법 및 본 방법에 따라 형성된 구조 |
JP2020188255A (ja) | 2019-05-16 | 2020-11-19 | エーエスエム アイピー ホールディング ビー.ブイ. | ウェハボートハンドリング装置、縦型バッチ炉および方法 |
JP2020188254A (ja) | 2019-05-16 | 2020-11-19 | エーエスエム アイピー ホールディング ビー.ブイ. | ウェハボートハンドリング装置、縦型バッチ炉および方法 |
USD947913S1 (en) | 2019-05-17 | 2022-04-05 | Asm Ip Holding B.V. | Susceptor shaft |
USD975665S1 (en) | 2019-05-17 | 2023-01-17 | Asm Ip Holding B.V. | Susceptor shaft |
USD935572S1 (en) | 2019-05-24 | 2021-11-09 | Asm Ip Holding B.V. | Gas channel plate |
USD922229S1 (en) | 2019-06-05 | 2021-06-15 | Asm Ip Holding B.V. | Device for controlling a temperature of a gas supply unit |
KR20200141002A (ko) | 2019-06-06 | 2020-12-17 | 에이에스엠 아이피 홀딩 비.브이. | 배기 가스 분석을 포함한 기상 반응기 시스템을 사용하는 방법 |
KR20200143254A (ko) | 2019-06-11 | 2020-12-23 | 에이에스엠 아이피 홀딩 비.브이. | 개질 가스를 사용하여 전자 구조를 형성하는 방법, 상기 방법을 수행하기 위한 시스템, 및 상기 방법을 사용하여 형성되는 구조 |
USD944946S1 (en) | 2019-06-14 | 2022-03-01 | Asm Ip Holding B.V. | Shower plate |
WO2020255222A1 (ja) | 2019-06-17 | 2020-12-24 | 三菱電機株式会社 | 温度入力ユニット、温度測定装置、及びプログラム |
USD931978S1 (en) | 2019-06-27 | 2021-09-28 | Asm Ip Holding B.V. | Showerhead vacuum transport |
KR20210005515A (ko) | 2019-07-03 | 2021-01-14 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치용 온도 제어 조립체 및 이를 사용하는 방법 |
JP7499079B2 (ja) | 2019-07-09 | 2024-06-13 | エーエスエム・アイピー・ホールディング・ベー・フェー | 同軸導波管を用いたプラズマ装置、基板処理方法 |
CN112216646A (zh) | 2019-07-10 | 2021-01-12 | Asm Ip私人控股有限公司 | 基板支撑组件及包括其的基板处理装置 |
KR20210010307A (ko) | 2019-07-16 | 2021-01-27 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
KR20210010820A (ko) | 2019-07-17 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 실리콘 게르마늄 구조를 형성하는 방법 |
KR20210010816A (ko) | 2019-07-17 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | 라디칼 보조 점화 플라즈마 시스템 및 방법 |
US11643724B2 (en) | 2019-07-18 | 2023-05-09 | Asm Ip Holding B.V. | Method of forming structures using a neutral beam |
TWI839544B (zh) | 2019-07-19 | 2024-04-21 | 荷蘭商Asm Ip私人控股有限公司 | 形成形貌受控的非晶碳聚合物膜之方法 |
TW202113936A (zh) | 2019-07-29 | 2021-04-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於利用n型摻雜物及/或替代摻雜物選擇性沉積以達成高摻雜物併入之方法 |
CN112309899A (zh) | 2019-07-30 | 2021-02-02 | Asm Ip私人控股有限公司 | 基板处理设备 |
CN112309900A (zh) | 2019-07-30 | 2021-02-02 | Asm Ip私人控股有限公司 | 基板处理设备 |
US11587814B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11227782B2 (en) | 2019-07-31 | 2022-01-18 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11587815B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
CN112323048B (zh) | 2019-08-05 | 2024-02-09 | Asm Ip私人控股有限公司 | 用于化学源容器的液位传感器 |
USD965524S1 (en) | 2019-08-19 | 2022-10-04 | Asm Ip Holding B.V. | Susceptor support |
USD965044S1 (en) | 2019-08-19 | 2022-09-27 | Asm Ip Holding B.V. | Susceptor shaft |
JP2021031769A (ja) | 2019-08-21 | 2021-03-01 | エーエスエム アイピー ホールディング ビー.ブイ. | 成膜原料混合ガス生成装置及び成膜装置 |
USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
KR20210024423A (ko) | 2019-08-22 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | 홀을 구비한 구조체를 형성하기 위한 방법 |
USD930782S1 (en) | 2019-08-22 | 2021-09-14 | Asm Ip Holding B.V. | Gas distributor |
USD949319S1 (en) | 2019-08-22 | 2022-04-19 | Asm Ip Holding B.V. | Exhaust duct |
USD940837S1 (en) | 2019-08-22 | 2022-01-11 | Asm Ip Holding B.V. | Electrode |
KR20210024420A (ko) | 2019-08-23 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | 비스(디에틸아미노)실란을 사용하여 peald에 의해 개선된 품질을 갖는 실리콘 산화물 막을 증착하기 위한 방법 |
US11286558B2 (en) | 2019-08-23 | 2022-03-29 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
KR20210029090A (ko) | 2019-09-04 | 2021-03-15 | 에이에스엠 아이피 홀딩 비.브이. | 희생 캡핑 층을 이용한 선택적 증착 방법 |
KR20210029663A (ko) | 2019-09-05 | 2021-03-16 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
US11562901B2 (en) | 2019-09-25 | 2023-01-24 | Asm Ip Holding B.V. | Substrate processing method |
CN112593212B (zh) | 2019-10-02 | 2023-12-22 | Asm Ip私人控股有限公司 | 通过循环等离子体增强沉积工艺形成拓扑选择性氧化硅膜的方法 |
CN112635282A (zh) | 2019-10-08 | 2021-04-09 | Asm Ip私人控股有限公司 | 具有连接板的基板处理装置、基板处理方法 |
KR20210042810A (ko) | 2019-10-08 | 2021-04-20 | 에이에스엠 아이피 홀딩 비.브이. | 활성 종을 이용하기 위한 가스 분배 어셈블리를 포함한 반응기 시스템 및 이를 사용하는 방법 |
KR20210043460A (ko) | 2019-10-10 | 2021-04-21 | 에이에스엠 아이피 홀딩 비.브이. | 포토레지스트 하부층을 형성하기 위한 방법 및 이를 포함한 구조체 |
US12009241B2 (en) | 2019-10-14 | 2024-06-11 | Asm Ip Holding B.V. | Vertical batch furnace assembly with detector to detect cassette |
TWI834919B (zh) | 2019-10-16 | 2024-03-11 | 荷蘭商Asm Ip私人控股有限公司 | 氧化矽之拓撲選擇性膜形成之方法 |
US11637014B2 (en) | 2019-10-17 | 2023-04-25 | Asm Ip Holding B.V. | Methods for selective deposition of doped semiconductor material |
KR20210047808A (ko) | 2019-10-21 | 2021-04-30 | 에이에스엠 아이피 홀딩 비.브이. | 막을 선택적으로 에칭하기 위한 장치 및 방법 |
KR20210050453A (ko) | 2019-10-25 | 2021-05-07 | 에이에스엠 아이피 홀딩 비.브이. | 기판 표면 상의 갭 피처를 충진하는 방법 및 이와 관련된 반도체 소자 구조 |
US11646205B2 (en) | 2019-10-29 | 2023-05-09 | Asm Ip Holding B.V. | Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same |
KR20210054983A (ko) | 2019-11-05 | 2021-05-14 | 에이에스엠 아이피 홀딩 비.브이. | 도핑된 반도체 층을 갖는 구조체 및 이를 형성하기 위한 방법 및 시스템 |
US11501968B2 (en) | 2019-11-15 | 2022-11-15 | Asm Ip Holding B.V. | Method for providing a semiconductor device with silicon filled gaps |
KR20210062561A (ko) | 2019-11-20 | 2021-05-31 | 에이에스엠 아이피 홀딩 비.브이. | 기판의 표면 상에 탄소 함유 물질을 증착하는 방법, 상기 방법을 사용하여 형성된 구조물, 및 상기 구조물을 형성하기 위한 시스템 |
US11450529B2 (en) | 2019-11-26 | 2022-09-20 | Asm Ip Holding B.V. | Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface |
CN112951697A (zh) | 2019-11-26 | 2021-06-11 | Asm Ip私人控股有限公司 | 基板处理设备 |
CN112885692A (zh) | 2019-11-29 | 2021-06-01 | Asm Ip私人控股有限公司 | 基板处理设备 |
CN112885693A (zh) | 2019-11-29 | 2021-06-01 | Asm Ip私人控股有限公司 | 基板处理设备 |
