CN1289946C

CN1289946C - Soft film structure

Info

Publication number: CN1289946C
Application number: CN 03128690
Authority: CN
Inventors: 陈慧昌; 魏全茂
Original assignee: AU Optronics Corp
Current assignee: AU Optronics Corp
Priority date: 2003-04-30
Filing date: 2003-04-30
Publication date: 2006-12-13
Anticipated expiration: 2023-04-30
Also published as: CN1542503A

Abstract

The present invention relates to a soft film structure used for leading a glass base board and a circuit board to be connected. The soft film structure comprises a soft support board, a driving IC and a plurality of pins, wherein the soft support board is provided with a first combination edge and a second combination edge which are corresponding, the first combination edge is combined with a glass base board, the second combination edge is combined with a circuit board, the driving IC is enclosed on the soft support board, a plurality of convex blocks are arranged on the driving IC, the pins comprise inner pins and outer pins, the inner pins are connected with the convex blocks of the driving IC, and the outer pins respectively extend to the first combination edge and the second combination edge of the soft support board. The outer pins which extend to the first combination edge are electrically connected with an electrode of the glass base board, and the outer pins which extend to the second combination edge are electrically connected with a connection point of the circuit board. The soft support board is provided with at least one long groove on a lateral edge where the first combination edge and the second combination edge are adjacent. External force of the soft film structure is buffered by the long groove. Therefore, the phenemenon that because the pins on the soft film structure are attacked by external force, the pins are damaged can be avoided.

Description

Soft film structure

Technical field

The invention relates to a kind of Soft film structure that connects glass substrate and circuit board, be meant that especially a kind of external force that absorbs is to reduce the Soft film structure of pin breakage.

Background technology

Along with membrane transistor (TFT-LCD) manufacturing technology is progressive fast, with and possess frivolous, power saving is arranged, advantage such as no width of cloth ray, make a large amount of being applied to personal digital assistant device PDA, notebook computer, digital camera, taking the photograph in the various electronic products such as video recorder, mobile phone of LCD.Add the positive input research and development of industry and adopt the production equipment that maximizes, make the continuous lifting of quality and the price of LCD continue to descend, therefore make the application of LCD enlarge rapidly.

See also shown in Figure 1ly, it is the side view for the LCD module 10 of known technology, comprises a glass substrate 11, one module 12 backlight, a Soft film structure 13, a circuit board 14 and a framework 15.Glass substrate 11 is made up of a upper glass and a lower-glass, and it is inner also to be provided with a plurality of liquid crystal born of the same parents (not shown), all has a pixel electrode on each liquid crystal born of the same parents (cell), itself and utilize an electrode pin extend to display pannel 11 around.Module 12 backlight is the back side of being located at glass substrate 11, and it is made up of elements such as fluorescent tube, light guide plate and reflecting plates, and said elements can produce the output of uniform light, required light source so that glass substrate 11 show images to be provided.

Be to utilize Soft film structure 13 to be connected to each other between glass substrate 11 and the circuit board 14, this Soft film structure 13 is with strip-like carrier structure packing technique (Tape Carrier Package, be called for short TCP) or wafer mantle structure packing technique (Chip on Film, be called for short COF) with drive IC 16 encapsulation thereon, and by drive IC 16 with active mode control pixel electrode switch or signal is provided, wherein this drive IC 16 can be gate control wafer or source electrode control wafer.Framework 15 then is the outside that is installed on LCD module 10, and to protect its inner element to avoid suffering external force and to destroy.

See also shown in Figure 2, it is the Soft film structure synoptic diagram for known technology, Soft film structure 13 comprises a soft carrier plate 131, a drive IC 16 and a plurality of pin (lead) 132, soft carrier plate 131 is softpanel structures of being made by macromolecular material, it comprise one first in conjunction with limit 133 and one second in conjunction with limit 134, above-mentioned two in conjunction with limit the 133, the 134th, and in correspondence with each other, wherein first is to combine with glass substrate 11 in conjunction with limit 133, and second then is to combine with circuit board 14 in conjunction with limit 134.Drive IC 16 is to be packaged on the soft carrier plate 131 with TCP structure packing technique, its surface then is to be provided with plurality of bump (bump) 161, and above-mentioned pin 132 is to lay (layout) on soft carrier plate 131, wherein each pin 132 all has a pin 1321 and an outer pin 1322 in one, pin 1321 is to be coupled with the projection 161 of drive IC 16 respectively in it, its 1322 of outer pin be extend to respectively soft carrier plate 131 first in conjunction with limit 133 and second in conjunction with limit 134, wherein extend to the first outer pin 1322 in conjunction with limit 133 and be with electrode around the glass substrate 11 and be connected, the contact that extends to the second outer pin 1322 in conjunction with limit 134 and then be with circuit board 14 is connected.