JP2021090042A (ja) | 2019-12-02 | 2021-06-10 | エーエスエム アイピー ホールディング ビー.ブイ. | 基板処理装置、基板処理方法 |
KR20210070898A (ko) | 2019-12-04 | 2021-06-15 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
KR20210078405A (ko) | 2019-12-17 | 2021-06-28 | 에이에스엠 아이피 홀딩 비.브이. | 바나듐 나이트라이드 층을 형성하는 방법 및 바나듐 나이트라이드 층을 포함하는 구조 |
US11527403B2 (en) | 2019-12-19 | 2022-12-13 | Asm Ip Holding B.V. | Methods for filling a gap feature on a substrate surface and related semiconductor structures |
KR20210089079A (ko) | 2020-01-06 | 2021-07-15 | 에이에스엠 아이피 홀딩 비.브이. | 채널형 리프트 핀 |
TW202140135A (zh) | 2020-01-06 | 2021-11-01 | 荷蘭商Asm Ip私人控股有限公司 | 氣體供應總成以及閥板總成 |
US11993847B2 (en) | 2020-01-08 | 2024-05-28 | Asm Ip Holding B.V. | Injector |
KR102675856B1 (ko) | 2020-01-20 | 2024-06-17 | 에이에스엠 아이피 홀딩 비.브이. | 박막 형성 방법 및 박막 표면 개질 방법 |
TW202130846A (zh) | 2020-02-03 | 2021-08-16 | 荷蘭商Asm Ip私人控股有限公司 | 形成包括釩或銦層的結構之方法 |
KR20210100010A (ko) | 2020-02-04 | 2021-08-13 | 에이에스엠 아이피 홀딩 비.브이. | 대형 물품의 투과율 측정을 위한 방법 및 장치 |
US11776846B2 (en) | 2020-02-07 | 2023-10-03 | Asm Ip Holding B.V. | Methods for depositing gap filling fluids and related systems and devices |
US11781243B2 (en) | 2020-02-17 | 2023-10-10 | Asm Ip Holding B.V. | Method for depositing low temperature phosphorous-doped silicon |
TW202203344A (zh) | 2020-02-28 | 2022-01-16 | 荷蘭商Asm Ip控股公司 | 專用於零件清潔的系統 |
KR20210116240A (ko) | 2020-03-11 | 2021-09-27 | 에이에스엠 아이피 홀딩 비.브이. | 조절성 접합부를 갖는 기판 핸들링 장치 |
US11876356B2 (en) | 2020-03-11 | 2024-01-16 | Asm Ip Holding B.V. | Lockout tagout assembly and system and method of using same |
CN113394086A (zh) | 2020-03-12 | 2021-09-14 | Asm Ip私人控股有限公司 | 用于制造具有目标拓扑轮廓的层结构的方法 |
KR20210124042A (ko) | 2020-04-02 | 2021-10-14 | 에이에스엠 아이피 홀딩 비.브이. | 박막 형성 방법 |
TW202146689A (zh) | 2020-04-03 | 2021-12-16 | 荷蘭商Asm Ip控股公司 | 阻障層形成方法及半導體裝置的製造方法 |
TW202145344A (zh) | 2020-04-08 | 2021-12-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於選擇性蝕刻氧化矽膜之設備及方法 |
US11821078B2 (en) | 2020-04-15 | 2023-11-21 | Asm Ip Holding B.V. | Method for forming precoat film and method for forming silicon-containing film |
US11996289B2 (en) | 2020-04-16 | 2024-05-28 | Asm Ip Holding B.V. | Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods |
KR20210132605A (ko) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | 냉각 가스 공급부를 포함한 수직형 배치 퍼니스 어셈블리 |
KR20210132600A (ko) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | 바나듐, 질소 및 추가 원소를 포함한 층을 증착하기 위한 방법 및 시스템 |
CN113555279A (zh) | 2020-04-24 | 2021-10-26 | Asm Ip私人控股有限公司 | 形成含氮化钒的层的方法及包含其的结构 |
KR20210134226A (ko) | 2020-04-29 | 2021-11-09 | 에이에스엠 아이피 홀딩 비.브이. | 고체 소스 전구체 용기 |
KR20210134869A (ko) | 2020-05-01 | 2021-11-11 | 에이에스엠 아이피 홀딩 비.브이. | Foup 핸들러를 이용한 foup의 빠른 교환 |
KR20210141379A (ko) | 2020-05-13 | 2021-11-23 | 에이에스엠 아이피 홀딩 비.브이. | 반응기 시스템용 레이저 정렬 고정구 |