But because Soft film structure 13 is to belong to three kinds of materials with different properties respectively with glass substrate 11 and circuit board 14, thermal expansion each other is that number has very big difference.For the two different materials of interosculating, if it changes (for example process of hot pressing) in the junction occurrence temperature, then the junction will have tight and stress such as concentrates to produce at phenomenon because thermal deformation is inconsistent, Fig. 3 a is when combining with glass substrate 11 and circuit board 14 respectively for Soft film structure 13, and its junction is because the STRESS VARIATION that temperature change produced.See also again shown in Fig. 3 b, when the stress concentration phenomenon takes place in Soft film structure 13, if be subjected to after the external impacts (comprise move, external force that assembling process produced), not only Soft film structure 13 will destroy, even pin also can produce distortion, peel off or phenomenon such as fracture.

Because the Soft film structure of known technology is often because above-mentioned former thereby cause the bad of product, therefore, how solve and propose the road of suitable improvement, real problem place for the anxious desire solution of relevant practitioner of present stage at the problems referred to above.

Summary of the invention

Fundamental purpose of the present invention is to provide a kind of Soft film structure, and this Soft film structure has the function of buffering external force, can avoid the pin of Soft film structure to be subjected to external impacts and destroys.

Soft film structure of the present invention is to be connected with a glass substrate and a circuit board respectively, and it comprises a soft carrier plate, a drive IC and a plurality of pin.

Soft carrier plate have corresponding first in conjunction with limit and second in conjunction with the limit, it is to utilize first to combine with glass substrate in conjunction with the limit, and utilize second to combine with circuit board in conjunction with the limit, wherein be to be provided with plurality of electrodes on glass substrate, on the circuit board then be provided with a plurality of contacts, drive IC is packaged on the soft carrier plate with TCP structure packing technique or COF structure packing technique, drive IC more comprises plurality of bump in addition.Above-mentioned pin is to be laid on the soft carrier plate, its each pin all has a pin and an outer pin in one, pin is to be coupled with the projection of drive ratio respectively in above-mentioned, outer pin then be extend to respectively first in conjunction with limit and second in conjunction with the limit, wherein extending to the first outer pin in conjunction with the limit and be by the Anisotropically conductive film and be coupled mutually with the electrode of glass substrate respectively, is to see through the Anisotropically conductive film to be coupled mutually with the contact of circuit board respectively and extend to the second outer pin in conjunction with the limit.

The invention is characterized in: this soft carrier plate more comprises two elongate slots, be located at respectively and combine limit and second with first in conjunction with on the adjacent dual side-edge in limit, and stress is disperseed by the elongate slots structure, be formed on the stress of soft carrier plate and glass substrate junction with elimination, and the stress that is formed on soft carrier plate and circuit board junction.In addition, because the structural design of elongate slots has the effect of buffering external force, it can absorb external force to the impact that soft carrier plate caused, and therefore can make the pin of soft carrier plate avoid external impacts and destroys.

Description of drawings

Fig. 1 is the side view of the LCD module of known technology;

Fig. 2 is the Soft film structure synoptic diagram of known technology;

Fig. 3 a is a Soft film structure when combining with glass substrate and circuit board respectively, and its junction produces the STRESS VARIATION synoptic diagram because of temperature change;

Fig. 3 b be the Soft film structure of known technology after being subjected to external impacts, the synoptic diagram that destroys takes place in pin;

Fig. 4 a is that first of Soft film structure of the present invention is implemented illustration;

Fig. 4 b is that Soft film structure of the present invention utilizes elongate slots to absorb the external force synoptic diagram;

Fig. 5 is that second of Soft film structure of the present invention is implemented illustration;

Fig. 6 is that the 3rd of Soft film structure of the present invention is implemented illustration.

The figure number explanation

10 display modules, 11 glass substrates, 110 electrodes

12 module 13 Soft film structures 131 soft carrier plate backlight

Pin 1322 outer pins in 132 pins 1321

133 first in conjunction with limit 134 second in conjunction with limit 14 circuit boards

140 contacts, 15 frameworks, 16 drive IC

161 projections, 40 Soft film structures, 41 soft carrier plate

42 drive IC, 420 projections, 43 pins

Pin 432 outer pin 433 first ends in 431

434 second ends 44 first in conjunction with limit 45 second in conjunction with the limit

46 Anisotropically conductive films, 47 elongate slots

Embodiment

The present invention discloses a kind of Soft film structure that pin destroys that reduces, and this Soft film structure is to be used to connect a glass substrate and a circuit board, and its preferred embodiment and related embodiment will be described in detail through following content.

See also shown in Fig. 4 a, it is to implement illustration for first of Soft film structure of the present invention, Soft film structure 40 is to comprise a soft carrier plate 41, a drive IC 42 and a plurality of pin 43 among the figure, soft carrier plate 41 is by the made soft platy structure of macromolecular material, its have corresponding first in conjunction with limit 44 and second in conjunction with limit 45, wherein first is to combine with a glass substrate 11 in conjunction with limit 44, and second is to combine with a circuit board 14 in conjunction with limit 45.Wherein glass substrate 11 is being to be provided with plurality of electrodes 110 with first in conjunction with limit 44 corresponding parts, and circuit board 14 is being provided with a plurality of contacts 140 with second in conjunction with limit 45 corresponding parts.

Drive IC 42 is packaged on the soft carrier plate 41 with TCP structure packing technique or COF structure packing technique, in addition, drive IC 42 more comprises plurality of bump 420, above-mentioned pin 43 then is to be laid on the soft carrier plate 41, wherein each pin 43 all has a pin 431 and an outer pin 432 in one, pin 43 is coupled with the projection 420 of drive IC 42 respectively in above-mentioned, outer pin 432 then be extend to respectively first in conjunction with limit 44 and second in conjunction with limit 45.Between soft carrier plate 41 and the glass substrate 11 is to utilize Anisotropically conductive film 46 to combine, make and extend to first the electrode 110 and reach electric connection in conjunction with the outer pin 432 on limit 44 and glass substrate 11, in addition, between soft carrier plate 41 and the circuit board 14 is to utilize Anisotropically conductive film 46 to combine equally, makes to extend to first contact 140 in conjunction with the outer pin 432 on limit 45 and circuit board 14 and reach electric connection.

The invention is characterized in that this soft carrier plate 41 more comprises two elongate slots 47, above-mentioned two elongate slots 47 are to be located at respectively to combine limit 44 and second with first in conjunction with on the adjacent dual side-edge in limit 45, because elongate slots 47 structures can be disperseed the stress of soft carrier plate 41, therefore can eliminate the thermal expansion stress of soft carrier plate 41 and glass substrate 11 junctions, and the thermal expansion stress of soft carrier plate 41 and circuit board 14 junctions, in addition, because the structural design of elongate slots 47 has the effect of buffering external force, it can absorb external force to the impact that soft carrier plate caused, and therefore can make the pin 43 of soft carrier plate 41 avoid external impacts and destroy (shown in Fig. 4 b).

See also shown in Figure 5ly, it is to implement illustration for second of Soft film structure of the present invention, and present embodiment is the simple change for first embodiment, therefore will repeat no more for something in common, and only be described at different part.Not being both of the present embodiment and the first embodiment maximum is provided with two

elongate slots

47a, 47b on each side, one of them elongate slots 47a is the junction that is formed at soft carrier plate 41 and glass substrate 11, and another elongate slots 47b then is the junction that is formed at soft carrier plate 41 and circuit board 14.Because the junction is to concentrate the most obvious part for soft carrier plate 41 stress, also be that soft carrier plate 41 temperature distortions remove and the buffering of external force can obtain maximum effect.

See also shown in Figure 6, for the 3rd of Soft film structure of the present invention is executed illustration.It mainly is to be applied to glass substrate to plant crystal technique (Chip on Glass is called for short COG), and drive IC 42 electrodes direct and glass substrate 11 are coupled mutually, utilize Soft film structure 41 to be connected with circuit board 14 afterwards again.

The Soft film structure 40 of present embodiment comprises a soft carrier plate 41 and a plurality of pin 43, and it is to combine with glass substrate 11 in conjunction with limit 44 and one in conjunction with limit 44 that this soft carrier plate 41 has one first, and second is to combine with circuit board 14 in conjunction with 45 on limit.Above-mentioned pin 43 is to be laid on the soft carrier plate 41, and each pin 43 all has one first end 433 and one second end 434, and wherein first end 433 is that to extend to first then be to extend to second in conjunction with limit 45 in conjunction with limit 44, the first ends 434.Between soft carrier plate 41 and the glass substrate 11 is to utilize Anisotropically conductive film 46 to combine, and make first end 433 of above-mentioned pin 43 reach electric connection with the projection 420 of the drive IC 42 of glass substrate 11 respectively, be to utilize Anisotropically conductive film 46 to combine equally between soft carrier plate 41 and the circuit board 14 again, and make second end 434 of above-mentioned pin 43 reach electric connection with the contact 140 of circuit board 14 respectively.

The invention is characterized in first in conjunction with limit 44 and second in conjunction with being respectively provided to a few elongate slots on the adjacent side in limit 45, wherein each side is to be preferable with two

elongate slots

47a, 47b, and is separately positioned on the junction of the junction of soft carrier plate 41 and glass substrate 11 and soft carrier plate 41 and circuit board 14.The stress that disperses soft carrier plate 41 by above-mentioned elongate slots, combine the thermal expansion stress that the place produces to eliminate soft carrier plate 41 with circuit board 14 with glass substrate 11 junctions and soft carrier plate 41, in addition, because the structural design of elongate slots has the effect of buffering external force, therefore it can absorb the impact that external force is caused soft carrier plate 41, can make the pin 43 of soft carrier plate 41 avoid external impacts and destroys.