KR20210143653A (ko) | 2020-05-19 | 2021-11-29 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
KR20210145078A (ko) | 2020-05-21 | 2021-12-01 | 에이에스엠 아이피 홀딩 비.브이. | 다수의 탄소 층을 포함한 구조체 및 이를 형성하고 사용하는 방법 |
KR20210145080A (ko) | 2020-05-22 | 2021-12-01 | 에이에스엠 아이피 홀딩 비.브이. | 과산화수소를 사용하여 박막을 증착하기 위한 장치 |
TW202201602A (zh) | 2020-05-29 | 2022-01-01 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理方法 |
TW202218133A (zh) | 2020-06-24 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | 形成含矽層之方法 |
TW202217953A (zh) | 2020-06-30 | 2022-05-01 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理方法 |
TW202202649A (zh) | 2020-07-08 | 2022-01-16 | 荷蘭商Asm Ip私人控股有限公司 | 基板處理方法 |
KR20220010438A (ko) | 2020-07-17 | 2022-01-25 | 에이에스엠 아이피 홀딩 비.브이. | 포토리소그래피에 사용하기 위한 구조체 및 방법 |
TW202204662A (zh) | 2020-07-20 | 2022-02-01 | 荷蘭商Asm Ip私人控股有限公司 | 用於沉積鉬層之方法及系統 |
US12040177B2 (en) | 2020-08-18 | 2024-07-16 | Asm Ip Holding B.V. | Methods for forming a laminate film by cyclical plasma-enhanced deposition processes |
KR20220027026A (ko) | 2020-08-26 | 2022-03-07 | 에이에스엠 아이피 홀딩 비.브이. | 금속 실리콘 산화물 및 금속 실리콘 산질화물 층을 형성하기 위한 방법 및 시스템 |
USD990534S1 (en) | 2020-09-11 | 2023-06-27 | Asm Ip Holding B.V. | Weighted lift pin |
USD1012873S1 (en) | 2020-09-24 | 2024-01-30 | Asm Ip Holding B.V. | Electrode for semiconductor processing apparatus |
US12009224B2 (en) | 2020-09-29 | 2024-06-11 | Asm Ip Holding B.V. | Apparatus and method for etching metal nitrides |
TW202229613A (zh) | 2020-10-14 | 2022-08-01 | 荷蘭商Asm Ip私人控股有限公司 | 於階梯式結構上沉積材料的方法 |
KR20220053482A (ko) | 2020-10-22 | 2022-04-29 | 에이에스엠 아이피 홀딩 비.브이. | 바나듐 금속을 증착하는 방법, 구조체, 소자 및 증착 어셈블리 |
TW202223136A (zh) | 2020-10-28 | 2022-06-16 | 荷蘭商Asm Ip私人控股有限公司 | 用於在基板上形成層之方法、及半導體處理系統 |
CN112345101A (zh) * | 2020-10-29 | 2021-02-09 | 上海卫星装备研究所 | 在真空室内置浮动参考端的温度测量***及方法 |
TW202235649A (zh) | 2020-11-24 | 2022-09-16 | 荷蘭商Asm Ip私人控股有限公司 | 填充間隙之方法與相關之系統及裝置 |
KR20220076343A (ko) | 2020-11-30 | 2022-06-08 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치의 반응 챔버 내에 배열되도록 구성된 인젝터 |
CN114639631A (zh) | 2020-12-16 | 2022-06-17 | Asm Ip私人控股有限公司 | 跳动和摆动测量固定装置 |
TW202231903A (zh) | 2020-12-22 | 2022-08-16 | 荷蘭商Asm Ip私人控股有限公司 | 過渡金屬沉積方法、過渡金屬層、用於沉積過渡金屬於基板上的沉積總成 |
USD980813S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
USD981973S1 (en) | 2021-05-11 | 2023-03-28 | Asm Ip Holding B.V. | Reactor wall for substrate processing apparatus |
USD980814S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
USD1023959S1 (en) | 2021-05-11 | 2024-04-23 | Asm Ip Holding B.V. | Electrode for substrate processing apparatus |
USD990441S1 (en) | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4133700A (en) * | 1975-03-13 | 1979-01-09 | Omega Engineering Inc. | Cold junction thermocouple compensator |
US4130019A (en) * | 1977-06-09 | 1978-12-19 | Nitschke John Stephen | Self-compensating thermocouple reading circuit |