Certainly; the above only is the preferred embodiment of Soft film structure of the present invention; it is not in order to limit practical range of the present invention; anyly have the knack of this skill person and all should belong to scope of the present invention in the modification of making without prejudice to spirit of the present invention, thus protection scope of the present invention when with following described claim as foundation.

Claims

1. Soft film structure is in order to connecting a glass substrate and a circuit board, and this glass substrate is provided with plurality of electrodes, and this circuit board is provided with a plurality of contacts, and this Soft film structure comprises:

One soft carrier plate, it comprise one first in conjunction with limit and one second in conjunction with the limit, wherein this first to combine the limit in conjunction with the limit with second be in correspondence with each other, and this first is to combine with this glass substrate in conjunction with the limit, this second is to combine with this circuit board in conjunction with the limit again, and this soft carrier plate first is combining on the side adjacent in conjunction with the limit of limit and second and is provided with at least one elongate slots with this;

One drive IC is to be packaged on this soft carrier plate, on it and be provided with plurality of bump; And

A plurality of pins, be to be formed on this soft carrier plate, above-mentioned pin includes a pin and an outer pin in one, in wherein above-mentioned pin be respectively with the coupling of the projection of this drive IC, above-mentioned outer pin then is to extend to first of this soft carrier plate respectively to combine the limit in conjunction with the limit with second, wherein extending to this first is to electrically connect with the electrode of this glass substrate in conjunction with pin outside the limit, and the contact that extends to this second outer pin in conjunction with the limit and be with this circuit board electrically connects.

2. Soft film structure as claimed in claim 1 is characterized in that, is to utilize an Anisotropically conductive film to combine between this soft carrier plate and this glass substrate.

3. Soft film structure as claimed in claim 1 is characterized in that, is to utilize an Anisotropically conductive film to be connected between this soft carrier plate and this circuit board.

4. Soft film structure as claimed in claim 1 is characterized in that, this drive IC is to be packaged on this soft carrier plate with TCP structure packing technique.

5. Soft film structure as claimed in claim 1 is characterized in that, this drive IC is to be packaged on this soft carrier plate with COF structure packing technique.

6. Soft film structure as claimed in claim 1, it is characterized in that, this soft carrier plate is in that first to combine on the side adjacent in conjunction with the limit of limit and second be to be respectively equipped with two elongate slots with this, wherein an elongate slots is the junction that is formed at this soft carrier plate and this glass substrate, and another elongate slots then is the junction that is formed at this soft carrier plate and this circuit board.

7. a Soft film structure is a drive IC and the circuit board in order to connect a glass substrate, and this drive IC is provided with plurality of bump, and this circuit board is provided with a plurality of contacts, and this Soft film structure comprises:

One soft carrier plate, it comprise one first in conjunction with limit and one second in conjunction with the limit, wherein this first to combine the limit in conjunction with the limit with second be in correspondence with each other, and this first is to combine with this glass substrate in conjunction with the limit, this second is to combine with this circuit board in conjunction with the limit again, and this soft carrier plate first is combining on the side adjacent in conjunction with the limit of limit and second and is provided with at least one elongate slots with this; And

A plurality of pins, be to be formed on this soft carrier plate, above-mentioned pin includes one first end and one second end, wherein above-mentioned first end is to be connected with the projection of this drive IC respectively, above-mentioned second end then is to extend to first of this soft carrier plate respectively to combine the limit in conjunction with the limit with second, the projection that wherein extends to this first second end in conjunction with the limit and be with the drive IC of this glass substrate electrically connects, and the contact that extends to this second second end in conjunction with the limit and be with this circuit board electrically connects.

8. Soft film structure as claimed in claim 7 is characterized in that, is to utilize an Anisotropically conductive film to combine between this soft carrier plate and this glass substrate.

9. Soft film structure as claimed in claim 7 is characterized in that, is to utilize an Anisotropically conductive film to be connected between this soft carrier plate and this circuit board.

10. Soft film structure as claimed in claim 7 is characterized in that, this drive IC is to be packaged on this glass substrate with COG structure packing technique.

11. Soft film structure as claimed in claim 7, it is characterized in that, this soft carrier plate is in that first to combine on the side adjacent in conjunction with the limit of limit and second be to be respectively equipped with two elongate slots with this, wherein an elongate slots is the junction that is formed at this soft carrier plate and this glass substrate, and another elongate slots then is the junction that is formed at this soft carrier plate and this circuit board.