US4157663A (en) * | 1978-04-25 | 1979-06-12 | The Boeing Company | Automatic thermocouple reference junction compensator |
US4403296A (en) * | 1980-12-18 | 1983-09-06 | Electromedics, Inc. | Measuring and determination device for calculating an output determination based on a mathematical relationship between multiple different input responsive transducers |
US4482261A (en) * | 1982-07-15 | 1984-11-13 | Owens-Corning Fiberglas Corporation | Method for simultaneous reference junction compensation of a plurality of thermocouples |
DE3424288A1 (de) * | 1984-07-02 | 1986-01-23 | Heinz-Ulrich 5800 Hagen Wigger | Anordnung und verfahren zur digitalen fehlerkompensation in eingangsschaltungen |
US4718777A (en) | 1986-02-28 | 1988-01-12 | John Fluke Mfg. Co., Inc. | Isothermal block for temperature measurement system using a thermocouple |
US4776706A (en) * | 1987-08-10 | 1988-10-11 | Thermo Electric Instruments | Universal connector and compensating terminal apparatus for temperature responsive instruments |
US5161893A (en) * | 1987-10-13 | 1992-11-10 | Respiratory Support Products, Inc. | Temperature measurement |
US4936690A (en) * | 1989-05-31 | 1990-06-26 | Rosemount Inc. | Thermocouple transmitter with cold junction compensation |
US5090918A (en) | 1990-05-31 | 1992-02-25 | John Fluke Mfg. Co., Inc. | Isothermal termination block having a multi-layer thermal conductor |
FI87494C (fi) * | 1991-03-19 | 1993-01-11 | Beamex Ab Oy | Jaemfoerelsekoppling foer termoparmaetning |
US5167519A (en) * | 1991-11-12 | 1992-12-01 | Transmation, Inc. | Temperature compensating universal connector |
FR2687782B1 (fr) * | 1992-02-21 | 1994-04-29 | Sadis Bruker Spectrospin | Dispositif de compensation de jonction froide pour thermocouple. |
US5492482A (en) | 1994-06-07 | 1996-02-20 | Fluke Corporation | Compact thermocouple connector |
US5669713A (en) * | 1994-09-27 | 1997-09-23 | Rosemount Inc. | Calibration of process control temperature transmitter |
US6068400A (en) * | 1998-02-27 | 2000-05-30 | Tektronix, Inc. | Temperature compensated adapter for a DMM |
-
1999
- 1999-09-24 US US09/404,921 patent/US6293700B1/en not_active Expired - Lifetime
-
2000
- 2000-09-22 EP EP00308302.9A patent/EP1087217B2/en not_active Expired - Lifetime
- 2000-09-22 DE DE60041310T patent/DE60041310D1/de not_active Expired - Lifetime
- 2000-09-22 TW TW089119654A patent/TW495606B/zh not_active IP Right Cessation
- 2000-09-22 JP JP2000288290A patent/JP2001116630A/ja active Pending
- 2000-09-23 CN CNB00128861XA patent/CN1192223C/zh not_active Expired - Lifetime
- 2000-09-23 KR KR10-2000-0055982A patent/KR100400651B1/ko active IP Right Grant
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8900888B2 (en) | 2009-05-29 | 2014-12-02 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip |
CN102252770A (zh) * | 2011-04-29 | 2011-11-23 | 中冶赛迪工程技术股份有限公司 | 一种测温补偿方法及修正型高精度温度计 |
CN105987774A (zh) * | 2015-03-18 | 2016-10-05 | 恩德莱斯+豪瑟尔韦泽尔有限商业两合公司 | 热电偶线测试电路 |
US10209143B2 (en) | 2015-03-18 | 2019-02-19 | Endress + Hauser Wetzer Gmbh + Co. Kg | Thermo wire testing circuit |
CN110476044A (zh) * | 2017-04-03 | 2019-11-19 | 夏普株式会社 | 电子设备 |
Also Published As
Publication number | Publication date |
---|---|
KR20010030481A (ko) | 2001-04-16 |
EP1087217B2 (en) | 2015-12-23 |
EP1087217A1 (en) | 2001-03-28 |
EP1087217B1 (en) | 2009-01-07 |
US6293700B1 (en) | 2001-09-25 |
TW495606B (en) | 2002-07-21 |
CN1192223C (zh) | 2005-03-09 |
KR100400651B1 (ko) | 2003-10-08 |
JP2001116630A (ja) | 2001-04-27 |
DE60041310D1 (de) | 2009-02-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1192223C (zh) | 用于热电偶型温度计的已标定的等温组件 | |
KR0180068B1 (ko) | 콤팩트 열전쌍 커넥터 | |
US4133700A (en) | Cold junction thermocouple compensator | |
US4403296A (en) | Measuring and determination device for calculating an output determination based on a mathematical relationship between multiple different input responsive transducers | |
US8311763B2 (en) | System and method of compensating for device mounting and thermal transfer errors | |
US2735754A (en) | Dravnieks | |
EP0644418A1 (en) | Measuring thermal conductivity and apparatus therefor | |
KR890005499A (ko) | 온도감지장치 및 그 제조방법 | |
GB2233457A (en) | Temperature reference junction for a multichannel temperature sensing system. | |
CN103293184A (zh) | 一种基于准、非稳态法测试建筑材料导热系数的实验装置 | |
HU186066B (en) | Method and apparatus for measuring coefficient of heat transfer | |
Steckler et al. | High precision microcalorimetry: Apparatus, procedures, and biochemical applications | |
US4147061A (en) | Thermocouple reference junction calibrator | |
USH562H (en) | Accurate electronic thermometer | |
Charitidou et al. | A computer-controlled instrument for the measurement of the thermal conductivity of liquids | |
US3332285A (en) | Fast precision temperature sensing thermocouple probe | |
JPH07151572A (ja) | 計測装置および計測方法 | |
GB2023848A (en) | Thermoelectric metal sorter | |
US3280630A (en) | Cold junction | |
CA1069337A (en) | Cold junction thermocouple compensator | |
Edler et al. | Reference material for Seebeck coefficients | |
Anderson et al. | Characteristics of germanium resistance thermometers from 1 to 35 K and the ISU magnetic temperature scale | |
Guy et al. | Temperature measurement in high pressure cells using a rhodium+ 0.5% iron-chromel thermocouple pair | |
GB2032109A (en) | Measuring temperature and thermal flux | |
McIldowie | Introducing temperature scales |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term |
Granted publication date: 20050309 |
|
CX01 | Expiry of patent term |